CN207151069U - Cooling system and virtual reality equipment - Google Patents

Abstract

The utility model provides a heat dissipation system and virtual reality equipment. The heat dissipation system includes a heat sink, a thermoelectric generator, a motor and a heat dissipation fan driven by the motor. The hot end of the thermoelectric generator is in contact with the heat sink, and the thermoelectric generator It is electrically connected with the motor through wires. The cooling fins of the heat dissipation system of the utility model not only actively diffuse the heat outward for active heat dissipation, but also transfer a part of the heat to the thermoelectric generator, so that the thermoelectric generator can generate temperature difference power generation, and this part of the heat is no longer simply guided to the outside for loss. , but first converted into electrical energy and then converted into the mechanical energy of the cooling fan, driving the cooling fan to rotate, effectively using the heat energy, and further improving the cooling effect.

Description

Cooling system and virtual reality equipment

technical field

The utility model relates to virtual reality equipment, in particular to the structural improvement of the heat dissipation system of the main board of the virtual reality equipment.

Background technique

For virtual reality head-mounted all-in-one devices, due to the high power consumption of the whole machine, the motherboard chips are hot, so the motherboard needs to be dissipated. In order to solve the heat dissipation problem of the motherboard, in the prior art, the heat dissipation structure usually guides the heat to the external environment, that is, passive heat dissipation, such as setting heat dissipation holes on the chassis, but due to the high power consumption of the whole machine, the passive heat dissipation structure is adopted , the temperature of the outer surface of the case is generally high, especially the temperature where the main body of the device is attached to the forehead is still higher than the temperature of the human body, resulting in a decrease in wearing comfort.

Contents of the invention

The utility model provides a cooling system and a virtual reality device, which can solve the above-mentioned technical problems existing in the prior art.

In order to achieve the above technical purpose, the heat dissipation system proposed by the utility model is realized by the following technical solutions: a heat dissipation system, a heat sink, a thermoelectric generator, a motor and a heat dissipation fan driven by the motor, the heat dissipation of the thermoelectric generator The end is in contact with the heat sink, and the thermoelectric generator is electrically connected with the motor through wires.

The thermoelectric generator is a semiconductor refrigeration chip.

The hot end of the semiconductor cooling sheet is bonded to the heat sink, and a thermal interface material layer is arranged between the hot end of the semiconductor cooling sheet and the cooling sheet.

The wires are hard wire bundles.

The utility model also proposes a virtual reality device, including a display main body, a main board is arranged inside the display main body, a heating chip is arranged on the main board, and a heat dissipation system for dissipating heat from the heating chip is also included in the virtual reality device , the heat dissipation system is the above heat dissipation system, the heat dissipation fin is in contact with the heat generating chip, and the cold end of the thermoelectric generator is in contact with the housing of the display body.

The casing of the display main body is provided with a through hole for leading out the wires, and the motor and the cooling fan are located outside the display main body.

The cooling fan faces to the rear side of the display body.

The main board and the semiconductor cooling fin are located on opposite sides of the heat sink.

A thermal interface material layer is provided between the thermoelectric generator and the heating chip.

The heat dissipation system of the utility model is provided with a thermoelectric generator and a heat sink, the hot end of the thermoelectric generator is in contact with the heat sink, and the heat sink is in contact with the heat-generating component, so that the heat sink evenly diffuses the heat and conducts a part of the heat to the thermoelectric generator. , the hot end of the thermoelectric generator receives heat, and the temperature rises, causing a temperature difference between the hot end and the cold end, which generates a current and voltage based on the Seebeck effect, and then drives a motor electrically connected to the thermoelectric generator through a wire to rotate the cooling fan; The heat sink of the utility model not only actively diffuses the heat outward for active heat dissipation, but also transfers a part of the heat to the semi-thermoelectric generator, so that the thermoelectric generator generates thermoelectric power generation, and this part of the heat is no longer simply guided to the outside for loss. Instead, it is first converted into electrical energy and then converted into the mechanical energy of the cooling fan to drive the cooling fan to rotate, effectively utilizing the heat energy and further improving the cooling effect.

Description of drawings

Fig. 1 is the structural representation of the utility model cooling system;

Fig. 2 is a partial structural schematic diagram of the virtual reality device of the present invention.

Detailed ways

The technical solution of the present utility model will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

Referring to Fig. 1, the heat dissipation system of this embodiment includes a heat sink 1, a thermoelectric generator, a motor 3 and a heat dissipation fan 4 driven by the motor 3, the hot end of the thermoelectric generator is in contact with the heat sink 1, and the thermoelectric generator passes through a wire 5 It is electrically connected with the motor 3.

The working principle of the heat dissipation system in this embodiment is: the heat emitted by the heating device is transmitted to the heat sink 1, and while the heat sink 1 spreads the heat evenly, a part of the heat is conducted to the thermoelectric generator through the heat sink 1, and the thermoelectric generator The hot end receives heat and the temperature rises, causing a temperature difference between the hot end and the cold end. Based on the Seebeck effect, a current and voltage are generated, and then the motor 3 is driven to work to rotate the cooling fan 4, and the cooling fan 4 further blows and cools down. The Seebeck effect, also known as the first thermoelectric effect, refers to the thermoelectric phenomenon in which the voltage difference between two substances is caused by the temperature difference between two different electrical conductors or semiconductors. The essence of the Seebeck effect is that when two metals contact The contact potential difference (voltage), the potential difference depends on the difference in the electron overflow work in the two metals and the difference in the electron concentration in the two metals. The thermoelectric potential of the semiconductor is relatively large, which can be used as a thermoelectric generator to drive the motor 3 to work, and then Drive cooling fan 4 to run.

Further, in this embodiment, the thermoelectric generator is a semiconductor cooling chip 2 , of course, it can also be a thermoelectric chip or a thermoelectric generator. Semiconductor refrigerating sheet 2 is bonded with heat sink 1 with its hot end, preferably, radiating fin 1 covers the hot end of semiconductor refrigerating sheet 2 completely, so that as much heat as possible is conducted to semiconductor refrigerating sheet 2, makes semiconductor refrigerating sheet 2 A larger temperature difference and electromotive force are generated between the hot end and the cold end, and then there is enough electric energy to drive the cooling fan 4 to rotate. A thermally conductive interface material layer 6 is provided between the semiconductor cooler 2 and the heat sink 1 to fill the micro-gap between the semiconductor cooler 2 and the heat sink 1 and the uneven surface of the heat sink 1, thereby reducing thermal resistance and improving heat dissipation Thermal performance of sheet 1.

For the wire 5, it is preferred to be a hard wire bundle. In addition to conducting electricity, it can be used to support the motor 3 and the cooling fan 4. There is no need to set up an additional support structure for the motor 3 and the cooling fan 4, which simplifies the overall structure of the cooling system and reduces the product cost. cost.

Referring to FIG. 2, this embodiment also proposes a virtual reality device. Since this embodiment only involves structural improvement at the place where the cooling system is installed for the virtual reality device, in order to show the improved structure more clearly, only the The local structure of the virtual reality equipment is shown, that is, the structure where the cooling system is installed. A virtual reality device, comprising a display main body 7, a main board 8 is arranged in the display main body 7, a heating chip 9 is arranged on the main board 8, the virtual reality device also includes a cooling system for cooling the heating chip 9, and the cooling system is provided in this embodiment For the heat dissipation system described above, refer to the description of the embodiment of the heat dissipation system of the present invention and the accompanying drawing 1 for its specific structure, and will not repeat them here. In the heat dissipation system, the heat sink 1 is in contact with the heating chip 9 to dissipate heat from the heating chip 9, and the cold end of the semiconductor cooling chip 2 is in contact with the housing of the display body 7, mainly because the temperature of the housing of the display body 7 is relatively low. The cold end of the semiconductor refrigerating sheet 2 is in contact with the housing of the display body, and the hot end of the semiconductor refrigerating sheet 2 is in contact with the heat sink 1, so that the distance between the hot end and the cold end of the semiconductor refrigerating sheet 2 can be increased to a greater extent. temperature difference. Wherein, since the volume of the display body 7 itself is limited, the motor 3 is preferably a micro motor, and the cooling fan 4 is a small fan.

Since the virtual reality device in this embodiment is worn on the user's head for use, the temperature of the display body 7 attached to the user's forehead is relatively high, exceeding the normal temperature of the human body, resulting in a decrease in the user's wearing comfort. The body is provided with a through hole (not shown in the figure) for the wire 5 to pass through, and the motor 3 and the cooling fan 4 are located outside the display body 7, and the cooling fan 4 can be used to blow and dissipate heat from the wearing part of the user's head, improving the user's performance. Wearing comfort, at the same time, the external cooling fan 4 can also avoid the problem of easy accumulation of dust inside the display main body 7 inside the built-in display main body 7 . At this time, a cover for covering and decorating the wire 5 and the motor 3 can be provided (snapped or screwed) on the outer surface of the housing of the display main body 7, so that only the cooling fan 4 is exposed.

Since the rear side of the display body 7 (that is, the side where the lens barrel is located) is attached to the user's forehead, the temperature at the user's forehead is relatively high, so it is advisable for the cooling fan 4 to face the rear side of the display body 7 and be close to the user's forehead.

The main board 8 and the semiconductor cooling fin 2 are located on opposite sides of the heat sink 1, so that the cooling fin 1 contacts the main board 8 and the semiconductor cooling fin 2 with the largest area.

A thermal interface material layer 10 is also provided between the heat sink 1 and the heating chip 9 to reduce thermal resistance and improve the heat dissipation performance of the heat sink 1 .

The above embodiments are only used to illustrate the technical solutions of the present utility model, and are not intended to limit it; although the utility model has been described in detail with reference to the foregoing embodiments, for those of ordinary skill in the art, the aforementioned implementation can still be carried out. The technical solutions described in the examples are modified, or some of the technical features are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions claimed by the utility model.

Claims (9)

1. A heat dissipation system, characterized in that: a heat sink, a thermoelectric generator, a motor and a cooling fan driven by the motor, the hot end of the thermoelectric generator is in contact with the heat sink, and the thermoelectric generator passes through a wire electrically connected to the motor. 2. The heat dissipation system according to claim 1, wherein the thermoelectric generator is a semiconductor cooling chip. 3. The heat dissipation system according to claim 2, characterized in that: the hot end of the semiconductor cooling fin is attached to the heat sink, and a heat sink is arranged between the hot end of the semiconductor cooling fin and the heat sink. Thermal interface material layer. 4. The heat dissipation system according to claim 1, wherein the wires are hard wire bundles. 5. A virtual reality device, comprising a display body, said display body is provided with a main board, said main board is provided with a heating chip, and said virtual reality device also includes a cooling system for radiating heat to said heating chip, characterized in that : The heat dissipation system is the heat dissipation system according to any one of claims 1 to 3, the heat dissipation fin is in contact with the heating chip, and the cold end of the thermoelectric generator is in contact with the housing of the display body. 6. The virtual reality device according to claim 5, characterized in that: the casing of the display body is provided with a through hole for leading the wires out, and the motor and the cooling fan are located on the display body outside. 7. The virtual reality device according to claim 5, wherein the cooling fan is directed toward the rear side of the display body. 8. The virtual reality device according to claim 5, wherein the main board and the thermoelectric generator are located on opposite sides of the heat sink. 9. The virtual reality device according to any one of claims 5 to 8, characterized in that: a thermal interface material layer is provided between the heat sink and the heat generating chip.