CN207200825U - Light source module and imaging device - Google Patents
Light source module and imaging device Download PDFInfo
- Publication number
- CN207200825U CN207200825U CN201720676853.6U CN201720676853U CN207200825U CN 207200825 U CN207200825 U CN 207200825U CN 201720676853 U CN201720676853 U CN 201720676853U CN 207200825 U CN207200825 U CN 207200825U
- Authority
- CN
- China
- Prior art keywords
- light
- source module
- light source
- light emitting
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 230000003287 optical effect Effects 0.000 claims abstract description 13
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 3
- 239000004744 fabric Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000009877 rendering Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
Description
技术领域technical field
本实用新型是关于用于阅读或识别印刷或书写文字或者用于识别图形的方法或装置,且特别是有关于线型影像感测器的光源模组及取像装置。The utility model relates to a method or device for reading or recognizing printed or written characters or for recognizing graphics, and particularly relates to a light source module and an image capturing device of a linear image sensor.
背景技术Background technique
接触式影像感测器(contact image sensor)为线型影像感测器的一种,主要应用于扫描器、传真机以及多功能事务机,以将平面的图像或文件扫描成电子格式,以便于储存、显示或传输。Contact image sensor (contact image sensor) is a kind of linear image sensor, mainly used in scanners, fax machines and multi-function business machines, to scan flat images or documents into electronic format, so that store, display or transmit.
接触式影像感测器的工作原理是将光源所产生的光线照射到待扫描的稿件上,经过稿件反射光线,并利用一镜片组将所述反射光线聚集于感光件上;利用感光件将光的信号改变为电的信号,进而产生类比或数字像素(pixel)资料。The working principle of the contact image sensor is to irradiate the light generated by the light source on the manuscript to be scanned, reflect the light through the manuscript, and use a lens group to gather the reflected light on the photosensitive element; The signal is changed into an electrical signal to generate analog or digital pixel (pixel) data.
目前市面上一般用于接触式影像感测装置中的光源主要提供一白光以照射物件;然而,以蓝光发光晶粒搭配黄色萤光粉来产生白光的发光二极管因演色性不佳将致使成像品质不佳。Currently, the light sources generally used in contact image sensing devices on the market mainly provide a white light to irradiate objects; however, LEDs that use blue light-emitting chips and yellow phosphors to produce white light will cause poor image quality due to poor color rendering. bad.
实用新型内容Utility model content
依据本实用新型提供一种光源模组,供应用于取像装置中;光源模组包含一基板、一光导杆及多个发光二极管。光导杆具有一入光面及一出光面,出光面邻接于入光面。发光二极管设于基板上并沿着一第一轴线排列并朝向入光面投射光线,每个发光二极管的一光轴与第一轴线之间的距离不大于0.5毫米。其次,第一轴线平行于出光面的法线。According to the utility model, a light source module is provided, which is used in an image-taking device; the light source module includes a substrate, a light guiding rod and a plurality of light emitting diodes. The light guide rod has a light incident surface and a light exit surface, and the light exit surface is adjacent to the light incident surface. The light-emitting diodes are arranged on the substrate and arranged along a first axis and project light toward the light-incident surface. The distance between an optical axis of each light-emitting diode and the first axis is not greater than 0.5 millimeters. Secondly, the first axis is parallel to the normal of the light-emitting surface.
在本实用新型的一实施方式中,光源模组中的发光二极管配合产生一白色光线,且在光源模组的发光二极管中,排列最邻近出光面的发光二极管供产生波长介于606~626纳米的光线,排列次邻近于出光面的发光二极管供产生波长介于508~555纳米的光线,排列最远离出光面的发光二极管供产生波长介于450~480纳米的光线。In one embodiment of the present invention, the light emitting diodes in the light source module cooperate to generate a white light, and among the light emitting diodes of the light source module, the light emitting diodes closest to the light-emitting surface are arranged to generate light with a wavelength between 606 and 626 nanometers. The light emitting diodes arranged next to the light-emitting surface are for generating light with a wavelength of 508-555 nanometers, and the light-emitting diodes arranged farthest from the light-emitting surface are for generating light with a wavelength of 450-480 nanometers.
在本实用新型的一实施方式中,光导杆多个微棱镜,形成于光导杆的一底面上,底面相对于出光面;微棱镜的布设密度与其布设位置所接收到的光线强度呈反比。In one embodiment of the present utility model, a plurality of microprisms of the light guiding rod are formed on a bottom surface of the light guiding rod, and the bottom surface is opposite to the light emitting surface; the arrangement density of the microprisms is inversely proportional to the light intensity received by the arrangement position.
在本实用新型的一实施方式中,光源模组还包含一反射件,安装于基板上,反射件的一侧壁环绕所述多个发光二极管,侧壁的内径随着远离所述基板而增加。In one embodiment of the present invention, the light source module further includes a reflector installed on the substrate, a side wall of the reflector surrounds the plurality of light emitting diodes, and the inner diameter of the side wall increases as the distance away from the substrate .
在本实用新型的一实施方式中,反射件还包含一底壁,连接于侧壁邻近于基板的一侧,发光二极管设于底壁上。In an embodiment of the present invention, the reflector further includes a bottom wall connected to a side of the side wall adjacent to the substrate, and the light-emitting diodes are arranged on the bottom wall.
在本实用新型的一实施方式中,光源模组还包含一接合件,发光二极管及反射件设于接合件的一侧,光导杆安装于接合件的另一侧以接收发光二极管配合产生的白色光线。In one embodiment of the present invention, the light source module further includes a joint, the light-emitting diode and the reflector are arranged on one side of the joint, and the light guiding rod is installed on the other side of the joint to receive the white light emitted by the light-emitting diode. light.
在本实用新型的一实施方式中,光源模组还包含一保护件,部份包覆光导杆,入光面及出光面露出保护件之外。In an embodiment of the present invention, the light source module further includes a protective part, which partially covers the light guiding rod, and the light incident surface and the light outgoing surface are exposed outside the protective part.
根据本实用新型另提供一种取像装置,用以撷取一物件的影像;取像装置包含前述的光源模组、一基座、一感测模组及一成像模组。基座包含一容置槽及一穿槽,光源模组设于容置槽中,物件位于基座的一侧。感测模组位于基座的另一侧,并包含沿着一第二轴线排列的多个感光件。成像模组安装于穿槽中,并用以将物件的影像成像于感光件。According to the present invention, an image capturing device is further provided for capturing an image of an object; the image capturing device includes the aforementioned light source module, a base, a sensing module and an imaging module. The base includes an accommodating groove and a through groove, the light source module is arranged in the accommodating groove, and the object is located on one side of the base. The sensing module is located on the other side of the base, and includes a plurality of photosensitive elements arranged along a second axis. The imaging module is installed in the slot, and is used to image the image of the object on the photosensitive element.
在本实用新型的一实施方式中,第一轴线与感光件的一光轴的夹角介于35~65度之间。In one embodiment of the present invention, the included angle between the first axis and an optical axis of the photosensitive member is between 35° and 65°.
本实用新型的取像装置通过适当地排列光源模组中供产生蓝光、绿光及红光的发光二极管及其等与出光面的相对位置,来提供高演色性的白光光源以照射物件,达到提高成像品质的效果。The imaging device of the utility model provides a white light source with high color rendering property to irradiate the object by properly arranging the light-emitting diodes for generating blue light, green light and red light in the light source module and their relative positions with the light-emitting surface, so as to achieve Effects that improve image quality.
附图说明Description of drawings
图1是依照本实用新型的取像装置的立体分解图;Fig. 1 is a three-dimensional exploded view of an imaging device according to the present invention;
图2是依照本实用新型的取像装置的局部分解图;Fig. 2 is a partial exploded view of the imaging device according to the present invention;
图3是依照本实用新型的基板、反光件及发光二极管的俯视图;Fig. 3 is a top view of a substrate, a reflector and a light emitting diode according to the present invention;
图4是依照本实用新型的光源模组的立体组合图;以及Fig. 4 is a three-dimensional combined view of the light source module according to the present invention; and
图5是依照本实用新型的取像装置的剖视图。Fig. 5 is a cross-sectional view of the imaging device according to the present invention.
图中标记说明:Instructions for marks in the figure:
1取像装置;10座体;100顶面;102底面;104容置槽;106穿槽;1 image taking device; 10 seat body; 100 top surface; 102 bottom surface; 104 accommodating groove; 106 through groove;
12光源模组;120基板;1200贯孔;1202导电部;122光导杆;1220入光面;12 light source module; 120 substrate; 1200 through hole; 1202 conductive part; 122 light guiding rod; 1220 light incident surface;
1222出光面;1226微棱镜;124反光件;1240侧壁;1242底壁;1222 light-emitting surface; 1226 microprism; 124 reflector; 1240 side wall; 1242 bottom wall;
126B、126G、126R发光二极管;128保护件;130接合件;132凸肋;126B, 126G, 126R light-emitting diodes; 128 protective parts; 130 joint parts; 132 convex ribs;
14成像模组;16感测模组;160电路板;162感光件;164连接垫;14 imaging module; 16 sensing module; 160 circuit board; 162 photosensitive element; 164 connection pad;
A第一轴线;C光轴。A first axis; C optical axis.
具体实施方式Detailed ways
图1是依照本实用新型的取像装置的立体分解图,图2是依照本实用新型的取像装置的局部分解图。在图1及图2中,取像装置1用以感测一(平面)物件的影像,并将物件的光学影像转换为类比或数位电子信号以利于储存及传输。取像装置1包含一座体10、一光源模组12、一成像模组14及一感测模组16。FIG. 1 is a three-dimensional exploded view of an image-taking device according to the present invention, and FIG. 2 is a partial exploded view of the image-taking device according to the present invention. In FIG. 1 and FIG. 2 , an imaging device 1 is used to sense an image of a (flat) object, and convert the optical image of the object into an analog or digital electronic signal for storage and transmission. The imaging device 1 includes a base 10 , a light source module 12 , an imaging module 14 and a sensing module 16 .
座体10包含一顶面100、一相对于顶面100的底面102、一容置槽104及一穿槽106;底面102大致平行于顶面100。容置槽104形成在顶面100并朝向底面102的方向凹陷,穿槽106为贯穿顶面100及底面102的槽孔结构。座体10可使用塑胶或其它高分子材料利用射出成型或铸模技术制作而成。座体10可呈黑色或其它不具反光效果的深色材料制程,借以避免经物件反射而产生的光学影像受到座体10反射而影响成像对比度。换言之,座体10不建议使用白色或银色等具有反光效果的材料来制造。The seat body 10 includes a top surface 100 , a bottom surface 102 opposite to the top surface 100 , an accommodating groove 104 and a through groove 106 ; the bottom surface 102 is substantially parallel to the top surface 100 . The accommodating groove 104 is formed on the top surface 100 and is recessed toward the bottom surface 102 , and the through groove 106 is a slot structure penetrating through the top surface 100 and the bottom surface 102 . The seat body 10 can be made of plastic or other polymer materials by injection molding or casting techniques. The base body 10 can be made of black or other dark materials without reflective effect, so as to prevent the optical image generated by the reflection of the object from being reflected by the base body 10 and affecting the imaging contrast. In other words, it is not recommended to use white or silver or other materials with reflective effect to make the seat body 10 .
光源模组12供产生一线性光线以照射物件。光源模组12包含一基板120、一光导杆122、一反光件124及多个发光二极管126B、126G、126R。基板120可为印刷电路板(printedcircuit board)或软性电路板(flexible print circuit);其中,软性电路板可有效地降低光源模组12的体积及重量。The light source module 12 is used to generate a linear light to illuminate objects. The light source module 12 includes a substrate 120 , a light guiding rod 122 , a light reflector 124 and a plurality of LEDs 126B, 126G, 126R. The substrate 120 can be a printed circuit board or a flexible print circuit; wherein, the flexible print circuit can effectively reduce the volume and weight of the light source module 12 .
光导杆122可透光,并包含一入光面1220及一出光面1222;入光面1220用以接收发光二极管126B、126G、126R产生的光线,出光面1222邻接于入光面1220,并用以供光线射出。The light guiding rod 122 can transmit light, and includes a light incident surface 1220 and a light exit surface 1222; the light incident surface 1220 is used to receive the light generated by the light emitting diodes 126B, 126G, 126R, and the light exit surface 1222 is adjacent to the light incident surface 1220, and is used for For light to exit.
光导杆122的底面(未另标号)可形成多个微棱镜1226, 其等用以使得由入光面1220进入光导杆122的光线得以传递至远光侧(即远离入光面1220处);底面邻接于入光面1220并可与出光面1222相对。微棱镜1226的布设数量随着其布设位置所接受到的光线强度而改变,并可例如呈非线性变化;借此,可让出光面1222输出的线性光线的均匀亮度。The bottom surface (not otherwise labeled) of the light guide rod 122 can form a plurality of microprisms 1226, which are used to make the light entering the light guide rod 122 from the light incident surface 1220 be transmitted to the far light side (ie away from the light incident surface 1220); The bottom surface is adjacent to the light incident surface 1220 and may be opposite to the light exit surface 1222 . The number of microprisms 1226 varies with the intensity of light received at the location where they are arranged, and can be non-linear, for example; thereby, the uniform brightness of the linear light output from the light emitting surface 1222 can be achieved.
更具体言之,在邻近入光面1220处,每单位面积中,微棱镜1226的布设数量低(即低密度);在远离入光面1220之处,每单位面积中,微棱镜1226的布设数量高(即高密度);申言之,微棱镜1226的布设密度与其布设位置所接收到的光线强度呈反比。More specifically, in the vicinity of the light incident surface 1220, the number of microprisms 1226 arranged per unit area is low (i.e. low density); The number is high (that is, high density); in other words, the arrangement density of the microprisms 1226 is inversely proportional to the light intensity received by the arrangement positions.
反光件124设置于基板120并包含一侧壁1240及一底壁1242;反光件124可为白色或银色等具备高反光效果的颜色制成。侧壁1240的内径随着远离基板120而增加,借以改变发光二极管126B、126G、126R产生的大角度光线的传递路径,据此大角度光线能够顺利地耦合至光导杆122,达到提高光利用率的效果。底壁1242连接于侧壁1240邻近基板120的一侧,供承载发光二极管126B、126G、126R。The reflective element 124 is disposed on the substrate 120 and includes a side wall 1240 and a bottom wall 1242 ; the reflective element 124 can be made of a color with high reflective effect such as white or silver. The inner diameter of the side wall 1240 increases as the distance from the substrate 120 increases, so as to change the transmission path of the large-angle light generated by the light-emitting diodes 126B, 126G, and 126R, so that the large-angle light can be smoothly coupled to the light guiding rod 122, thereby improving light utilization. Effect. The bottom wall 1242 is connected to one side of the side wall 1240 adjacent to the substrate 120 for supporting the LEDs 126B, 126G, 126R.
反光件124还包含多个连接件1244,其等的一端可设于底壁1242,并供与发光二极管126B、126G、126R形成电性连接;另一端突出于底壁1242之外,以供与基板120形成电性连接。The reflector 124 also includes a plurality of connectors 1244, one end of which can be arranged on the bottom wall 1242 for electrical connection with the light emitting diodes 126B, 126G, 126R; form an electrical connection.
请参见图3;发光二极管126B、126G、126R沿着一第一轴线A排列于底壁1242上,侧壁1240围绕发光二极管126B、126G、126R。每个发光二极管126B、126G、126R的光轴I与第一轴线A之间的距离不大于0.5毫米;其中,光轴C为每个发光二极管126B、126G、126R所发出的光线在空间中光强度分布的对称轴。Please refer to FIG. 3 ; the LEDs 126B, 126G, 126R are arranged on the bottom wall 1242 along a first axis A, and the sidewall 1240 surrounds the LEDs 126B, 126G, 126R. The distance between the optical axis I of each light emitting diode 126B, 126G, 126R and the first axis A is not more than 0.5 mm; wherein, the optical axis C is the light emitted by each light emitting diode 126B, 126G, 126R in space. The axis of symmetry of the intensity distribution.
发光二极管126B、126G、126R可分别在不同的时间点发光;在本实用新型中,发光二极管126B供产生波长介于450~480纳米的蓝光,发光二极管126G供产生波长介于508~555纳米的绿光,发光二极管126R供产生波长介于606~626纳米的红光。The light emitting diodes 126B, 126G, and 126R can emit light at different time points respectively; For green light, the light emitting diode 126R is used to generate red light with a wavelength between 606-626 nanometers.
请参见图4;当发光二极管126B、126G、126R与光导杆122完成组装后,第一轴线A平行于与出光面1222的一法线;发光二极管126R排列在最邻近出光面1222,发光二极管126G排列次靠近出光面1222,发光二极管126B排列最远离出光面1222;换言之,发光二极管126G排列在发光二极管126R和126B之间。据此,可以提高成像品质。在实际实施时,发光二极管126B、126G、126R与出光面1222的相对位置可依实际需求来调整。Please refer to FIG. 4; when the light-emitting diodes 126B, 126G, 126R are assembled with the light-guiding rod 122, the first axis A is parallel to a normal line to the light-emitting surface 1222; The second arrangement is closest to the light emitting surface 1222 , and the light emitting diode 126B is arranged farthest from the light emitting surface 1222 ; in other words, the light emitting diode 126G is arranged between the light emitting diodes 126R and 126B. Accordingly, imaging quality can be improved. In actual implementation, the relative positions of the light-emitting diodes 126B, 126G, 126R and the light-emitting surface 1222 can be adjusted according to actual needs.
在此要特别说明的是,发光二极管126B、126G、126R也可直接地安装于基板120上。在前述状态下,反光件124仅包含侧壁1240以供围绕发光二极管126B、126G、126R来改变其等发出的大角度光线的传递路径。换言之,当发光二极管126B、126G、126R直接在装在基板120时,反光件124可不包含在前所述的底壁1242;据此可降低光源模组12的整体长度。It should be noted here that the light emitting diodes 126B, 126G, 126R can also be directly mounted on the substrate 120 . In the aforementioned state, the reflector 124 only includes the side wall 1240 for surrounding the light emitting diodes 126B, 126G, 126R to change the transmission path of the large-angle light emitted by them. In other words, when the light emitting diodes 126B, 126G, 126R are directly installed on the substrate 120 , the light reflector 124 may not include the aforementioned bottom wall 1242 ; thus, the overall length of the light source module 12 can be reduced.
光源模组12还可包含一保护件128及一接合件130。保护件128局部地包覆光导杆122,并至少露出入光面1220及出光面1222;保护件128主要用于保护光导杆122,避免光导杆122于组装或运送时因无支撑而断裂。保护件128可使用白色或银色等具有反光效果的材料制作而成,据此可反射非由光导杆122的出光面1222出射的部份光线,达到提高光线使用效率的效果。The light source module 12 may further include a protection part 128 and a joint part 130 . The protective member 128 partially covers the light guiding rod 122 and at least exposes the light incident surface 1220 and the light emitting surface 1222 ; the protective member 128 is mainly used to protect the light guiding rod 122 and prevent the light guiding rod 122 from being broken due to no support during assembly or transportation. The protective member 128 can be made of white or silver material with reflective effect, so that it can reflect part of the light that is not emitted from the light-emitting surface 1222 of the light-guiding rod 122 , so as to improve the efficiency of light use.
接合件130的一端设有反光件124及发光二极管126B、126G、126R,光导杆122设于接合件130的另一端以接收发光二极管126B、126G、126R各别产生的蓝色光线、绿色光线、红色光线。换言之,接合件130的中心设有适当孔径的一开口(图中未示)以供发光二极管126B、126G、126R个别产生的蓝色光线、绿色光线、红色光线能顺利耦合至光导杆122。申言之,接合件130可提供光导杆122及发光二极管126B、126G、126R定位及提高光耦合率的效果。接合件130供容设发光二极管126B、126G、126R的一侧表面上还形成有多个凸肋132,其等穿设形成在基板120上的贯孔1200来达到定位效果。进一步地,借由控制发光二极管126B、126G、126R个别产生的蓝色光线、绿色光线、红色光线的时序,可让出光面1222射出的光线为经混光后人眼可视白光。One end of the joint 130 is provided with a reflector 124 and LEDs 126B, 126G, 126R, and the light guide rod 122 is arranged at the other end of the joint 130 to receive blue light, green light, red rays. In other words, an opening (not shown) with a suitable aperture is provided at the center of the joint member 130 so that the blue light, green light, and red light generated by the LEDs 126B, 126G, and 126R can be smoothly coupled to the light guiding rod 122 . In other words, the joint member 130 can provide the positioning of the light guiding rod 122 and the light emitting diodes 126B, 126G, 126R and the effect of improving the light coupling rate. A plurality of convex ribs 132 are formed on one side surface of the bonding member 130 for accommodating the LEDs 126B, 126G, 126R, and the ribs 132 pass through the through holes 1200 formed on the substrate 120 to achieve a positioning effect. Furthermore, by controlling the timing of the blue light, green light, and red light generated by the light emitting diodes 126B, 126G, and 126R, the light emitted from the light emitting surface 1222 can be mixed and visible to the human eye.
复参见图1;成像模组14容设于穿槽106中,用以使物件的影像得以成像于感测模组16;成像模组14可例如包含多个折射率渐变透镜。Referring again to FIG. 1 , the imaging module 14 is accommodated in the slot 106 for imaging the image of the object on the sensing module 16 ; the imaging module 14 may include a plurality of progressive refractive index lenses, for example.
感测模组16设置于座体10的一侧,并包含一电路板160及多个个感光件162。电路板160可例如(但不限定)为印刷电路板;基板120上的多个导电部1202可与电路板160上的多个连接垫164电性连接以撷取发光二极管126B、126G、126R发光所需电力。The sensing module 16 is disposed on one side of the base body 10 and includes a circuit board 160 and a plurality of photosensitive elements 162 . The circuit board 160 can be, for example (but not limited to), a printed circuit board; the plurality of conductive parts 1202 on the substrate 120 can be electrically connected to the plurality of connection pads 164 on the circuit board 160 to capture the light emitting diodes 126B, 126G, and 126R. electricity required.
感光件162沿着一第二轴线排列在电路板160上并与电路板160形成电性连接;感光件160的一光轴与第一轴线A的夹角θ可介于35~65度之间(如图5所示),且感光件162对应于穿槽106排列,以接收物件反射光源模组12产生的光线所产生的光学影像,进一步地将光学影像转换为类比或数位电子信号。感光件162可为电荷耦合元件、互补式金属氧化物半导体元件或其他具有光电转换特性的元件。The photosensitive element 162 is arranged on the circuit board 160 along a second axis and is electrically connected to the circuit board 160; the angle θ between an optical axis of the photosensitive element 160 and the first axis A can be between 35° and 65° (as shown in FIG. 5 ), and the photosensitive element 162 is arranged corresponding to the through groove 106 to receive the optical image generated by the object reflecting the light generated by the light source module 12 , and further convert the optical image into an analog or digital electronic signal. The photosensitive element 162 can be a charge-coupled device, a complementary metal-oxide-semiconductor device or other devices with photoelectric conversion properties.
本实用新型的取像装置1的发光二极管126B、126G、126R经适当地定位可增加出射光线的均匀度;再者,通过适当地排列光源模组12中供产生蓝光、绿光及红光的发光二极管126B、126G、126R及其等与出光面1222的相对位置,来达到提高成像品质的效果。The light-emitting diodes 126B, 126G, and 126R of the imaging device 1 of the present utility model can increase the uniformity of the outgoing light through proper positioning; moreover, by properly arranging the LEDs in the light source module 12 for generating blue light, green light and red light The relative positions of the light emitting diodes 126B, 126G, 126R and the like to the light emitting surface 1222 are used to improve the imaging quality.
以上所述实施例仅是为充分说明本实用新型而所举的较佳的实施例,本实用新型的保护范围不限于此。本技术领域的技术人员在本实用新型基础上所作的等同替代或变换,均在本实用新型的保护范围之内。本实用新型的保护范围以权利要求书为准。The above-mentioned embodiments are only preferred embodiments for fully illustrating the utility model, and the protection scope of the utility model is not limited thereto. Equivalent substitutions or transformations made by those skilled in the art on the basis of the present utility model are all within the protection scope of the present utility model. The scope of protection of the utility model shall be determined by the claims.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720676853.6U CN207200825U (en) | 2017-06-12 | 2017-06-12 | Light source module and imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720676853.6U CN207200825U (en) | 2017-06-12 | 2017-06-12 | Light source module and imaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207200825U true CN207200825U (en) | 2018-04-06 |
Family
ID=61784158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720676853.6U Expired - Fee Related CN207200825U (en) | 2017-06-12 | 2017-06-12 | Light source module and imaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207200825U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109040508A (en) * | 2017-06-12 | 2018-12-18 | 菱光科技股份有限公司 | Light source module and image capturing device |
-
2017
- 2017-06-12 CN CN201720676853.6U patent/CN207200825U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109040508A (en) * | 2017-06-12 | 2018-12-18 | 菱光科技股份有限公司 | Light source module and image capturing device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5499592B2 (en) | Light guide, light source device and reading device | |
| US7316353B2 (en) | Line-illuminating device and image-scanning device | |
| JP4788577B2 (en) | LIGHT GUIDE, LIGHT SOURCE DEVICE, AND ELECTRONIC DEVICE | |
| US9036220B2 (en) | Contact image sensing device | |
| US8885231B2 (en) | Illumination apparatus, image sensor unit, image reading apparatus, and image forming apparatus | |
| JP2001343531A (en) | Illumination device, image sensor having the illumination device, image reading device using the image sensor, and information processing system | |
| US10911632B2 (en) | Image scanning device | |
| CN102843488A (en) | Image sensor unit, image reader and image forming apparatus | |
| WO2019003480A1 (en) | Light guide body and image reading apparatus | |
| US8169673B2 (en) | Illuminating device and image reading apparatus | |
| CN207200825U (en) | Light source module and imaging device | |
| TWM548238U (en) | Lighting module and image capture apparatus | |
| TWI615015B (en) | Lighting module and image capture apparatus | |
| JP6479286B2 (en) | Illumination device and image reading device | |
| CN109040508A (en) | Light source module and image capturing device | |
| JPH10150526A (en) | Linear lighting device | |
| JP2012114759A (en) | Line light source | |
| CN110785988B (en) | Light guide and image reading apparatus | |
| CN115336241A (en) | Illumination device and image scanner | |
| CN207124194U (en) | Contact image sensor and light emitting module | |
| CN102221162A (en) | Light source module and contact image sensing device with the light source module | |
| CN103916563B (en) | Contact image sensing device | |
| JP6720022B2 (en) | Lighting device and image reading device | |
| US20020003580A1 (en) | Line image sensor module | |
| TWM547221U (en) | Contact image sensor and illuminant module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180406 Termination date: 20200612 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |