CN207542205U - Substrate board treatment - Google Patents
Substrate board treatment Download PDFInfo
- Publication number
- CN207542205U CN207542205U CN201721580438.7U CN201721580438U CN207542205U CN 207542205 U CN207542205 U CN 207542205U CN 201721580438 U CN201721580438 U CN 201721580438U CN 207542205 U CN207542205 U CN 207542205U
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- China
- Prior art keywords
- snap ring
- substrate
- bracket
- board treatment
- placement section
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 154
- 238000011282 treatment Methods 0.000 title claims abstract description 47
- 238000005259 measurement Methods 0.000 claims abstract description 124
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 31
- 230000000694 effects Effects 0.000 abstract description 24
- 230000002265 prevention Effects 0.000 abstract 1
- 238000000227 grinding Methods 0.000 description 30
- 238000005299 abrasion Methods 0.000 description 12
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 8
- 238000007665 sagging Methods 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- 238000005498 polishing Methods 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 3
- 230000007306 turnover Effects 0.000 description 3
- 239000013013 elastic material Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000019643 circumnutation Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000010002 mechanical finishing Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The substrate board treatment of the utility model includes：Carrier head has the snap ring for constraining the side of substrate；Bracket is used to place substrate；Measurement portion is installed on bracket, measures the distance change from bracket to snap ring；Wear extent detecting part based on the distance change that measurement portion measures, senses the wear extent of snap ring, it is hereby achieved that the wear extent of accurate sensing snap ring and in advance sensing, the prevention chip caused by retainer ring wear are detached from and the advantageous effects of process mistake.
Description
Technical field
The utility model is related to substrate board treatments, and more specifically, being related to one kind can accurately sense for bound base
The substrate board treatment of the wear extent of the snap ring of the disengaging of plate.
Background technology
Semiconductor element is manufactured by fine circuit line with High Density Integration, therefore, is carried out and this phase in wafer surface
The precise finiss answered.In order to more closely carry out the grinding of chip, as shown in Figures 1 and 2, implementation is carried out at the same time mechanical polishing
With the chemical-mechanical polishing process (CMP processes) of chemical formula grinding.
That is, above grinding table 10, the grinding pad 11 for pressurizeing and connecting to wafer W is mounted so as to revolve together with grinding table 10
Turn 11d, in order to chemical formula grind, on one side by the slurry supply opening 32 of supply unit 30 supply slurry, one in face of wafer W into
Mechanical polishing of the row based on friction.At this point, wafer W carries out rotation 20d in the position determined by means of carrier head 20, carry out
It is allowed to the grinding process critically planarized.
For adjuster 40 while being rotated to the direction represented with reference numeral 40d, arm 41 is to the side represented with 41d
To circumnutation is carried out, by means of the adjuster 40, the slurry for being coated on 11 surface of grinding pad can be on grinding pad 11
Even to be unfolded and be flowed into wafer W, grinding pad 11 can keep set and grind by means of the mechanical finishing process of adjuster 40
Flour milling.
As shown in figure 3, carrier head 1 includes：Main body 110；The pedestal 120 rotated together with main body 110；Snap ring 130, with
Around the annular state of pedestal 120, it can install, be rotated together with pedestal 120 up or down；The diaphragm 140 of elastic material, Gu
Due to pedestal 120, the space between pedestal 120 forms pressure chamber C1, C2, C3, C4, C5；Pressure control portion 150,
Pressure is adjusted while supplying pressure chamber C1, C2, C3, C4, C5 by air pressure service duct 155 or discharge air.
The diaphragm 140 of elastic material is formed with side in the edge termination bending for the flat floor 141 pressurizeed to wafer W
142.The central portion end 140a of diaphragm 140 is fixed on pedestal 120, forms the inlet hole 77 for being directly sucked in wafer W.In diaphragm
140 central portion can not also form inlet hole, but to be formed to the face that wafer W is pressurizeed.The center from diaphragm 140 to
Between side 142, it is formed with the next door 143 of multiple annular states for being fixed on pedestal 120, on the basis of next door 143, multiple pressure
Chamber C1, C2, C3, C4, C5 are with concentric circles morphologic arrangement.
Therefore, in chemical-mechanical polishing process, by means of the air pressure applied from pressure regulating part 195, pressure
Chamber C1, C2, C3, C4, C5 pressurize to the plate face of wafer W while expansion, by diaphragm bottom plate 141.
At the same time, the bottom surface 130s of the snap ring 130 rotated together with main body 110 and pedestal 120 also adds grinding pad 11
It presses and rotates, so as to prevent being detached to except carrier head 1 by the circular wafer W of snap ring 130.
On the other hand, in grinding process, since snap ring 130 also contacts grinding pad 11, thus the mill of snap ring 130 occurs
Damage.
But if more than the wear extent increase to a certain extent of snap ring 130, the contact that snap ring 130 contacts bracket is high
Degree changes, there are problems that when loading and unloading wafer occur process mistake, in grinding process, there are wafer W from
The problem of carrier head 1 is detached from.
Particularly in the grinding process of wafer W, chip revolves round the sun while rotation, and carries out high speed rotation, such as
The abrasion of fruit snap ring 130 carries out more than given degree, then gap is formed between grinding pad and snap ring 130 or snap ring 130 is difficult to
Grinding pad is contacted with sufficient plus-pressure, it is de- from carrier head 20 that wafer W occurs when there is the centrifugal force occurred when high speed rotation
From chip break-off, that is, the problem of occurring to slide (slip-out) phenomenon, and being equipped with wafer W and the periphery of disengaging
Collision, there are the problem of chip and damaged periphery equipment.
For this purpose, it is being intended to occur due to retainer ring wear recently to replace card in due course before chip disengaging and process mistake
A variety of discussions of ring, but it is also far from enough, it is desirable that the exploitation to this.
Utility model content
Technical problem to be solved
The utility model aim is, provides a kind of wear extent that can accurately sense for constraining the snap ring that substrate is detached from
Substrate board treatment.
Particularly the utility model aim is that it is possible to sense in advance, prevents the chip disengaging caused by retainer ring wear
And process mistake.
In addition, the utility model aim is that it is possible to accurately sense the state of wear of snap ring, the replacement cycle is easily carried out
Management.
In addition, the utility model aim is that it is possible to improve process efficiency and productivity.
In addition, the utility model aim is that it is possible to improve stability and reliability.
Technical solution
According to the preferred embodiment of described the utility model for being intended to reach the utility model aim, substrate board treatment packet
It includes：Carrier head has the snap ring for constraining the side of substrate；Bracket is used to place substrate；Measurement portion is installed on
Bracket measures the distance change from bracket to snap ring；Wear extent detecting part, based on the distance change that measurement portion measures, sensing
The wear extent of snap ring.
This is the wear extent in order to accurately sense snap ring, advance preventing substrate caused by snap ring is excessively worn be detached from and
Process mistake.
Particularly the utility model can accurately sense the mill of snap ring by means of measuring the distance change from bracket to snap ring
Damage amount, it is hereby achieved that caused by the retainer ring wear substrate be detached from and process mistake occur before replace snap ring in due course
Advantageous effects.
That is, in the past due to that can not know the degree of wear of snap ring, thus exist and be difficult to advance preventing because of snap ring excessive wear
Caused by substrate break-off in process mistake and grinding process in loading and unloading the problem of.But in this reality
In novel, by means of measuring the distance change from bracket to snap ring, the wear extent of snap ring can be accurately sensed, so as to obtain
The substrate obtained in process mistake and grinding process of the advance preventing when caused by snap ring excessive wear in loading and unloading takes off
Advantageous effects from phenomenon.
In addition, measurement portion is installed on bracket in a manner of being separated from the bottom surface of snap ring.
Bracket can place the offer of the various structures of substrate, the structure and characteristic of bracket can according to desired condition and
Design pattern and diversely change.For example, the substrate placed side for placing substrate and the snap ring for placing snap ring to be used in bracket
Placed side may be integrally formed or be provided in the form of separation.
As an example, bracket includes：Substrate placement section is used to place substrate；Snap ring placement section, is configured at base
The periphery of plate placement section, for placing snap ring.At this point, snap ring placement section can be separatedly to detach along the circumferencial direction of snap ring
Form provide or the circumferencial direction along snap ring, with continuous annular state offer.
In addition, the configuration of snap ring placement section is in the position higher than substrate placement section.
In addition, bracket can include flexible support portion, the flexible support portion is with relative to the substrate placement section, energy edge
The mode of upper and lower directions resilient movement supports the snap ring placement section.As described above, by being elastically supported snap ring placement section
Portion is flexibly supported, and when snap ring contacts snap ring placement section, snap ring placement section can carry out elastic shifting relative to substrate placement section
It is dynamic, thus the advantageous effects for making the impact force attenuation caused by contact of snap ring and snap ring placement section can be obtained.
As another example, bracket includes：Support puts plate, is separatedly configured from the bottom surface of substrate；Edge placement section, matches
It is placed in support to put above plate, the bottom edge of supporting substrate；Flexible support portion, putting plate relative to support can be elastic up or down
Bearing edge placement section.
Measurement portion is configured, it, can be with according to desired condition and design pattern to measure distance change from bracket to snap ring
It is installed on substrate placement section or is installed on snap ring placement section.
As an example, measurement portion is installed on substrate placement section.More specifically, it is formed with sensing in snap ring placement section
Hole, measurement portion are installed on substrate placement section in a manner of being configured at the lower part in configuration sensing hole, by sensing hole, measure to snap ring
Distance.
As another example, measurement portion is installed on snap ring placement section.More specifically, it is formed above snap ring placement section
There is holding tank, measurement portion is installed on the inside of the holding tank.
As measurement portion, a variety of measuring devices that can measure the distance change from bracket to snap ring can be used.It is preferred that
Ground as measurement portion, is used with the non-contact measurement apparatus of distance change of the contactless sensing from bracket to snap ring.As
One example as measurement portion, uses Proximity Sensor or displacement sensor.
Preferably, in a state that carrier head is configured at pre-set altitude datum relative to bracket, measurement portion measures
From bracket to the distance change of snap ring.
That is, the range measurement by means of measurement portion can be repeated whenever mutually different substrate is being handled.But
According to the processing sequence of mutually different substrate, carrying out based on during the range measurement of measurement portion, carrier head is relative to bracket
If altitude datum it is different every time, there are problems that being difficult to distance change of the accurate measurement from measurement portion to snap ring.For example,
It completes after measuring the 1st time from measurement portion to snap ring distance, is implementing the 2nd after to the grinding stage of other substrates
During secondary measurement, the additional abrasion that snap ring occurs, although the distance to snap ring increases " A ", but if with carrier head relative to bracket
Altitude datum reduce " A " state (than the 1st time measure when reduce " A " state) carry out the 2nd time measurement, then existing makes survey
The result that amount portion measures becomes the problem of identical with previously measured result (the 1st measurement result).But in the utility model
In, by means of making carrier head certain always relative to the altitude datum of bracket in each measure, can obtain raising by means of
The advantageous effects of the accuracy of measurement of measurement portion.
In addition, when in a state that snap ring is moved to the top height on carrier head, measurement portion is measured from bracket to card
The distance change of ring.
As described above, by means of being measured in the state of the top height is moved on carrier head in snap ring from bracket to card
The distance change of ring can obtain the advantageous effects for further improving the accuracy of measurement by means of measurement portion.
That is, in the case where carrier head is configured at aerial state (state separated from bracket), snap ring be configured to due to dead weight to
The sagging state in lower section, at this point, the sag of chain of snap ring can be different due to the degree of wear (the dead weight difference) of snap ring.But according to
The processing sequence of mutually different substrate, during carrying out the range measurement by means of measurement portion, if the sag of chain of snap ring is each
Difference, then carrier head is also different every time relative to the altitude datum of bracket, and accordingly, there exist be difficult to accurately measure from measurement portion to card
The problem of distance change of ring.But in the utility model, when snap ring is moved to the state of the top height on carrier head
Under (the sagging state for not having snap ring), measurement portion carries out range measurement, when can measure every time, definitely keeps carrying always
Head relative to bracket altitude datum, thus can obtain improve by means of measurement portion accuracy of measurement advantageous effects.
Furthermore, it is possible to along the circumferencial direction of bracket separatedly equipped with multiple measurement portions.As described above, by means of utilizing
Multiple measurement portions sense the abrasion of snap ring, can obtain the advantageous effects for improving sensing accuracy and reliability.
In addition, substrate board treatment can include flatness detecting part, the flatness detecting part is based on multiple measurement portions
Sensing as a result, sensing snap ring flatness.As described above, by means of sensing snap ring together while snap ring wear extent is measured
Flatness (abrasion deviation), can more accurately sense the state of wear of snap ring, easily carry out replacement cycle management.Into one
Step ground, can be based on the measurement being pre-equipped with for sensor card ring wear extent by means of the flatness sensing of flatness detecting part
Signal measured by portion is sensed, and because matching sensor for being ready for use on flatness sensing etc. without adding, thus can be obtained
The advantageous effects of structure and processing procedure must be simplified.
In addition, substrate board treatment includes control unit, the mill for the snap ring that the control unit is sensed based on wear extent detecting part
Damage amount carries out the grinding of substrate.
More specifically, control unit is configured to, if the wear extent of the snap ring of wear extent detecting part sensing is in allowed band
Within, then the treatment process of substrate is normally carried out, if the wear extent of snap ring exceeds allowed band, interrupts the processing work of substrate
Sequence.
As described above, when the wear extent of snap ring increases more than to a certain extent, control unit interrupts the treatment process of substrate,
It is hereby achieved that advance preventing because loaded caused by the excessive abrasion of snap ring and process mistake during unloading, grinding process in
Substrate break-off advantageous effects.
In addition, substrate board treatment includes alarm generating unit, when the mill for sensing the snap ring that wear extent detecting part is sensed
When damage amount is more than predetermined setting range, alarm generating unit signal an alert.
Utility model effect
In conclusion according to the utility model, accurate sensing can be obtained for constraining the abrasion of the snap ring of substrate disengaging
Amount prevents the advantageous effects of substrate disengaging and process mistake caused by snap ring excessive wear in advance.
In particular according to the utility model, the utility model, can be with by means of measuring the distance change from bracket to snap ring
The wear extent of accurate sensing snap ring, it is hereby achieved that occur the substrate caused by retainer ring wear be detached from and process mistake it
Before, the in due course advantageous effects for replacing snap ring.
In addition, according to the utility model, the shape of pre-set altitude datum is configured at relative to bracket in carrier head
Distance change from bracket to snap ring is measured under state, by means of this, when measuring every time, carrier head relative to bracket altitude datum
It can remain set, thus the advantageous effects for improving the accuracy of measurement by means of measurement portion can be obtained.
In addition, according to the utility model, when snap ring is moved to the state of the top height (without under snap ring on carrier head
Vertical state) under, measurement portion carries out range measurement, by means of this, when measuring every time, can definitely keep carrier head phase always
For the altitude datum of bracket, thus the advantageous effects for improving the accuracy of measurement by means of measurement portion can be obtained.
In addition, according to the utility model, by means of sensing the flat of snap ring together while the wear extent for measuring snap ring
It spends (abrasion deviation), it is hereby achieved that more accurately sensing the state of wear of snap ring, easily carrying out replacement cycle management
Advantageous effects.
In addition, according to the utility model, the advantageous effects for improving process efficiency and productivity can be obtained.
In addition, according to the utility model, the advantageous effects for improving stability and reliability can be obtained.
Description of the drawings
Fig. 1 is the vertical view for illustrating previous chemical-mechanical polishing device.
Fig. 2 is the side view for illustrating previous chemical-mechanical polishing device.
Fig. 3 is the sectional view for illustrating previous carrier head.
Fig. 4 and Fig. 5 is the figure for illustrating the substrate board treatment of the utility model first embodiment.
Fig. 6 and Fig. 7 is the figure for illustrating the substrate board treatment of the utility model second embodiment.
Fig. 8~Figure 10 is the figure for illustrating the substrate board treatment of the utility model 3rd embodiment.
Figure 11 and Figure 12 is the figure for illustrating the substrate board treatment of the utility model fourth embodiment.
Reference numeral
10：Substrate 100：Carrier head
200：Bracket 210：Support puts plate
210'：Substrate placement section 212：Sense hole
210"：Support puts plate 230 "：Edge placement section
230'：Snap ring placement section 240：Flexible support portion
300：Measurement portion 400：Wear extent detecting part
500：Control unit 600：Flatness detecting part
700：Alarm generating unit
Specific embodiment
With reference to the accompanying drawings, be described in detail the preferred embodiment of the utility model, but not the utility model by embodiment
Limitation limits.As reference, in the present note, identical label censures substantially the same element, can under this rule
It is illustrated with quoting the content recorded in different figures, it is convenient to omit judgement thinks that those skilled in the art are self-evident
Or the content repeated.
Fig. 4 and Fig. 5 is the figure for illustrating the substrate board treatment of the utility model first embodiment.
With reference to Fig. 4 and Fig. 5, the substrate board treatment of the utility model first embodiment includes：Carrier head 100, has
For constraining the snap ring 193 of the side of substrate 10；Bracket 200 is used to place substrate 10；Measurement portion 300 is installed on support
Frame 200 measures the variation from bracket 200 to 193 distance of snap ring；Wear extent detecting part 400 is measured based on measurement portion 300
Distance change senses the wear extent of snap ring 193.
The substrate board treatment of the utility model can make the substrate that will be ground 10 be loaded into carrier head 100 or
The substrate 10 that completion is ground is made to be unloaded to bracket 200.Below the substrate board treatment of the utility model is used to make to grind
The example that the substrate 10 of mill is loaded into carrier head 100 illustrates.
When loading substrate 10, in the lower part of carrier head 100, bracket 200 is moved upward, therefore, the card of carrier head 100
Ring 193 can be contacted first above bracket 200, if be spaced between the diaphragm 192 of carrier head close to both above bracket 200
Determine more than degree, then, by means of the sucking pressure (surface tension of diaphragm) of carrier head 100, substrate 10 can be loaded into carrying
First 100.
Carrier head 100 is supplied in slurry and is provided in grinding table (not shown) after bracket 200 loads substrate 10
Grinding pad (not shown) states above under, pressurize to substrate 10, to perform chemical-mechanical polishing process；
After using the chemical-mechanical polishing process of grinding pad and slurry, substrate 10 is transplanted on cleaning device.
As reference, in the utility model, so-called substrate 10, it can be understood as the grinding pair that can be ground on grinding pad
As object, the utility model is not restricted or limits due to the type and characteristic of substrate 10.As an example, it can use
Chip as substrate 10.
Carrier head 100 can be provided according to desired condition and design pattern with various structure.As an example,
Carrier head 100 includes：Main part 191 can rotate；Diaphragm 192, in the bottom surface of main part 191；Snap ring 193, to match
The mode for being placed in 192 periphery of diaphragm is incorporated into the edge part of main part 191, and substrate 10 is prevented to be detached from.
Diaphragm 192 can be provided according to desired condition and design pattern with various structure.As an example, exist
Could be formed with the multiple turnover panels turnover panel of state (for example, annular) on diaphragm 192, by means of multiple turnover panels, main part 191 with every
Between film 192, multiple pressure chamber 192C along the radial direction division of main part 192 can be provided.
In each pressure chamber 192C, the pressure sensor for measuring pressure can be respectively provided with.Each pressure chamber 192C's
Pressure can individually be adjusted according to the control of pressure regulating part 195, the pressure of each pressure chamber 192C can be adjusted, with indivedual
Adjust the pressurized pressure of substrate 10.In addition, retainer ring pressure chamber 193C can also be provided on the top of snap ring 193, can adjust
The pressure of retainer ring pressure chamber 193C, to adjust the pressurized pressure of snap ring 193.
In the central part of carrier head 100, the central part pressure that could be formed with by means of the opening of diaphragm 192 and be formed through
Power chamber 195X.Central part pressure chamber 195X is directly connected with substrate 10, because sucking pressure is acted on, substrate 10 is made to be adjacent to carrier head
100 diaphragm 192, so as to load substrate 10.According to circumstances, sucking pressure can not also be applied, only by the surface of diaphragm
Tension can load substrate.
Bracket 200 can be lifted along upper and lower directions, above bracket 200, be placed with the substrate 10 for loading.
As reference, when loading substrate 10, in the lower part of carrier head 100, bracket 200 is moved upward, therefore, carrying
First 100 snap ring 193 can be contacted first above bracket 200, approached if be spaced between diaphragm 192 above bracket 200
To a certain range, then by means of the sucking pressure of carrier head 100, substrate 10 can be loaded into carrier head 100.
Bracket 200 can with can substrate 10 place various structures provide, the structure and characteristic of bracket 200 can bases
It is required that condition and design pattern and diversely change.For example, it is used to place substrate placed side and the use of substrate 10 in bracket 200
It may be integrally formed in the snap ring placed side for placing snap ring 193 or provided in the form of separation.
As an example, with reference to Fig. 4 and Fig. 5, bracket 200 includes substrate placed side and the use by being used to place substrate 10
Plate 210 is put in the support that the snap ring placed side for placing snap ring 193 is integrally formed.At this point, snap ring placed side can form with low
Height in substrate placed side.More specifically, the substrate placed side that central portion is equipped with above plate 210, Ke Yifang are put in support
Substrate 10 is put, snap ring 193 can be contacted with the snap ring placed side that edge part is equipped with above bracket 200.
Moreover, bracket 200 can be lifted, the liter of bracket 200 by means of the driving portion (MH) of such as common motor
Drop structure can diversely be changed according to desired condition and design pattern.
Measurement portion 300 is installed on bracket 200, to measure from bracket 200 to the distance change of snap ring 193.
Wherein, so-called measurement portion 300 measures the distance change from bracket 200 to snap ring 193, is defined as measuring from measurement portion
The distance of 300 infields to the bottom surface of snap ring 193.
As measurement portion 300, it can use and can measure from bracket 200 to a variety of measurements of the distance change of snap ring 193 dress
It puts.Preferably as measurement portion 300, use and connect with contactless sensing from bracket 200 to the non-of the distance change of snap ring 193
Touch measuring device.As an example, as measurement portion 300, Proximity Sensor or displacement sensor are used.According to feelings
Condition can also utilize touch sensor or other different sensors, measure the distance change from bracket to snap ring.
More specifically, measurement portion 300 is installed on bracket 200 in a manner of being separated from the bottom surface of snap ring 193.As one
Example puts plate 210 in support and is formed through sensing hole 212, and measurement portion 300 is configured at the lower part in sensing hole 212, by sensing hole
212, it measures to the distance of snap ring 193.
At this point, measurement portion 300 can be installed on the bottom that support puts plate 210 in a manner of being configured at the lower part in sensing hole 212
Face.According to circumstances or measurement portion is put the bottom surface of plate from support and is separatedly installed.
The distance change that wear extent detecting part 400 is measured based on measurement portion 300 (becomes from bracket 200 to the distance of snap ring
Change), the wear extent of sensing snap ring 193.
With reference to Fig. 5, the wear extent increase proportional to the number of grinding process repeatedly of snap ring 193, if it is known that from bracket
200 to snap ring 193 distance, then understand snap ring 193 wear extent.
More specifically, if the distance to snap ring 193 such as L1, L2, L3 that measurement portion 300 measures gradually increase (L1
＜ L2 ＜ L3), then it can sense the wear extent increase for snap ring 193.At this point, under the different distance variation that measurement portion 300 measures
193 wear extent of snap ring can be pre-stored within look-up table (Lookup Table), and wear extent detecting part 400 can utilize look-up table
In pre-stored information, the wear extent that the different distance of quick sensing to snap ring 193 changes.
Preferably, with reference to Fig. 5, measurement portion 300 is configured at pre-set benchmark in carrier head 100 relative to bracket 200
In the state of height SH, the distance change from bracket 200 to snap ring 193 is measured.
It is wherein, so-called in a state that carrier head 100 is configured at pre-set altitude datum SH relative to bracket 200,
It measures from bracket 200 to the distance change of snap ring 193, is defined as being configured at relative to bracket 200 in carrier head 100 identical always
Altitude range in the state of, every time carry out by means of measurement portion 300 range measurement.
That is, by means of the range measurement of measurement portion 300, can be repeated whenever mutually different substrate 10 is handled.
But in the processing sequence according to mutually different substrate 10, during carrying out the range measurement by means of measurement portion 300, if
Carrier head 100 is different every time relative to the altitude datum SH of bracket 200, then exists and be difficult to accurately measure from measurement portion 300 to card
The problem of distance change of ring 193.For example, after being measured to the 1st time from measurement portion 300 to 193 distance of snap ring, passing through
When measuring carrying out the 2nd time after the grinding stage of other substrates 10, the additional abrasion that snap ring 193 occurs, although to snap ring 193
Distance increase " A ", but if be in carrier head 100 relative to bracket 200 altitude datum reduce " A " state (ratio the 1st
The state of " A " is reduced during secondary measurement), carry out the 2nd measurement, then there is the result for measuring measurement portion 300 with measuring before
Result (the 1st measurement result) it is identical the problem of.But in the utility model, by means of making carrying in each measure
First 100 is set always relative to the altitude datum SH of bracket 200, and it is accurate by means of the measurement of measurement portion 300 can to obtain raising
The advantageous effects of degree.
In addition, with reference to Fig. 4, measurement portion 300 is configured to, and is moved on carrier head 100 in snap ring 193 high topmost
It spends in the state of H1, measures the distance change from bracket 200 to snap ring 193.
Wherein, so-called snap ring 193 is moved to the state of the top height on carrier head 100, is defined as to retainer ring pressure
Chamber 193C applies negative pressure, in the case where snap ring 193 is not sagging, in the section that snap ring 193 can move on carrier head 100
In (for example, H1, H2, H3), snap ring 193 is moved to the state of highest section H1.
As described above, by means of being measured in the state of the top height is moved on carrier head 100 in snap ring 193 from support
Frame 200 to snap ring 193 distance change, can obtain further improve by means of measurement portion 300 accuracy of measurement it is advantageous
Effect.
That is, in the case where carrier head 100 is configured at aerial state (state separated from bracket 200), snap ring 193 be configured to because
Dead weight and sagging state downwards, at this point, the sag of chain (for example, H1, H2, H3) of snap ring 193 can be because of the abrasion of snap ring 193
Degree (dead weight difference) and it is different.But it in the processing sequence according to mutually different substrate 10, carries out by means of measurement portion 300
Range measurement during, if the sag of chain of snap ring 193 is different every time, carrier head 100 relative to bracket 200 altitude datum
(with reference to the SH of Fig. 5) is also different every time, and accordingly, there exist be difficult to accurately measure from measurement portion 300 to the distance change of snap ring 193
The problem of.But in the utility model, when the state that snap ring 193 is moved to the top height H1 on carrier head 100 (does not have
Have the state that snap ring is sagging) under, measurement portion 300 carries out range measurement, and carrier head can be definitely kept always when measuring every time
100 relative to bracket 200 altitude datum, thus can obtain improve by means of measurement portion 300 accuracy of measurement it is advantageous
Effect.
In addition, substrate board treatment includes control unit 500, the control unit 500 is based on being sensed by wear extent detecting part 400
Snap ring 193 wear extent, the grinding of control base board 10.
More specifically, control unit 500 is configured to, if the wear extent for the snap ring 193 that wear extent detecting part 400 senses
Within allowed band, then it is normally carried out the treatment process of substrate 10, if the wear extent of snap ring 193 exceeds allowed band,
Then interrupt the treatment process of substrate 10.
If as described above, more than the wear extent increase to a certain extent of snap ring 193, control unit 500 interrupts substrate 10
Treatment process, it is hereby achieved that advance preventing process when loading and unloading caused by the excessive wear of snap ring 193 is wrong
Accidentally, the advantageous effects of 10 break-off of substrate in grinding process.
Fig. 6 and Fig. 7 is the figure for illustrating the substrate board treatment of the utility model second embodiment, and Fig. 8~Figure 10 is
For illustrating the figure of the substrate board treatment of the utility model 3rd embodiment.Moreover, for identical and suitable with aforementioned composition
In identical part, assign same or equivalent in identical reference numeral, omission detailed description thereof.
It is used to place the substrate placed side of substrate 10 in another embodiment according to the present utility model, bracket 200', 200 "
It can be provided with for placing the snap ring placed side of snap ring 193 with the structure of separation.
With reference to Fig. 6 and Fig. 7, the substrate board treatment of the utility model second embodiment includes：Carrier head 100, has
For constraining the snap ring 193 of the side of substrate 10；Bracket 200 ' is used to place substrate 10；Measurement portion 300 is installed on support
Frame 200 ' measures the distance change from bracket 200 ' to snap ring 193；Wear extent detecting part 400 is measured based on measurement portion 300
Distance change, sense snap ring 193 wear extent；And bracket 200' includes：Substrate placement section 210', is used to place substrate
10；Snap ring placement section 230' is configured at the periphery of substrate placement section 210', for placing snap ring 193.
Substrate placement section 210' can be formed with that can place the variform of substrate 10.As an example, substrate is placed
Portion 210' is configured to the bottom surface of comprehensively supporting substrate 10.
Snap ring placement section 230' can be provided according to desired condition and design pattern with various structures.Show as one
Example, snap ring placement section 230' can provide separatedly detached along the circumferencial direction of snap ring 193 it is multiple.As another example, block
Ring placement section 230' can be provided along the circumferencial direction of snap ring 193 with continuous annular state.
Preferably, snap ring placement section 230' can be only fitted to the position higher than substrate placement section 210'.According to circumstances, also may be used
To be that snap ring placement section is configured at the height identical with substrate placement section or is configured at the position less than substrate placement section.
In addition, bracket 200', which can include flexible support portion 240', the flexible support portion 240', supports snap ring placement section
230' enables snap ring placement section 230' relative to substrate placement section 210', along the vertical direction resilient movement.
As flexible support portion 240', common spring can be used.According to circumstances, air pressure or liquid can also be utilized
Pressure substitutes spring, and making snap ring, the impact force caused by contact is decayed with snap ring placement section.
As described above, by the way that snap ring placement section 230' is made to be elastically supported portion 240' resilient support, when snap ring 193 contacts
During snap ring placement section 230', snap ring placement section 230' can carry out resilient movement relative to substrate placement section 210', therefore, can be with
Snap ring 193 and snap ring placement section 230' impact forces caused by contact is made to decay.In addition, this structure is in snap ring 193 and card
When ring placement section 230' is contacted, snap ring placement section 230' is allow to carry out elastic compression to flexible support portion 240' and to lower part
Predetermined interval is moved in direction, in the state of being configured in diaphragm 192 and substrate 10 further to ground, realizes substrate 10
Loading.
Measurement portion 300 can be installed on substrate placement section 210' or be installed on card according to desired condition and design pattern
Ring placement section 230'.
As an example, with reference to Fig. 6 and Fig. 7, measurement portion 300 can be installed on substrate placement section 210'.It is more specific and
Speech is formed with sensing hole 232a' in snap ring placement section 230', and measurement portion 300 is in a manner of being configured at the lower part of sensing hole 232a'
It is installed on substrate placement section 210'.
Measurement portion 300 can be measured to the distance of snap ring 193 by sensing hole 232a', and wear extent detecting part 400 can be with
Based on the result (distance change) that measurement portion 300 measures, the wear extent of snap ring 193 is sensed.
As another example, with reference to Fig. 8 and Fig. 9, measurement portion 300 can be installed on snap ring placement section 230'.It is more specific and
Speech, is formed with holding tank 232b', measurement portion 300 is installed on the interior of the holding tank 232b' above snap ring placement section 230'
Portion.
Measurement portion 300 can measure the distance from holding tank 232b' to snap ring 193, and wear extent detecting part 400 can be with base
In the result (distance change) that measurement portion 300 measures, the wear extent of snap ring 193 is sensed.
With reference to Figure 10, measurement portion 300 can separatedly be equipped with multiple along the circumferencial direction of bracket.It is set forth below along support
The example that the circumferencial direction of frame separatedly has 3 measurement portions 300 illustrates.According to circumstances, the survey of 4 or more can be used
Amount portion, the utility model are not limited or are limited due to the number of measurement portion and configuration space.
As described above, the abrasion by means of sensing snap ring 193 using multiple measurement portions 300, can obtain raising sensing
Accuracy and the advantageous effects of reliability.
In addition, with reference to Fig. 8~Figure 10, substrate board treatment can include flatness detecting part 600, the flatness sensing
Portion 600 based on multiple measurement portions 300 sense as a result, sensing snap ring 193 flatness.
The distance change that flatness detecting part 600 is sensed respectively based on multiple measurement portions 300 senses the abrasion of snap ring 193
It is equably to occur on the whole, abrasion deviation still has occurred.
As described above, flatness (the mill by means of sensing snap ring 193 together while the wear extent for measuring snap ring 193
Damage deviation), the state of wear of snap ring 193 can be more accurately sensed, easily carries out replacement cycle management.Further, it borrows
Help the flatness sensing of flatness detecting part 600, the survey that can be pre-equipped with based on the wear extent for sensor card ring 193
The signal that amount portion 300 measures is sensed, because without additional with being ready for use on sensor that flatness senses etc., thus can be with
Obtain the advantageous effects for simplifying structure and processing procedure.
Figure 11 and Figure 12 is the figure for illustrating the substrate board treatment of the utility model fourth embodiment.Moreover, for
It is identical with aforementioned composition and be equivalent to identical part, it assigns same or equivalent in identical reference numeral, omits to the detailed of its
It describes in detail bright.
With reference to Figure 11 and Figure 12, the substrate board treatment of the utility model fourth embodiment includes：Carrier head 100, tool
It is ready for use on the snap ring 193 of the side of constraint substrate 10；Bracket 200 " is used to place substrate 10；Measurement portion 300, is installed on
Bracket 200 " is measured from bracket 200 " to the distance change of snap ring 193；Wear extent detecting part 400 is surveyed based on measurement portion 300
The distance change of amount senses the wear extent of snap ring 193；And bracket 200 " includes：Support puts plate 210 ", from the bottom surface of substrate 10
Separatedly it is configured；Edge placement section 230 " is configured at support and puts plate 210 " above, the bottom edge of supporting substrate 10；Elasticity
Support portion 240 " puts plate 210 " can flexibly support edge placement section 230 up or down " relative to support.
" sensing hole 212 is formed with, measurement portion 300 senses the lower part in hole 212 to be configured at this point, in edge placement section 230
Mode be installed on support and put plate 210 ".
Measurement portion 300 can be measured to the distance of snap ring 193, wear extent detecting part 400 can be with base by sensing hole 212
In the result (distance change) that measurement portion 300 measures, the wear extent of snap ring 193 is sensed.
As described above, substrate 10 is by means of edge placement section 230 ", only bottom edge region is partly supported, thus
It can make bracket 200 and " minimize with the contact area of substrate 10, " remained between substrate 10 by means of making foreign matter in bracket 200
Realize and minimize, can make because of bracket 200 that " damage of substrate 10 is realized minimum caused by the contact area increase with substrate 10
Change.
In addition, by means of flexibly supporting edge placement section 230 " being elastically supported portion 240 ", when 193 contact edge of snap ring
During edge placement section 230 ", edge placement section 230 " plate 210 can be put relative to support " carries out resilient movement, therefore, can make because of card
Ring 193 and edge placement section 230 " impact force attenuation caused by contacting.
In addition, with reference to Figure 11, the substrate board treatment of the utility model can include alarm generating unit 700, when sensing
When the wear extent of the snap ring 193 that the wear extent detecting part 400 is sensed is more than predetermined setting range, the police
Report 700 signal an alert of generating unit.
Wherein, so-called alarm signal, can include by means of common audio device audible alarm signals and by means of
At least one of visual warning signal of common warning light, can additionally utilize can allow user to recognize snap ring 193
Other the different a variety of alarm signals for the situation that wear extent excessively occurs.
As described above, the preferred embodiment with reference to the utility model is illustrated, but as long as being relevant art field
Skilled practitioner just it will be appreciated that without departing from the utility model claims record the utility model thought and
In the range of field, the utility model diversely can be revised and changed.
Claims (16)
1. a kind of substrate board treatment, which is characterized in that including：
Carrier head has the snap ring for constraining the side of substrate；
Bracket is used to place the substrate；
Measurement portion is installed on the bracket, measures the distance change from the bracket to the snap ring；
Wear extent detecting part based on the distance change measured by the measurement portion, senses the wear extent of the snap ring.
2. substrate board treatment according to claim 1, which is characterized in that
The measurement portion is installed on the bracket in a manner of being separated from the bottom surface of the snap ring.
3. substrate board treatment according to claim 1, which is characterized in that
The bracket includes：
Substrate placement section is used to place the substrate；
Snap ring placement section is configured at the periphery of the substrate placement section, for placing the snap ring.
4. substrate board treatment according to claim 3, which is characterized in that
The snap ring placement section configuration is in the position higher than the substrate placement section.
5. substrate board treatment according to claim 3, which is characterized in that
Further include flexible support portion, the flexible support portion relative to the substrate placement section, elasticity to move along the vertical direction
Dynamic mode supports the snap ring placement section.
6. substrate board treatment according to claim 4, which is characterized in that
The measurement portion is installed on the substrate placement section.
7. substrate board treatment according to claim 6, which is characterized in that
Sensing hole is formed in the snap ring placement section, the measurement portion is configured at the lower part in the sensing hole, passes through the sense
Gaging hole is measured to the distance of the snap ring.
8. substrate board treatment according to claim 3, which is characterized in that
The measurement portion is installed on the snap ring placement section.
9. substrate board treatment according to claim 8, which is characterized in that
Holding tank is formed with above the snap ring placement section, the measurement portion is installed on the inside of the holding tank.
10. the substrate board treatment according to any one in claim 1~9, which is characterized in that
The measurement portion is with contactless sensing the distance between from the bracket to the bottom surface of the snap ring.
11. substrate board treatment according to claim 10, which is characterized in that
The measurement portion is Proximity Sensor or displacement sensor.
12. the substrate board treatment according to any one in claim 1~9, which is characterized in that
Along the circumferencial direction of the bracket separatedly equipped with multiple measurement portions.
13. substrate board treatment according to claim 12, which is characterized in that
Including flatness detecting part, sensing result of the flatness detecting part based on multiple measurement portions senses the card
The flatness of ring.
14. the substrate board treatment according to any one in claim 1~9, which is characterized in that
It is more than in advance really when sensing the wear extent of the snap ring that the wear extent detecting part sensed including alarm generating unit
During fixed setting range, the alarm generating unit signal an alert.
15. the substrate board treatment according to any one in claim 1~9, which is characterized in that
In a state that the carrier head is configured at pre-set altitude datum relative to the bracket, the measurement portion measures
From the bracket to the distance change of the snap ring.
16. the substrate board treatment according to any one in claim 1~9, which is characterized in that
In a state that the snap ring is moved to the top height on the carrier head, the measurement portion is measured from the bracket
To the distance change of the snap ring.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0052137 | 2017-04-24 | ||
| KR1020170052137A KR20180118896A (en) | 2017-04-24 | 2017-04-24 | Substrate procesing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207542205U true CN207542205U (en) | 2018-06-26 |
Family
ID=62614509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721580438.7U Active CN207542205U (en) | 2017-04-24 | 2017-11-23 | Substrate board treatment |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20180118896A (en) |
| CN (1) | CN207542205U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117484382A (en) * | 2023-11-14 | 2024-02-02 | 北京子牛亦东科技有限公司 | Diaphragm for grinding head of chemical mechanical grinding equipment |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102735264B1 (en) * | 2018-12-10 | 2024-11-27 | 주식회사 케이씨텍 | Substrate processing apparatus |
| KR102670164B1 (en) * | 2018-12-24 | 2024-05-29 | 주식회사 케이씨텍 | Substrate processing apparatus |
| WO2023234973A1 (en) * | 2022-06-03 | 2023-12-07 | Applied Materials, Inc. | Acoustic monitoring of cmp retaining ring |
-
2017
- 2017-04-24 KR KR1020170052137A patent/KR20180118896A/en not_active Withdrawn
- 2017-11-23 CN CN201721580438.7U patent/CN207542205U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117484382A (en) * | 2023-11-14 | 2024-02-02 | 北京子牛亦东科技有限公司 | Diaphragm for grinding head of chemical mechanical grinding equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180118896A (en) | 2018-11-01 |
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