CN208368498U - Lead frame and semiconductor devices - Google Patents
Lead frame and semiconductor devices Download PDFInfo
- Publication number
- CN208368498U CN208368498U CN201821153533.3U CN201821153533U CN208368498U CN 208368498 U CN208368498 U CN 208368498U CN 201821153533 U CN201821153533 U CN 201821153533U CN 208368498 U CN208368498 U CN 208368498U
- Authority
- CN
- China
- Prior art keywords
- pin
- chip
- interim pins
- pins
- interim
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 239000003292 glue Substances 0.000 claims description 9
- 239000000084 colloidal system Substances 0.000 claims description 5
- 230000001154 acute effect Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 22
- 230000015556 catabolic process Effects 0.000 abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model provides a kind of lead frame and semiconductor devices, lead frame includes multiple frame units, the other side of interim pins is arranged in second side pin in each frame unit, second side pin includes the second internal pin, second internal pin increases along the direction close to interim pins, and second internal pin close to the side of interim pins there is a bevel edge for extending to by top bottom end, the bevel edge is opposite and parallel with the side of interim pins.Second internal pin increases along the direction of interim pins, its bonding area can be made to increase, and realizes the welding of the thicker lead of more diameters, increases the overcurrent capability of second side pin；Second internal pin has the bevel edge extended from top to bottom end, the bevel edge is opposite and parallel with the side of interim pins, the spacing between second side pin and the opposite part of interim pins can be made consistent, reduce the risk for generating breakdown between adjacent pin, guarantee product stability.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors, in particular to a kind of lead frame and semiconductor devices.
Background technique
In semiconductor packages, pressure welding area is usually set on the pin of lead frame, then by the two of lead
End is welded with chip and pressure welding area respectively, so that chip be made to be electrically connected with the pin of lead frame.
But when encapsulation has the chip of relatively high power, it is necessary to use much thicker leads, can just make semiconductor device
Part carries larger current.It is smaller to can weld area for the pin of lead frame at present, when need pressure welding area weld more it is thicker
When aluminum steel, existing pressure welding area can not accommodate these much thicker leads, not be able to satisfy product improved high current behaviour.Simultaneously
For the pin of lead frame when welding much thicker leads, the pin for welding lead needs correspondingly area increased, makes it
It not can guarantee the spacing between adjacent pin, be easy the risk for making product generate breakdown, not can guarantee the stability of product.
Utility model content
The utility model aim is to solve in prior art lead frame and semiconductor devices, and pin can not weld more
Thicker lead, and the problem of puncturing risk easily occurs between adjacent pin.
In order to solve the above technical problems, the utility model provides a kind of lead frame, including multiple frame units, it is each described
Frame unit includes radiating part, chip substrate, interim pins, the first side pipe foot and second side pin；Chip Ji Dao is used for
Chip, the chip Ji Dao connection radiating part；Interim pins are connected to the bottom of the chip Ji Dao；First side pipe
The side of the interim pins is arranged in foot；The other side of the interim pins, second side pipe is arranged in second side pin
Foot includes the second internal pin, and second internal pin increases along the direction close to the interim pins, and second internal pin
There is a bevel edge that bottom end is extended to by top, the side of the bevel edge and the interim pins close to the side of the interim pins
Side is opposite and parallel.
Preferably, the outer profile of internal pin is in short trapezoidal in the long bottom edge of top margin, and second internal pin is close to the intermediate tube
The side of foot is the bevel edge, and the angle between the bevel edge and the top margin is acute angle.
Preferably, the angle of the bevel edge and the top margin is 43 °~45 °.
Preferably, the area of second internal pin is gradually reduced from top to bottom end.
Preferably, the distance between bevel edge side opposite with the interim pins is 0.37mm~0.47mm.
Preferably, during the interim pins include top section, bottom section and are connected between the top section and bottom section
Section；The top section is connect with the chip Ji Dao, and the middle section is obliquely installed, and is tilted towards the first side pipe foot.
Preferably, the first side pipe foot includes the first internal pin and is connected to outside the first of first internal pin bottom end
Pin, first internal pin are equipped with the lock glue for locking colloid and the lead frame away from the side of the interim pins
Shrinkage pool, the lock glue shrinkage pool profile is arc-shaped, taper, trapezoidal or rectangle.
Preferably, triode chip is installed on the chip Ji Dao, the triode chip be equipped with source electrode, grid and
Drain electrode, for connect with the grid, second side pin is used to connect with the source electrode the first side pipe foot, it is described in
Between pin be used for and the drain electrode connection.
The utility model also provides a kind of semiconductor devices, including frame unit, package casing and chip；The frame
Unit includes radiating part, chip Ji Dao, interim pins, the first side pipe foot and second side pin；Chip Ji Dao connection is described to be dissipated
Hot portion and the inside for being coated on the package casing, the chip Ji Dao is for installing the chip；Interim pins are connected to institute
State the bottom of chip Ji Dao；The side of the interim pins is arranged in first side pipe foot；Second side pin is arranged in the centre
The other side of pin, second side pin include the second internal pin, and second internal pin is along close to the interim pins
Direction increases, and second internal pin is extended to the bevel edge of bottom end close to the side of the interim pins with one by top,
The bevel edge is opposite and parallel with the side of the interim pins.
Preferably, the chip is triode chip, which is equipped with source electrode, grid and drain electrode, the grid and institute
The connection of the first side pipe foot is stated, the source electrode is connect with second side pin, and the drain electrode is connect with the interim pins.
As shown from the above technical solution, the utility model has the following beneficial effects:
In the lead frame and semiconductor devices of the utility model, the second internal pin increases along the direction of interim pins, can
Increase the bonding area on second side pin, more can be welded while guaranteeing that pin is laid below chip base island
The thicker lead of diameter realizes the characteristic of semiconductor product high current to increase the overcurrent capability of second side pin；Furthermore
Second internal pin has a bevel edge from top to bottom end that extends from, the bevel edge and the side of interim pins with respect to and parallel, Neng Gou
While guaranteeing that second side pin bonding area increases, the spacing one between part that keeps second side pin opposite with interim pins
It causes, to reduce the risk for generating breakdown between second side pin and interim pins, to guarantee the stability of product.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of frame unit in the utility model leadframe embodiments.
Fig. 2 is the schematic enlarged-scale view in Fig. 1 at A.
The reference numerals are as follows: 1, frame unit；11, radiating part；12, chip Ji Dao；131, interim pins；1311,
Push up section；1312, bottom section；1313, middle section；1314, first side；132, the first side pipe foot；1321, the first internal pin；1322,
One external pin；1323, glue shrinkage pool is locked；1324, the first clamp area；1325, the second clamp area；133, second side pin；1331,
Two internal pins；1332, the second external pin；1333, bevel edge.
Specific embodiment
The exemplary embodiment for embodying the utility model features and advantages will describe in detail in the following description.It should be understood that
Be that the utility model can have various variations in different embodiments, all do not depart from the model of the utility model
It encloses, and the descriptions and illustrations are essentially for illustration purposes, rather than to limit the utility model.
Preferred implementation in order to further illustrate the principles of the present invention and structure, now in conjunction with attached drawing to the utility model
Example is described in detail.
Refering to fig. 1 and Fig. 2, the application preferred embodiment provide a kind of lead frame comprising multiple frame units 1, it should
Frame unit 1 includes radiating part 11, chip base island 12, interim pins 131, the first side pipe foot 132 and second side pin 133.
Specifically, chip base island 12 is connect with radiating part 11, which is used for chip.Fig. 1's and Fig. 2
On view direction, interim pins 131 are connected to the bottom on chip base island 12, and interim pins 131 are arranged in the first side pipe foot 132
Side.The other side of interim pins 131 is arranged in second side pin 133, which includes the second internal pin
1331.Second internal pin 1331 increases along the direction close to interim pins 131, and the second internal pin 1331 is close to interim pins
131 side has a bevel edge 1333 for extending to bottom end by top, the bevel edge 1333 it is opposite with the side of interim pins 131 and
In parallel.
Further, second side pin 133 further includes the second external pin 1332, and the second external pin 1332 is arranged in second
1331 bottom of pin.The upper surface of second internal pin 1331 is used for welding lead, to realize the company of second side pin 133 Yu chip
It connects.
Second internal pin 1331 of the present embodiment increases along the direction close to interim pins 131, the second internal pin 1331
Outer profile is in short trapezoidal in the long bottom edge of top margin.Second internal pin 1331 is bevel edge 1333, bevel edge close to the side of interim pins 131
Angle ɑ between 1333 and top margin is acute angle.
In second internal pin 1331 of the present embodiment, the size of the angle ɑ between bevel edge 1333 and top margin is 43 °~
45°.On the one hand such setting can satisfy the increase demand of the second internal pin 1331 pin 131 towards the middle, to expand second
The bonding area of internal pin 1331 enables the second internal pin 1331 to weld the much thicker leads of diameter, to increase second
The overcurrent capability of side pipe foot 133；On the other hand the gradient of bevel edge 1333 can be made to conform to lead on the second internal pin 1331
Gradient, convenient for welding of the lead on second side pin 133.
Preferably, in the present embodiment, the area of the second internal pin 1331 is gradually reduced from top to bottom end.Second inner tube
Area of the foot 1331 close to top is larger, can provide biggish welding space for much thicker leads；Second internal pin
1331 area close to bottom end is smaller, it is possible to reduce is not necessarily to the region of welding lead on the second internal pin 1331, guarantees intermediate tube
The arrangement of foot 131 and the first side pipe foot 132, it is ensured that the compatibility and whole structural strength of product.
In second side pin 133 of the present embodiment, the second external pin 1332 is arranged close to the outside of the second internal pin 1331,
The outside of second internal pin 1331 is concordant with the outside on chip base island 12, to provide bigger prolong for the second internal pin 1331
Space is stretched, so as to which much thicker leads can be connected on the second internal pin 1331.In addition, 1331 surface area of the second internal pin increases
Greatly, when guaranteeing the welding space of much thicker leads, moreover it is possible to provide grasping part for welding fixture, guarantee the suitable of lead welding
Benefit carries out.
Further, interim pins 131 include top section 1311, bottom section 1312 and are connected to top section 1311 and bottom section 1312
Between middle section 1313.In the present embodiment, top section 1311 is connect with chip base island 12, and the middle section 1313 of interim pins 131 is in
It is skewed, and tilted towards the first side pipe foot 132.Middle section 1313 is obliquely installed, and can be provided for the second internal pin 1331 bigger
Expansive space.In some other more preferably embodiment, the middle sections 1313 of interim pins 131 is in bending, and towards first
Side pipe foot 132 is bent.In addition, in other more preferably embodiment, middle section 1313 can also be with top section 1311, bottom section 1312
Right angle connection.
In the interim pins 131 of the present embodiment, middle section 1313 is first side close to the side of second side pin 133
1314.The bevel edge 1333 of the first side 1314 and the second internal pin 1331 is opposite, and parallel with bevel edge 1333.Such setting energy
Enough make the spacing between second side pin 133 and the opposite part of interim pins 131 consistent, reduces second side pin 133 in
Between the risk of breakdown is generated between pin 131, guarantee the stability of product.
More preferably, in the present embodiment, the first side of the bevel edge 1333 of second side pin 133 and interim pins 131
Spacing between 1314 is 0.37mm~0.47mm.Such be arranged in guarantees the same of the larger wider space of the first internal pin 1321
When, it is ensured that bigger pressure difference can be born between second side pin 133 and interim pins 131, and it is high to be effectively reduced adjacent pin
Low pressure, and reduce and puncture air again in breakdown film Feng Tihou and generate the risk of electric discharge, to improve the reliability of product.
Further, the first side pipe foot 132 of the present embodiment includes the first internal pin 1321 and the first external pin 1322, the
One external pin 1322 is connected to the bottom of the first internal pin 1321.The upper surface of first internal pin 1321 is used for welding lead, with
Realize the connection of the first side pipe foot 132 and chip.
In the present embodiment, the outside of the first internal pin 1321 is equipped with lock glue shrinkage pool 1323.Lead frame is in sealing process
In, lock glue shrinkage pool 1323 makes colloid link closely with lead frame, to enable to combine closely between colloid and lead frame, avoids
It is fallen off between colloid and lead frame, guarantees the qualification rate of product.
The lock glue shrinkage pool 1323 of the present embodiment is arc-shaped, arc radius 0.25mm.Preferably implement some other
In example, lock glue shrinkage pool 1323 can also be the shapes such as taper, trapezoidal, rectangle.
In the present embodiment, the first internal pin 1321 is additionally provided with the first clamp area 1324 and the second clamp area 1325.?
When one 1321 welding lead of internal pin, the first clamp area 1324 and the second clamp area 1325 can provide for welding fixture and can press from both sides
Region is held, lead welding goes on smoothly on the first internal pin 1321 of guarantee.
Wherein, the first clamp area 1324 is located on 1321 top of the first internal pin, and is arranged close to outside；Second clamp area
1325 are located at the bottom end of the first internal pin 1321, and are arranged close to inside.First clamp area 1324 and the second clamp area 1325 are handed over
Mistake setting, while welding fixture clamping zone on guaranteeing the first internal pin 1321, additionally it is possible to ensure the first internal pin 1321
The welding space of upper lead, to improve the welding quality of lead and the qualification rate of product.
In addition, the triode chip is equipped with when the chip installed on the chip base island 12 of the present embodiment is triode chip
Source electrode, grid and drain electrode.In the present embodiment, the first side pipe foot 132 is with grid for connect, interim pins 131 for
Drain electrode connection, second side pin 133 with source electrode for connecting.
Another preferably embodiment of the application also provides a kind of semiconductor devices comprising frame unit 1, package casing with
And chip.Wherein, frame unit 1 includes radiating part 11, chip base island 12, interim pins 131, the first side pipe foot 132 and the
Two side pipe feet 133.
Specifically, chip base island 12 is connect with radiating part 11, and interim pins 131 are connected to the bottom on chip base island 12, the
The side of interim pins 131 is arranged in side pin 132.The other side of interim pins 131 is arranged in second side pin 133, should
Second side pin 133 includes the second internal pin 1331.Second internal pin 1331 increases along the direction close to interim pins 131, and
Second internal pin 1331 is extended to the bevel edge 1333 of bottom end, the bevel edge close to the side of interim pins 131 with one by top
1333 is opposite and parallel with the side of interim pins 131.
Wherein, chip is mounted on chip base island 12, which is coated on the inside of package casing.Chip passes through
Lead is connect with the first side pipe foot 132 and second side pin 133, and the bottom of the first side pipe foot 132 and second side pin 133 is exposed
In the outside of package casing.
The chip of the present embodiment is triode chip, is equipped with drain electrode, source electrode and grid.Wherein, interim pins 131 with
The drain electrode of chip connects, and the first side pipe foot 132 is connected by the grid of lead and chip, second side pin 133 by lead with
The source electrode of chip connects.
Further, lead can be metal wire or sheet metal.Wherein metal wire can be copper wire, gold thread, aluminum steel or conjunction
Gold thread；Sheet metal can be aluminium strip, copper strips, tin-coated copper strip etc..In the present embodiment, second side pin 133 is by more
20mil aluminum steel is connect with chip.Second internal pin 1331 of second side pin 133 can provide welding space for more aluminum steels,
Guarantee aluminum steel is stably connected with second side pin 133.
The present embodiment second side pin 133 is connect with the source electrode of chip by the aluminum steel of more 20mil, is guaranteeing that product is steady
While qualitative, allow second side pin 133 by electric current increase, to meet the ability of semiconductor devices high current,
To meet the needs of market.
To sum up, for the lead frame of the present embodiment and semiconductor devices, the second internal pin increases along the direction of interim pins
Greatly, the bonding area on second side pin can be made to increase, can be welded while guaranteeing that pin is laid below chip base island
The thicker lead of more diameters realizes the characteristic of semiconductor product high current to increase the overcurrent capability of second side pin；
Furthermore the second internal pin has a bevel edge from top to bottom end that extends from, the bevel edge and the side of interim pins with respect to and parallel, energy
Between between enough parts for while guaranteeing that second side pin bonding area increases, keeping second side pin opposite with interim pins
Away from consistent, to reduce the risk for generating breakdown between second side pin and interim pins, to guarantee the stability of product.
Although describing the utility model with reference to several exemplary embodiments, it is to be understood that, term used is to say
Term bright and exemplary, and not restrictive.Since the utility model can be embodied in a variety of forms without departing from practical
Novel spirit or essence, it should therefore be appreciated that above embodiment is not limited to any of the foregoing details, and should be in accompanying right
Widely explained in spirit and scope defined by it is required that, thus fall into whole variations in claim or its equivalent scope and
Remodeling all should be appended claims and be covered.
Claims (10)
1. a kind of lead frame, including multiple frame units, which is characterized in that each frame unit includes:
Radiating part；
Chip Ji Dao is used for chip, the chip Ji Dao connection radiating part；
Interim pins are connected to the bottom of the chip Ji Dao；
First side pipe foot, is arranged in the side of the interim pins；
Second side pin, is arranged in the other side of the interim pins, and second side pin includes the second internal pin, and described the
Two internal pins increase along the direction close to the interim pins, and second internal pin has close to the side of the interim pins
There is a bevel edge that bottom end is extended to by top, the bevel edge is opposite and parallel with the side of the interim pins.
2. lead frame according to claim 1, which is characterized in that the outer profile of second internal pin is in the long bottom of top margin
Short trapezoidal in side, second internal pin are the bevel edge close to the side of the interim pins, the bevel edge and the top margin it
Between angle be acute angle.
3. lead frame according to claim 2, which is characterized in that the angle of the bevel edge and the top margin is 43 °~
45°。
4. lead frame according to claim 2, which is characterized in that the area of second internal pin is from top to bottom end
It is gradually reduced.
5. lead frame according to claim 1, which is characterized in that the bevel edge side opposite with the interim pins
The distance between be 0.37mm~0.47mm.
6. lead frame according to claim 1, which is characterized in that the interim pins include top section, bottom section and connect
Connect the middle section between the top section and bottom section；The top section is connect with the chip Ji Dao, and the middle section is obliquely installed,
And it is tilted towards the first side pipe foot.
7. lead frame according to claim 1, which is characterized in that the first side pipe foot includes the first internal pin and company
The first external pin in first internal pin bottom end is connect, first internal pin is equipped with away from the side of the interim pins and uses
In the lock glue shrinkage pool of locking colloid and the lead frame, the lock glue shrinkage pool profile is arc-shaped, taper, trapezoidal or rectangle.
8. lead frame according to claim 1, which is characterized in that triode chip is installed on the chip Ji Dao,
The triode chip is equipped with source electrode, grid and drain electrode, and the first side pipe foot with the grid for connecting, and described second
For connecting with the source electrode, the interim pins are used to connect with the drain electrode side pipe foot.
9. a kind of semiconductor devices, which is characterized in that including frame unit, package casing and chip；
The frame unit includes:
Radiating part；
Chip Ji Dao connects the radiating part and is coated on the inside of the package casing, and the chip Ji Dao is for installing institute
State chip；
Interim pins are connected to the bottom of the chip Ji Dao；
First side pipe foot, is arranged in the side of the interim pins；
Second side pin, is arranged in the other side of the interim pins, and second side pin includes the second internal pin, and described the
Two internal pins increase along the direction close to the interim pins, and second internal pin has close to the side of the interim pins
There is a bevel edge that bottom end is extended to by top, the bevel edge is opposite and parallel with the side of the interim pins.
10. semiconductor devices according to claim 9, which is characterized in that the chip is triode chip, which sets
Source, grid and drain electrode, the grid are connect with the first side pipe foot, and the source electrode and second side pin connect
It connects, the drain electrode is connect with the interim pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821153533.3U CN208368498U (en) | 2018-07-19 | 2018-07-19 | Lead frame and semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821153533.3U CN208368498U (en) | 2018-07-19 | 2018-07-19 | Lead frame and semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208368498U true CN208368498U (en) | 2019-01-11 |
Family
ID=64925558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821153533.3U Active CN208368498U (en) | 2018-07-19 | 2018-07-19 | Lead frame and semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208368498U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109904081A (en) * | 2019-01-18 | 2019-06-18 | 深圳赛意法微电子有限公司 | The packaging method of semiconductor product based on IDF lead frame |
| CN113394188A (en) * | 2021-05-14 | 2021-09-14 | 南通华达微电子集团股份有限公司 | Lead frame with special-shaped lock hole |
-
2018
- 2018-07-19 CN CN201821153533.3U patent/CN208368498U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109904081A (en) * | 2019-01-18 | 2019-06-18 | 深圳赛意法微电子有限公司 | The packaging method of semiconductor product based on IDF lead frame |
| CN109904081B (en) * | 2019-01-18 | 2020-11-20 | 深圳赛意法微电子有限公司 | Packaging method of semiconductor product based on IDF lead frame |
| CN113394188A (en) * | 2021-05-14 | 2021-09-14 | 南通华达微电子集团股份有限公司 | Lead frame with special-shaped lock hole |
| CN113394188B (en) * | 2021-05-14 | 2022-04-22 | 南通华达微电子集团股份有限公司 | Lead frame with special-shaped lock hole |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208368498U (en) | Lead frame and semiconductor devices | |
| JP2009239321A (en) | Side surface discharge light-emitting diode package | |
| CN106298722A (en) | The encapsulating structure of a kind of big current power semiconductor device and manufacture method | |
| US20130049231A1 (en) | Semiconductor device and method for making the same | |
| CN107978668B (en) | LED device, LED lamp and method for processing conductive wire of LED device | |
| TW200901344A (en) | Semiconductor device and wire bonding method | |
| CN208478305U (en) | Fixation device for anchor leg frame | |
| US20080054052A1 (en) | Method of manufacturing semiconductor device | |
| CN207038528U (en) | Compact frequency converter | |
| WO2016000377A1 (en) | Reinforcing structure and method of conductor soldering point of semiconductor device | |
| WO2018082629A1 (en) | Led device, led lamp and method for machining bonding wire of led device | |
| CN105470189A (en) | Double-pad frame bonding heating block and fixture | |
| CN102637668A (en) | Novel lead frame | |
| CN207068657U (en) | A kind of capacitor arrangement | |
| CN203617280U (en) | Lead frame convenient for bonding wires | |
| CN205016518U (en) | Electric crystal packaging part with general purpose type encapsulation sheetmetal | |
| CN207026839U (en) | A kind of device for lifting clamping efficiency | |
| CN110473954A (en) | A kind of LED chip connection structure of low cost and high reliability | |
| CN222485220U (en) | LED support and package | |
| CN105405953B (en) | Low thermal resistance high-efficient large power LED lamp bead | |
| CN104064540B (en) | The wire solder joint reinforced structure of semiconductor device | |
| WO2012055085A1 (en) | Method for bonding wire between chips or between chip and metal frame | |
| CN221947081U (en) | A double aluminum strip welding mechanism for MOS tube and MOS chip frame thereof | |
| CN206441708U (en) | Heat block for paster operation | |
| CN212182310U (en) | Bonding wire |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |