CN209879523U

CN209879523U - Fingerprint module, electronic equipment and liquid crystal display fingerprint detection system

Info

Publication number: CN209879523U
Application number: CN201920453222.7U
Authority: CN
Inventors: 张胜斌; 刘凯; 许炜添
Original assignee: Shenzhen Huiding Technology Co Ltd
Current assignee: Hainan Boling Medical Technology Co ltd
Priority date: 2019-04-04
Filing date: 2019-04-04
Publication date: 2019-12-31
Anticipated expiration: 2029-04-04

Abstract

The utility model provides a fingerprint module, electronic equipment and liquid crystal display fingerprint detection system. The utility model provides a fingerprint module, include: the flexible printed circuit FPC, and set up lens on FPC, fingerprint response chip and support, wherein, FPC's a lateral buckling back forms the holding chamber with lens and support, be provided with the second mirror on the inner wall at holding chamber top, fingerprint response chip sets up on the bottom inner wall in holding chamber is for the position of second mirror, and, be provided with first speculum in the outside in holding chamber, so that the fingerprint image of formation of image inputs fingerprint response chip behind lens and the second mirror in proper order in first speculum. The utility model provides a fingerprint module when realizing the fingerprint identification function of fingerprint module, the mode of the partial lateral wall that forms the holding chamber after buckling through FPC for the lateral wall and the top size in holding chamber are thinner, and then reduce the fingerprint module overall dimension who produces.

Description

Fingerprint module, electronic equipment and liquid crystal display fingerprint detection system

Technical Field

The utility model relates to a fingerprint identification technical field especially relates to a fingerprint module, electronic equipment and liquid crystal display fingerprint detection system.

Background

Along with the development of biological identification sensor, especially the rapid development of fingerprint identification sensor, the fingerprint module is widely used in fields such as mobile terminal, intelligent house, automotive electronics.

At present, to the real design of fingerprint module under the screen, all be the mode through shaping integral type support with fingerprint response chip package in the fingerprint module usually.

And the mode that the support through the integral type formed the holding chamber of holding fingerprint response chip can lead to the lateral wall in holding chamber and top size great, and then makes the size of the fingerprint module that produces great, needs to occupy the space of great installation in electronic equipment.

SUMMERY OF THE UTILITY MODEL

The utility model provides a fingerprint module, electronic equipment and liquid crystal display fingerprint detection system to reduce the size of fingerprint module, thereby reduce shared installation space in the electronic equipment of installation.

In a first aspect, the utility model provides a fingerprint module, include: the fingerprint sensing device comprises a Flexible Printed Circuit (FPC), and a lens, a fingerprint sensing chip and a bracket which are arranged on the FPC;

one side of the FPC is bent to form an accommodating cavity together with the lens and the bracket;

a second reflector is arranged on the inner wall of the top of the accommodating cavity, and the fingerprint sensing chip is arranged on the position, relative to the second reflector, of the inner wall of the bottom of the accommodating cavity;

and a first reflector is arranged outside the accommodating cavity, so that a fingerprint image imaged in the first reflector sequentially passes through the lens and the second reflector and then is input into the fingerprint sensing chip.

In a possible design manner, the FPC is rectangular, and the first reflecting mirror, the lens, the second reflecting mirror and the fingerprint sensing chip are arranged on the FPC in parallel;

the FPC comprises a flexible printed circuit board (FPC), a first reflector, a lens, a support and a holding cavity, wherein the FPC is bent into a U-shaped side wall on one side, a front opening of the U-shaped side wall faces the first reflector, the lens blocks a front opening of the U-shaped side wall, and the support blocks two side openings of the U-shaped side wall to form the holding cavity.

In one possible design, the FPCs include a first FPC and a second FPC that are arranged perpendicular to each other;

the first reflector, the lens, the fingerprint sensing chip and the bracket are arranged on the first FPC, and the second reflector is arranged on the second FPC;

the support constitutes U type lateral wall, the anterior opening of U type lateral wall faces first speculum, the lens shutoff the anterior opening of U type lateral wall, the second FPC buckles the back shutoff the open-top of U type lateral wall, in order to form the holding chamber.

In a possible design, the fingerprint module further includes: the first reinforcing plate is arranged at the bottom of the fingerprint module;

the FPC is arranged on the first reinforcing plate;

the FPC is provided with a first through hole, so that the first through hole and the first reinforcing plate form a first accommodating groove for accommodating the first reflector.

In a possible design, the fingerprint module further includes: a second reinforcing plate;

the second reinforcing plate covers the outer side wall of the top of the accommodating cavity;

and a second through hole is formed in the FPC, so that the second through hole and the second reinforcing plate form a second accommodating groove for accommodating the second reflector.

In a possible design, the second reflecting mirror is disposed on the FPC, and the second reflecting mirror covers a top inner side wall of the accommodating cavity.

In a possible design, the fingerprint module further includes: a Light Emitting Diode (LED) disposed on the FPC;

the LED is used for emitting light rays to image the fingerprint image in the first reflector.

In one possible design, the light emitted by the LED is infrared light having a wavelength of 850 nm or 940 nm.

In one possible embodiment, the thickness of the first mirror and the second mirror is 0.03 mm to 0.15 mm.

In one possible design, a sealant is disposed at the side wall plugging portion of the accommodating cavity to form the sealed accommodating cavity.

In a second aspect, the present invention provides an electronic device, comprising any one of the fingerprint modules provided in the first aspect.

A third aspect of the present invention further provides a liquid crystal display fingerprint detection system, which includes a fingerprint module set, configured to be disposed under a non-display area of a liquid crystal panel, wherein the fingerprint module set is at least partially disposed in the display area of the liquid crystal panel, and wherein the fingerprint module set is any one of the fingerprint module sets provided in the first aspect.

In one possible design, the fingerprint module is located between a liquid crystal panel and a backlight module of the liquid crystal display screen.

In a possible design, still include fingerprint detection light source, fingerprint detection light source be located liquid crystal display's marginal area, and with liquid crystal display panel sets up in the below of glass apron side by side, fingerprint detection light source mainly used to liquid crystal display panel's fingerprint detection area transmission fingerprint exciting light.

The utility model provides a fingerprint module, electronic equipment and liquid crystal display fingerprint detection system, form the holding chamber with lens and support after buckling through one side with FPC, and set up the second mirror on the inner wall at holding chamber top, and the bottom inner wall in holding chamber sets up fingerprint response chip for the position of second mirror, then set up first mirror in the outside in holding chamber, so that it inputs fingerprint response chip after lens and second mirror in proper order to become like in first mirror fingerprint image, thereby realize the fingerprint identification function of fingerprint module, and buckle the mode that forms the partial lateral wall in holding chamber after through FPC, make the lateral wall and the top size in holding chamber thinner, and then reduce the fingerprint module overall dimension that produces, with the space that reduces the installation in electronic equipment.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.

Fig. 1 is a schematic structural diagram of a first state of a fingerprint module according to an embodiment of the present invention before packaging;

FIG. 2 is a schematic cross-sectional view taken along the line A-A in FIG. 1;

FIG. 3 is a schematic cross-sectional view taken along the line B-B in FIG. 1;

FIG. 4 is a schematic structural diagram of the fingerprint module shown in FIG. 1 in a second state before packaging;

FIG. 5 is a schematic cross-sectional view taken along the line A-A in FIG. 4;

FIG. 6 is a schematic cross-sectional view taken along line B-B of FIG. 4;

fig. 7 is a schematic structural view of a fingerprint module bending process according to a first embodiment of the present invention;

fig. 8 is a schematic cross-sectional view of the fingerprint module according to an embodiment of the present invention in the direction of a-a after being packaged;

fig. 9 is a schematic cross-sectional view of the fingerprint module according to an embodiment of the present invention in the B-B direction after being packaged;

fig. 10 is a schematic cross-sectional view of the fingerprint module according to the second embodiment of the present invention in the B-B direction after being packaged;

fig. 11 is a schematic structural diagram of a fingerprint module according to a third embodiment of the present invention in a first state before packaging;

FIG. 12 is a schematic structural diagram of the fingerprint module of FIG. 11 in a second state before packaging;

fig. 13 is a schematic cross-sectional view of the fingerprint module according to the third embodiment of the present invention in the C-C direction after being packaged;

fig. 14 is a schematic cross-sectional view of the fingerprint module according to the third embodiment of the present invention in the D-D direction after being packaged;

fig. 15 is a schematic flow chart illustrating a fingerprint module packaging method according to a fourth embodiment of the present invention;

fig. 16 is a schematic flow chart illustrating a fingerprint module packaging method according to a fifth embodiment of the present invention;

fig. 17 is a schematic structural diagram of an electronic device according to a sixth embodiment of the present invention;

fig. 18 is a schematic structural diagram of an electronic device according to a seventh embodiment of the present invention.

With the foregoing drawings in mind, certain embodiments of the disclosure have been shown and described in more detail below. These drawings and written description are not intended to limit the scope of the disclosed concepts in any way, but rather to illustrate the concepts of the disclosure to those skilled in the art by reference to specific embodiments.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims, as well as in the drawings, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The following describes the technical solution of the present invention and how to solve the above technical problems with specific embodiments. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments. Embodiments of the present invention will be described below with reference to the accompanying drawings.

Fig. 1 is a schematic structural view of a fingerprint module according to an embodiment of the present invention in a first state before packaging, fig. 2 is a schematic sectional view taken along a direction a-a in fig. 1, and fig. 3 is a schematic sectional view taken along a direction B-B in fig. 1. As shown in fig. 1-3, in the fingerprint module packaging process provided in this embodiment, the fingerprint sensing chip 5, the first reflecting mirror 41 and the second reflecting mirror 42 may be assembled on a Flexible Circuit Board (FPC) 2, wherein the fingerprint sensing chip 5, the first reflecting mirror 41 and the second reflecting mirror 42 may be assembled by using a high-precision chip mounter. In order to make the fingerprint module thinner in thickness dimension, an ultra-thin reflector may be used, for example, a reflector with a thickness of 0.03 mm to 0.15 mm may be selected for the first reflector 41 and the second reflector 42, but the thicknesses of the first reflector 41 and the second reflector 42 are not particularly limited in this embodiment.

Fig. 4 is a schematic structural view of the fingerprint module shown in fig. 1 in a second state before packaging, fig. 5 is a schematic sectional view taken along the direction a-a in fig. 4, and fig. 6 is a schematic sectional view taken along the direction B-B in fig. 4. As shown in fig. 4-6, after the fingerprint sensing chip 5, the first reflecting mirror 41 and the second reflecting mirror 42 are assembled to the FPC2, the assembly of the lens 6 and the support 7 may be continued.

With continued reference to fig. 1-6, the FPC2 in this embodiment may be rectangular, and the first reflector 41, the lens 6, the second reflector 42, and the fingerprint sensing chip 5 may be disposed in parallel on the FPC 2.

Fig. 7 is the embodiment of the present invention provides a structural schematic diagram of the fingerprint module bending process, fig. 8 is the embodiment of the present invention provides a profile schematic diagram of a-a direction after the fingerprint module is packaged, and fig. 9 is the embodiment of the present invention provides a profile schematic diagram of a B-B direction after the fingerprint module is packaged. As shown in fig. 7-9, the FPC2 may be bent into a U-shaped sidewall on the side close to the second reflector 42, wherein the front opening of the U-shaped sidewall faces the first reflector 41, the lens 6 blocks the front opening of the U-shaped sidewall, and the bracket 7 blocks the openings on both sides of the U-shaped sidewall, thereby forming a receiving cavity.

In addition, in order to carry out better protection to fingerprint response chip 5 in the fingerprint module, can also set up sealed glue in the lateral wall shutoff department in holding chamber to form sealed holding chamber, in order to set up fingerprint response chip 5 in airtight space.

The bracket 7 may be an integral type or a split type, and is not particularly limited in this embodiment. And the bracket 7 can be made of injection molding materials, substrate materials or metals.

With continued reference to fig. 6, the side of the FPC2 near the second reflecting mirror 42 may be bent for the first time toward the fingerprint sensing chip 5, i.e. in the first direction as shown in fig. 6, wherein the state after the first bending is shown in fig. 7. Based on the structure shown in fig. 7, the FPC2 may be continuously bent downward toward the fingerprint sensing chip 5, i.e., bent for the second time in the second direction in fig. 7, wherein the state after the second bending is shown in fig. 9.

After the FPC2 is bent to form the accommodating cavity with the lens 6 and the bracket 7, the second reflecting mirror 42 is located on the inner wall of the top of the accommodating cavity, and the fingerprint sensing chip 5 is located on the position of the inner wall of the bottom of the accommodating cavity relative to the second reflecting mirror 42. The first reflector 41 is disposed outside the accommodating cavity. Thereby make the fingerprint image of formation of image input fingerprint induction chip 5 behind lens 6 and the second reflector 41 in proper order in first reflector 41 to realize the fingerprint identification function of fingerprint module.

With continued reference to fig. 9, in order to make the fingerprint module after the encapsulation can have a stable supporting structure, a first reinforcing plate 11 can also be arranged at the bottom of the fingerprint module. Specifically, the FPC2 is disposed on the first reinforcing plate 11, and the FPC2 is provided with a first through hole, so that the first through hole and the first reinforcing plate 11 form a first accommodating groove for accommodating the first reflector 41. That is, the first reinforcing plate 11 is the bottom of the first receiving groove, the first through hole on the FPC2 is the wall of the first receiving groove, and the first reflector 41 may be mounted on the first reinforcing plate 11 by a high-precision chip mounter.

With continued reference to fig. 9, a second stiffening plate 12 may be disposed on the top outer sidewall of the accommodating cavity, so as to form a protective structure on the top of the accommodating cavity. Specifically, the FPC2 is disposed on the first reinforcing plate 12, and the FPC2 is provided with a second through hole, so that the second through hole and the second reinforcing plate 12 form a second accommodating groove for accommodating the second reflecting mirror 42. That is, the second reinforcing plate 12 is the bottom of the second receiving groove, and the second through hole on the FPC2 is the wall of the second receiving groove. As shown in fig. 6, the second reflector 42 may be first assembled to the second reinforcing plate 12 by a high precision placement machine and then transformed into the inner wall of the top of the receiving cavity during bending of the FPC 2. Since the protective structure has been formed to the top of the receiving chamber by the second reinforcing plate 12, the size of the second reflecting mirror 42 can be designed to be a minimum size according to the actual optical path signal transmission, thereby covering only a partial area of the inner wall of the top of the receiving chamber.

Fig. 10 is a schematic cross-sectional view of the fingerprint module according to the second embodiment of the present invention in the B-B direction after being packaged. As shown in fig. 10, the top of the accommodating chamber can be protected by covering the second reflector 42 on the inner side wall of the top of the accommodating chamber. Specifically, the second reflecting mirror 42 is disposed on the FPC2, and the second reflecting mirror 42 is changed into the inner wall of the top of the accommodating cavity in the process of bending the FPC2, which can be understood as that the second reflecting mirror 42 completely covers the inner wall of the top of the accommodating cavity.

Except that the bottom of fingerprint module is protected through first stiffening plate 11 to the aforesaid to and protect the top of fingerprint module through second stiffening plate 12 or the second mirror 42 that covers holding chamber top inner wall completely, can also utilize materials such as Polyimide Film (PI membrane for short), bubble cotton or double faced adhesive tape to protect other parts of fingerprint module, for example the lateral wall of fingerprint module.

With continued reference to fig. 1, 2, 4, 5, and 8, a Light-Emitting Diode (LED) 3 may also be disposed on the FPC 2. The LED3 is used to emit light to form an image of the fingerprint on the first reflector 41, and the manner of forming the image of the fingerprint can be implemented optically, which is not described in detail in this embodiment. Alternatively, the LEDs 3 may be disposed on the periphery of the first reflector 41 or other positions on the FPC2, for example, symmetrically disposed on both sides of the first reflector 41. It should be noted that the number and the position of the LEDs 3 provided on the FPC2 are not particularly limited in this embodiment. The light emitted from the LED is infrared light having a wavelength of 850 nm or 940 nm, but the wavelength of the light emitted from the LED is not specifically limited in this embodiment, and it is only necessary to ensure that the fingerprint image can be imaged in the first reflecting mirror 41.

In this embodiment, form the holding chamber with lens and support after buckling through the lateral buckling with FPC, and set up the second mirror on the inner wall at holding chamber top, and the bottom inner wall in holding chamber sets up fingerprint response chip for the position of second mirror, then set up first speculum in the outside in holding chamber, so that form images on fingerprint image and input fingerprint response chip behind lens and the second mirror in proper order in first speculum, thereby realize the fingerprint identification function of fingerprint module, and buckle the mode of the partial lateral wall that forms the holding chamber after through FPC, make the lateral wall and the top size in holding chamber thinner, and then reduce the fingerprint module overall dimension who produces, in order to reduce the space of the installation in electronic equipment.

Fig. 11 is a schematic structural view of a fingerprint module according to a third embodiment of the present invention in a first state before packaging. As shown in fig. 11, in the fingerprint module packaging process provided in this embodiment, the fingerprint sensing chip 5, the first reflecting mirror 41 and the second reflecting mirror 42 may be assembled on the Flexible Circuit Board (FPC) 2, wherein the fingerprint sensing chip 5, the first reflecting mirror 41 and the second reflecting mirror 42 may be assembled by using a high precision chip mounter. In order to make the fingerprint module thinner in thickness dimension, an ultra-thin reflector may be used, for example, a reflector with a thickness of 0.03 mm to 0.15 mm may be selected for the first reflector 41 and the second reflector 42, but the thicknesses of the first reflector 41 and the second reflector 42 are not particularly limited in this embodiment.

Fig. 12 is a structural diagram of the fingerprint module shown in fig. 11 in a second state before packaging. As shown in fig. 12, after the fingerprint sensing chip 5, the first reflecting mirror 41 and the second reflecting mirror 42 are assembled to the FPC2, the assembly of the lens 6 and the support 7 may be continued.

With continued reference to fig. 11-12, the FPC2 in this embodiment may include a first FPC and a second FPC that are vertically disposed to each other, that is, the first FPC and the second FPC are vertically disposed to form an L-shaped FPC structure, where the second FPC may be disposed on the left side of the first FPC or on the right side of the first FPC. Here, referring to fig. 11 to 12, it can be described that the second FPC can be disposed on the left side of the first FPC. Specifically, the first reflector 41, the lens 6, the fingerprint sensing chip 5 and the support 7 are disposed on the first FPC, and the second reflector 42 is disposed on the second FPC. The support 7 forms a U-shaped side wall, the front opening of the U-shaped side wall faces the first reflector 41, the lens 6 blocks the front opening of the U-shaped side wall, and the second FPC bends to block the top opening of the U-shaped side wall so as to form an accommodating cavity.

Fig. 13 is a schematic sectional view of the fingerprint module in the C-C direction after being packaged, and fig. 14 is a schematic sectional view of the fingerprint module in the D-D direction after being packaged. As shown in fig. 13-14, in this embodiment, the second FPC may be bent to the right, so that after bending, the second reflector 42 is located on the inner wall of the top of the accommodating cavity, and the fingerprint sensing chip 5 is located on the position of the inner wall of the bottom of the accommodating cavity relative to the second reflector 42. The first reflector 41 is disposed outside the accommodating cavity. Thereby make the fingerprint image of formation of image input fingerprint induction chip 5 behind lens 6 and the second reflector 41 in proper order in first reflector 41 to realize the fingerprint identification function of fingerprint module.

It should be noted that, if the second FPC is disposed on the right side of the first FPC, the second FPC may be bent leftward, and the specific implementation principle is similar to that when the second FPC is disposed on the left side of the first FPC, which is not described in detail in this embodiment.

With continued reference to fig. 13-14, in order to make the fingerprint module after encapsulation have a stable supporting structure, a first reinforcing plate 11 may be further disposed at the bottom of the fingerprint module. Specifically, the FPC2 is disposed on the first reinforcing plate 11, and the FPC2 is provided with a first through hole, so that the first through hole and the first reinforcing plate 11 form a first accommodating groove for accommodating the first reflector 41. That is, the first reinforcing plate 11 is the bottom of the first receiving groove, the first through hole on the FPC2 is the wall of the first receiving groove, and the first reflector 41 may be mounted on the first reinforcing plate 11 by a high-precision chip mounter.

With continued reference to fig. 14, a second stiffening plate 12 may be disposed on the top outer sidewall of the receiving cavity to form a protective structure on the top of the receiving cavity. Specifically, the FPC2 is disposed on the first reinforcing plate 12, and the FPC2 is provided with a second through hole, so that the second through hole and the second reinforcing plate 12 form a second accommodating groove for accommodating the second reflecting mirror 42. That is, the second reinforcing plate 12 is the bottom of the second receiving groove, and the second through hole on the FPC2 is the wall of the second receiving groove. The second reflecting mirror 42 may be assembled to the second reinforcing plate 12 by a high-precision chip mounter, and then transformed into the inner wall of the top of the accommodating cavity in the process of bending the FPC 2. Since the protective structure has been formed to the top of the receiving chamber by the second reinforcing plate 12, the size of the second reflecting mirror 42 can be designed to be a minimum size according to the actual optical path signal transmission, thereby covering only a partial area of the inner wall of the top of the receiving chamber. In addition, the top of the accommodating cavity can be protected by covering the second reflector 42 on the inner side wall of the top of the accommodating cavity. Specifically, the second reflecting mirror 42 is disposed on the FPC2, and the second reflecting mirror 42 is changed into the inner wall of the top of the accommodating cavity in the process of bending the FPC2, which can be understood as that the second reflecting mirror 42 completely covers the inner wall of the top of the accommodating cavity.

With continued reference to fig. 11-13, a Light-Emitting Diode (LED) 3 may also be disposed on the FPC2 for clear imaging of the user's fingerprint. The LED3 is used to emit light to form an image of the fingerprint on the first reflector 41, and the manner of forming the image of the fingerprint can be implemented optically, which is not described in detail in this embodiment. Alternatively, the LEDs 3 may be disposed on the periphery of the first reflector 41 or other positions on the FPC2, for example, symmetrically disposed on both sides of the first reflector 41. It should be noted that the number and the position of the LEDs 3 provided on the FPC2 are not particularly limited in this embodiment. The light emitted from the LED is infrared light having a wavelength of 850 nm or 940 nm, but the wavelength of the light emitted from the LED is not specifically limited in this embodiment, and it is only necessary to ensure that the fingerprint image can be imaged in the first reflecting mirror 41.

The embodiment of the utility model provides a still provide an electronic equipment, the fingerprint module that provides including any above-mentioned embodiment. The electronic equipment can be a screen assembly, and can also be electronic equipment which needs to be subjected to fingerprint identification operation, such as a smart phone, a tablet computer, a personal computer and a fingerprint lock.

Fig. 15 is a schematic flow chart of a fingerprint module packaging method according to a fourth embodiment of the present invention. As shown in fig. 15, the fingerprint module packaging method provided in this embodiment includes:

step 101, assembling the fingerprint sensing chip, the lens, the first reflector, the second reflector and the bracket on a Flexible Printed Circuit (FPC).

It should be noted that the fingerprint sensing chip, the lens, the first reflector, the second reflector and the bracket may be mounted on the flexible printed circuit FPC by a high-precision surface mounting machine in a surface mounting manner. And the specific assembling sequence of the fingerprint sensing chip, the lens, the first reflector, the second reflector and the bracket can be adjusted according to specific process requirements. For example, the fingerprint sensing chip can be attached first, and then the first reflector, the second reflector, the lens and the bracket are attached; or the first reflector and the second reflector can be pasted firstly, and then the fingerprint sensing chip, the lens and the bracket can be pasted.

And 102, bending the FPC to form an accommodating cavity together with the lens and the support so as to form a fingerprint module.

Specifically, bending the FPC sets up one side of the second mirror to make the FPC after buckling and lens and support form the holding chamber, wherein, first speculum is located the outside in holding chamber, and the second mirror is located the inner wall at holding chamber top after FPC buckles, and fingerprint response chip is located the bottom inner wall in holding chamber for the position of the second mirror, so that the fingerprint image inputs fingerprint response chip behind lens and the second mirror in proper order in first speculum.

Fig. 16 is a schematic flowchart of a fingerprint module packaging method according to a fifth embodiment of the present invention. As shown in fig. 16, the fingerprint module packaging method provided in this embodiment includes:

step 201, assembling a first reinforcing plate and a second reinforcing plate on the FPC.

Step 202, assembling the light emitting diode LED on the FPC.

Specifically, the light emitting diode LED may be mounted on the FPC by Surface Mount Technology (SMT). The LEDs 3 may be disposed around the perimeter of the first reflector 41 or elsewhere on the FPC2, for example, may be symmetrically disposed on both sides of the first reflector 41. It should be noted that the number and the position of the LEDs 3 provided on the FPC2 are not particularly limited in this embodiment.

And step 203, assembling the fingerprint sensing chip, the lens, the first reflector, the second reflector and the bracket on a Flexible Printed Circuit (FPC).

And 204, bending the FPC to form an accommodating cavity together with the lens and the support so as to form a fingerprint module.

It should be noted that, the specific implementation manner of steps 203-204 in this embodiment refers to the description of steps 101-102 in the fourth embodiment, and is not described herein again.

Step 205, arranging sealant at the side wall plugging part of the accommodating cavity.

Specifically, in order to carry out better protection to the fingerprint response chip in the fingerprint module, can also set up sealed glue in the lateral wall shutoff department in holding chamber to form sealed holding chamber, in order to respond to the chip setting with the fingerprint in airtight space.

The application provides a fingerprint module specially adapted has the electronic equipment of Liquid Crystal Display (LCD) screen in order to realize liquid crystal display fingerprint detection system. In particular, the optical fingerprint system under the LCD screen may adopt a system architecture of a liquid crystal display fingerprint identification device as described in international patent application PCT/CN2019/072598, which is incorporated by reference in its entirety in this patent application document.

Fig. 17 is a schematic structural diagram of an electronic device according to a sixth embodiment of the present invention. Referring to fig. 17, the embodiment takes the application of the fingerprint module shown in fig. 9 to an electronic device having a liquid crystal display screen as an example, it should be understood that the fingerprint module described above is also applicable to various embodiments, and the application is not limited thereto. Specifically, the liquid crystal display screen of the electronic device to which the fingerprint module is applied includes a liquid crystal panel and a backlight module 9, wherein the backlight module 9 is disposed below the liquid crystal panel and is configured to provide a uniform visible light source for the liquid crystal panel so that the liquid crystal panel displays a picture. On the other hand, a transparent protective cover plate, such as a glass cover plate 83, may be disposed above the liquid crystal panel.

The liquid crystal panel may include a display region 81 and a non-display region 82, and the non-display region 82 is generally located in an edge region, i.e., a chin portion of the electronic device. The non-display region 82 may be used to provide a display driving chip, external connection wires, and the like. The fingerprint module provided by the application can be arranged between the backlight module 9 and the liquid crystal panel and is positioned below the non-display area 82 of the liquid crystal panel; and, through the light path design, can make the fingerprint detection area of fingerprint module at least part be located in liquid crystal display panel's display area 81.

When the fingerprint module works, a light source (for example, the light emitting diode 3 shown in fig. 8) inside the fingerprint module can emit fingerprint excitation light to a fingerprint detection area of the liquid crystal panel display area 81 under the control of the fingerprint sensing chip 5, and the fingerprint excitation light can generally adopt invisible light, such as infrared light or light with other specific wavelengths. As shown in fig. 17, when a finger is pressed against the fingerprint detection area, the fingerprint excitation light is irradiated to the finger and reflected or scattered at the finger to form return light; the returning light carries fingerprint information of the finger and can therefore be detected as fingerprint light. The returning light enters the fingerprint module after passing through the liquid crystal panel, and is firstly transmitted to the second reflecting mirror 42 through the lens 6 after the first reflection of the first reflecting mirror 41 occurs, and is transmitted to the fingerprint sensing chip 5 after the second reflection of the second reflecting mirror 42 occurs, and the fingerprint sensing chip 5 can perform optical imaging according to the received returning light to obtain a fingerprint image of the finger.

In order to increase the area of the fingerprint module in the effective fingerprint detection area of the liquid crystal panel display area 81, the lens 6 may include at least one aspheric lens, and the incident surface of the lens 6 may also be formed as a micropore, the micropore may be formed by forming a micro through hole in a non-transparent layer or a non-transparent material (such as an inner part of a lens barrel where the lens 6 is installed or an outer shell), and the center of the micropore may be slightly offset from the optical center of the lens 6, so as to enlarge the field angle of the fingerprint module.

As other alternative embodiments, the fingerprint excitation light may be provided by a component independent of the outside of the fingerprint module, and the fingerprint excitation light is fixed to other specific areas, as long as the emitted fingerprint excitation light can irradiate the fingerprint detection area in the liquid crystal panel display area 81.

For example, fig. 18 is a schematic structural diagram of an electronic device according to a seventh embodiment of the present invention. In the embodiment shown in fig. 18, the fingerprint module may further include a fingerprint detection light source 21, and the fingerprint detection light source 21 is disposed below the edge of the glass cover 83 and near the portion of the liquid crystal panel display area 82, that is, the fingerprint detection light source 21 may be disposed below the glass cover 83 side by side with the liquid crystal panel. Fingerprint detection light source 21 can be one or more, and its also erection joint is in the flexible circuit board 2 of fingerprint module. And optionally, a light blocking layer may be disposed between the fingerprint detection light source 21 and the liquid crystal panel, and the light blocking layer is mainly used to prevent the fingerprint detection light emitted by the light source 21 on the other side of the fingerprint from directly entering the liquid crystal panel to affect the display performance of the liquid crystal panel.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. The invention is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. The utility model provides a fingerprint module which characterized in that includes: the fingerprint sensing device comprises a Flexible Printed Circuit (FPC), and a lens, a fingerprint sensing chip and a bracket which are arranged on the FPC;

2. The fingerprint module of claim 1, wherein the FPC is rectangular, and the first reflector, the lens, the second reflector and the fingerprint sensing chip are disposed on the FPC in parallel;

3. The fingerprint module of claim 1, wherein the FPCs comprise a first FPC and a second FPC arranged perpendicular to each other;

4. The fingerprint module of claim 2 or 3, further comprising: the first reinforcing plate is arranged at the bottom of the fingerprint module;

the FPC is arranged on the first reinforcing plate;

5. The fingerprint module of claim 4, further comprising: a second reinforcing plate;

6. The fingerprint module of claim 4, wherein the second reflector is disposed on the FPC and covers a top inner sidewall of the accommodating cavity.

7. The fingerprint module of any one of claims 1-3, further comprising: a Light Emitting Diode (LED) disposed on the FPC;

8. The fingerprint module of claim 7, wherein the light emitted by the LED is infrared light having a wavelength of 850 nm or 940 nm.

9. The fingerprint module of any one of claims 1-3, wherein the first mirror and the second mirror have a thickness of 0.03 mm to 0.15 mm.

10. The fingerprint module of any one of claims 1 to 3, wherein a sealant is disposed at the side wall sealing point of the receiving cavity to form the sealed receiving cavity.

11. The fingerprint module of any one of claims 1-3, wherein the entrance surface of the lens is formed with a micro-hole, the micro-hole is used for enlarging the effective field angle of the fingerprint module, and the micro-hole is offset from the optical center of the lens.

12. An electronic device, comprising the fingerprint module of any one of claims 1-11.

13. A liquid crystal display fingerprint detection system, characterized in that, includes the fingerprint module for set up in the non-display area below of liquid crystal display panel, and the fingerprint detection area of fingerprint module is located at least part in the display area of liquid crystal display panel, wherein, the fingerprint module is according to any one of claims 1-11 the fingerprint module.

14. The system of claim 13, wherein the fingerprint module is located between a liquid crystal panel and a backlight module of the liquid crystal display.

15. The lcd fingerprint detection system of claim 13, further comprising a fingerprint detection light source located in an edge area of the lcd and disposed below the glass cover plate side by side with the lcd panel, the fingerprint detection light source being mainly configured to emit a fingerprint excitation light to a fingerprint detection area of the lcd panel.