CN209981476U - Sheet type electrical appliance - Google Patents

Abstract

The utility model discloses a chip-type electrical appliance. The chip-type electrical appliance comprises an electrical functional layer, an insulating layer and a plurality of node chips. The electrical functional layer comprises a substrate and a plurality of conductive parts. The substrate is provided with a conductive loop, and several The conductive parts are arranged on the surface of the substrate at intervals and are connected with the conductive circuit; the insulating layer covers the two surfaces of the substrate, and the insulating layer is provided with through holes at the positions corresponding to the conductive parts; Each contact piece covers the corresponding through hole and is arranged on the outer surface of the insulating layer, each through hole is provided with a conductive connection portion, and each contact piece is respectively connected with the corresponding conductive member through the conductive connection portion. The utility model aims to realize the flat bonding of the chip-type electrical appliance and other planes, and at the same time make the chip-type electrical appliance have better mechanical and electrical properties, thereby improving the application reliability of the chip-type electrical appliance.

Description

Chip electrical appliances

technical field

The utility model relates to the field of electronic technology, in particular to a chip-type electrical appliance.

Background technique

With the continuous development of electronic products in the direction of light and thin, chip electrical appliances have been widely used. Chip-type electrical appliances are generally formed by covering the functional layer of electricity with insulating materials. Since the functional layer is located inside the insulating material, in order to realize the electrical connection of the functional layer during the application process, it is necessary to use conductive materials in the production of chip-type electrical appliances. The terminal leads the electrical contacts of the internal functional layer out of the insulating layer, so as to facilitate the subsequent application of the chip electrical appliance.

However, at present, the conductive terminals of chip-type electrical appliances are generally button-type terminals installed by riveting, which need to be perforated in the densely connected insulating layer and functional layer during installation. Such an installation process is cumbersome and easily leads to chip-type electrical appliances. The damage will lead to unstable electrical connection and affect the strength of the chip electrical appliance; moreover, the conductive terminals will protrude relative to the surface of the chip electrical appliance, resulting in the chip electrical appliance being unable to achieve a smooth fit with other planes. It can be seen that the conductive terminals used for power connection in the current chip electrical appliances cause the chip electrical appliances to be unable to fit flatly with the plane, and the installation process affects the performance of the chip electrical appliances and affects the application of the chip electrical appliances.

The above content is only used to assist the understanding of the technical solutions of the present invention, and does not mean that the above content is the prior art.

Utility model content

The main purpose of the utility model is to provide a chip-type electrical appliance, which aims to realize the flat bonding of the chip-type electrical appliance and other planes, and at the same time make the chip-type electrical appliance have better mechanical properties and electrical properties, thereby improving the chip-type electrical appliance. Reliability of electrical applications.

In order to achieve the above purpose, the utility model provides a chip-type electrical appliance, which comprises:

The electrical function layer includes a substrate and a plurality of conductive parts, the substrate is provided with a conductive loop, and a plurality of the conductive parts are spaced on the board surface of the substrate and connected to the conductive loop;

an insulating layer covering the two surfaces of the substrate, and the insulating layer is respectively provided with through holes corresponding to the positions of the conductive parts;

A plurality of contact pieces, the contact pieces are arranged in a one-to-one correspondence with the through holes, each of the contact pieces covers the corresponding through holes and is arranged on the outer surface of the insulating layer, and each of the through holes is provided with There is a conductive connection part, and each of the contact pieces is connected to the corresponding conductive member through the conductive connection part respectively.

Optionally, the electrical connection piece is provided with a process hole, the process hole and the through hole are arranged in alignment, and the conductive connection portion is provided between the process hole and the conductive member.

Optionally, the diameter of the process hole is smaller than the diameter of the through hole.

Optionally, the number of the process holes is multiple, and the multiple process holes are arranged at intervals.

Optionally, a plurality of the conductive members are all disposed on the same surface of the substrate.

Optionally, the insulating layer includes a first sub-insulating layer and a second sub-insulating layer, the first sub-insulating layer and the second sub-insulating layer respectively cover two surfaces of the substrate, and the first sub-insulating layer and the second sub-insulating layer respectively cover A sub-insulating layer and/or the second sub-insulating layer is provided with the through hole corresponding to the position on the substrate where the conductive member is provided;

The chip-type electrical appliance further includes an encapsulant layer, and the encapsulant layer is disposed along the edge of the substrate and between the first sub-insulating layer and the second sub-insulating layer.

Optionally, the electrical connection sheet includes conductive cloth, copper foil or flexible circuit board.

Optionally, the substrate includes a chip heating element, a chip light emitting element or a chip sensor.

Optionally, the sheet-type heating element is a sheet-like structure made of graphene, carbon fiber or copper.

Optionally, the conductive connection portion is formed by curing silver paste, solder paste or flux.

The utility model proposes a chip-type electrical appliance. The chip-type electrical appliance comprises an electrical functional layer, an insulating layer and a plurality of electrical connection pieces, wherein the electrical functional layer comprises a substrate and several conductive parts, and the substrate is provided with a conductive loop , a number of conductive parts are arranged on the surface of the substrate at intervals and connected with the conductive circuit; the insulating layer covers the two surfaces of the substrate, and the insulating layer is provided with through holes corresponding to the positions of the conductive parts; A corresponding arrangement, each contact piece covers the corresponding through hole and is arranged on the outer surface of the insulating layer, each through hole is provided with a conductive connection portion, and each contact piece is respectively connected with the corresponding conductive member through the conductive connection portion. Among them, a sheet-shaped electrical connection piece is used as the electrical connection part of the chip-type electrical appliance, so that the surface of the chip-type electrical appliance is smooth, and there is no protruding structure, so that the external electrical parts can pass through the electrical connection part and the conductive loop in the internal substrate. At the same time, the chip-type electrical appliance can be flatly attached to other planes, and such a structural processing process does not require additional openings. damage, to ensure that the chip electrical appliance has better mechanical properties and electrical properties, thereby improving the reliability of the chip electrical appliance application.

Description of drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are just some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained based on the structures shown in these drawings without any creative effort.

1 is a schematic cross-sectional structure diagram of an embodiment of a chip-type electrical appliance of the present invention;

FIG. 2 is a schematic top-view structural diagram of the chip-type electrical appliance in FIG. 1 .

Description of reference numbers:

label name label name 100 Electrical functional layer 200 Insulation 110 substrate 210 through hole 120 Conductive parts 201 first sub-insulating layer 300 terminal block 202 second sub-insulating layer 310 Process hole 500 Sealing layer 400 conductive connection

The realization, functional characteristics and advantages of the purpose of the present utility model will be further described with reference to the accompanying drawings in conjunction with the embodiments.

Detailed ways

It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not intended to limit the present invention.

The main solution of the embodiment of the present invention is to use a chip-type electrical appliance including an electrical functional layer 100 , an insulating layer 200 and a plurality of electrical connection sheets 300 , wherein the electrical functional layer 100 includes a substrate 110 and several conductive members 120 , the substrate 110 is provided with a conductive circuit (not shown), and a plurality of conductive members 120 are arranged on the surface of the substrate 110 at intervals and connected with the conductive circuit (not shown); the insulating layer 200 covers the two surfaces of the substrate 110, The insulating layer 200 is provided with through holes 210 at positions corresponding to the respective conductive members 120 ; the contact pieces 300 are arranged in a one-to-one correspondence with the through holes 210 , and each contact piece 300 covers the corresponding through holes 210 respectively and is disposed outside the insulating layer 200 . On the surface, each of the through holes 210 is provided with a conductive connection portion 400 , and each of the contact pieces 300 is respectively connected to the corresponding conductive member 120 through the conductive connection portion 400 .

In the prior art, the conductive terminals used for electrical connection in the chip electrical appliance cause the chip electrical appliance to be unable to be flatly attached to the plane, and the installation process affects the performance of the chip electrical appliance and affects the application of the chip electrical appliance.

The utility model provides the above-mentioned solution, aiming at realizing the flat bonding of the chip electrical appliance and other planes, and at the same time making the chip electrical appliance have better mechanical and electrical properties, thereby improving the reliability of the application of the chip electrical appliance.

The utility model provides a chip-type electrical appliance. Here, the sheet-type electrical appliance refers to a sheet-shaped electrical appliance with a thickness of less than or equal to 2 mm and a certain flexibility. Specifically, the chip-type electrical appliance may specifically include a heating film, a backlight film, a sensing film, and the like.

In the embodiment of the present invention, referring to FIG. 1 , a chip-type electrical appliance specifically includes an electrical functional layer 100 , an insulating layer 200 , and a plurality of electrical connection sheets 300 .

The electrical functional layer 100 includes a substrate 110 and a plurality of conductive members 120, the substrate 110 is provided with a conductive loop (not shown), and the plurality of the conductive members 120 are arranged on the surface of the substrate 110 at intervals, and Connect with the conductive loop (not shown). The power-consuming functional layer 100 is a layered structure capable of consuming or converting electrical energy to achieve certain functions such as heat generation, light emission, and induction. The substrate 110 is made of metal wires, electrical and electronic components, etc. to form a conductive circuit (not shown), and the conductive circuit (not shown) consumes or converts electrical energy to achieve the above functions. The specific structure of the conductive circuit (not shown) can be Set according to actual functional requirements.

Specifically, the substrate 110 may include a chip-type heating element, a chip-type light-emitting element or a chip-type sensor. When the substrate 110 is a sheet-type heating element, the sheet-type heating element may be a sheet-like structure made of graphene, carbon fiber or copper, so as to generate heat after being powered on. When the substrate 110 is a chip-type light-emitting element, the chip-type light-emitting element may specifically include an LED lamp, a light guide sheet, etc., and may be used as a backlight element such as a display screen. When the substrate 110 is a chip sensor, the chip sensor may specifically include a thermistor, an induction coil and other chip sensors.

The conductive member 120 can be provided on one surface of the substrate 110 or on two surfaces of the substrate 110 at the same time according to actual requirements. Preferably, a plurality of the conductive members 120 are disposed on the same surface of the substrate 110 to facilitate the installation of the electrical connection piece 300 .

The conductive member 120 is used for connecting with the positive electrode, the negative electrode, the data output terminal and the like of the conductive loop (not shown). The number of the conductive members 120 is at least two, which can be set according to actual requirements. Wherein, when the number of the conductive members 120 is two, the two conductive members 120 are respectively connected to the positive electrode and the negative electrode of the conductive loop (not shown); when the number of the conductive members 120 is three, the three conductive members 120 can be They are respectively connected to the positive, negative and data output terminals of the conductive loop (not shown); the number of conductive members 120 can also be set in multiples according to actual functional requirements. The conductive member 120 may be specifically a conductive contact or the like.

The insulating layer 200 covers the two surfaces of the substrate 110 , and the insulating layer 200 is provided with through holes 210 at positions corresponding to the conductive members 120 ; The through-holes 210 are arranged on the outer surface of the insulating layer 200 , each of the through-holes 210 is provided with a conductive connection portion 400 , and each of the contact pieces 300 is respectively connected to the corresponding conductive member 120 through the conductive connection portion 400 .

Specifically, the electrical connection sheet 300 may include conductive cloth, copper foil, or a flexible circuit board or the like. The conductive connection portion 400 is an integrally formed structure, and can be formed by curing silver paste, solder paste or flux during the installation process of the electrical connection sheet 300 .

The number of the through holes 210 and the conductive members 120 is the same, and the through holes 210 and the conductive members 120 are aligned one by one. The conductive connection portion 400 is closely connected with the through hole 210 in which it is located. The contact piece 300 is connected to its corresponding conductive member 120 through the conductive connection portion 400 .

The electrical connection piece 300 is used as an electrical connection piece for connecting the chip electrical appliance with other electrical components, so that the external electrical components can pass through the electrical connection piece 300 and the electrical function layer 100 in the chip electrical appliance. shown) connection, so that the chip electrical appliance can realize its function.

The technical solution of the present invention proposes a chip-type electrical appliance, the chip-type electrical appliance includes a power-consuming functional layer 100, an insulating layer 200 and a plurality of electrical connection pieces 300, wherein the electrical-using functional layer 100 includes a substrate 110 and several The conductive member 120, the substrate 110 is provided with a conductive loop (not shown), a plurality of conductive members 120 are arranged on the surface of the substrate 110 at intervals, and are connected to the conductive loop (not shown); the insulating layer 200 covers two of the substrate 110. On the board surface, the insulating layer 200 is provided with through holes 210 at the positions corresponding to the conductive members 120 ; the contact pieces 300 are arranged in a one-to-one correspondence with the through holes 210 , and each contact piece 300 covers the corresponding through holes 210 and is provided on the insulating layer. On the outer surface of the 200 , each through hole 210 is provided with a conductive connecting portion 400 , and each electrical connection piece 300 is respectively connected to the corresponding conductive member 120 through the conductive connecting portion 400 . Among them, the sheet-shaped electrical connection piece 300 is used as the electrical connection part of the chip-type electrical appliance, so that the surface of the chip-type electrical appliance is smooth, and there is no protruding structure, so that the external electrical parts can pass through the electrical connection part and the inner substrate 110. The conductive loop (not shown) is connected, and the chip electrical appliance can be flatly attached to other planes, and such a structural processing process does not require additional openings, and the electrical connection piece 300 and the conductive member 120 are connected through the conductive connection portion 400. The structure of the electrical functional layer 100 will not be damaged, so as to ensure that the chip electrical appliance has better mechanical properties and electrical properties, thereby improving the reliability of the application of the electrical chip electrical appliance. Among them, the chip-shaped electrical connection member has higher conductivity than the existing conductive terminal, which can ensure the electrical connectivity when the chip-shaped electrical appliance needs to flow a large current.

The insulating layer 200 may be integrally formed to cover the entire outer surface of the substrate 110; in addition, in order to ensure the molding accuracy of the insulating layer 200, the insulating layer 200 may also be a separate structure. The insulating layer 200 includes a first sub-insulating layer 201 and a second sub-insulating layer 202. The first sub-insulating layer 201 and the second sub-insulating layer 202 respectively cover two surfaces of the substrate 110. The through holes 210 are provided in a sub-insulating layer 201 and/or the second sub-insulating layer 202 corresponding to the positions on the substrate 110 where the conductive members 120 are provided. Specifically, when the conductive members 120 are provided on the surface of the substrate 110 covered by the first sub-insulation layer 201, through holes 210 are respectively provided at the positions of the first sub-insulation layer 201 corresponding to each conductive member 120; When the conductive members 120 are provided on the surface of the substrate 110 covered by the layer 200, through holes 210 are respectively provided at the positions of each conductive member 120 of the second sub-insulation layer 202; conductive members are provided on both surfaces of the substrate 110 120 , through holes 210 are respectively provided at the positions of the first sub-insulating layer 201 and the second sub-insulating layer 202 corresponding to each conductive member 120 . The insulating layer 200 may be specifically made of polyethylene, polyethylene terephthalate plastic, polyimide, etc., which may be selected according to actual needs.

The chip-type electrical appliance further includes an encapsulation layer 500 disposed along the edge of the substrate 110 and between the first sub-insulating layer 201 and the second sub-insulating layer 202 . The sealing layer 500 may be a frame-shaped adhesive structure. The encapsulant layer 500 can be bonded to the edge of the substrate 110 , and the first sub-insulation layer 201 and the second sub-insulation layer 202 can be bonded at the same time, so that the electrical functional layer 100 and the insulating layer 200 can be used to form a tight structure. The first sub-insulating layer 201 , the second sub-insulating layer 202 and the sealing glue layer 500 together constitute the insulating structure of the chip electrical appliance, so as to ensure the creepage distance between the electrical functional layer 100 and the outside and ensure electrical safety.

Further, referring to FIG. 1 and FIG. 2 , the electrical connection sheet 300 is provided with a process hole 310 , the process hole 310 is arranged in alignment with the through hole 210 , and the conductive connection portion 400 is provided in the process hole 310 and the conductive member 120 . The arrangement of the process hole 310 on the contact piece 300 is convenient to observe whether the through hole 210 is filled with conductive filler when the contact piece 300 is installed, and at the same time, the conductive filler can enter the corresponding hole of the contact piece 300 through the process hole 310. Through holes 210, thereby improving the convenience of installation of the contact piece 300, and when the conductive filler is cured to form the conductive connection portion 400, it is ensured that the conductive connection portion 400 can realize the tight electrical connection between the contact piece 300 and the conductive member 120. Further improve the electrical performance of chip electrical appliances.

The diameter of the process hole 310 is smaller than that of the through hole 210 in order to prevent the conductive filler from overflowing and curing on the surface of the contact piece 300 and to ensure the smoothness of the surface of the insulating layer 200 where the contact piece 300 is located.

Specifically, in order to ensure the convenience of installation of the electrical connection piece 300 , there are multiple process holes 310 , and the plurality of process holes 310 are arranged at intervals. It should be noted that, the plurality of process holes 310 on the same contact piece 300 are arranged in alignment with the through holes 210 corresponding to the contact piece 300 .

The above are only preferred embodiments of the present utility model, and are not intended to limit the scope of the present utility model patent. Under the concept of the utility model of the present utility model, the equivalent structure transformations made by using the contents of the present utility model description and accompanying drawings, Or directly/indirectly applied in other related technical fields are included in the scope of patent protection of the present invention.

Claims (10)

1. An electrical appliance of the chip type, characterized in that, the electrical appliance of the chip type includes:

the electricity utilization function layer comprises a substrate and a plurality of conductive pieces, wherein the substrate is provided with a conductive loop, and the conductive pieces are arranged on the surface of the substrate at intervals and are connected with the conductive loop;

the insulating layer covers two plate surfaces of the substrate, and through holes are respectively formed in the positions, corresponding to the conductive pieces, of the insulating layer;

the electric connection pieces are arranged in one-to-one correspondence with the through holes, each electric connection piece covers the corresponding through hole and is arranged on the outer surface of the insulating layer, a conductive connecting part is arranged in each through hole, and each electric connection piece is connected with the corresponding conductive part through the conductive connecting part.

2. The chip electrical appliance according to claim 1, wherein the electrical connection piece has a fabrication hole, the fabrication hole is aligned with the through hole, and the conductive connection portion is disposed between the fabrication hole and the conductive member.

3. The chip-type electrical appliance according to claim 2, wherein the aperture of the fabrication hole is smaller than the aperture of the through hole.

4. The chip-type electrical appliance according to claim 3, wherein the number of the fabrication holes is plural, and the plurality of the fabrication holes are arranged at intervals.

5. The chip-type electrical appliance according to claim 1, wherein the plurality of conductive members are disposed on a same surface of the substrate.

6. The chip-type electrical appliance according to claim 1, wherein the insulating layer comprises a first sub-insulating layer and a second sub-insulating layer, the first sub-insulating layer and the second sub-insulating layer respectively cover two board surfaces of the substrate, and the through hole is formed in the first sub-insulating layer and/or the second sub-insulating layer corresponding to the position on the substrate where the conductive member is disposed;

the chip type electric appliance further comprises a sealing adhesive layer, wherein the sealing adhesive layer is arranged along the edge of the substrate and is arranged between the first sub-insulating layer and the second sub-insulating layer.

7. The sheet-type electric appliance according to any one of claims 1 to 6, wherein the electric connecting piece comprises a conductive cloth, a copper foil, or a flexible circuit board.

8. The sheet type electric appliance according to any one of claims 1 to 6, wherein the substrate includes a sheet type heat generating member, a sheet type light emitting member, or a sheet type sensor.

9. The sheet-type electric appliance according to claim 8, wherein the sheet-type heat generating member is a sheet-type structure made of graphene, carbon fiber, or copper.

10. The chip-type electrical appliance according to any one of claims 1 to 6, wherein the conductive connection portion is formed by curing a silver paste, a solder paste, or a flux.

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