CN201093225Y - Light-transmitting light-emitting diode array display device - Google Patents
Light-transmitting light-emitting diode array display device Download PDFInfo
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- CN201093225Y CN201093225Y CNU2007201755771U CN200720175577U CN201093225Y CN 201093225 Y CN201093225 Y CN 201093225Y CN U2007201755771 U CNU2007201755771 U CN U2007201755771U CN 200720175577 U CN200720175577 U CN 200720175577U CN 201093225 Y CN201093225 Y CN 201093225Y
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- 239000011521 glass Substances 0.000 claims abstract description 17
- 239000011159 matrix material Substances 0.000 claims abstract description 17
- 238000005245 sintering Methods 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 18
- 230000005611 electricity Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
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Abstract
Description
技术领域technical field
本实用新型涉及一种显示装置,特别是涉及一种发光二极管阵列显示装置。The utility model relates to a display device, in particular to a light emitting diode array display device.
背景技术Background technique
为了采光及美观的考量,越来越多建筑物舍弃以往的水泥墙,而改采透明的玻璃帷幕作为外墙。For the sake of lighting and aesthetic considerations, more and more buildings abandon the previous cement walls and use transparent glass curtains as the outer walls.
近来将大型显示看板设置于建筑物的玻璃帷幕内,向外显示影像或图案,已经成为一种新的广告宣传手法。而用以作为显示影像或图案的显示看板通常是采用发光二极管阵列显示装置。Recently, it has become a new advertising method to set large-scale display boards in the glass curtains of buildings and display images or patterns outside. The display board used to display images or patterns usually adopts a light emitting diode array display device.
然而,实际将上述发光二极管阵列显示装置装设于玻璃帷幕时,由于现行供发光二极管阵列设置并提供电源的印刷电路板(Printed Circuit Board;PCB)本身是不透光的,以致于会妨碍了原有玻璃帷幕所具有的采光功能。However, when actually installing the above LED array display device on the glass curtain, because the existing printed circuit board (Printed Circuit Board; PCB) for LED array setting and power supply itself is opaque, it will hinder the The lighting function of the original glass curtain.
此外,由于供发光二极管阵列设置的印刷电路板散热效率差易导致发光二极管元件失效,因此,通常会在印刷电路板的发光二极管阵列相反面设置一散热器以辅助散热,如此,更增加了整体的体积与重量。In addition, due to the poor heat dissipation efficiency of the printed circuit board for the LED array, it is easy to cause the failure of the LED element. Therefore, a heat sink is usually arranged on the opposite side of the LED array of the printed circuit board to assist heat dissipation, which increases the overall cost. volume and weight.
实用新型内容Utility model content
本实用新型的一目的是在于提供一种可透光的发光二极管阵列显示装置,使其设置于玻璃帷幕内时,可兼顾原有玻璃帷幕的采光功能。An object of the present invention is to provide a light-transmitting light-emitting diode array display device, which can take into account the lighting function of the original glass curtain when it is installed in the glass curtain.
本实用新型可透光的发光二极管阵列显示装置,包括一透明基板、多个导电线路,以及多个发光二极管元件。The light-transmitting light-emitting diode array display device of the utility model comprises a transparent substrate, a plurality of conductive lines, and a plurality of light-emitting diode elements.
透明基板具有一第一表面;导电线路间隔地形成于所述第一表面上;发光二极管元件以矩阵排列设置于第一表面上并分别与导电线路电连接。The transparent substrate has a first surface; conductive lines are formed on the first surface at intervals; light emitting diode elements are arranged in a matrix on the first surface and electrically connected with the conductive lines respectively.
本实用新型所述的可透光的发光二极管阵列显示装置,所述透明基板的材质为玻璃。In the light-transmitting light-emitting diode array display device described in the utility model, the material of the transparent substrate is glass.
本实用新型所述的可透光的发光二极管阵列显示装置,所述导电线路是将导电胶涂布于所述透明基板上并以烧结而形成。In the light-transmitting LED array display device described in the utility model, the conductive circuit is formed by coating conductive glue on the transparent substrate and sintering.
本实用新型所述的可透光的发光二极管阵列显示装置,所述导电胶包含有纳米尺度的银粒子。In the light-transmitting light-emitting diode array display device described in the utility model, the conductive adhesive contains nanoscale silver particles.
本实用新型所述的可透光的发光二极管阵列显示装置,所述烧结温度低于500摄氏度。In the light-transmitting light-emitting diode array display device described in the utility model, the sintering temperature is lower than 500 degrees Celsius.
本实用新型所述的可透光的发光二极管阵列显示装置,所述发光二极管元件为表面黏贴式封装型式的发光二极管。In the light-transmitting light-emitting diode array display device described in the present invention, the light-emitting diode element is a surface-mounted light-emitting diode.
本实用新型所述的可透光的发光二极管阵列显示装置,所述发光二极管元件为未经封装的发光二极管晶片。In the light-transmitting light-emitting diode array display device described in the utility model, the light-emitting diode element is an unpackaged light-emitting diode chip.
本实用新型所述的可透光的发光二极管阵列显示装置,所述可透光的发光二极管阵列显示装置还包括一设置于所述第一表面上并覆盖所述发光二极管晶片的封装层。According to the light-transmitting LED array display device of the present invention, the light-transmitting LED array display device further includes an encapsulation layer arranged on the first surface and covering the LED chip.
本实用新型所述的可透光的发光二极管阵列显示装置,所述可透光的发光二极管阵列显示装置,还包括形成于所述透明基板的相反于所述第一表面的一第二表面上的多个导电线路,以及多个分别与所述第二表面上的导电线路电连接并朝所述第一表面方向发光的发光二极管元件。According to the light-transmitting light-emitting diode array display device described in the present utility model, the light-transmitting light-emitting diode array display device further includes a second surface formed on the transparent substrate opposite to the first surface a plurality of conductive lines on the second surface, and a plurality of light emitting diode elements that are respectively electrically connected to the conductive lines on the second surface and emit light toward the first surface.
本实用新型所述的可透光的发光二极管阵列显示装置,与所述发光二极管元件的正负两电极其中的一个电极电连接的导电线路彼此形成电连接,且与所述发光二极管元件的正负两电极的另外一个电极电连接的导电线路分别朝向所述透明基板边缘呈分散的延伸。In the light-transmitting light-emitting diode array display device described in the utility model, the conductive lines electrically connected to one of the positive and negative electrodes of the light-emitting diode element are electrically connected to each other, and are electrically connected to the positive and negative electrodes of the light-emitting diode element. The conductive lines electrically connected to the other electrode of the two negative electrodes respectively extend in a dispersed manner towards the edge of the transparent substrate.
本实用新型的有益效果在于:通过将发光二极管元件设置于透明基板上,并搭配以与发光二极管元件电连接的导电线路,使得本实用新型发光二极管阵列显示装置可透光,使其应用在建筑物的玻璃帷幕上作为显示看板,并可兼顾玻璃帷幕原有的采光功能。The beneficial effect of the utility model is that: by arranging the light-emitting diode elements on the transparent substrate and matching the conductive circuit electrically connected with the light-emitting diode elements, the light-emitting diode array display device of the utility model can transmit light, so that it can be used in architectural It can be used as a display board on the glass curtain of the object, and can take into account the original lighting function of the glass curtain.
附图说明Description of drawings
图1是一本实用新型可透光的发光二极管阵列显示装置的较佳实施例的立体示意图;Fig. 1 is a three-dimensional schematic diagram of a preferred embodiment of a light-transmitting light-emitting diode array display device of the utility model;
图2是本较佳实施例的局部侧视示意图;Fig. 2 is a partial side view schematic diagram of this preferred embodiment;
图3是本较佳实施例另一实施态样的局部侧视示意图;Fig. 3 is a schematic partial side view of another embodiment of the preferred embodiment;
图4是本较佳实施例又一实施态样的局部侧视示意图;Fig. 4 is a schematic partial side view of another embodiment of the preferred embodiment;
图5是本较佳实施例再一实施态样的局部侧视示意图;Fig. 5 is a schematic partial side view of yet another implementation of the preferred embodiment;
图6是本较佳实施例的俯视示意图。Fig. 6 is a schematic top view of the preferred embodiment.
具体实施方式Detailed ways
下面结合附图及实施例对本实用新型进行详细说明。Below in conjunction with accompanying drawing and embodiment the utility model is described in detail.
如图1与图2所示,本实用新型可透光的发光二极管阵列显示装置的较佳实施例包括一透明基板10、多个导电线路20,以及多个发光二极管元件30。As shown in FIG. 1 and FIG. 2 , a preferred embodiment of the transparent LED array display device of the present invention includes a
透明基板10为玻璃材质所制成,具有一第一表面11,以及一相反于第一表面11的第二表面12。The
多个导电线路20,间隔地形成于第一表面11上,导电线路20是将包含有纳米尺度的银粒子的导电胶以印刷或涂布于透明基板10上,再以低于500摄氏度的温度烧结而形成。A plurality of
多个发光二极管元件30,是以矩阵排列设置于第一表面11上并分别与所述导电线路20电连接。在本实施例中,发光二极管元件30为表面黏贴式封装(Surface mounted technology;SMT)型式的发光二极管。实际实施时,亦可如图3所示,以未经封装的发光二极管晶片作为发光二极管元件30,直接设置于第一表面11上,利用导线(wire)31使发光二极管元件30电连接于导电线路20,并且,还可于第一表面11上设置一覆盖发光二极管元件30及导线31的封装层40。或者,还可如图4所示,以覆晶(flip chip)接合方式将发光二极管元件30与导电线路20进行电连接。A plurality of light
另外,如图5所示,还可于透明基板10的相反于第一表面11的第二表面12上形成多个导电线路20,以及设置多个分别与第二表面12上的导电线路20电连接并朝第一表面11方向发光的发光二极管元件30,以增加单位面积的发光二极管元件30密度,提高整体发光强度。In addition, as shown in FIG. 5 , a plurality of
此外,为了提高透明基板10各部位的透光均匀性,还可调整导电线路20的布局,如图6所示,将电连接发光二极管元件30的正负两电极其中一者的导电线路21彼此形成电连接,并将电连接发光二极管元件30的正负两电极的另外一者的导电线路22分别朝向透明基板10四个边缘呈分散的延伸。In addition, in order to improve the light transmission uniformity of each part of the
实际应用时,本实用新型发光二极管阵列显示装置是由建筑物内,以发光二极管元件30的发光方向向外地安装在建筑物的玻璃帷幕上。In actual application, the light-emitting diode array display device of the present utility model is installed on the glass curtain of the building with the light-emitting direction of the light-emitting
归纳上述,本实用新型通过将发光二极管元件30设置于透明基板10上,并搭配以导电胶印刷并烧结形成导电线路20,使得本实用新型发光二极管阵列显示装置可为光线穿透,而应用在建筑物的玻璃帷幕上时,不会妨碍玻璃帷幕原有的采光功能,此外,由于玻璃材质的透明基板10本身的散热效果较以往的印刷电路板为佳,无须外加散热器辅助散热,还可缩减体积与重量,确实达成本实用新型的功效。To sum up the above, the utility model arranges the light-
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| Application Number | Priority Date | Filing Date | Title |
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| CNU2007201755771U CN201093225Y (en) | 2007-08-30 | 2007-08-30 | Light-transmitting light-emitting diode array display device |
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| CNU2007201755771U CN201093225Y (en) | 2007-08-30 | 2007-08-30 | Light-transmitting light-emitting diode array display device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101846271A (en) * | 2010-03-23 | 2010-09-29 | 邓涛 | LED (light-emitting diode) module and LED display device |
| CN102734665A (en) * | 2012-05-21 | 2012-10-17 | 王定锋 | LED (Light Emitting Diode) lamp module and manufacturing method thereof |
| CN104421708A (en) * | 2013-09-11 | 2015-03-18 | 雷盟光电股份有限公司 | LED lamps with heat dissipation structure |
| US9328911B2 (en) | 2013-09-02 | 2016-05-03 | Lediamond Opto Corporation | LED lamp with a heat dissipation structure capable of omnidirectionally emitting light |
| CN106968392A (en) * | 2016-10-27 | 2017-07-21 | 厦门腾月光电科技有限公司 | Luminous building materials |
-
2007
- 2007-08-30 CN CNU2007201755771U patent/CN201093225Y/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101846271A (en) * | 2010-03-23 | 2010-09-29 | 邓涛 | LED (light-emitting diode) module and LED display device |
| CN102734665A (en) * | 2012-05-21 | 2012-10-17 | 王定锋 | LED (Light Emitting Diode) lamp module and manufacturing method thereof |
| US9328911B2 (en) | 2013-09-02 | 2016-05-03 | Lediamond Opto Corporation | LED lamp with a heat dissipation structure capable of omnidirectionally emitting light |
| CN104421708A (en) * | 2013-09-11 | 2015-03-18 | 雷盟光电股份有限公司 | LED lamps with heat dissipation structure |
| CN104421708B (en) * | 2013-09-11 | 2017-09-05 | 雷盟光电股份有限公司 | LED lamp with heat radiation structure |
| CN106968392A (en) * | 2016-10-27 | 2017-07-21 | 厦门腾月光电科技有限公司 | Luminous building materials |
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