[go: up one dir, main page]

CN201093225Y - Light-transmitting light-emitting diode array display device - Google Patents

Light-transmitting light-emitting diode array display device Download PDF

Info

Publication number
CN201093225Y
CN201093225Y CNU2007201755771U CN200720175577U CN201093225Y CN 201093225 Y CN201093225 Y CN 201093225Y CN U2007201755771 U CNU2007201755771 U CN U2007201755771U CN 200720175577 U CN200720175577 U CN 200720175577U CN 201093225 Y CN201093225 Y CN 201093225Y
Authority
CN
China
Prior art keywords
light
emitting diode
display unit
matrix display
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2007201755771U
Other languages
Chinese (zh)
Inventor
杜嘉明
张志伟
李维汉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CNU2007201755771U priority Critical patent/CN201093225Y/en
Application granted granted Critical
Publication of CN201093225Y publication Critical patent/CN201093225Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The utility model provides a light-permeable LED array display device, which comprises a transparent substrate, a plurality of conductive circuits and a plurality of LED elements; the transparent substrate is provided with a first surface; the conductive circuits are formed on the first surface at intervals; the light emitting diode elements are arranged on the first surface in a matrix manner and are respectively electrically connected with the conducting circuits; through setting up the emitting diode component on transparent substrate to the conducting wire of being connected with the emitting diode component electricity is mated with, makes the utility model discloses emitting diode array display device light-permeable, and can use as the demonstration billboard on the glass curtain of building, and can compromise the original daylighting function of glass curtain.

Description

可透光的发光二极管阵列显示装置 Light-transmitting light-emitting diode array display device

技术领域technical field

本实用新型涉及一种显示装置,特别是涉及一种发光二极管阵列显示装置。The utility model relates to a display device, in particular to a light emitting diode array display device.

背景技术Background technique

为了采光及美观的考量,越来越多建筑物舍弃以往的水泥墙,而改采透明的玻璃帷幕作为外墙。For the sake of lighting and aesthetic considerations, more and more buildings abandon the previous cement walls and use transparent glass curtains as the outer walls.

近来将大型显示看板设置于建筑物的玻璃帷幕内,向外显示影像或图案,已经成为一种新的广告宣传手法。而用以作为显示影像或图案的显示看板通常是采用发光二极管阵列显示装置。Recently, it has become a new advertising method to set large-scale display boards in the glass curtains of buildings and display images or patterns outside. The display board used to display images or patterns usually adopts a light emitting diode array display device.

然而,实际将上述发光二极管阵列显示装置装设于玻璃帷幕时,由于现行供发光二极管阵列设置并提供电源的印刷电路板(Printed Circuit Board;PCB)本身是不透光的,以致于会妨碍了原有玻璃帷幕所具有的采光功能。However, when actually installing the above LED array display device on the glass curtain, because the existing printed circuit board (Printed Circuit Board; PCB) for LED array setting and power supply itself is opaque, it will hinder the The lighting function of the original glass curtain.

此外,由于供发光二极管阵列设置的印刷电路板散热效率差易导致发光二极管元件失效,因此,通常会在印刷电路板的发光二极管阵列相反面设置一散热器以辅助散热,如此,更增加了整体的体积与重量。In addition, due to the poor heat dissipation efficiency of the printed circuit board for the LED array, it is easy to cause the failure of the LED element. Therefore, a heat sink is usually arranged on the opposite side of the LED array of the printed circuit board to assist heat dissipation, which increases the overall cost. volume and weight.

实用新型内容Utility model content

本实用新型的一目的是在于提供一种可透光的发光二极管阵列显示装置,使其设置于玻璃帷幕内时,可兼顾原有玻璃帷幕的采光功能。An object of the present invention is to provide a light-transmitting light-emitting diode array display device, which can take into account the lighting function of the original glass curtain when it is installed in the glass curtain.

本实用新型可透光的发光二极管阵列显示装置,包括一透明基板、多个导电线路,以及多个发光二极管元件。The light-transmitting light-emitting diode array display device of the utility model comprises a transparent substrate, a plurality of conductive lines, and a plurality of light-emitting diode elements.

透明基板具有一第一表面;导电线路间隔地形成于所述第一表面上;发光二极管元件以矩阵排列设置于第一表面上并分别与导电线路电连接。The transparent substrate has a first surface; conductive lines are formed on the first surface at intervals; light emitting diode elements are arranged in a matrix on the first surface and electrically connected with the conductive lines respectively.

本实用新型所述的可透光的发光二极管阵列显示装置,所述透明基板的材质为玻璃。In the light-transmitting light-emitting diode array display device described in the utility model, the material of the transparent substrate is glass.

本实用新型所述的可透光的发光二极管阵列显示装置,所述导电线路是将导电胶涂布于所述透明基板上并以烧结而形成。In the light-transmitting LED array display device described in the utility model, the conductive circuit is formed by coating conductive glue on the transparent substrate and sintering.

本实用新型所述的可透光的发光二极管阵列显示装置,所述导电胶包含有纳米尺度的银粒子。In the light-transmitting light-emitting diode array display device described in the utility model, the conductive adhesive contains nanoscale silver particles.

本实用新型所述的可透光的发光二极管阵列显示装置,所述烧结温度低于500摄氏度。In the light-transmitting light-emitting diode array display device described in the utility model, the sintering temperature is lower than 500 degrees Celsius.

本实用新型所述的可透光的发光二极管阵列显示装置,所述发光二极管元件为表面黏贴式封装型式的发光二极管。In the light-transmitting light-emitting diode array display device described in the present invention, the light-emitting diode element is a surface-mounted light-emitting diode.

本实用新型所述的可透光的发光二极管阵列显示装置,所述发光二极管元件为未经封装的发光二极管晶片。In the light-transmitting light-emitting diode array display device described in the utility model, the light-emitting diode element is an unpackaged light-emitting diode chip.

本实用新型所述的可透光的发光二极管阵列显示装置,所述可透光的发光二极管阵列显示装置还包括一设置于所述第一表面上并覆盖所述发光二极管晶片的封装层。According to the light-transmitting LED array display device of the present invention, the light-transmitting LED array display device further includes an encapsulation layer arranged on the first surface and covering the LED chip.

本实用新型所述的可透光的发光二极管阵列显示装置,所述可透光的发光二极管阵列显示装置,还包括形成于所述透明基板的相反于所述第一表面的一第二表面上的多个导电线路,以及多个分别与所述第二表面上的导电线路电连接并朝所述第一表面方向发光的发光二极管元件。According to the light-transmitting light-emitting diode array display device described in the present utility model, the light-transmitting light-emitting diode array display device further includes a second surface formed on the transparent substrate opposite to the first surface a plurality of conductive lines on the second surface, and a plurality of light emitting diode elements that are respectively electrically connected to the conductive lines on the second surface and emit light toward the first surface.

本实用新型所述的可透光的发光二极管阵列显示装置,与所述发光二极管元件的正负两电极其中的一个电极电连接的导电线路彼此形成电连接,且与所述发光二极管元件的正负两电极的另外一个电极电连接的导电线路分别朝向所述透明基板边缘呈分散的延伸。In the light-transmitting light-emitting diode array display device described in the utility model, the conductive lines electrically connected to one of the positive and negative electrodes of the light-emitting diode element are electrically connected to each other, and are electrically connected to the positive and negative electrodes of the light-emitting diode element. The conductive lines electrically connected to the other electrode of the two negative electrodes respectively extend in a dispersed manner towards the edge of the transparent substrate.

本实用新型的有益效果在于:通过将发光二极管元件设置于透明基板上,并搭配以与发光二极管元件电连接的导电线路,使得本实用新型发光二极管阵列显示装置可透光,使其应用在建筑物的玻璃帷幕上作为显示看板,并可兼顾玻璃帷幕原有的采光功能。The beneficial effect of the utility model is that: by arranging the light-emitting diode elements on the transparent substrate and matching the conductive circuit electrically connected with the light-emitting diode elements, the light-emitting diode array display device of the utility model can transmit light, so that it can be used in architectural It can be used as a display board on the glass curtain of the object, and can take into account the original lighting function of the glass curtain.

附图说明Description of drawings

图1是一本实用新型可透光的发光二极管阵列显示装置的较佳实施例的立体示意图;Fig. 1 is a three-dimensional schematic diagram of a preferred embodiment of a light-transmitting light-emitting diode array display device of the utility model;

图2是本较佳实施例的局部侧视示意图;Fig. 2 is a partial side view schematic diagram of this preferred embodiment;

图3是本较佳实施例另一实施态样的局部侧视示意图;Fig. 3 is a schematic partial side view of another embodiment of the preferred embodiment;

图4是本较佳实施例又一实施态样的局部侧视示意图;Fig. 4 is a schematic partial side view of another embodiment of the preferred embodiment;

图5是本较佳实施例再一实施态样的局部侧视示意图;Fig. 5 is a schematic partial side view of yet another implementation of the preferred embodiment;

图6是本较佳实施例的俯视示意图。Fig. 6 is a schematic top view of the preferred embodiment.

具体实施方式Detailed ways

下面结合附图及实施例对本实用新型进行详细说明。Below in conjunction with accompanying drawing and embodiment the utility model is described in detail.

如图1与图2所示,本实用新型可透光的发光二极管阵列显示装置的较佳实施例包括一透明基板10、多个导电线路20,以及多个发光二极管元件30。As shown in FIG. 1 and FIG. 2 , a preferred embodiment of the transparent LED array display device of the present invention includes a transparent substrate 10 , a plurality of conductive circuits 20 , and a plurality of LED elements 30 .

透明基板10为玻璃材质所制成,具有一第一表面11,以及一相反于第一表面11的第二表面12。The transparent substrate 10 is made of glass material and has a first surface 11 and a second surface 12 opposite to the first surface 11 .

多个导电线路20,间隔地形成于第一表面11上,导电线路20是将包含有纳米尺度的银粒子的导电胶以印刷或涂布于透明基板10上,再以低于500摄氏度的温度烧结而形成。A plurality of conductive lines 20 are formed at intervals on the first surface 11. The conductive lines 20 are printed or coated on the transparent substrate 10 with conductive glue containing nanoscale silver particles, and then heated at a temperature lower than 500 degrees Celsius. formed by sintering.

多个发光二极管元件30,是以矩阵排列设置于第一表面11上并分别与所述导电线路20电连接。在本实施例中,发光二极管元件30为表面黏贴式封装(Surface mounted technology;SMT)型式的发光二极管。实际实施时,亦可如图3所示,以未经封装的发光二极管晶片作为发光二极管元件30,直接设置于第一表面11上,利用导线(wire)31使发光二极管元件30电连接于导电线路20,并且,还可于第一表面11上设置一覆盖发光二极管元件30及导线31的封装层40。或者,还可如图4所示,以覆晶(flip chip)接合方式将发光二极管元件30与导电线路20进行电连接。A plurality of light emitting diode elements 30 are disposed on the first surface 11 in a matrix arrangement and are respectively electrically connected to the conductive lines 20 . In this embodiment, the light emitting diode element 30 is a surface mounted technology (SMT) type light emitting diode. In actual implementation, as shown in FIG. 3 , an unpackaged LED chip can be used as the LED element 30, which can be directly arranged on the first surface 11, and the LED element 30 can be electrically connected to the conductor by using a wire (wire) 31. The circuit 20 , and an encapsulation layer 40 covering the LED element 30 and the wire 31 can also be disposed on the first surface 11 . Alternatively, as shown in FIG. 4 , the light emitting diode element 30 and the conductive circuit 20 can be electrically connected by flip chip bonding.

另外,如图5所示,还可于透明基板10的相反于第一表面11的第二表面12上形成多个导电线路20,以及设置多个分别与第二表面12上的导电线路20电连接并朝第一表面11方向发光的发光二极管元件30,以增加单位面积的发光二极管元件30密度,提高整体发光强度。In addition, as shown in FIG. 5 , a plurality of conductive circuits 20 may also be formed on the second surface 12 opposite to the first surface 11 of the transparent substrate 10 , and a plurality of conductive circuits 20 electrically connected to the second surface 12 may be provided. The light emitting diode elements 30 connected and emitting light toward the first surface 11 are used to increase the density of the light emitting diode elements 30 per unit area and improve the overall luminous intensity.

此外,为了提高透明基板10各部位的透光均匀性,还可调整导电线路20的布局,如图6所示,将电连接发光二极管元件30的正负两电极其中一者的导电线路21彼此形成电连接,并将电连接发光二极管元件30的正负两电极的另外一者的导电线路22分别朝向透明基板10四个边缘呈分散的延伸。In addition, in order to improve the light transmission uniformity of each part of the transparent substrate 10, the layout of the conductive circuit 20 can also be adjusted. As shown in FIG. The electrical connection is formed, and the conductive lines 22 electrically connected to the other of the positive and negative electrodes of the light emitting diode element 30 respectively extend towards the four edges of the transparent substrate 10 in a dispersed manner.

实际应用时,本实用新型发光二极管阵列显示装置是由建筑物内,以发光二极管元件30的发光方向向外地安装在建筑物的玻璃帷幕上。In actual application, the light-emitting diode array display device of the present utility model is installed on the glass curtain of the building with the light-emitting direction of the light-emitting diode element 30 facing outwards in the building.

归纳上述,本实用新型通过将发光二极管元件30设置于透明基板10上,并搭配以导电胶印刷并烧结形成导电线路20,使得本实用新型发光二极管阵列显示装置可为光线穿透,而应用在建筑物的玻璃帷幕上时,不会妨碍玻璃帷幕原有的采光功能,此外,由于玻璃材质的透明基板10本身的散热效果较以往的印刷电路板为佳,无须外加散热器辅助散热,还可缩减体积与重量,确实达成本实用新型的功效。To sum up the above, the utility model arranges the light-emitting diode element 30 on the transparent substrate 10, and prints and sinters it with a conductive glue to form a conductive circuit 20, so that the light-emitting diode array display device of the utility model can penetrate light, and is applied in When placed on the glass curtain of a building, it will not hinder the original lighting function of the glass curtain. In addition, since the heat dissipation effect of the transparent substrate 10 made of glass is better than that of the previous printed circuit board, there is no need for an additional radiator to assist heat dissipation. The volume and weight are reduced, and the effect of the utility model is indeed achieved.

Claims (10)

1. the light emitting diode matrix display unit of a light-permeable is characterized in that, described light emitting diode matrix display unit comprises:
One transparency carrier has a first surface;
A plurality of conducting wires, compartment of terrain are formed on the described first surface; And
A plurality of light-emitting diodes are arranged with matrix and to be arranged on the described first surface and to be electrically connected with described conducting wire respectively.
2. the light emitting diode matrix display unit of light-permeable according to claim 1 is characterized in that, the material of described transparency carrier is a glass.
3. the light emitting diode matrix display unit of light-permeable according to claim 2 is characterized in that, described conducting wire is conducting resinl to be coated on the described transparency carrier and with sintering form.
4. the light emitting diode matrix display unit of light-permeable according to claim 3 is characterized in that, described conducting resinl includes the silver particles of nanoscale.
5. the light emitting diode matrix display unit of light-permeable according to claim 4 is characterized in that, described sintering temperature is lower than 500 degrees centigrade.
6. the light emitting diode matrix display unit of light-permeable according to claim 5 is characterized in that, described light-emitting diode is pasted the light emitting diode of formula encapsulation pattern for the surface.
7. the light emitting diode matrix display unit of light-permeable according to claim 5 is characterized in that, described light-emitting diode is the LED wafer of un-encapsulated.
8. the light emitting diode matrix display unit of light-permeable according to claim 7 is characterized in that, the light emitting diode matrix display unit of described light-permeable comprises that also one is arranged on the described first surface and covers the encapsulated layer of described LED wafer.
9. the light emitting diode matrix display unit of light-permeable according to claim 6, it is characterized in that, the light emitting diode matrix display unit of described light-permeable, also comprise a plurality of conducting wires on the second surface of described first surface that are formed at described transparency carrier, and a plurality of be electrically connected with conducting wire on the described second surface respectively and towards the luminous light-emitting diode of described first surface direction.
10. the light emitting diode matrix display unit of light-permeable according to claim 7, it is characterized in that, the conducting wire that is electrically connected with positive and negative one of them electrode of two electrodes of described light-emitting diode forms electrical connection each other, and the conducting wire that is electrically connected with the another one electrode of positive and negative two electrodes of described light-emitting diode is the extension of dispersion respectively towards described transparency carrier edge.
CNU2007201755771U 2007-08-30 2007-08-30 Light-transmitting light-emitting diode array display device Expired - Lifetime CN201093225Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007201755771U CN201093225Y (en) 2007-08-30 2007-08-30 Light-transmitting light-emitting diode array display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007201755771U CN201093225Y (en) 2007-08-30 2007-08-30 Light-transmitting light-emitting diode array display device

Publications (1)

Publication Number Publication Date
CN201093225Y true CN201093225Y (en) 2008-07-30

Family

ID=39901194

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2007201755771U Expired - Lifetime CN201093225Y (en) 2007-08-30 2007-08-30 Light-transmitting light-emitting diode array display device

Country Status (1)

Country Link
CN (1) CN201093225Y (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101846271A (en) * 2010-03-23 2010-09-29 邓涛 LED (light-emitting diode) module and LED display device
CN102734665A (en) * 2012-05-21 2012-10-17 王定锋 LED (Light Emitting Diode) lamp module and manufacturing method thereof
CN104421708A (en) * 2013-09-11 2015-03-18 雷盟光电股份有限公司 LED lamps with heat dissipation structure
US9328911B2 (en) 2013-09-02 2016-05-03 Lediamond Opto Corporation LED lamp with a heat dissipation structure capable of omnidirectionally emitting light
CN106968392A (en) * 2016-10-27 2017-07-21 厦门腾月光电科技有限公司 Luminous building materials

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101846271A (en) * 2010-03-23 2010-09-29 邓涛 LED (light-emitting diode) module and LED display device
CN102734665A (en) * 2012-05-21 2012-10-17 王定锋 LED (Light Emitting Diode) lamp module and manufacturing method thereof
US9328911B2 (en) 2013-09-02 2016-05-03 Lediamond Opto Corporation LED lamp with a heat dissipation structure capable of omnidirectionally emitting light
CN104421708A (en) * 2013-09-11 2015-03-18 雷盟光电股份有限公司 LED lamps with heat dissipation structure
CN104421708B (en) * 2013-09-11 2017-09-05 雷盟光电股份有限公司 LED lamp with heat radiation structure
CN106968392A (en) * 2016-10-27 2017-07-21 厦门腾月光电科技有限公司 Luminous building materials

Similar Documents

Publication Publication Date Title
CN108807356B (en) Four-in-one mini-LED module, display screen and manufacturing method
CN105895792A (en) Light-Emitting Device
CN203300159U (en) Chip-on-board packaging technology based light-emitting diode (LED) display screen
CN101571237A (en) Light emitting diode module and lighting string comprising same
CN201293282Y (en) LED support and LED luminous structure
CN201093225Y (en) Light-transmitting light-emitting diode array display device
CN104979462A (en) 360-degree transparent LED glass and preparation method thereof
CN102889487A (en) Novel technical scheme for producing LED (Light Emitting Diode) soft light bar
CN107195755A (en) A kind of flexible and transparent LED display and its processing method
CN107768366A (en) A kind of COB encapsulation for filling Thermal protection IC and its method for packing
CN201226216Y (en) Light-transmitting display device containing LED and control logic circuit
CN103367346A (en) Novel high-power LED light source and implementation method thereof
TW201101268A (en) Translucent LED display panel
CN110418460B (en) Luminous glass based on double-sided flexible circuit board
CN203363722U (en) Sandwich type LED light source module with two sides emitting light
CN102938442B (en) LED package unit and LED package system having same
CN202888239U (en) Heat dissipation carrier structure of LED light-emitting chips
CN2901586Y (en) Packaging structure of light-emitting components
CN204884446U (en) A LED display
CN106710461A (en) Transparent substrate full-color LED (light emitting diode) display screen and production technology
CN104377195A (en) LED light-emitting device
CN204227116U (en) A kind of LED of luminescence chip particular arrangement
CN209856796U (en) LED light source module and lighting device
CN202712177U (en) Two-sided light emitting plane sheet type LED package structure
CN206271334U (en) A kind of LED display

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20080730