CN201243282Y - Electric power line communication apparatus - Google Patents

Abstract

The communication performance of the communication device is improved by configuring the communication board with the PLC signal processor so that the communication board is commonly used in other devices, and the communication device that performs communication through a power line and a transmission medium different from the power line includes: a power supply substrate, having a power supply unit connected to the power line; an interface board formed separately from the power supply substrate, the interface board having an interface for performing communication through a transmission medium; and a communication board connected to the power supply substrate and the interface board Separately formed, the communication board has a power line communication unit for performing communication via a power line and an interface unit electrically connectable to the power supply substrate and the interface board.

Description

Power Line Communication Device

technical field

The utility model relates to a power line communication device capable of using a power line as a transmission medium to perform communication.

Background technique

Recently, a power line communication system capable of transmitting data by superimposing a high-frequency signal on a power line carrying electric power such as commercial power has been proposed. As such a power line communication system, a multi-carrier transmission communication device capable of transmitting and receiving multi-carrier communication signals is known (for example, see JP-A-2003-218831).

A power line communication device used in a power line communication system, such as a PLC (Power Line Communication) modem, can be realized in various forms, such as an AC adapter type directly connected to a power line outlet, a single modem type with functions such as a hub or router, an integrated Integrated device type into PC (personal computer), etc. Accordingly, if the signal processor of the PLC modem is designed according to an individual device type, design effort or manufacturing cost will be greatly increased.

The problem that the analog signal processor of the PLC modem has is that when the analog signal processor is separated from the coupler, the coupler separates the high frequency signal used for the power line communication from the power line and separates the high frequency signal used for the power line communication from the power line. Power line coupling increases noise in analog high-frequency signals (power line communication signals), thereby deteriorating communication performance. Meanwhile, it is preferable that an analog signal processor of the PLC modem and a network interface such as Ethernet (registered trademark) provided in a subsequent step of the PLC modem be separated from each other as much as possible.

For this reason, various units such as a power supply unit, a signal processor, and an interface unit must be set in consideration of various situations of the power line communication device.

Contents of the invention

The present invention is devised in consideration of the above circumstances, and an object of the present invention is to provide a communication device capable of configuring a communication board having a signal processor for power line communication that can be used universally even in various types of devices.

Another object of the present invention is to provide a communication device capable of improving communication performance by providing an analog signal processor for power line communication near a coupler that separates the power line communication signal from the power line and combines the power line communication signal with the power line coupling.

Another object of the present invention is to provide a communication device capable of improving communication performance by disposing an analog signal processor and a network interface unit for power line communication separated from each other.

Another object of the present invention is to provide a communication device capable of ensuring a sufficient heat dissipation function of a heat sink while preventing the input unit and the heat sink from contacting each other.

According to an aspect of the present invention, there is provided a communication device that performs communication through a power line and a transmission medium other than the power line. The communication device includes: a power supply substrate having a power supply unit connected to a power line; an interface board formed separately from the power supply substrate, the interface board having an interface for performing communication through a transmission medium; and a communication board formed separately from the power supply substrate and the interface board, the The communication board has a power line communication unit for performing communication through a power line and a connection unit electrically connectable to the power supply substrate and the interface board.

The communication device having the above-mentioned configuration may include; a first connector including a transmission channel for a power line communication signal and electrically connectable to the power substrate; and a second connector including a communication signal for transmission and reception through the interface. transmission channel, and can be electrically connected to the interface board.

According to the communication device having the above configuration, the first connector can be separated from the second connector.

According to the communication device having the above configuration, the power supply substrate may include a coupler for separating and coupling a power line communication signal, and the first connector may be provided near the coupler.

According to the communication device having the above configuration, the communication board can be perpendicular to the power supply substrate and the interface board.

The communication device having the above configuration may further include: a case housing the power substrate, the interface board, and the communication board; a power plug provided on a surface of the case; and a heat sink dissipating heat generated from the communication board. The base of the power plug may be connected to the power substrate. In addition, the heat sink may hold the communication board, and at least a part of the heat sink may be disposed at a position facing the power substrate so as not to overlap the power plug.

According to the communication device having the above configuration, the heat sink may include an extension extending from the communication board at a position facing the power substrate, and an adjustment member adjusting displacement of an end of the extension toward the power substrate.

According to the communication device having the above configuration, the interface may be an interface for wireless communication.

According to the communication device having the above configuration, the interface may be an interface for a coaxial cable.

According to the present invention, there is provided a communication device capable of configuring a communication board with a signal processor for power line communication, which can be used universally even in various types of devices.

According to the present invention, there is provided a communication device capable of improving communication performance because an analog signal processor for power line communication can be provided near the coupler that separates the power line communication signal from the power line and couples the power line communication signal with the power line .

According to the present invention, there is provided a communication device capable of improving communication performance because an analog signal processor and a network interface unit for power line communication are provided separately from each other.

According to the present invention, there is provided a communication device capable of ensuring a sufficient heat dissipation function of the heat sink while preventing the heat sink and the input unit of the power line from contacting each other.

Description of drawings

The above-mentioned objects and advantages of the present invention will become more apparent when preferred exemplary embodiments of the present invention are described in detail with reference to the accompanying drawings, wherein, in the various views, the same reference numerals indicate the same or corresponding parts, and wherein:

FIG. 1 is a perspective view showing an arrangement structure of main elements of a communication device;

2 is a perspective view showing the structure of each board of the communication device;

3 is a perspective view showing an assembly process of each unit of the communication device;

4 is a block diagram showing an example of a circuit configuration of a communication device;

5 is a perspective view showing an arrangement structure of main elements of a communication device;

6 is a perspective view showing an arrangement structure of main elements of a communication device;

7 is a perspective view showing an arrangement structure of main elements of a communication device;

FIG. 8 is a perspective view showing an arrangement structure of main elements of a communication device; and

Fig. 9 is a perspective view showing an arrangement structure of main elements of the communication device.

Detailed ways

FIG. 1 shows a configuration example of an AC adapter type PLC modem directly connected to an outlet of a power line. The structure of the communication device is not limited thereto but may be modified in various forms.

In the PLC modem 10, a power plug 25 is integrally formed on one outer surface of the lower cabinet 100 so as to protrude from the outer surface. The PLC modem 10 is an AC adapter type. Connect directly to the outlet of the power line. A power supply substrate 101 on which a power supply unit is formed, a communication board 102 on which a signal processor for power line communication is formed, an interface board 103 on which a network interface unit of Ethernet (registered trademark) is located are located in the lower cabinet 100 middle.

The three boards are arranged in the following manner: the power supply substrate 101 and the interface board 103 are connected through the power supply connector 104 arranged on a plane, and the communication board 102 is erected substantially at right angles to the power supply substrate 101 and the interface board 103. The communication board 102 is formed separately from the power board 101 and the interface board 103 . In addition, the communication board 102 is electrically connected to the power substrate 101 and the interface board 103 through a first connector (PLC connector) 105 and a second connector (interface connector) 106, respectively.

By using screws or the like, the communication board 102 is fixed to the board holder 107A of the heat sink 107 formed by bending a flat member such as a metal plate, and the communication board 102 is also passed through the first connector 105 and the second connector. 106 are connected to the power substrate 101 and the interface board 103, respectively. In addition, the heat sink 107 is attached and fixed to the lower cabinet 100 and the interface board 103 by screws or the like at the fixing portion 107B in a state in which the heat sink 107 holds and fixes the communication board 102 with the power supply board. 101 and the interface board 103 are integrated.

In FIG. 2 , the heat sink 107 is omitted, and for convenience of explanation, the power substrate 101 , the communication board 102 and the interface board 103 are shown.

On the power supply board 101, a plug socket (plug receiver) 111 of the power plug 25, a coil transformer 16A, coupling capacitors 16B and 16C of the coupler 16, a part of the power connector 104, a part of the first connector 105, etc. are used as main components. component installation. On the interface board 103, the rest of the power connector 104, a part of the second connector 106, a network connection unit 112 accommodating four modular jacks for network connection, etc. are mounted as main components. On the communication board 102, the rest of the first connector 105, the rest of the second connector 106, a circuit IC (not shown), and the like are mounted as main components. At this time, the first connector 105 and the second connector 106 are located at both ends in the longitudinal direction of the communication board 102 apart from each other. The first connector 105, serving as a PLC connector, includes a connection portion of a transmission channel through which a high-frequency analog signal (PLC signal) for PLC is transmitted. The second connector 106, serving as an interface connector, includes a connection portion of a transmission channel through which a digital signal containing data is transmitted to or received from another device by a network interface or the like.

As shown in FIG. 3A , the power substrate 101 , the interface board 103 , the communication board 102 and the heat sink 107 are integrally assembled to be connected together. At this time, the base end of the power plug 25 is inserted into the plug socket 111 of the power board 101, and the power board 101, the interface board 103, and the heat sink 107 are fixed to the lower cabinet 100 with screws. Protrusions formed at predetermined positions of the lower case 100 engage with convex holes of the power base plate 101 and the interface board 103 so that the boards are positioned on the lower case 100 .

Subsequently, as shown in FIG. 3B , the board positioned above the lower cabinet 100 is covered with the upper cabinet 110 . As shown in FIG. 3C , the lower case 100 and the upper case 110 are fixed to each other by screws. In the PLC modem 10 assembled in this way, the power plug 25 and the network connection unit 112 are exposed outside. In addition, the power plug 25 is configured to be connected to an outlet of a power line, and the network connection unit 112 is configured to be connected to a network cable. Power is supplied through the power line, and PLC signals are received and transmitted, so that the PLC modem 10 can perform data communication by sending data to another device such as a PC through a network cable.

As described above, the PLC modem 10 includes a power supply board 101 , a communication board 102 and an interface board 103 . As shown in FIG. 4 , the power board 101 has a power plug 25 , a coupler 16 , an impedance upper 27 , an AC/DC converter 24 , and a switching power supply 20 . The switching power supply 20 supplies various DC voltages (such as +1.2V, +3.3V, +10.5V, and +12V) to the communication board 102 or the interface board 103 . The switching power supply 20 includes, for example, a switching transformer and a DC-DC converter (these are not shown). Power is supplied from the power plug 25 to the switching power supply 20 through the impedance upper part 27 and the AC/DC converter 24 . The coupler 16 which separates and connects the PLC signal which will be a high-frequency signal from the power line to the power line, includes a coil transformer 16A and coupling capacitors 16B and 16C. The coupling capacitors 16B and 16C are connected to the power plug 25 , and the coil transformer 16A is connected to the communication board 102 .

The communication board 102 has a main IC (integrated circuit) 11, AFE/IC (analog front end/integrated circuit) 12, low pass filter (LPF) 13, driver IC 15, band pass filter (BPF) 17, memory 18, Ethernet PHY/IC (Physical Layer/Integrated Circuit)19. Connect indicator 23 to main IC11. The main IC 11 functions as a communication control unit in power line communication.

The main IC 11 includes a CPU (Central Processing Unit) 11A, a PLC/MAC (Power Line Communication/Media Access Control Layer) block 11C, and a PLC/PHY (Power Line Communication/Physical Layer) block 11B. A 32-bit RISC (Reduced Instruction Set Computer) processor is installed in the CPU 11A. The PLC/MAC block 11C manages the MAC layer (media access control layer) of transmitting and receiving signals. The PLC/PHY block 11B manages the PHY layer (physical layer) of transmitting signals and receiving signals. The AFE/IC 12 includes a DA converter (DAC: D/A converter) 12A, an AD converter (ADC: A/D converter) 12D, and variable gain amplifiers (VGA: Variable Gain Amplifier) 12B and 12C. In addition, the CPU 11A controls the PLC/MAC block 11C and the PLC/PHY block 11B using data stored in the memory 18, and also controls the PLC modem 10 as a whole.

The interface board 103 has a hub 28 , an indicator 29 , and a network connection unit 112 accommodating four RJ45 type modular jacks 22A, 22B, 22C and 22D. A network cable for connection to a PC or the like is connected to the modular jacks 22A, 22B, 22C, and 22D.

Communication performed by the PLC modem 10 in FIG. 4 is as follows. That is, data input to the modular jacks 22A, 22B, 22C, and 22D is sent to the main IC 11 through the hub 28 and the Ethernet PHY/IC 19 , and digital transmission signals are generated by performing digital signal processing. The generated digital transmission signal is converted into an analog signal by the DA converter (DAC) 12A of the AFE/IC12, and superimposed on the transmission channel as a PLC signal through the low-pass filter 13, the driver IC 15, and the coupler 16, and passed through the power supply Plug 25 and outlet 2 output to power line 1A.

The signal received from the power line 1A is divided into a PLC signal via a coupler 16, its gain is adjusted by a variable gain amplifier (VGA) 12C of the AFE/IC 12 through a bandpass filter 17, and the gain is adjusted by an AD converter (ADC) 12D. This signal is converted to a digital signal. The converted digital signal is sent to the main IC11, and digital signal processing is performed to convert into digital data. The converted digital data is output from modular jacks 22A, 22B, 22C and 22D through Ethernet PHY/IC 19 and hub 28 .

The PLC modem 10 is configured in such a manner that the power supply board 101 is a separate part from the communication board 102, and thus the communication board 102 is provided separately to be connected to the power supply board 101 through a connector. In this way, the communication board 102 having a signal processor for power line communication can be commonly used in various devices. Accordingly, the communication board 102 can be used in general when providing a power line communication function to various devices. Therefore, since it is not necessary to design separate communication boards according to the shapes of various devices, design effort or manufacturing cost can be reduced.

The first connector 105 and the second connector 106 are separately provided in the communication board 102 . The first connector 105 is separated from the second connector 106 . The coupler 16 is arranged near the first connector 105 and the power supply board 101, and the input unit (analog signal processor) for the PLC signal formed on the communication board 102 can be as close as possible, through the first connection Coupler 105 is connected to coupler 16. Accordingly, transmission channels for analog signals can be shortened. In addition, by erecting the communication board 102 relative to the power substrate 101 , the communication board 102 can be closer to the coupler 16 . In addition, since the communication board 102 and the interface board 103 can be connected to each other through the second connector 106 at a position away from the first connector 105, the transmission channel for the digital signal can be connected with the analog signal processor or the analog signal processor. Separated from the transmission channel, the digital signal contains data transmitted and received from a network connector such as Ethernet (registered trademark) interfaced with another device. With this structure, noise interference can be reduced, thereby improving communication performance.

The power base board 101 and the interface board 103 can be configured as two independent boards, and can also be configured as one integrated board as a base board. When the power supply substrate 101 and the interface board 103 are configured as one board, the number of components is reduced. When the power supply substrate 101 and the interface board 103 are configured as two boards, the interface board 103 is interchangeable with different boards having different shapes of the network connection unit 112 and the like. Accordingly, the PLC modem can be configured to easily correspond to different numbers of connection ports, various network types, and the like.

The heat sink 107 may be formed by bending a flat member such as a metal plate having high thermal conductivity and electrical conductivity, and holds the communication board 102 to be located in and fixed to the cabinet. With this structure, strength can be maintained while ensuring sufficient heat dissipation capability and heat dissipation area. The heat sink 107 extends so that at least a part of the heat sink faces the power supply substrate 101 and is provided so as not to overlap the power supply plug 25 and the plug receptacle 111 .

A support portion 107D formed upright from the interface board 103 is provided near an end portion 107C of the heat sink 107 facing the extension portion of the power supply substrate 101 . Due to this structure, even if pressure is applied to the heat sink 107 toward the power supply substrate 101 , the end portion 107C is held by the support portion 107D, and thus, the displacement of the heat sink 107 toward the power supply substrate 101 is regulated. At this time, the space between the radiator 107 and the power plug 25 or the plug socket 111 is sufficiently secured. As a modified example of the heat sink 107, the heat sink 107 may be formed in a substantially reversed U shape with respect to the power substrate 101 and the interface board 103, which suppresses displacement of the heat sink toward the power substrate. By configuring the heat sink 107 in this way, it is possible to prevent contact with the power plug 25 and the like while having a sufficient heat dissipation function.

Hereinafter, other embodiments regarding the arrangement of the power supply board 101 , the communication board 102 , and the interface board 103 will be described with reference to FIGS. 5 to 9 .

As shown in FIG. 5 , the communication board 102 is arranged such that the normal direction of the communication board 102 is different from the normal direction of the power substrate 101 and the normal direction of the interface board 103 . In addition, the communication board 102 , the power board 101 and the interface board 103 are electrically connected to each other. The power substrate 101 and the interface board 103 are arranged on one plane. In addition, the communication board 102 is erected substantially at right angles to the power supply board 101 and the interface board 103 arranged on one plane.

By arranging the power supply board 101 and the interface board 103 on one plane, it is possible to allow the outer size of the upper chassis 110 for housing the boards to be small, thereby miniaturizing the PLC modem 10 . In addition, by erecting the communication board 102 substantially at right angles to the power board 101 and the interface board 103 arranged on one plane, sufficient space can be ensured for mounting electronic components on the power board 101 and the interface board 103 . In particular, this structure is suitable for mounting electronic components because many large-sized electronic components (eg, coil transformer 16A of coupler 16 or coupling capacitors 16B and 16C) can be mounted on power supply substrate 101 .

In FIG. 5 , the longitudinal direction of the communication board 102 is substantially parallel to the lateral direction of the power supply substrate 101 and the lateral direction of the interface board 103 .

The power board 101 , the interface board 103 and the communication board 102 are electrically connected to each other through a connector 108 . The connector 108 has the functions of the power connector 104 , the first connector 105 and the second connector 106 described above.

By allowing the connector 108 to function as the power connector 104 , the first connector 105 and the second connector 106 , the number of components used in the PLC modem 10 can be reduced, thereby simplifying the manufacturing process of the PLC modem 10 .

However, since the connector 108 has the functions of the first connector 105 and the second connector 106, the PLC signal is more affected by noise generated by the digital signal used for the interface. For this reason, in the connector 108, preferably, an insulating member (not shown) is provided around the transmission channel for transmitting the PLC signal.

Preferably, coupler 16 (not shown) is positioned adjacent to connector 108 . Since the transmission channel for the PLC signal between the coupler 16 and the connector 18 can be shortened by disposing the coupler 16 near the connector 108, the communication performance of the PLC modem 10 can be improved.

Like the structure shown in FIG. 5, the structure of the main elements of the PLC modem 10 shown in FIG. 6 is specifically as follows. That is, the normal direction of the communication board 102 is different from the normal direction of the power substrate 101 and the normal direction of the interface board 103 . In addition, the communication board 102, the power board 101, and the interface board 103 are electrically connected to each other.

The power substrate 101 and the interface board 103 are arranged on one plane. In addition, the communication board 102 is arranged upright at substantially a right angle with respect to the power board 101 and the interface board 103 arranged on one plane, and is arranged between the power board 101 and the interface board 103 .

In the structural example shown in FIG. 6, since the communication board 102 is disposed between the power board 101 and the interface board 103, the overlapping area of the communication board 102 with the power board 101 and the interface board 103 can be made smaller. Accordingly, this structure is suitable for mounting electronic components because a large area can be secured in which electronic components are mounted in power supply substrate 101 and interface board 103 .

In addition, like the structural example shown in FIG. 5, since the communication board 102 is erected substantially at right angles to the power supply board 101 and the interface board 103 arranged on one plane, a large area can be secured in which the Electronic components are mounted in the power supply substrate 101 and the interface board 103 . In particular, this structure is suitable for mounting electronic components because many large-sized electronic components (eg, coil transformer 16A of coupler 16 or coupling capacitors 16B and 16C) can be mounted on power supply substrate 101 .

In FIG. 6 , the longitudinal direction of the communication board 102 is substantially parallel to the longitudinal direction of the power substrate 101 and the longitudinal direction of the interface board 103 .

A first connector 105 is provided on one main surface of the communication board 102 , and a second connector 106 is provided on the other main surface of the communication board 102 . The first connector 105 and the second connector 106 may be located anywhere on the communication board 102, but it is preferable to provide the first connector 105 and the second connector 106 separately. Since the influence of noise generated by the digital signal of the interface for receiving the PLC signal can be reduced by spacing the first connector 105 and the second connector 106 apart, the communication performance of the PLC modem 10 can be improved. In the case where the first connector 105 and the second connector 106 cannot be arranged to be separated from each other, an insulating member (not shown) may be provided at any position of the communication board 102 .

In FIG. 6 , power is supplied to the interface board 103 from the power board 101 through the first connector 105 and the second connector 106 .

In addition, it is preferable to arrange a coupler 16 (not shown) near the first connector 105 . Because the transmission channel for PLC signals between the coupler 16 and the first connector 15 can be shortened by disposing the coupler 16 near the first connector 105 , the communication performance of the PLC modem 10 can be improved.

In FIG. 7 , the communication board 102 , the power board 101 and the interface board 103 are arranged such that the normal direction of the communication board 102 , the normal direction of the power board 101 , and the normal direction of the interface board 103 are substantially parallel to each other. That is, the communication board 102, the power supply board 101, and the interface board 103 are arranged substantially on one plane.

Because by arranging all the boards substantially on one plane, the outer dimensions of the upper chassis 110 (dimensions in the normal direction of the communication board 102, the power supply board 101, and the interface board 103) can be made smaller, so this The structure is adapted to allow the PLC modem 10 to be thinned.

Since electronic components mounted on the boards can be prevented from interfering with each other even when stress is applied to the PLC modem 10 by arranging all the boards substantially on one surface, the durability or safety of the PLC modem 10 can be improved .

In the structure example shown in FIG. 7, since the communication board 102 is arranged between the power substrate 101 and the interface board 103, the area where the communication board 102 overlaps with the power substrate 101 and the interface board 103 can be equal to that shown in FIG. Area. Accordingly, since a large area can be secured in which electronic components are mounted on the power supply substrate 101 and the interface board 103, this structure is suitable for mounting electronic components.

In FIG. 7 , the longitudinal direction of the communication board 102 is substantially parallel to the longitudinal direction of the power substrate 101 and the longitudinal direction of the interface board 103 .

The first connector 105 is provided on one long side of the communication board 102 , and the second connector 106 is provided on the other long side of the communication board 102 .

The first connector 105 and the second connector 106 may be provided at any position, but it is preferable to provide the first connector 105 and the second connector 106 separately from each other. Since the PLC signal and the digital signal for one interface can be separated from each other by separating the first connector 105 and the second connector 106 from each other, noise influence of the digital signal on the PLC signal can be reduced.

In FIG. 7 , as in the structural example shown in FIG. 6 , power is also supplied from the power supply substrate 101 to the interface board 103 via the first connector 105 and the second connector 106 .

Preferably, a coupler 16 (not shown) is arranged adjacent to the first connector 105 . Since the transmission channel for PLC signals between the coupler 16 and the first connector 15 can be shortened by disposing the coupler 16 near the first connector 105, the communication performance of the PLC modem 10 can be improved.

In the structural example shown in FIG. 8, similar to the structural example shown in FIG. 7, the communication board 102, the power supply substrate 101, and the interface board 103 are set so that the normal direction of the communication board 102, the normal direction of the power substrate 101, The normal directions of the interface boards 103 are substantially parallel to each other. That is, the communication board 102, the power supply board 101, and the interface board 103 are disposed substantially on one surface.

As shown in FIG. 8 , the longitudinal direction of the communication board 102 is substantially perpendicular to the longitudinal direction of the power substrate 101 and the longitudinal direction of the interface board 103 .

This structure is suitable for allowing the PLC modem 10 to be thinned because the outer dimensions (dimensions in the normal direction of the communication board 102, etc.) of the upper cabinet 110 can be made smaller by arranging all the boards on substantially one plane. change.

Since electronic components mounted on the boards can be prevented from interfering with each other even when stress is applied to the PLC modem 10 by arranging all the boards on substantially one surface, durability or safety of the PLC modem 10 can be improved.

On one long side of the communication substrate 102, a first connector 105 and a second connector 106 are provided.

The first connector 105 and the second connector 106 may be provided at any position on one long side of the communication board 102 , but it is preferable to separate the first connector 105 from the second connector 106 . Since the PLC signal and the digital signal for one interface can be separated from each other by separating the first connector 105 and the second connector 106, noise influence of the digital signal on the PLC signal can be reduced.

Preferably, a coupler 16 (not shown) is arranged adjacent to the first connector 105 . Since the transmission channel for PLC signals between the coupler 16 and the first connector 15 can be shortened by disposing the coupler 16 near the first connector 105, the communication performance of the PLC modem 10 can be improved.

Like the structure example shown in FIG. 5 , the communication board 102 , the power board 101 and the interface board 103 can be connected to each other through the connector 108 .

Preferably, a coupler 16 (not shown) is arranged adjacent to the first connector 105 . Since the transmission channel for PLC signals between the coupler 16 and the first connector 15 can be shortened by disposing the coupler 16 near the first connector 105, the communication performance of the PLC modem 10 can be improved.

In the structural example shown in FIG. 9, the communication board 102, the power supply board 101 and the interface board 103 are arranged so that the normal direction of the communication board 102, the normal direction of the power board 101, and the normal direction of the interface board 103 are substantially parallel to each other. , and the communication board 102 overlaps with the power board 101 and the interface board 103 .

This configuration is beneficial in miniaturizing the PLC modem 10 because the outer dimensions of the upper and lower cabinets 110 and 100 can be made smaller by overlapping the communication board 102 with the power board 101 and the interface board 103 .

The first connector 105 and the second connector 106 may be provided at any position on the edge of the communication board 102, but preferably, as shown in the structural example of FIG. 9, the first connector is provided on the short side of the communication board 102. 105 and the second connector 106. Under this structure, since the first connector 105 and the second connector 106 can be arranged separately, the noise influence of the digital signal of one interface on the PLC signal can be reduced.

Power is supplied from the power substrate 101 to the interface board 103 through the first connector 105 and the second connector 106 .

Since, in FIGS. 5 to 9 , descriptions about components mounted on the power supply board 101 , communication board 102 , and interface board 103 are the same as those in FIGS. 1 to 4 , repeated descriptions are omitted.

Preferably, a coupler 16 (not shown) is arranged adjacent to the first connector 105 . Since the transmission channel for PLC signals between the coupler 16 and the first connector 15 can be shortened by disposing the coupler 16 near the first connector 105, the communication performance of the PLC modem 10 can be improved.

Specifically, in the description of the coupler 16 , the vicinity of the first connector 105 refers to a diameter range of 2 cm away from the first connector 105 .

In this way, the communication board 102 can be configured for common use in other devices. Under this structure, since the analog signal processor of the communication board 102 can be arranged near the coupler 16, the communication performance can be improved by shortening the transmission channel of the analog signal. In addition, the analog signal processor provided on the communication board 102 and the network interface unit provided on the interface board 103 can be separated from each other, so communication performance can be improved by reducing noise interference. Furthermore, while ensuring a sufficient heat dissipation function of the heat sink 107, it is possible to prevent the heat sink 107 from coming into contact with the input unit of the power line, such as the power plug 25 and the plug socket 111.

As for the interface unit, an interface for wireless communication and an interface for coaxial cable can be used.

The utility model is not limited to the above-mentioned embodiments, and those skilled in the art can modify and apply in various forms without departing from the description and based on known techniques. Therefore, it should be understood that various forms can be included within the scope of the present invention.

Claims (9)

1. communicator, by power line be different from the transmission medium executive communication of described power line, described communicator comprises:

Power supply board has the power subsystem that is connected to described power line;

Interface board forms discretely with described power supply board, and has the interface that is used for by described transmission medium executive communication; And

Communication board forms discretely with described power supply board and described interface board, and has the power line communication units by described power line executive communication, and the linkage unit that can be electrically connected to described power supply board and described interface board.

2. communicator as claimed in claim 1, wherein, described linkage unit comprises:

First connector comprises the transmission channel that is used for electric-power wire communication signal, and described first connector can be electrically connected to described power supply board; And

Second connector comprise the communication signal transmission passage that is used for by described interface transmission and reception, and described second connector can be electrically connected to described interface board.

3. communicator as claimed in claim 2, wherein, described first connector is away from described second connector.

4. communicator as claimed in claim 2, wherein, described power supply board comprises and is used to separate and the coupler of the described electric-power wire communication signal that is coupled, and

Wherein, described first connector is arranged near the described coupler.

5. communicator as claimed in claim 1, wherein, described communication board is perpendicular to described power supply board and described interface board.

6. communicator as claimed in claim 1 also comprises:

Casing holds described power supply board, described interface board and described communication board;

Attaching plug is provided on the surface of described casing; And

Radiator distributes the heat that produces from described communication board,

Wherein, the base portion of described attaching plug is connected to described power supply board, and

Wherein, described radiator keeps described communication board, and at least a portion of described radiator is arranged on the position towards described power supply board, thereby not overlapping with described attaching plug.

7. communicator as claimed in claim 6, wherein, described radiator comprises:

Extension extends out on the position of described power supply board from described communication board; And

Regulating part is regulated the displacement of the end of described extension towards described power supply board.

8. communicator as claimed in claim 1, wherein, described interface is the interface that is used for radio communication.

9. communicator as claimed in claim 1, wherein, described interface is the interface that is used for coaxial cable.

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