CN201966209U - Mixed light polycrystalline packaging structure - Google Patents

Abstract

A light mixing type polycrystalline packaging structure comprises: the LED packaging structure comprises a substrate unit, a light-emitting unit, a frame unit and a packaging unit; the first light-emitting module of the light-emitting unit is provided with a plurality of red light-emitting diode crystal grains arranged on the substrate unit, and the second light-emitting module of the light-emitting unit is provided with a plurality of blue light-emitting diode crystal grains arranged on the substrate unit; the first surrounding type frame colloid of the frame unit surrounds the first light-emitting module, and the second surrounding type frame colloid of the frame unit surrounds the second light-emitting module and the first surrounding type frame colloid; the transparent colloid and the fluorescent colloid of the packaging unit respectively cover the first light-emitting module and the second light-emitting module. The color rendering property is improved by the mutual light mixing of the red light source generated after the red light emitting diode crystal grains are matched with the transparent colloid and the white light source generated after the blue light emitting diode crystal grains are matched with the fluorescent colloid.

Description

Mixed light polycrystalline packaging structure

technical field

The utility model relates to a light-mixing polycrystalline packaging structure, in particular to a light-mixing polycrystalline packaging structure for increasing color rendering.

Background technique

The creation of electric lights can be said to have completely changed the way of life of all human beings. If we live without electric lights, all work will be suspended at night or when the weather is bad; The way of construction or the way of life of human beings will be completely changed, and all human beings will not be able to progress because of this, and will continue to stay in a relatively backward age.

Therefore, lighting devices used in the market today, such as fluorescent lamps, tungsten filament lamps, and even energy-saving light bulbs that are widely accepted by the public, have been widely used in daily life. However, most of these lamps have disadvantages such as fast light decay, high power consumption, high heat generation, short life, fragile or difficult to recycle. Therefore, in order to solve the above-mentioned problems, a light-emitting device made of light-emitting diodes has been developed accordingly. However, conventional light-emitting devices made of light-emitting diodes have insufficient color rendering and poor heat dissipation.

Utility model content

The embodiment of the present invention provides a light-mixing polycrystalline packaging structure, which can be used to increase color rendering.

One embodiment of the present invention provides a mixed-light polycrystalline packaging structure, which includes: a substrate unit, a light emitting unit, a frame unit and a packaging unit. The substrate unit has a substrate body and at least two crystal mounting regions arranged on the upper surface of the substrate body. The light-emitting unit has at least one first light-emitting module for generating red light and at least one second light-emitting module for generating blue light, wherein the first light-emitting module has a plurality of electrically disposed on one of the crystal placement regions of the substrate unit The red light-emitting diode crystal grain, and the second light-emitting module has a plurality of blue light-emitting diode crystal grains that are electrically arranged on another crystal placement area of the substrate unit. The frame unit has at least one first surrounding frame glue and at least one second surrounding frame glue formed on the upper surface of the substrate body by coating, wherein the first surrounding frame glue surrounds the first light-emitting module, so as to Form at least one first colloid limiting space above one of the crystal placement regions, and the second surrounding frame colloid surrounds the second light-emitting module and the first surrounding frame colloid, so as to form at least one space above the other crystal placement region and The second colloid limiting space is located between the first surrounding frame colloid and the second surrounding frame colloid. The packaging unit has a transparent colloid and a fluorescent colloid arranged on the upper surface of the substrate body to respectively cover the first light-emitting module and the second light-emitting module, wherein the transparent colloid is confined in the space limited by the first colloid, and the fluorescent colloid is confined in the In the space limited by the second colloid. Therefore, a plurality of red LED crystal grains cooperate with the transparent colloid and are located in the inner circle, and a plurality of blue LED crystal grains cooperate with the fluorescent colloid and are located in the outer circle.

In other words: a light-mixing type polycrystalline packaging structure, comprising: a substrate unit, which has a substrate body and at least two crystal placement regions arranged on the upper surface of the substrate body; a light-emitting unit, which has at least one In the first light-emitting module for generating red light and at least one second light-emitting module for generating blue light, wherein the above-mentioned at least one first light-emitting module has a plurality of red light-emitting modules that are electrically arranged on one of the crystal-mounting regions of the substrate unit Diode crystal grains, and the above-mentioned at least one second light-emitting module has a plurality of blue light-emitting diode crystal grains electrically disposed on another crystal mounting area of the substrate unit; at least one first surrounding frame glue and at least one second surrounding frame glue formed on the upper surface of the substrate body, wherein the at least one first surrounding frame glue surrounds the at least one first light-emitting module to form at least one The first colloid limiting space above one of the crystal placement regions, and the above-mentioned at least one second surrounding frame colloid surrounds the above-mentioned at least one second light-emitting module and the above-mentioned at least one first surrounding colloidal colloid, so as to form at least one space located in another A second colloid limiting space above the chip placement area and between the at least one first surrounding frame colloid and the at least one second surrounding frame colloid; A transparent colloid and a fluorescent colloid covering the at least one first light-emitting module and the at least one second light-emitting module respectively, wherein the transparent colloid is confined in the limiting space of the at least one first colloid, and the fluorescent colloid is covered by Confined in the at least one second colloid confining space.

Yet another embodiment of the present invention provides a light-mixing polycrystalline packaging structure, which includes: a substrate unit, a light emitting unit, a frame unit and a packaging unit. The difference from one of the above-mentioned embodiments is that multiple red light-emitting elements can be used to replace multiple red light-emitting diode chips, and the use of transparent colloid can be omitted. That is, the utility model further provides a light-mixing polycrystalline package structure, including: a substrate unit, which has a substrate body and at least two crystal placement regions arranged on the upper surface of the substrate body; a light-emitting unit, which has at least A first light-emitting module for generating red light and at least one second light-emitting module for generating blue light, wherein the above-mentioned at least one first light-emitting module has a plurality of electrically disposed on one of the crystal placement regions of the substrate unit Red light-emitting diode crystal grains, and the above-mentioned at least one second light-emitting module has a plurality of blue light-emitting diode crystal grains electrically arranged on another crystal mounting area of the substrate unit; a frame unit, which has a coating method And at least one first surrounding frame glue and at least one second surrounding frame glue are formed around the upper surface of the substrate body, wherein the at least one first surrounding frame glue surrounds the at least one second light-emitting module to form At least one first colloid limiting space above one of the crystal placement regions, and the at least one second surrounding frame colloid surrounds the at least one first light-emitting module and the at least one first surrounding frame colloid to form at least one A second colloid limiting space located above the other chip placement area and between the at least one first surrounding frame colloid and the at least one second surrounding frame colloid; The upper surface is covered with a transparent colloid and a fluorescent colloid of the at least one first light-emitting module and the at least one second light-emitting module respectively, wherein the fluorescent colloid is confined in the space limited by the at least one first colloid, and the transparent colloid The colloid is confined in the at least one second colloid confining space. In other words, since the multiple red light-emitting elements of the first light-emitting module have been packaged, they can be directly electrically connected to the substrate unit through SMT (Surface Mounted Technology).

Another embodiment of the present invention provides a mixed-light polycrystalline packaging structure, which includes: a substrate unit, a light emitting unit, a frame unit and a packaging unit. It differs from one of the above-mentioned embodiments in that: a plurality of red LED crystal grains cooperate with the transparent colloid and are located in the outer circle, and a plurality of blue LED crystal grains cooperate with the fluorescent colloid and are located in the inner circle. In other words, the present invention further provides a light-mixing polycrystalline packaging structure, including: a substrate unit, which has a substrate body and at least two crystal placement regions arranged on the upper surface of the substrate body; a light-emitting unit, It has at least one first light-emitting module for generating red light and at least one second light-emitting module for generating blue light, wherein the at least one first light-emitting module has a plurality of one of the crystals electrically disposed on the substrate unit The red light-emitting element on the region, and the above-mentioned at least one second light-emitting module has a plurality of blue light-emitting diode crystal grains that are electrically arranged on another crystal region of the substrate unit; a frame unit, which has a coated At least one first surrounding frame glue and at least one second surrounding frame glue formed on the upper surface of the substrate body in a surrounding manner, wherein the at least one first surrounding frame glue surrounds the at least one first light-emitting module, and The above-mentioned at least one second surrounding frame glue surrounds the above-mentioned at least one second light-emitting module and the above-mentioned at least one first surrounding frame glue, so as to form at least one above the other crystal placement area and at the above-mentioned at least one first surrounding frame The colloid limiting space between the colloid and the above-mentioned at least one second surrounding frame colloid; and a packaging unit, which has a fluorescent colloid arranged on the upper surface of the substrate body to cover the above-mentioned at least one second light-emitting module, wherein the fluorescent colloid The colloid is confined in the at least one colloid limiting space.

Still another embodiment of the present invention provides a light-mixing polycrystalline packaging structure, which includes: a substrate unit, a light emitting unit, a frame unit and a packaging unit. It is different from the other embodiment above in that: multiple red light emitting elements can be used to replace multiple red light emitting diode chips, and the use of transparent colloid can be omitted. That is, a light-mixing polycrystalline packaging structure, comprising: a substrate unit, which has a substrate body and at least two crystal placement regions arranged on the upper surface of the substrate body; a light-emitting unit, which has at least one for generating red A first light-emitting module for light and at least one second light-emitting module for generating blue light, wherein the at least one first light-emitting module has a plurality of red light-emitting elements electrically arranged on one of the crystal mounting regions of the substrate unit, and The above-mentioned at least one second light-emitting module has a plurality of blue light-emitting diode crystal grains electrically disposed on another crystal-mounting area of the substrate unit; At least one first surrounding frame colloid and at least one second surrounding frame colloid on the upper surface of the main body, wherein the at least one first surrounding frame colloid surrounds the at least one second light-emitting module to form at least one chip located in one of them. The colloid limiting space above the area, and the above-mentioned at least one second surrounding frame colloid surrounds the above-mentioned at least one first light-emitting module and the above-mentioned at least one first surrounding colloidal frame; and a packaging unit, which has a The upper surface is covered with the fluorescent colloid of the at least one second light-emitting module, wherein the fluorescent colloid is confined in the space limited by the at least one colloid. In other words, since the multiple red light-emitting elements of the first light-emitting module have been packaged, they can be directly electrically connected to the substrate unit through SMT.

To sum up, the polycrystalline packaging structure provided by the embodiment of the present invention can pass through "the red light source (or a plurality of packaged red light-emitting elements) )” and “the white light source produced by the cooperation of the blue light-emitting diode crystal grains and the fluorescent colloid” mutually produce a mixed light effect, thereby improving the color rendering that can be presented by the light-mixed polycrystalline packaging structure of the utility model.

In order to further understand the features and technical content of the present utility model, please refer to the following detailed description and accompanying drawings of the present utility model. However, the attached drawings are only for reference and illustration, and are not intended to limit the present utility model.

Description of drawings

Fig. 1A is a schematic top view of Embodiment 1 of the utility model;

Fig. 1B is a schematic side view sectional view of Embodiment 1 of the utility model;

Fig. 2 is a schematic top view of Embodiment 2 of the utility model;

Fig. 3 is a schematic side view sectional view of the third embodiment of the utility model;

Fig. 4 is a schematic side view sectional view of Embodiment 4 of the present utility model;

Fig. 5 is a schematic top view of Embodiment 5 of the present utility model; and

Fig. 6 is a schematic top view of Embodiment 6 of the present utility model.

[Description of reference signs of main components]

LED packaging structure M

The first group of light-emitting structures N1

The second group of light-emitting structures N2

Substrate unit 1 Substrate body 10

Circuit board 100

Heat dissipation layer 101

Conductive pad 102

Insulation layer 103

Crystal placement area 11

The first light-emitting module 2a red light-emitting diode grain 20a

Red light emitting element 20a’

The second light-emitting module 2b blue light-emitting diode grain 20b

Frame unit 3 1st surrounding frame colloid 30a

The second surrounding frame colloid 30b

Engagement convex part 300

The first colloid limit space 300a

Colloid limited space 300a’

The second colloid limiting space 300b

Colloid limited space 300b’

Arc Tangent T

angle θ

Height H

Width W

Encapsulation unit 4 transparent colloid 40a

Fluorescent colloid 40b

Detailed ways

Embodiment one

Please refer to FIG. 1A to FIG. 1B . Embodiment 1 of the present invention provides a light-mixing polycrystalline packaging structure M, which includes: a substrate unit 1 , a light emitting unit, a frame unit 3 and a packaging unit 4 .

The substrate unit 1 has at least one substrate body 10 and at least two crystal mounting regions 11 disposed on the upper surface of the substrate body 10 . In addition, the substrate body 10 has a circuit substrate 100, a heat dissipation layer 101 disposed on the bottom of the circuit substrate 100, a plurality of conductive pads 102 disposed on the upper surface of the circuit substrate 100, and a plurality of conductive pads 102 disposed on the upper surface of the circuit substrate 100 for exposing The insulating layer 103 of the plurality of conductive pads 102 . Therefore, the heat dissipation layer 101 can be used to increase the heat dissipation effect of the circuit substrate 100 , and the plurality of insulating layers 103 is a solder resist layer that can only expose the plurality of conductive pads 102 and reach a limited soldering area.

The light-emitting unit has at least one first light-emitting module 2a for generating red light and at least one second light-emitting module 2b for generating blue light, wherein the first light-emitting module 2a has a plurality of electrical devices disposed on the substrate unit 1. The red light-emitting diode crystal grain (bare crystal) 20a on the crystal region 11, and the second light-emitting module 2b has a plurality of blue light-emitting diode crystal grains (bare crystal) electrically disposed on another crystal region 11 of the substrate unit 1. ) 20b. In other words, the designer can pre-plan at least two predetermined die placement regions 11 on the substrate unit 1, so that the above-mentioned multiple red LED dies 20a and the above-mentioned multiple blue LED dies 20b can be wired The method is respectively electrically disposed on the two chip placement regions 11 of the substrate unit 1 .

The frame unit 3 has at least one first surrounding frame glue 30a and at least one second surrounding frame glue 30b formed around the upper surface of the substrate body 10 by coating or any other forming method, wherein the first surrounding frame The glue 30a surrounds the first light-emitting module 2a to form at least one first glue-limiting space 300a above one of the crystal placement regions 11, and the second surrounding frame glue 30b surrounds the second light-emitting module 2b and the first surrounding frame The glue 30a is used to form at least one second glue limiting space 300b located above the other crystal placement area 11 and between the first surrounding frame glue 30a and the second surrounding frame glue 30b.

Furthermore, the first and second surrounding frame glue 30a, 30b both have an engaging convex portion 300 or an engaging concave portion, that is, when the surrounding forming process of the first and second surrounding frame glue 30a, 30b is about to end , the engaging convex portion 300 or an engaging concave portion will be naturally generated. In addition, the upper surfaces of the first and second surrounding frame adhesives 30a, 30b are both arc-shaped, and the angle of the first and second surrounding frame adhesives 30a, 30b relative to the arc tangent T of the upper surface of the substrate body 10 θ is between 40 and 50 degrees, the height H of the top surface of the first and second surrounding frame glue 30a, 30b relative to the upper surface of the substrate body 10 is between 0.3 and 0.7mm, and the first and second The width W of the bottom of the surrounding frame glue 30a, 30b is between 1.5mm and 3mm, and the thixotropic index (thixotropic index) of the first and second surrounding frame glue 30a, 30b is between 4 and 6, and Both the first and second surrounding frame glues 30a, 30b are white thermosetting frame glues with inorganic additive particles inside.

The packaging unit 4 has a transparent glue 40a and a fluorescent glue 40b formed on the upper surface of the substrate body 10 to cover the first light emitting module 2a and the second light emitting module 2b respectively, wherein the transparent glue 40a is confined in the first glue limiting space 300a Inside, and the fluorescent colloid 40b is confined in the second colloid limiting space 300b. In addition, the first surrounding frame glue 30a and the second surrounding frame glue 30b are arranged in a concentric circle, and the second light emitting module 2b is disposed between the first surrounding frame glue 30a and the second surrounding frame glue 30b.

In addition, the first group of light-emitting structures N1 disposed on the inner ring includes: a substrate body 10 , a plurality of red LED dies 20 a , a first surrounding frame glue 30 a and a transparent glue 40 a. The second group of light-emitting structures N2 disposed on the outer circle includes: a substrate body 10 , a plurality of blue light-emitting diode chips 20 b , a second surrounding frame glue 30 b and a fluorescent glue 40 b. Furthermore, according to different design requirements, the first group of light-emitting structures N1 and the second group of light-emitting structures N2 can share the same substrate unit 1, such as the example given in Embodiment 1 or use different substrate units respectively, and the first group The combination of the light-emitting structure N1 and the second group of light-emitting structures N2 forms the utility model light-mixing polycrystalline packaging structure M.

In addition, because "the red light source produced by the combination of multiple red light-emitting diode crystal grains 20a and the transparent colloid 40a" and "the white light source produced by the cooperation of the blue light-emitting diode crystal grains 20b and the fluorescent colloid 40b" can generate mixed light effect, and further improve the color rendering performance that can be presented by the light-mixing polycrystalline packaging structure M of the present invention.

Embodiment two

Please refer to FIG. 2 , the second embodiment of the present invention provides a light-mixing polycrystalline package structure M. From the comparison of Fig. 2 and Fig. 1, it can be seen that the biggest difference between the second embodiment of the present invention and the first embodiment is: in the second embodiment, the positions of the first light-emitting module 2a and the second light-emitting module 2b are reversed, so that the second light-emitting module 2a A light emitting module 2a is placed on the outer ring, and a second light emitting module 2b is placed on the inner ring. In other words, the first surrounding frame glue 30a surrounds the second light emitting module 2b, the second surrounding frame glue 30b surrounds the first light emitting module 2a and the first surrounding frame glue 30a, and the first light emitting module 2a is arranged on the first surrounding frame Between the frame glue 30a and the second surrounding frame glue 30b. The fluorescent colloid 40b is confined in the first colloid limiting space 300a, and the transparent colloid 40a is confined in the second colloid limiting space 300b.

Therefore, the utility model can set the first group of light-emitting structures N1 with "a plurality of red light-emitting diode crystal grains 20a and transparent colloid 40a" in the inner ring according to the designer's needs, and will have "blue light-emitting diodes" The second group of light-emitting structures N2 of crystal grains 20b and fluorescent colloid 40b" are arranged on the outer ring, as shown in Embodiment 1, or the first group of light-emitting structures with "multiple red light-emitting diode crystal grains 20a and transparent colloid 40a" N1 is arranged on the outer ring, and the second group of light-emitting structures N2 having "blue light-emitting diode crystal grains 20b and fluorescent colloid 40b" is arranged on the inner ring, as shown in the second embodiment.

Embodiment three

Please refer to FIG. 3 . Embodiment 3 of the present invention provides a light-mixing polycrystalline packaging structure M, which includes: a substrate unit 1 , a light emitting unit, a frame unit 3 and a packaging unit 4 . The biggest difference between the third embodiment of the utility model and the first embodiment is that in the third embodiment, according to different design requirements, the first surrounding frame colloid 30a and the second surrounding frame colloid 30b can be transparent colloid or fluorescent colloid one of the For example, the present invention can selectively add fluorescent powder in the first surrounding frame colloid 30a and the second surrounding frame colloid 30b according to different requirements, so that the light source can be guided to the transparent colloid 40a and the second surrounding frame colloid 30b. Light is emitted between the fluorescent colloids 40b, as shown by upward or oblique arrows in the figure, thereby reducing the dark band between the transparent colloids 40a and the fluorescent colloids 40b.

Embodiment Four

Please refer to FIG. 4 . Embodiment 4 of the present invention provides a light-mixing polycrystalline packaging structure M, which includes: a substrate unit 1 , a light emitting unit, a frame unit 3 and a packaging unit 4 . The biggest difference between Embodiment 4 of the present utility model and Embodiment 1 is that in Embodiment 4, according to different design requirements, the first surrounding frame colloid 30a can be transparent colloid or fluorescent colloid, and the second surrounding frame colloid 30b Can be reflective colloid. For example, the present invention can selectively add fluorescent powder to the first surrounding frame colloid 30a according to different needs, so that the light source can be guided between the transparent colloid 40a and the fluorescent colloid 40b to emit light, such as As shown by the upward arrow in the figure, the dark band between the transparent colloid 40a and the fluorescent colloid 40b is further reduced. In addition, because the second surrounding frame colloid 30b is a light-reflecting colloid, the light source projected by the light-mixing polycrystalline packaging structure M can obtain a better light-gathering effect.

Embodiment five

Please refer to FIG. 5 . Embodiment 5 of the present invention provides a light-mixing polycrystalline packaging structure M, which includes: a substrate unit 1 , a light emitting unit, a frame unit 3 and a packaging unit 4 . The substrate unit 1 has a substrate body 10 and at least two crystal mounting regions 11 disposed on the upper surface of the substrate body 10 . The light-emitting unit has at least one first light-emitting module 2a for generating red light and at least one second light-emitting module 2b for generating blue light, wherein the first light-emitting module 2a has a plurality of electrical devices disposed on the substrate unit 1. The red light-emitting elements 20a' on the crystal region 11, for example, each red light-emitting element 20a' can be a packaged red LED package element, which can be electrically connected to the substrate unit 1 by means of SMT, and the second light-emitting module 2b There are a plurality of blue light-emitting diode chips 20 b electrically disposed on another chip-mounting region 11 of the substrate unit 1 . The frame unit 3 has at least one first surrounding frame glue 30a and at least one second surrounding frame glue 30b formed around the upper surface of the substrate body 10 by coating, wherein the first surrounding frame glue 30a surrounds the second A light-emitting module 2a, and the second surrounding frame glue 30b surrounds the second light-emitting module 2b and the first surrounding frame glue 30a, so as to form at least one above the other crystal placement area 11 and between the first surrounding frame glue 30a and The colloid limiting space 300b' between the second surrounding frame colloids 30b. Both the first and second surrounding frame glues 30a, 30b have an engaging convex portion 300 or an engaging concave portion. The packaging unit 4 has a fluorescent glue 40b disposed on the upper surface of the substrate body 10 to cover the second light emitting module 2b, wherein the fluorescent glue 40b is confined in the glue limiting space 300b'.

Embodiment six

Please refer to FIG. 6 , the sixth embodiment of the present invention provides a light-mixing polycrystalline packaging structure M, which includes: a substrate unit 1 , a light emitting unit, a frame unit 3 and a packaging unit 4 . The substrate unit 1 has a substrate body 10 and at least two crystal mounting regions 11 disposed on the upper surface of the substrate body 10 . The light-emitting unit has at least one first light-emitting module 2a for generating red light and at least one second light-emitting module 2b for generating blue light, wherein the first light-emitting module 2a has a plurality of electrical devices disposed on the substrate unit 1. The red light-emitting elements 20a' on the crystal region 11, for example, each red light-emitting element 20a' can be a packaged red LED package element, which can be electrically connected to the substrate unit 1 by means of SMT, and the second light-emitting module 2b There are a plurality of blue light-emitting diode chips 20 b electrically disposed on another chip-mounting region 11 of the substrate unit 1 . The frame unit 3 has at least one first surrounding frame glue 30a and at least one second surrounding frame glue 30b formed around the upper surface of the substrate body 10 by coating, wherein the first surrounding frame glue 30a surrounds the second Two light-emitting modules 2b to form at least one colloid limiting space 300a' above one of the chip placement regions 11, and the second surrounding frame colloid 30b surrounds the first light-emitting module 2a and the first surrounding colloidal frame colloid 30a. The packaging unit 4 has a fluorescent glue 40b disposed on the upper surface of the substrate body 10 to cover the second light emitting module 2b, wherein the fluorescent glue 40b is confined in the glue limiting space 300a'.

To sum up, due to the red light source produced by the combination of multiple red light-emitting diode crystal grains and transparent colloid, or multiple packaged red light-emitting elements The generated white light sources" can generate mixed light effects with each other, thereby improving the color rendering that can be presented by the light-mixed polycrystalline packaging structure of the utility model.

In addition, the utility model forms a surrounding frame colloid (surrounding white colloid) of any shape by coating, and limits a light-transmitting packaging colloid (transparent colloid or light-transmitting colloid) through the surrounding frame colloid position and adjust the surface shape of the light-transmitting encapsulation colloid, so the utility model can "improve the luminous efficiency of the LED crystal grain" and "control the light emitting angle of the LED crystal grain". In other words, through the use of the enclosing frame glue, the light-transmitting packaging glue is limited in the glue-limiting space, and then the "use amount and position of the light-transmitting packaging glue" can be controlled. Furthermore, by controlling the amount and position of the transparent encapsulating colloid, the surface shape and height of the transparent encapsulating colloid can be adjusted, thereby controlling the exit angle of the light beams generated by the plurality of LED chips. In addition, the utility model can also use the enclosing frame colloid, so that the light beams generated by a plurality of LED crystal grains are projected on the inner wall of the enclosing frame colloid to generate reflection, thereby increasing the luminous efficiency of the utility model.

The above descriptions are only preferred feasible embodiments of the present utility model, and are not intended to limit the scope of protection of the present utility model. Therefore, all equivalent technical changes made by using the description of the utility model and the contents of the accompanying drawings are included in the utility model. within the scope of protection.

Claims (14)

1. A light-mixing type polycrystalline packaging structure, characterized in that, comprising: A substrate unit, which has a substrate body and at least two crystal mounting regions arranged on the upper surface of the substrate body; A light-emitting unit, which has at least one first light-emitting module for generating red light and at least one second light-emitting module for generating blue light, wherein the at least one first light-emitting module has a plurality of electrically arranged on the substrate unit The red light-emitting diode crystal grain on one of the die-mounting regions, and the above-mentioned at least one second light-emitting module has a plurality of blue light-emitting diode dies electrically arranged on the other die-mounting region of the substrate unit; A frame unit, which has at least one first surrounding frame glue and at least one second surrounding frame glue formed around the upper surface of the substrate body by coating, wherein the at least one first surrounding frame glue Surround the at least one first light-emitting module to form at least one first colloidal space above one of the crystal mounting regions, and the at least one second surrounding frame colloid surrounds the at least one second light-emitting module and the at least one The first surrounding frame glue, to form at least one second glue limiting space above the other crystal placement area and between the at least one first surrounding frame glue and the at least one second surrounding frame glue; and A packaging unit, which has a transparent colloid and a fluorescent colloid arranged on the upper surface of the substrate body to cover the at least one first light-emitting module and the at least one second light-emitting module respectively, wherein the transparent colloid is confined to the at least one In the first colloid limiting space, and the fluorescent colloid is confined in the at least one second colloid limiting space. 2 . The light-mixing polycrystalline packaging structure according to claim 1 , wherein the at least one first and second surrounding frame glues both have a joint protrusion or a joint recess. 3 . 3. The light-mixing polycrystalline packaging structure according to claim 1, wherein the at least one first surrounding frame colloid and the at least one second surrounding frame colloid are arranged in a concentric circle, and the at least one The second light-emitting module is disposed between the at least one first surrounding frame glue and the at least one second surrounding frame glue. 4. The light-mixing polycrystalline packaging structure according to claim 1, wherein the at least one first surrounding frame colloid is transparent colloid or fluorescent colloid, and the at least one second surrounding frame colloid is transparent colloid , fluorescent colloid or reflective colloid. 5. The light-mixing polycrystalline packaging structure according to claim 1, wherein the upper surfaces of the at least one first and second surrounding frame colloids are both arc-shaped, and the at least one first and second The angles of the two surrounding frame colloids relative to the arc tangent of the upper surface of the substrate body are between 40 and 50 degrees, and the top surfaces of the at least one first and second surrounding frame colloids are relative to the upper surface of the substrate body. The heights are all between 0.3 and 0.7 mm, the widths of the bottom of the at least one first and second surrounding frame colloids are both between 1.5 and 3 mm, and the thixotropy of the at least one first and second surrounding frame colloids The indexes are all between 4 and 6, and the above-mentioned at least one first and second surrounding frame colloids are both a white thermosetting frame colloid with inorganic added particles inside. 6. A mixed-light polycrystalline packaging structure, characterized in that it comprises: A substrate unit, which has a substrate body and at least two crystal mounting regions arranged on the upper surface of the substrate body; A light-emitting unit, which has at least one first light-emitting module for generating red light and at least one second light-emitting module for generating blue light, wherein the at least one first light-emitting module has a plurality of electrically arranged on the substrate unit The red light-emitting diode crystal grain on one of the die-mounting regions, and the above-mentioned at least one second light-emitting module has a plurality of blue light-emitting diode dies electrically arranged on the other die-mounting region of the substrate unit; A frame unit, which has at least one first surrounding frame glue and at least one second surrounding frame glue formed around the upper surface of the substrate body by coating, wherein the at least one first surrounding frame glue Surrounding the at least one second light-emitting module to form at least one first colloid space above one of the crystal mounting regions, and the at least one second surrounding frame colloid surrounds the at least one first light-emitting module and the at least one The first surrounding frame glue, to form at least one second glue limiting space above the other crystal placement area and between the at least one first surrounding frame glue and the at least one second surrounding frame glue; and A packaging unit, which has a transparent colloid and a fluorescent colloid arranged on the upper surface of the substrate body to cover the at least one first light-emitting module and the at least one second light-emitting module respectively, wherein the fluorescent colloid is confined to the at least one In the first colloid limiting space, and the transparent colloid is confined in the at least one second colloid limiting space. 7 . The light-mixing polycrystalline packaging structure according to claim 6 , wherein the at least one first and second surrounding frame adhesives both have a joint protrusion or a joint recess. 8 . 8. The light-mixing polycrystalline packaging structure according to claim 6, wherein the at least one first surrounding frame colloid and the at least one second surrounding frame colloid are arranged in a concentric circle, and the at least one The first light-emitting module is disposed between the at least one first surrounding frame glue and the at least one second surrounding frame glue. 9. The light-mixing polycrystalline packaging structure according to claim 6, wherein the at least one first surrounding frame colloid is transparent colloid or fluorescent colloid, and the at least one second surrounding frame colloid is transparent colloid , fluorescent colloid or reflective colloid. 10. The light-mixing polycrystalline packaging structure according to claim 6, wherein the upper surfaces of the at least one first and second surrounding frame colloids are both arc-shaped, and the at least one first and second The angles of the two surrounding frame colloids relative to the arc tangent of the upper surface of the substrate body are between 40 and 50 degrees, and the top surfaces of the at least one first and second surrounding frame colloids are relative to the upper surface of the substrate body. The heights are all between 0.3 and 0.7 mm, the widths of the bottom of the at least one first and second surrounding frame colloids are both between 1.5 and 3 mm, and the thixotropy of the at least one first and second surrounding frame colloids The indexes are all between 4 and 6, and the above-mentioned at least one first and second surrounding frame colloids are both a white thermosetting frame colloid with inorganic added particles inside. 11. A mixed-light polycrystalline packaging structure, characterized in that it comprises: A substrate unit, which has a substrate body and at least two crystal mounting regions arranged on the upper surface of the substrate body; A light-emitting unit, which has at least one first light-emitting module for generating red light and at least one second light-emitting module for generating blue light, wherein the at least one first light-emitting module has a plurality of electrically arranged on the substrate unit The red light-emitting element on one of the crystal-mounting regions, and the at least one second light-emitting module has a plurality of blue light-emitting diode crystal grains electrically arranged on the other crystal-mounting region of the substrate unit; A frame unit, which has at least one first surrounding frame glue and at least one second surrounding frame glue formed around the upper surface of the substrate body by coating, wherein the at least one first surrounding frame glue Surrounding the at least one first light-emitting module, and the at least one second surrounding frame colloid surrounding the at least one second light-emitting module and the at least one first surrounding frame colloid to form at least one area above the other crystal placement area And the colloid limiting space between the at least one first surrounding frame colloid and the at least one second surrounding frame colloid; and An encapsulation unit has a fluorescent colloid arranged on the upper surface of the substrate body to cover the at least one second light-emitting module, wherein the fluorescent colloid is confined in the space limited by the at least one colloid. 12 . The light-mixing polycrystalline packaging structure according to claim 11 , wherein the at least one first and second surrounding frame adhesives both have a joint protrusion or a joint recess. 13 . 13. A mixed-light polycrystalline packaging structure, characterized in that it comprises: A substrate unit, which has a substrate body and at least two crystal mounting regions arranged on the upper surface of the substrate body; A light-emitting unit, which has at least one first light-emitting module for generating red light and at least one second light-emitting module for generating blue light, wherein the at least one first light-emitting module has a plurality of electrically arranged on the substrate unit The red light-emitting element on one of the crystal-mounting regions, and the at least one second light-emitting module has a plurality of blue light-emitting diode crystal grains electrically arranged on the other crystal-mounting region of the substrate unit; A frame unit, which has at least one first surrounding frame glue and at least one second surrounding frame glue formed around the upper surface of the substrate body by coating, wherein the at least one first surrounding frame glue Surround the at least one second light-emitting module to form at least one colloidal space above one of the crystal placement regions, and the at least one second surrounding frame colloid surrounds the at least one first light-emitting module and the at least one first light-emitting module. Wrap-around bezel gel; and An encapsulation unit has a fluorescent colloid arranged on the upper surface of the substrate body to cover the at least one second light-emitting module, wherein the fluorescent colloid is confined in the space limited by the at least one colloid. 14 . The light-mixing polycrystalline packaging structure according to claim 13 , wherein the at least one first and second surrounding frame adhesives both have a joint protrusion or a joint recess. 15 .

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