[go: up one dir, main page]

CN202167495U - An Improved Hybrid Rectifier Diode Structure - Google Patents

An Improved Hybrid Rectifier Diode Structure Download PDF

Info

Publication number
CN202167495U
CN202167495U CN201120167436.1U CN201120167436U CN202167495U CN 202167495 U CN202167495 U CN 202167495U CN 201120167436 U CN201120167436 U CN 201120167436U CN 202167495 U CN202167495 U CN 202167495U
Authority
CN
China
Prior art keywords
junction
utility
model
active region
anode electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201120167436.1U
Other languages
Chinese (zh)
Inventor
王颖
李婷
曹菲
刘云涛
邵雷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harbin Engineering University
Original Assignee
Harbin Engineering University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harbin Engineering University filed Critical Harbin Engineering University
Priority to CN201120167436.1U priority Critical patent/CN202167495U/en
Application granted granted Critical
Publication of CN202167495U publication Critical patent/CN202167495U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/60Schottky-barrier diodes 

Landscapes

  • Electrodes Of Semiconductors (AREA)

Abstract

本实用新型提供的是一种改进的混合整流二极管结构,包括N+衬底区(100)、N型漂移区(101)、有源区结P+部分(102)、第一部分阳极电极(104)、阴极电极(105)、二氧化硅层(106)、第二部分阳极电极(107);还包括有源区结P部分(103),所述有源区结P部分(103)包围有源区结P+部分(102)。本实用新型将结终端保护环与二极管有源区同时形成,并且所有区域(102)都在区域(103)中形成,在不牺牲器件正向特性,输出电容的前提下,提高了结势垒肖特基二极管器件的耐压。本实用新型与普通MPS、JBS工艺兼容,具有很强的可实施性,更易满足功率电子系统的应用要求。

Figure 201120167436

The utility model provides an improved hybrid rectifier diode structure, comprising an N + substrate region (100), an N-type drift region (101), an active region junction P + part (102), a first part of the anode electrode (104 ), the cathode electrode (105), the silicon dioxide layer (106), the second part of the anode electrode (107); also includes the active region junction P part (103), and the active region junction P part (103) is surrounded by Source junction P + part (102). The utility model forms the junction terminal protection ring and the diode active region at the same time, and all the regions (102) are formed in the region (103), and the junction potential barrier is improved without sacrificing the forward characteristics of the device and the output capacitance. The withstand voltage of the tertiary diode device. The utility model is compatible with ordinary MPS and JBS processes, has strong implementability, and can more easily meet the application requirements of power electronic systems.

Figure 201120167436

Description

A kind of improved mixed-rectification diode structure
Technical field
The utility model relates to a kind of diode, specifically a kind of mixed-rectification diode structure.
Background technology
Carborundum (SiC) is typical case's representative of third generation semi-conducting material; Also be that present crystal technique and device manufacture level are the most ripe, one of most widely used semiconductor material with wide forbidden band, can produce the excellent more high temperature (300~500 ℃) of performance, high frequency, high power, high-speed, radioresistance device.Under same withstand voltage and current condition, the drift zone resistance of SiC device is lower 200 times than silicon, even the conduction voltage drop of high withstand voltage SiC FET, also much lower than mono-polar, ambipolar silicon device; Can reach the 10ns magnitude switching time of SiC device, and have very superior FBSOA; The SiC power device, performance index are than the taller one magnitude of GaAs device.The SiC power device can significantly reduce the energy consumption of electronic equipment, so the SiC power device also is described as " green energy resource " device of drive " new forms of energy revolution ".
PiN diode and Schottky diode are two kinds of the most frequently used power rectifiers.Fig. 2 has provided common junction barrier schottky diode device architecture.The I-V characteristic and the PN junction diode of Schottky diode are very similar, but the electric current composition is different.The Schottky diode of mono-polar has switching speed faster than ambipolar P-i-N diode, yet the reverse leakage current of Schottky diode is big, and breakdown potential is forced down, and is not suitable for high-voltage applications.Have simultaneously SBD fast and the high voltage bearing device of P-i-N be best choice.This diode is called JBS (Junction Barrier Schottky) or MPS (Merged PiN/Schottky).PN junction is integrated in the Schottky junction structure, and the depletion region of PN junction is shielded from schottky interface outside the High-Field when applied in reverse, has avoided Schottky barrier to reduce effect, and reverse leakage current is reduced greatly.MPS has thick drift region, is suitable for high-pressure work.The JBS device adopts the low metal of Schottky barrier, has reduced forward voltage drop, and its reverse leakage current reduces owing to the screen effect of PN junction.Forward conduction characteristics is determined by Schottky contacts, and reverse blocking is determined by PN junction, so the switching speed of this device is very fast.
Summary of the invention
The purpose of the utility model is to provide a kind of and is not sacrificing the device forward characteristic, under the prerequisite of output capacitance, can improve the withstand voltage improved mixed-rectification diode structure of junction barrier schottky diode device.
The purpose of the utility model is achieved in that
Comprise N +Substrate zone 100, N type drift region 101, active area knot P +Part 102, first's anode electrode 104, cathode electrode 105, silicon dioxide layer 106, second portion anode electrode 107; Also include source region knot P part 103, said active area knot P part 103 is surrounded by source region knot P +Part 102.
The utility model can also comprise:
1, the doping content of active area knot P part 103 is lower than active area knot P +The doping content of part 102.
2, the metal of first's anode electrode 104 and cathode electrode 105 contacts with N type drift region 101 and is ohmic contact, second portion anode electrode 107 and active area knot P +Part 102 contacts Schottky contacts with active area knot P part 103, and first's anode electrode 104 and second portion anode electrode 107 short circuits.
A kind of improved mixed-rectification diode structure of the utility model can be through the doping content and the two-dimensional of optimal design N type drift region 101, and field oxide is the two-dimensional of silicon dioxide layer 106.The utility model structure not only PN junction place has the peak electric field point, and at active area knot P +Also there is the peak electric field point in the edge in part 102 zones; This makes that PN junction knee peak electric field point is lower than common junction barrier schottky diode at identical negative sense bias voltage, this shows that a kind of improved mixed-rectification diode structure of the utility model has the withstand voltage characteristics that promote significantly.
The utility model provides a kind of improved mixed-rectification diode structure.Junction termination technique ring and diode active area are formed simultaneously, and all active area knot P +Part 102 all forms in active area knot P part 103 zones, is not sacrificing the device forward characteristic, under the prerequisite of output capacitance, has improved the withstand voltage of junction barrier schottky diode device.The utility model and common MPS, JBS process compatible have very strong exploitativeness, more are prone to satisfy the application requirements of power electronic system.
The structural parameters of MPS, JBS device mainly are schottky barrier height, injection window, Schottky contacts proportion, epitaxial layer concentration, epitaxy layer thickness etc.The puncture voltage of MPS, JBS depends on semiconductor breakdown electric field, outer layer doping concentration frontal organ spare edge termination.Because devices such as JBS, SBD, MPS are harsh to the requirement at terminal; High to the surface charge susceptibility; The utility model provides the guard ring structure that forms the P+ district in the P trap; And this structure applications formed in the inner P+ ring of MPS, JBS, the utility model claims that this structure is a kind of improved mixed-rectification diode structure.
Description of drawings
Fig. 1 is a kind of improved mixed-rectification diode structure device architecture sketch map of the utility model;
Fig. 2 is common junction barrier schottky diode device architecture sketch map;
Fig. 3 is a kind of improved mixed-rectification diode structure device of the utility model and the comparison of common junction barrier schottky diode device electric breakdown strength characteristic;
Fig. 4 is a kind of improved mixed-rectification diode structure device of the utility model and the comparison of common junction barrier schottky diode device forward conduction characteristic;
Fig. 5 is a kind of improved mixed-rectification diode structure device of the utility model and the comparison of common junction barrier schottky diode device output capacitance.
Embodiment
For example the utility model is done description in more detail below in conjunction with accompanying drawing:
With reference to Fig. 1, a kind of improved mixed-rectification diode structure of the utility model.Comprise N +Substrate zone 100, N type drift region 101, active area knot P +Part 102, active area knot P part 103, first's anode electrode 104, cathode electrode 105, silicon dioxide layer 106, second portion anode electrode 107.Its characteristic is at N +Extension forms N on the substrate zone 100 + Substrate zone 100, oxidation then, photoetching utilize injection, diffusion technology, are formed with source region knot P part 103, active area knot P according to this + Part 102; Active area knot P part 103 is surrounded by source region knot P +Part 102; The doping content of active area knot P part 103 is lower than active area knot P +The doping content of part 102; The metal of first's anode electrode 104 and cathode electrode 105 contacts with N type drift region 101 and is ohmic contact, second portion anode electrode 107 and active area knot P +Part 102 contacts Schottky contacts with active area knot P part 103, and first's anode electrode 104 and second portion anode electrode 107 short circuits.Play after adjacent depletion region is communicated with and suppress Schottky contact barrier reduction effect and make reverse withstand voltage raising in reverse voltage biasing down; Because the active area of low concentration doping knot P part 103 exists, and proper internal electric field is improved, rather than concentrations makes device withstand voltage improve in knot junction depth place, terminal, and leakage current reduces.According to the requirement of the concrete on state characteristic of device, breakdown characteristics, output capacitance, confirm the doping content and the two-dimensional of N type drift region 101 among Fig. 1, the two-dimensional of silicon dioxide layer 106, active area knot P +The two-dimensional of part 102, active area knot P part 103.
With reference to Fig. 3; Comparison by a kind of improved mixed-rectification diode structure device electric breakdown strength characteristic of the utility model is visible; With respect to common junction barrier schottky diode device; The utility model device has not only improved withstand voltage but also has reduced leakage current and since introduced new peak electric field point promptly not only the PN junction place peak electric field point is arranged, and tie P at active area +Also there is the peak electric field point in the edge of part 102; This makes that PN junction knee peak electric field point is lower than common junction barrier schottky diode at identical negative sense bias voltage; Depletion layer has reduced reverse leakage current withstand voltage thicker than common junction barrier schottky diode than hour thickness simultaneously.
With reference to Fig. 4; Comparison by a kind of improved mixed-rectification diode structure device of the utility model and common junction barrier schottky diode device forward conduction characteristic is visible; With respect to common junction barrier schottky diode devices, forward conduction characteristic characteristic does not almost have difference.Because the Schottky contacts area of JBS device does not change than the ratio of PiN junction area, explains that the utility model does not influence the on state characteristic of JBS.
With reference to Fig. 5; Comparison by a kind of improved mixed-rectification diode structure device of the utility model and common junction barrier schottky diode device output capacitance is visible; With respect to common junction barrier schottky diode device, a kind of output capacitance difference of improved mixed-rectification diode structure device is very little, does not surpass an one magnitude; But raise with reverse bias voltage, the utility model device output capacitance is less.Because a kind of improved mixed-rectification diode structure device is also consistent with the same, the inner PiN duct ligation of the junction depth area of common junction barrier schottky diode device; But few charge of the electron quantity of the utility model is less than common JBS, explains that the utility model slightly improves output capacitance.
Above-mentioned is the embodiment of the special act of the utility model, is not in order to limit the utility model.A kind of improved mixed-rectification diode structure device architecture that the utility model provides is equally applicable to other material power semiconductor and MPS etc.In essence that does not break away from the utility model and scope, can do a little adjustment and optimization, the protection range of the utility model is as the criterion with claim.

Claims (3)

1.一种改进的混合整流二极管结构,包括N+衬底区(100)、N型漂移区(101)、有源区结P+部分(102)、第一部分阳极电极(104)、阴极电极(105)、二氧化硅层(106)、第二部分阳极电极(107);其特征是:还包括有源区结P部分(103),所述有源区结P部分(103)包围有源区结P+部分(102)。 1. An improved hybrid rectifier diode structure, comprising N + substrate region (100), N-type drift region (101), active region junction P + part (102), first part anode electrode (104), cathode electrode (105), silicon dioxide layer (106), the second part of the anode electrode (107); it is characterized in that: it also includes an active region junction P part (103), and the active region junction P part (103) is surrounded by Source junction P + part (102). 2.根据权利要求1所述的一种改进的混合整流二极管结构,其特征是:有源区结P部分(103)的掺杂浓度低于有源区结P+部分(102)的掺杂浓度。 2. An improved hybrid rectifier diode structure according to claim 1, characterized in that: the doping concentration of the active region junction P part (103) is lower than the doping concentration of the active region junction P + part (102) concentration. 3.根据权利要求1或2所述的一种改进的混合整流二极管结构,其特征是:第一部分阳极电极(104)和阴极电极(105)的金属与N型漂移区(101)接触为欧姆接触,第二部分阳极电极(107)与有源区结P+部分(102)和有源区结P部分(103)接触肖特基接触,且第一部分阳极电极(104)与第二部分阳极电极(107)短接。  3. A kind of improved hybrid rectifier diode structure according to claim 1 or 2, it is characterized in that: the metal of the first part of the anode electrode (104) and the cathode electrode (105) contacts with the N-type drift region (101) to be ohmic Contact, the second part of the anode electrode (107) is in Schottky contact with the active region junction P + part (102) and the active region junction P part (103), and the first part of the anode electrode (104) is in contact with the second part of the anode The electrodes (107) are shorted.
CN201120167436.1U 2011-05-24 2011-05-24 An Improved Hybrid Rectifier Diode Structure Expired - Fee Related CN202167495U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201120167436.1U CN202167495U (en) 2011-05-24 2011-05-24 An Improved Hybrid Rectifier Diode Structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201120167436.1U CN202167495U (en) 2011-05-24 2011-05-24 An Improved Hybrid Rectifier Diode Structure

Publications (1)

Publication Number Publication Date
CN202167495U true CN202167495U (en) 2012-03-14

Family

ID=45803304

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201120167436.1U Expired - Fee Related CN202167495U (en) 2011-05-24 2011-05-24 An Improved Hybrid Rectifier Diode Structure

Country Status (1)

Country Link
CN (1) CN202167495U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108091682A (en) * 2017-11-21 2018-05-29 重庆大学 A kind of super barrier rectifier of high reliability Schottky contacts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108091682A (en) * 2017-11-21 2018-05-29 重庆大学 A kind of super barrier rectifier of high reliability Schottky contacts

Similar Documents

Publication Publication Date Title
CN101540343B (en) 4H-SiC PiN/Schottky diode with offset field plate structure and its fabrication method
CN101976687B (en) Fast recovery metal oxide semiconductor diode with low power consumption
US8736013B2 (en) Schottky diode with opposite-polarity schottky diode field guard ring
CN102544114B (en) An Accumulation Trench-Gate Diode
WO2023142393A1 (en) High-speed flyback diode-integrated silicon carbide split gate mosfet and preparation method
CN102064201B (en) Shallow-slot metal oxide semiconductor diode
US9722029B2 (en) Semiconductor device and method of manufacturing semiconductor device
CN104409519A (en) Diode with floating island structure
CN105826399A (en) Soft fast recovery diode of multi-mixture structure and preparation method thereof
JP2014060376A (en) Schottky barrier diode and manufacturing method of the same
CN102709317B (en) Low-threshold voltage diode
CN101859703B (en) Low turn-on voltage diode preparation method
US9263560B2 (en) Power semiconductor device having reduced gate-collector capacitance
CN113644117A (en) Cell structure of silicon carbide JBS device with novel deep trench and preparation method thereof
CN103943688A (en) Schottky barrier diode device structure and manufacturing method thereof
CN106489210B (en) Semiconductor device
CN102593154A (en) Trench gate diode with P-type buried layer structure
CN105226104B (en) A kind of SiC schottky diode and preparation method thereof
CN102263139A (en) An Improved Hybrid Rectifier Diode Structure
CN113066870A (en) Gallium oxide-based junction barrier Schottky diode with terminal structure
CN202167495U (en) An Improved Hybrid Rectifier Diode Structure
JP6930113B2 (en) Semiconductor devices and manufacturing methods for semiconductor devices
US8969959B2 (en) Semiconductor device and method of manufacturing the same
CN106229342A (en) A kind of metal-oxide-semiconductor diode of many accumulation layers
CN111969053A (en) Low-conduction-voltage-drop diode device and preparation method thereof

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120314

Termination date: 20140524