CN202188376U - Backlight module with three-dimensional circuit structure and extruding type cover body - Google Patents
Backlight module with three-dimensional circuit structure and extruding type cover body Download PDFInfo
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- CN202188376U CN202188376U CN2011201423895U CN201120142389U CN202188376U CN 202188376 U CN202188376 U CN 202188376U CN 2011201423895 U CN2011201423895 U CN 2011201423895U CN 201120142389 U CN201120142389 U CN 201120142389U CN 202188376 U CN202188376 U CN 202188376U
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Abstract
The utility model relates to a backlight module with a three-dimensional circuit structure and an extruding type cover body, which comprises an extruding type cover body, a three-dimensional circuit layer, a plurality of lighting assemblies, a reflecting piece, a light guide plate and a heat conductive layer. A first surface of an installation portion of the extruding type cover body is provided with a plurality of recessed cavities, and the three-dimensional circuit layer is laid on the first surface and the lateral wall and the bottom of the plurality of recessed cavities, so that a completer electronic circuit can be arranged in the installation portion with limit size. In addition, the three-dimensional circuit layer arranged at the bottom of the plurality of recessed cavities is provided with a plurality of welding spots to enable the plurality of lighting assemblies to be respectively welded in the plurality of recessed cavities through multiple welding. Therefore, when a liquid display device is collided, the extruding type cover body can prevent the plurality of lighting assemblies from being damaged.
Description
Technical field
The utility model is about a kind of backlight module, particularly about a kind of backlight module with three-dimensional circuit structures and crowded type cover body.
Background technology
In recent years, (Light-Emitting Diode is to be applied to widely on the lighting device of daily life LED) to light emitting diode.Because LED is easy to generate high heat, therefore, the existing LED lighting device of commonly using can assemble the material or the utensil of assisting heat radiation usually.
See also Fig. 1, be a kind of stereogram of the existing LED assembly of commonly using, as shown in Figure 1, this existing LED assembly 10 ' of commonly using is to comprise: a substrate 101 ' and colloid 102 ', and wherein, at least one led chip is a surface that is arranged at this substrate 101 '; And with respect to this at least one led chip, another surface of substrate 101 ' is to be provided with a plurality of metal electrodes, and these a plurality of metal electrodes are to comprise: two positive electrodes 1011 ', two negative electrodes 1012 '.
Please continue to consult Fig. 1, simultaneously, see also Fig. 2, be a kind of stereogram of the existing LED-backlit module of commonly using.As shown in Figure 2; The LED-backlit module 1 ' that should existing commonly use is to be installed in the main frame of liquid crystal indicator; In order to launch the LGP (not shown) in a backlight to this main frame; Wherein, the existing LED-backlit module of commonly using 1 ' is to have a cover body 11 ', a circuit board 12 ' and these a plurality of LED assemblies 10 '.As shown in Figure 2, these a plurality of LED assemblies 10 ' are to be arranged on this circuit board 12 ', and this circuit board 12 ' is to be placed within this cover body 11 ' with these a plurality of LED assemblies 10 '.In addition, be printed with an electronic circuit on the circuit board 12 ', have a plurality of pads on this electronic circuit in order to these a plurality of LED assemblies 10 ' of welding.
The above-mentioned LED-backlit module 1 ' that should existing commonly use has advantage simple in structure and that be convenient to install, and therefore, this existing LED-backlit module 1 ' of commonly using is to be applied to widely in the various liquid crystal indicators, so that backlight source of liquid crystal display apparatus to be provided.Yet, along with the change of user's use habit, no matter be large scale or undersized liquid crystal indicator, all be asked to be made into the liquid crystal indicator of light and thin type.But; For the LED-backlit module that is applied to slim liquid crystal indicator, it must face a significant challenge, promptly; Must on the circuit board of limited size, print complicated and complete electronic circuit, be possibly cause electronic circuit intactly to be printed to circuit board.In addition; This cover body 11 ' of the LED-backlit module 1 ' that should existing commonly use is to be stamped to form by a tinsel; Because the thickness of this tinsel is not thick, therefore, well imagines; When liquid crystal indicator received external force collision with the existing LED-backlit module of commonly using 1 ', it is limited that cover body 11 ' can offer the protective capability of these a plurality of LED assemblies 10 '.
Therefore; The creator of the utility model is because the present LED-backlit module of commonly using that has now still has many shortcomings with not enough; So do one's utmost in addition study and composition, a kind of backlight module with three-dimensional circuit structures and crowded type cover body of the utility model is accomplished in research and development finally.
This shows that above-mentioned existing backlight module obviously still has inconvenience and defective, and demands urgently further improving in structure and use.Therefore how to found a kind of backlight module that has that volume is little, cost is low concurrently and can have the new structure of comprehensive adjustment function when using with three-dimensional circuit structures and crowded type cover body; Real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing backlight module exists; The inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge; And cooperate the utilization of studying the science, actively study innovation, in the hope of founding a kind of backlight module of new structure with three-dimensional circuit structures and crowded type cover body; Can improve general existing backlight module, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, found out the utility model of true tool practical value finally.
Summary of the invention
The purpose of the utility model is; Overcome the defective that existing backlight module exists; And a kind of backlight module with three-dimensional circuit structures and crowded type cover body of new structure is provided; Technical problem to be solved is that to make it be to squeeze to dig on the installation portion of type cover body one to establish a plurality of potholes; And a three-dimensional circuit layer is layed in the bottom of sidewall and this a plurality of potholes of surface, these a plurality of potholes of this installation portion, and follow, respectively a plurality of luminescence components are welded in these a plurality of potholes by a plurality of pads of this three-dimensional circuit layer; So, complete electronic circuit can be set within the installation portion of limited size, makes this backlight module with three-dimensional circuit structures can be applied within the slim liquid crystal indicator; And when liquid crystal indicator receives when clashing into, this crowded type cover body can protect these a plurality of luminescence components not to be damaged.
Another purpose of the utility model is; A kind of backlight module with three-dimensional circuit structures and crowded type cover body is provided; Technical problem to be solved is that to make it be to squeeze on the installation portion of type cover body one to make a groove; And a plurality of distance pieces are arranged in this groove to form a plurality of potholes; Then a three-dimensional circuit layer is layed in the bottom of sidewall and this a plurality of potholes of surface, these a plurality of potholes of this installation portion, follows, respectively a plurality of luminescence components are welded in these a plurality of potholes by a plurality of pads of this three-dimensional circuit layer; So, complete electronic circuit can be set at the installation portion of limited size, makes this backlight module with three-dimensional circuit structures and crowded type cover body can be applied within the slim liquid crystal indicator; And when liquid crystal indicator receives when clashing into, this crowded type cover body can protect these a plurality of luminescence components not to be damaged.
A purpose again of the utility model is; A kind of backlight module with three-dimensional circuit structures and crowded type cover body is provided; Technical problem to be solved be make its be with a plurality of distance pieces be arranged at one squeeze an installation portion of type cover body the surface; So as to forming a plurality of potholes on this installation portion; Then a three-dimensional circuit layer is layed in the bottom of sidewall and this a plurality of potholes of surface, these a plurality of potholes of this installation portion, follows, respectively a plurality of luminescence components are welded in these a plurality of potholes by a plurality of pads of this three-dimensional circuit layer; So, complete electronic circuit can be set at the installation portion of limited size, makes this backlight module with three-dimensional circuit structures and crowded type cover body can be applied in the slim liquid crystal indicator; And when liquid crystal indicator receives when clashing into, this crowded type cover body can protect these a plurality of luminescence components not to be damaged.
The purpose of the utility model and to solve its technical problem be that technical scheme below adopting realizes.According to a kind of backlight module of the utility model proposition with three-dimensional circuit structures and crowded type cover body, comprising: one squeezes the type cover body, comprising: a bottom; At least one protuberance is to be formed on this bottom; And an installation portion, be to be connected in this bottom, and a first surface of this installation portion is to have a plurality of potholes; One three-dimensional circuit layer be this first surface that is layed in installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes, and this three-dimensional circuit layer that is arranged at the bottom of these a plurality of potholes is to have a plurality of pads; A plurality of luminescence components are to be welded in respectively in these a plurality of potholes by these a plurality of pads; One reflecting element is to be arranged in this crowded type cover body with respect to these a plurality of luminescence components, and has a plurality of holes that wherein, through these a plurality of holes, a light emitting surface of these a plurality of luminescence components can expose to the open air outside this reflecting element; One LGP is to be arranged at respect to reflecting element to squeeze within the type cover body, in order to receive the light source that this a plurality of luminescence component is launched; And a heat-conducting layer, be to be attached at the outer surface that squeezes type cover body bottom.
The purpose of the utility model and solve its technical problem and can also adopt following technical measures to come further to realize.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body, the wherein said end reflector plate that more comprises is to be arranged at this LGP bottom, in order to prevent the side leakage of light.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body, a plurality of potholes of this of wherein said this installation portion can form via following processing mode: electrochemistry processing, impact processing, drilling and bore hole processing, extrusion process and pull processing.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body, wherein said these a plurality of potholes that are formed at this first surface of this installation portion, its bottom has a perforation respectively, in order to this luminescence component of tip-off.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body, wherein said a plurality of dielectric films are the bottoms that are formed at these a plurality of potholes, in order to cover the zone that does not have this pad on the bottom.
Aforesaid backlight module, wherein said this luminescence component with three-dimensional circuit structures and crowded type cover body can be following any: the direct encapsulation type of packaged LED assembly and chip (chip on boardCOB) LED assembly.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body; Wherein said this three-dimensional circuit layer is by behind the metal material bending forming, relends by an insulating heat-conductive sticker to attach this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body; Wherein said this three-dimensional circuit layer is by behind the metal material bending forming, and the Metal Material Welding that will bend again is in this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body; Wherein said this three-dimensional circuit layer is via after the making moulding on a tinsel and the insulating heat-conductive glue, and reverse side is attached at this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes again.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body, the wherein said type cover body that should squeeze more comprises an extension, is to be connected in this installation portion, and outwards outstanding by this first surface of installation portion.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body, this first surface of this installation portion of wherein said this crowded type cover body and the outer surface of crowded type cover body are to be respectively equipped with a Heat Conduction Material, in order to assist to squeeze the heat radiation of type cover body
The purpose of the utility model and solve its technical problem and also adopt following technical scheme to realize.According to a kind of backlight module of the utility model proposition with three-dimensional circuit structures and crowded type cover body, comprising: one squeezes the type cover body, comprising: a bottom; At least one protuberance is to be formed on this bottom; And an installation portion, be to be connected in this bottom, a first surface of this installation portion is to have a groove, and a plurality of distance piece is to be arranged in this groove, makes to form a pothole between adjacent two distance pieces; One three-dimensional circuit layer be this first surface that is layed in installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes, and this three-dimensional circuit layer that is arranged at the bottom of these a plurality of potholes is to have a plurality of pads; A plurality of luminescence components are to be welded in respectively in these a plurality of potholes by these a plurality of pads; One reflecting element is to be arranged in this crowded type cover body with respect to these a plurality of luminescence components, and has a plurality of holes that wherein, through these a plurality of holes, a light emitting surface of these a plurality of luminescence components can expose to the open air outside this reflecting element; One LGP is to be arranged at respect to reflecting element to squeeze within the type cover body, in order to receive the light source that this a plurality of luminescence component is launched; And a heat-conducting layer, be to be attached at the outer surface that squeezes type cover body bottom.
The purpose of the utility model and solve its technical problem and can also adopt following technical measures to come further to realize.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body, the wherein said end reflector plate that more comprises is to be arranged at this LGP bottom, in order to prevent the side leakage of light.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body, a plurality of potholes of this of wherein said this installation portion can form via following processing mode: electrochemistry processing, impact processing, drilling and bore hole processing, extrusion process and pull processing.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body, wherein said these a plurality of potholes that are formed at this first surface of this installation portion, its bottom has a perforation respectively, in order to this luminescence component of tip-off.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body, wherein said a plurality of dielectric films are the bottoms that are formed at these a plurality of potholes, in order to cover the zone that does not have this pad on the bottom.
Aforesaid backlight module, wherein said this luminescence component with three-dimensional circuit structures and crowded type cover body can be following any: the direct encapsulation type of packaged LED assembly and chip (chip on boardCOB) LED assembly.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body; Wherein said this three-dimensional circuit layer is by behind the metal material bending forming, relends by an insulating heat-conductive sticker to attach this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body; Wherein said this three-dimensional circuit layer is by behind the metal material bending forming, and the Metal Material Welding that will bend again is in this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body; Wherein said this three-dimensional circuit layer is via after the making moulding on a tinsel and the insulating heat-conductive glue, and reverse side is attached at this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes again.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body, this first surface of this installation portion of wherein said this crowded type cover body and the outer surface of crowded type cover body are to be respectively equipped with a Heat Conduction Material, in order to assist to squeeze the heat radiation of type cover body.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body, the wherein said type cover body that should squeeze more comprises an extension, is to be connected in this installation portion, and outwards outstanding by this first surface of installation portion.
The purpose of the utility model and solve the technical scheme of its technical problem below also adopting in addition and realize.According to a kind of backlight module of the utility model proposition with three-dimensional circuit structures and crowded type cover body, comprising: one squeezes the type cover body, comprising: a bottom; At least one protuberance is to be formed on this bottom; And an installation portion, be to be connected in this bottom, and a first surface of this installation portion is to be provided with a plurality of distance pieces, and is to form a pothole between adjacent two distance pieces; One three-dimensional circuit layer be this first surface that is layed in installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes, and this three-dimensional circuit layer that is arranged at the bottom of these a plurality of potholes is to have a plurality of pads; A plurality of luminescence components are to be welded in respectively in these a plurality of potholes by these a plurality of pads; One reflecting element is to be arranged in this crowded type cover body with respect to these a plurality of luminescence components, and has a plurality of holes that wherein, through these a plurality of holes, a light emitting surface of these a plurality of luminescence components can expose to the open air outside this reflecting element; One LGP is to be arranged at respect to reflecting element to squeeze within the type cover body, in order to receive the light source that this a plurality of luminescence component is launched; And a heat-conducting layer, be to be attached at the outer surface that squeezes type cover body bottom.
The purpose of the utility model and solve its technical problem and can also adopt following technical measures to come further to realize.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body, the wherein said end reflector plate that more comprises is to be arranged at this LGP bottom, in order to prevent the side leakage of light.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body, wherein said these a plurality of potholes that are formed at this first surface of this installation portion, its bottom has a perforation respectively, in order to this luminescence component of tip-off.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body, wherein said a plurality of dielectric films are the bottoms that are formed at these a plurality of potholes, in order to cover the zone that does not have this pad on the bottom.
Aforesaid backlight module, wherein said this luminescence component with three-dimensional circuit structures and crowded type cover body can be following any: the direct encapsulation type of packaged LED assembly and chip (chip on boardCOB) LED assembly.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body; Wherein said this three-dimensional circuit layer is by behind the metal material bending forming, relends by an insulating heat-conductive sticker to attach this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes.
Aforesaid backlight module with three-dimensional circuit structures; Wherein said this three-dimensional circuit layer is by behind the metal material bending forming, and the Metal Material Welding that will bend again is in this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body; Wherein said this three-dimensional circuit layer is via after the making moulding on a tinsel and the insulating heat-conductive glue, and reverse side is attached at this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes again.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body, the wherein said type cover body that should squeeze more comprises an extension, is to be connected in this installation portion, and outwards outstanding by this first surface of installation portion.
Aforesaid backlight module with three-dimensional circuit structures and crowded type cover body, this first surface of this installation portion of wherein said this crowded type cover body and the outer surface of crowded type cover body are to be respectively equipped with a Heat Conduction Material, in order to assist to squeeze the heat radiation of type cover body.
The utility model compared with prior art has tangible advantage and beneficial effect.By technique scheme, the utility model is in order to reach first purpose, and the creator proposes a kind of backlight module with three-dimensional circuit structures and crowded type cover body, comprising: one squeezes the type cover body, comprising: a bottom; At least one protuberance is to be formed on this bottom; And an installation portion, be to be connected in this bottom, and a first surface of this installation portion is to have a plurality of potholes; One three-dimensional circuit layer be this first surface that is layed in installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes, and this three-dimensional circuit layer that is arranged at the bottom of these a plurality of potholes is to have a plurality of pads; A plurality of luminescence components are to be welded in respectively in these a plurality of potholes by these a plurality of pads; One reflecting element is to be arranged in this crowded type cover body with respect to these a plurality of luminescence components, and has a plurality of holes that wherein, through these a plurality of holes, a light emitting surface of these a plurality of luminescence components can expose to the open air outside this reflecting element; One LGP is to be arranged at respect to reflecting element to squeeze within the type cover body, in order to receive the light source that this a plurality of luminescence component is launched; And a heat-conducting layer, be to be attached at the outer surface that squeezes type cover body bottom.
Therefore, in order to reach second purpose of the utility model, the creator of the utility model proposes a kind of backlight module with three-dimensional circuit structures and crowded type cover body, comprising: one squeezes the type cover body, comprising: a bottom; At least one protuberance is to be formed on this bottom; And an installation portion, be to be connected in this bottom, a first surface of this installation portion is to have a groove, and a plurality of distance piece is to be arranged in this groove, makes to form a pothole between adjacent two distance pieces; One three-dimensional circuit layer be this first surface that is layed in installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes, and this three-dimensional circuit layer that is arranged at the bottom of these a plurality of potholes is to have a plurality of pads; A plurality of luminescence components are to be welded in respectively in these a plurality of potholes by these a plurality of pads; One reflecting element is to be arranged in this crowded type cover body with respect to these a plurality of luminescence components, and has a plurality of holes that wherein, through these a plurality of holes, a light emitting surface of these a plurality of luminescence components can expose to the open air outside this reflecting element; One LGP is to be arranged at respect to reflecting element to squeeze within the type cover body, in order to receive the light source that this a plurality of luminescence component is launched; And a heat-conducting layer, be to be attached at the outer surface that squeezes type cover body bottom.
Therefore, in order to reach the 3rd purpose of the utility model, the creator of the utility model proposes a kind of backlight module with three-dimensional circuit structures and crowded type cover body, comprising: one squeezes the type cover body, comprising: a bottom; At least one protuberance is to be formed on this bottom; And an installation portion, be to be connected in this bottom, and a first surface of this installation portion is to be provided with a plurality of distance pieces, and is to form a pothole between adjacent two distance pieces; One three-dimensional circuit layer be this first surface that is layed in installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes, and this three-dimensional circuit layer that is arranged at the bottom of these a plurality of potholes is to have a plurality of pads; A plurality of luminescence components are to be welded in respectively in these a plurality of potholes by these a plurality of pads; One reflecting element is to be arranged in this crowded type cover body with respect to these a plurality of luminescence components, and has a plurality of holes that wherein, through these a plurality of holes, a light emitting surface of these a plurality of luminescence components can expose to the open air outside this reflecting element; One LGP is to be arranged at respect to reflecting element to squeeze within the type cover body, in order to receive the light source that this a plurality of luminescence component is launched; And a heat-conducting layer, be to be attached at the outer surface that squeezes type cover body bottom.Can reach suitable technological progress property and practicality, and have the extensive value on the industry, it has advantage at least:
1, passes through on the installation portion of this crowded type cover body, to make a plurality of potholes, and this three-dimensional circuit layer is layed in the surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes; So, complete electronic circuit can be set on the installation portion of limited size, makes this backlight module can be applied within the slim liquid crystal indicator.
2, hold above-mentioned the 1st point, this three-dimensional circuit layer can be layed in the surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes via at least three kinds of modes.
3, hold above-mentioned the 1st point, the mode that these a plurality of potholes do not limit with processing is formed on this installation portion, also can be by directly this a plurality of distance pieces being arranged on the first surface of installation portion, with installation portion on these a plurality of potholes of formation.
4, this crowded type cover body can be protected this luminescence component, so, even liquid crystal indicator or backlight module receive external force collision, needn't worry that luminescence component can be damaged.
5, hold above-mentioned the 1st point,, can locate these a plurality of luminescence components effectively, produce displacement to avoid luminescence component by putting in these a plurality of potholes by a plurality of luminescence components.
Above-mentioned explanation only is the general introduction of the utility model technical scheme; In order more to know the technological means of understanding the utility model; And can implement according to the content of specification, and for let the above-mentioned of the utility model with other purpose, feature and advantage can be more obviously understandable, below special act preferred embodiment; And conjunction with figs., specify as follows.
Description of drawings
Fig. 1 is a kind of stereogram of the existing LED assembly of commonly using;
Fig. 2 is a kind of stereogram of the existing LED-backlit module of commonly using;
Fig. 3 is the side view of first embodiment of backlight module with three-dimensional circuit structures and crowded type cover body of the utility model a kind of;
Fig. 4 be have three-dimensional circuit structures and crowded type cover body backlight module first embodiment one squeeze type cover body, a three-dimensional circuit layer, a plurality of luminescence component, with the stereogram of a reflecting element;
Fig. 5 A and Fig. 5 B-1 to Fig. 5 B-3 are the process schematic representations that on an installation portion that squeezes the type cover body, forms the three-dimensional circuit layer;
Fig. 6 is the side view of second embodiment with backlight module of three-dimensional circuit structures and crowded type cover body;
Fig. 7 be have three-dimensional circuit structures and crowded type cover body backlight module second embodiment one squeeze type cover body, a plurality of luminescence component and a three-dimensional circuit layer stereogram;
Fig. 8 be have three-dimensional circuit structures and crowded type cover body backlight module second embodiment crowded type cover body, a plurality of luminescence component, three-dimensional circuit layer, with the stereogram of a reflecting element;
Fig. 9 is second stereogram of crowded type cover body, a plurality of luminescence component and three-dimensional circuit layer of second embodiment with backlight module of three-dimensional circuit structures and crowded type cover body;
Figure 10 is the side view of the 3rd embodiment with backlight module of three-dimensional circuit structures and crowded type cover body; And
Figure 11 be have three-dimensional circuit structures and crowded type cover body backlight module the 3rd embodiment one squeeze type cover body, a plurality of luminescence component, a three-dimensional circuit layer, with the stereogram of a reflecting element.
1: backlight module with three-dimensional circuit structures and crowded type cover body
1 ': the existing LED-backlit module of commonly using
10 ': LED assembly 101 ': substrate
1011 ': positive electrode 1012 ': negative electrode
102 ': colloid 11: squeeze the type cover body
11 ': cover body 111: installation portion
1111: first surface 1112: pothole
1113: perforation 1115: groove
112: bottom 113: protuberance
114: extension 12: the three-dimensional circuit layer
12 ': circuit board 121: pad
13: luminescence component 14: reflecting element
141: hole 15: LGP
16: heat-conducting layer 161: tasselled portion
18: distance piece 19: end reflector plate
30: tinsel 31: diaphragm
32: insulating heat-conductive glue
The specific embodiment
For further setting forth the utility model is to reach technological means and the effect that predetermined goal of the invention is taked; Below in conjunction with accompanying drawing and preferred embodiment; To its specific embodiment of backlight module, structure, characteristic and the effect thereof that proposes according to the utility model with three-dimensional circuit structures and crowded type cover body, specify as after.
The utlity model has many group embodiment; See also Fig. 3; It is the side view of first embodiment of the utility model a kind of backlight module with three-dimensional circuit structures and crowded type cover body; As shown in Figure 3; This backlight module 1 with three-dimensional circuit structures and crowded type cover body comprises: one squeezes type cover body 11, a three-dimensional circuit layer 12, a plurality of luminescence component 13, a reflecting element 14, a LGP 15 and a heat-conducting layer 16, and wherein, the material of this crowded type cover body 11 can be metal materials such as copper, aluminium, plated steel sheet or galvanizing steel plate.
Consult Fig. 3 unceasingly, simultaneously, see also Fig. 4, be have three-dimensional circuit structures and crowded type cover body backlight module first embodiment should squeeze type cover body, this three-dimensional circuit layer, these a plurality of luminescence components, with the stereogram of this reflecting element.Like Fig. 3 and shown in Figure 4, squeeze type cover body 11, comprising: a bottom 112, two protuberances 113 and an installation portion 111, wherein, this protuberance 113 is to be formed on this bottom 112; 111 of this installation portions are connected in bottom 112, and a first surface 1111 of installation portion 111 is to have a plurality of potholes 1112.This three-dimensional circuit layer 12 is this first surface 1111 that is layed in this installation portion 111, the sidewall of these a plurality of potholes 1112 and the bottom of these a plurality of potholes 1112; Wherein, this three-dimensional circuit layer 12 that is arranged at the bottom of these a plurality of potholes 1112 is to have a plurality of pads 121.
Consult Fig. 3 and Fig. 4 unceasingly; This luminescence component 13 can be a packaged LED assembly or the direct encapsulation type of a chip (chip on board, COB) LED assembly, and; As shown in Figure 4, these a plurality of luminescence components 13 are to be welded in respectively in these a plurality of potholes 1112 by these a plurality of pads 121.14 of this reflecting elements are arranged in this crowded type cover body 11 with respect to these a plurality of luminescence components 13; Wherein, reflecting element 14 is to have a plurality of holes 141, and; Through these a plurality of holes 141, make a light emitting surface of these a plurality of luminescence components 13 can expose to the open air outside this reflecting element 14; And the mode of reflecting element 14 printings capable of using, coating or spraying is formed at squeezes type cover body 11 inside; Perhaps, a metal material capable of using and a synthetic ㄇ shape of reflection material or a L shaped reflecting element 14, and; One terminal of this ㄇ shape reflecting element or this L shaped reflecting element optionally forms a reflector plate tasselled portion (not shown); Wherein, the LGP 15 of closely fitting can be inserted in the cover body 11 by this reflector plate tasselled portion at LGP 15.
This LGP 15 is to be arranged at respect to reflecting element 14 to squeeze within the type cover body 11, in order to receive the light source that these a plurality of luminescence components 13 are launched.This heat-conducting layer 16 is to be attached at the outer surface that squeezes type cover body 11 bottoms; And the end of heat-conducting layer 16 is to form a tasselled portion 161; Wherein, when crowded type cover body 11 was mounted to a main frame of a liquid crystal indicator, this tasselled portion 161 can be attached at a base plate of this main frame.19 of this end reflector plates are arranged at LGP 15 bottoms, in order to prevent the side leakage of light.
The framework of first embodiment of the backlight module with three-dimensional circuit structures and crowded type cover body of the utility model is by above-mentioned and clearly disclosed; And; Have among first embodiment of backlight module 1 of three-dimensional circuit structures at this; When this a plurality of luminescence component 13 was luminous, the heat that it produced can leave via this crowded type cover body 11; In addition, because this tasselled portion 161 of heat-conducting layer 16 is these base plates that are attached at this main frame, therefore, tasselled portion 161 can be distributed in heat on the base plate equably; And,, be more to assist to squeeze 11 heat radiations of type cover body because the first surface 1111 of this installation portion 111 and the outer surface that should squeeze type cover body 11 are to be respectively equipped with a Heat Conduction Material 1A.And this Heat Conduction Material 1A can be further extend to (not shown) on the base plate of this main frame along the inner surface that squeezes type cover body 11; So, when this a plurality of luminescence component 13 was luminous, the heat that it produced can be via Heat Conduction Material 1A and heat-conducting layer 16 and is left two-wayly.
Moreover; What must specify is; Because should squeeze the material of type cover body 11 is metal, therefore, a plurality of potholes 1112 of this on this installation portion 111 can form via following processing mode: electrochemistry processing, impact processing, drilling and bore hole processing and extrusion process; And, as shown in Figure 4 when this pothole 1112 of processing and fabricating, can dig a perforation 1113 of establishing in pothole 1112 bottoms in order to this luminescence component of tip-off.After this perforation 1113 was formed on pothole 1112 bottoms, further, a plurality of dielectric film (not shown) were formed at the bottom of these a plurality of potholes 1112, in order to not have the zone of this pad 121 on the lower surface that covers this pothole 1112.
And; Seeing also Fig. 5 A and Fig. 5 B-1 to Fig. 5 B-3 is the process schematic representation that on this installation portion of this crowded type cover body, forms this three-dimensional circuit layer; For the backlight module that this of the utility model has three-dimensional circuit structures and crowded type cover body, this three-dimensional circuit layer 12 can be processed via following three kinds of modes:
Shown in Fig. 5 A; A plurality of tinsels are carried out twice bending; Relend the sidewall and these a plurality of potholes 1112 bottoms that attach these a plurality of potholes 1112 by an insulating heat-conductive glue respectively; Then, lay a metallic circuit layer, make this tinsel to be connected with this metallic circuit layer in this first surface 1111 of this installation portion 111;
Shown in Fig. 5 A, at first, on the surface of the sidewall of these a plurality of potholes 1112 and these a plurality of potholes 1112 bottoms, spray dielectric film; Then; A plurality of tinsels are carried out twice bending, and the sidewall and these a plurality of potholes 1112 bottoms that are welded in these a plurality of potholes 1112 of the tinsel after will bending, then; This first surface 1111 at this installation portion 111 is laid a metallic circuit layer, makes this tinsel to be connected with this metallic circuit layer; And
Shown in Fig. 5 B-1 to Fig. 5 B-3, attach a diaphragm 31 and an insulating heat-conductive glue 32 respectively in the front and the reverse side of a tinsel 30; Then; Through the mode of chemical wet etching, on this insulating heat-conductive glue 32, make the electronic circuit figure, then; This diaphragm 31 as a centrifugal film, and is attached at insulating heat-conductive glue 32 and this tinsel 30 through this centrifugal film the bottom of sidewall and these a plurality of potholes 1112 of this first surface 1111, these a plurality of potholes 1112 of this installation portion 111.
The backlight module with three-dimensional circuit structures and crowded type cover body of the utility model more comprises one second embodiment, sees also Fig. 6, is the side view of second embodiment of this backlight module with three-dimensional circuit structures and crowded type cover body.Similar in appearance to first embodiment; This second embodiment with backlight module 1 of three-dimensional circuit structures and crowded type cover body comprises: this crowded type cover body 11, this three-dimensional circuit layer 12, this a plurality of luminescence component 13, this reflecting element 14, this LGP 15, this heat-conducting layer 16, this end reflector plate 19 and this Heat Conduction Material 1A; Wherein, this crowded type cover body 11, this three-dimensional circuit layer 12, this a plurality of luminescence component 13, this reflecting element 14, this LGP 15, this heat-conducting layer 16 and basic framework that should end reflector plate 19 is same as the described crowded type cover body of first embodiment 11, three-dimensional circuit layer 12, a plurality of luminescence component 13, reflecting element 14, LGP 15, heat-conducting layer 16, this end reflector plate 19 and Heat Conduction Material 1A.
Consulting Fig. 6 unceasingly, simultaneously, see also Fig. 7, is the stereogram that should squeeze type cover body, these a plurality of luminescence components and this three-dimensional circuit layer of second embodiment with backlight module of three-dimensional circuit structures and crowded type cover body; And, see also Fig. 8, be have three-dimensional circuit structures and crowded type cover body backlight module second embodiment should squeeze type cover body, these a plurality of luminescence components, this three-dimensional circuit layer, with the stereogram of this reflecting element.Like Fig. 7 and shown in Figure 8; What be different from first embodiment is; Have among second embodiment of backlight module of three-dimensional circuit structures and crowded type cover body at this; This first surface 1111 of this installation portion 111 is to have a groove 1115, and a plurality of distance piece 18 is to be arranged in this groove 1115, makes to form a pothole 1112 between adjacent two distance pieces 18.12 on this three-dimensional circuit layer is layed in the first surface 1111 of installation portion 111, the sidewall of these a plurality of potholes 1112 and the bottom of these a plurality of potholes 1112; 13 of these a plurality of luminescence components are by these a plurality of pads 121 of three-dimensional circuit layer 12 and be arranged within these a plurality of potholes 1112.
So, this first embodiment and second embodiment with backlight module of three-dimensional circuit structures and crowded type cover body of the utility model clearly discloses among above-mentioned.Yet what must specify is that for this backlight module with three-dimensional circuit structures and crowded type cover body, the mode that these a plurality of potholes 1112 do not limit with processing is formed on this installation portion 111.See also Fig. 9; It is second stereogram that should squeeze type cover body, these a plurality of luminescence components and this three-dimensional circuit layer of second embodiment with backlight module of three-dimensional circuit structures and crowded type cover body; As shown in Figure 9; Have in the backlight module of three-dimensional circuit structures and crowded type cover body at this, also can be on this first surface that directly will these a plurality of distance pieces 18 be arranged at this installation portion 111 1111, on installation portion 111, to form these a plurality of potholes.
The backlight module with three-dimensional circuit structures and crowded type cover body of the utility model more comprises one the 3rd embodiment, sees also Figure 10, is the side view of the 3rd embodiment of this backlight module with three-dimensional circuit structures and crowded type cover body.Similar in appearance to aforementioned first embodiment; Shown in figure 10; This 3rd embodiment with backlight module 1 of three-dimensional circuit structures and crowded type cover body comprises: this crowded type cover body 11, this three-dimensional circuit layer 12, this a plurality of luminescence component 13, this reflecting element 14, this LGP 15, this heat-conducting layer 16, this end reflector plate 19 and this Heat Conduction Material 1A; Wherein, this crowded type cover body 11, this three-dimensional circuit layer 12, this a plurality of luminescence component 13, this reflecting element 14, this LGP 15, this heat-conducting layer 16 and basic framework that should end reflector plate 19 is same as the described crowded type cover body of first embodiment 11, three-dimensional circuit layer 12, a plurality of luminescence component 13, reflecting element 14, LGP 15, heat-conducting layer 16, this end reflector plate 19 and Heat Conduction Material 1A.
Consult Figure 10 unceasingly, simultaneously, see also Figure 11, be this backlight module with three-dimensional circuit structures and crowded type cover body the 3rd embodiment should squeeze type cover body, these a plurality of luminescence components, this three-dimensional circuit layer, with the stereogram of this reflecting element.Like Figure 10 and shown in Figure 11; What be different from first embodiment is; Have among the 3rd embodiment of backlight module of three-dimensional circuit structures and crowded type cover body at this; Should squeeze type cover body 11 and have more an extension 114 that is connected in this installation portion 111, this extension 114 is outwards outstanding by this first surface 1111 of installation portion 111, and forms an accommodation space between extension 114 and this protuberance 113; So, 14 of this reflecting elements can place in this accommodation space.
The above; It only is the preferred embodiment of the utility model; Not being that the utility model is done any pro forma restriction, though the utility model with the preferred embodiment exposure as above, yet is not in order to limit the utility model; Anyly be familiar with the professional and technical personnel; In not breaking away from the utility model technical scheme scope, make a little change or be modified to the equivalent embodiment of equivalent variations when the technology contents of above-mentioned announcement capable of using, be the content that does not break away from the utility model technical scheme in every case;, all still belong in the scope of the utility model technical scheme any simple modification, equivalent variations and modification that above embodiment did according to the technical spirit of the utility model.
Claims (30)
1. backlight module with three-dimensional circuit structures and crowded type cover body is characterized in that comprising:
One squeezes the type cover body, comprising:
One bottom;
At least one protuberance is to be formed on this bottom; And
One installation portion is to be connected in this bottom, and a first surface of this installation portion is to have a plurality of potholes;
One three-dimensional circuit layer be this first surface that is layed in installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes, and this three-dimensional circuit layer that is arranged at the bottom of these a plurality of potholes is to have a plurality of pads;
A plurality of luminescence components are to be welded in respectively in these a plurality of potholes by these a plurality of pads;
One reflecting element is to be arranged in this crowded type cover body with respect to these a plurality of luminescence components, and has a plurality of holes that wherein, through these a plurality of holes, a light emitting surface of these a plurality of luminescence components can expose to the open air outside this reflecting element;
One LGP is to be arranged at respect to reflecting element to squeeze within the type cover body, in order to receive the light source that this a plurality of luminescence component is launched; And
One heat-conducting layer is to be attached at the outer surface that squeezes type cover body bottom.
2. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 1 is characterized in that more comprising an end reflector plate, is to be arranged at this LGP bottom, in order to prevent the side leakage of light.
3. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 1 is characterized in that being formed at these a plurality of potholes of this first surface of this installation portion, and its bottom has a perforation respectively, in order to this luminescence component of tip-off.
4. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 1 is characterized in that a plurality of dielectric films are the bottoms that are formed at these a plurality of potholes, in order to cover the zone that does not have this pad on the bottom.
5. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 1, it is characterized in that this luminescence component can be following any: the direct encapsulation type assembly of encapsulation type assembly and chip.
6. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 1; It is characterized in that this three-dimensional circuit layer is by behind the metal material bending forming, relend by an insulating heat-conductive sticker and attach this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes.
7. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 1; It is characterized in that this three-dimensional circuit layer is by behind the metal material bending forming, the Metal Material Welding that will bend again is in this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes.
8. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 1; It is characterized in that this three-dimensional circuit layer is via after the making moulding on a tinsel and the insulating heat-conductive glue, reverse side is attached at this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes again.
9. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 1 is characterized in that this crowded type cover body more comprises an extension, is to be connected in this installation portion, and outwards outstanding by this first surface of installation portion.
10. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 1; The outer surface of this first surface and crowded type cover body that it is characterized in that this installation portion of this crowded type cover body is to be respectively equipped with a Heat Conduction Material, in order to assist to squeeze the heat radiation of type cover body.
11. the backlight module with three-dimensional circuit structures and crowded type cover body is characterized in that comprising:
One squeezes the type cover body, comprising:
One bottom;
At least one protuberance is to be formed on this bottom; And
One installation portion is to be connected in this bottom, one of this installation portion
One surface is to have a groove, and a plurality of distance piece is to be arranged in this groove, makes to form a pothole between adjacent two distance pieces;
One three-dimensional circuit layer, be this first surface of being layed in installation portion, should
The sidewall of a plurality of potholes and the bottom of these a plurality of potholes, and this three-dimensional circuit layer that is arranged at the bottom of these a plurality of potholes is to have a plurality of pads;
A plurality of luminescence components are to be welded in respectively in these a plurality of potholes by these a plurality of pads;
One reflecting element is to be arranged in this crowded type cover body with respect to these a plurality of luminescence components, and has a plurality of holes that wherein, through these a plurality of holes, a light emitting surface of these a plurality of luminescence components can expose to the open air outside this reflecting element;
One LGP is to be arranged at respect to reflecting element to squeeze within the type cover body, in order to receive the light source that this a plurality of luminescence component is launched; And
One heat-conducting layer is to be attached at the outer surface that squeezes type cover body bottom.
12. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 11 is characterized in that more comprising an end reflector plate, is to be arranged at this LGP bottom, in order to prevent the side leakage of light.
13. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 11 is characterized in that being formed at these a plurality of potholes of this first surface of this installation portion, its bottom has a perforation respectively, in order to this luminescence component of tip-off.
14. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 11 is characterized in that a plurality of dielectric films are the bottoms that are formed at these a plurality of potholes, in order to cover the zone that does not have this pad on the bottom.
15. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 11, it is characterized in that this luminescence component can be following any: the direct encapsulation type assembly of encapsulation type assembly and chip.
16. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 11; It is characterized in that this three-dimensional circuit layer is by behind the metal material bending forming, relend by an insulating heat-conductive sticker and attach this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes.
17. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 11; It is characterized in that this three-dimensional circuit layer is by behind the metal material bending forming, the Metal Material Welding that will bend again is in this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes.
18. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 11; It is characterized in that this three-dimensional circuit layer is via after the making moulding on a tinsel and the insulating heat-conductive glue, reverse side is attached at this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes again.
19. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 11; The outer surface of this first surface and crowded type cover body that it is characterized in that this installation portion of this crowded type cover body is to be respectively equipped with a Heat Conduction Material, in order to assist to squeeze the heat radiation of type cover body.
20. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 11 is characterized in that this crowded type cover body more comprises an extension, is to be connected in this installation portion, and outwards outstanding by this first surface of installation portion.
21. the backlight module with three-dimensional circuit structures and crowded type cover body is characterized in that comprising:
One squeezes the type cover body, comprising:
One bottom;
At least one protuberance is to be formed on this bottom; And
One installation portion is to be connected in this bottom, and a first surface of this installation portion is to be provided with a plurality of distance pieces, and is to form a pothole between adjacent two distance pieces;
One three-dimensional circuit layer be this first surface that is layed in installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes, and this three-dimensional circuit layer that is arranged at the bottom of these a plurality of potholes is to have a plurality of pads;
A plurality of luminescence components are to be welded in respectively in these a plurality of potholes by these a plurality of pads;
One reflecting element is to be arranged in this crowded type cover body with respect to these a plurality of luminescence components, and has a plurality of holes that wherein, through these a plurality of holes, a light emitting surface of these a plurality of luminescence components can expose to the open air outside this reflecting element;
One LGP is to be arranged at respect to reflecting element to squeeze within the type cover body, in order to receive the light source that this a plurality of luminescence component is launched; And
One heat-conducting layer is to be attached at the outer surface that squeezes type cover body bottom.
22. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 21 is characterized in that more comprising an end reflector plate, is to be arranged at this LGP bottom, in order to prevent the side leakage of light.
23. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 21 is characterized in that being formed at these a plurality of potholes of this first surface of this installation portion, its bottom has a perforation respectively, in order to this luminescence component of tip-off.
24. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 21 is characterized in that a plurality of dielectric films are the bottoms that are formed at these a plurality of potholes, in order to cover the zone that does not have this pad on the bottom.
25. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 21, it is characterized in that this luminescence component can be following any: the direct encapsulation type assembly of encapsulation type assembly and chip.
26. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 21; It is characterized in that this three-dimensional circuit layer is by behind the metal material bending forming, relend by an insulating heat-conductive sticker and attach this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes.
27. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 21; It is characterized in that this three-dimensional circuit layer is by behind the metal material bending forming, the Metal Material Welding that will bend again is in this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes.
28. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 21; It is characterized in that this three-dimensional circuit layer is via after the making moulding on a tinsel and the insulating heat-conductive glue, reverse side is attached at this first surface of this installation portion, the sidewall of these a plurality of potholes and the bottom of these a plurality of potholes again.
29. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 21 is characterized in that this crowded type cover body more comprises an extension, is to be connected in this installation portion, and outwards outstanding by this first surface of installation portion.
30. the backlight module with three-dimensional circuit structures and crowded type cover body as claimed in claim 21; The outer surface of this first surface and crowded type cover body that it is characterized in that this installation portion of this crowded type cover body is to be respectively equipped with a Heat Conduction Material, in order to assist to squeeze the heat radiation of type cover body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201423895U CN202188376U (en) | 2011-05-04 | 2011-05-04 | Backlight module with three-dimensional circuit structure and extruding type cover body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201423895U CN202188376U (en) | 2011-05-04 | 2011-05-04 | Backlight module with three-dimensional circuit structure and extruding type cover body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202188376U true CN202188376U (en) | 2012-04-11 |
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ID=45919827
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201423895U Expired - Fee Related CN202188376U (en) | 2011-05-04 | 2011-05-04 | Backlight module with three-dimensional circuit structure and extruding type cover body |
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| Country | Link |
|---|---|
| CN (1) | CN202188376U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103629597A (en) * | 2012-08-20 | 2014-03-12 | 三星显示有限公司 | Backlight assembly |
| CN104482508A (en) * | 2014-11-20 | 2015-04-01 | 瑞仪光电股份有限公司 | Lamp set |
-
2011
- 2011-05-04 CN CN2011201423895U patent/CN202188376U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103629597A (en) * | 2012-08-20 | 2014-03-12 | 三星显示有限公司 | Backlight assembly |
| CN104482508A (en) * | 2014-11-20 | 2015-04-01 | 瑞仪光电股份有限公司 | Lamp set |
| US10067286B2 (en) | 2014-11-20 | 2018-09-04 | Radiant Opto-Electronics Corporation | Lamp device |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120411 Termination date: 20140504 |