CN202354014U - Heat pipe and electronic equipment using same - Google Patents

Abstract

The utility model discloses a heat pipe and an electronic device using the heat pipe. The heat pipe comprises a first part and a second part. The second part is connected to and communicated with one end of the first part. The first part extends downward along the short axis of the heat pipe. The cross-sectional height of the first part is greater than the cross-sectional height of the second part. An electronic device using the heat pipe is also disclosed.

Description

Heat pipe and electronic equipment using the heat pipe

technical field

The utility model relates to a heat pipe, in particular to a thin heat pipe.

Background technique

Generally speaking, electronic equipment will generate heat during operation. If this heat is not removed efficiently, the electronic equipment will easily crash, and in severe cases, the electronic components in the electronic equipment may be burned, resulting in property damage or injury to the user. Therefore, designers usually install heat dissipation modules in electronic equipment.

In recent years, due to the higher performance of the electronic chip, it will also generate a higher temperature, so that the heat dissipation module corresponding to the electronic chip is becoming more and more important. A heat pipe is a commonly used heat dissipation device. The inner wall of the heat pipe has a capillary structure with a working fluid inside. When one end of the heat pipe is placed at a higher temperature such as an electronic chip, and the other end is placed at a lower temperature, the working fluid adsorbed by the capillary structure at the high temperature will start to evaporate. The evaporated gas gathers in the space inside the tube, and the gaseous fluid flows to the low temperature of the heat pipe due to the pressure factor. When the gaseous fluid reaches the low temperature, it begins to condense into a liquid fluid, which is adsorbed and recycled by the capillary structure at the low temperature.

Light and thin has become the design trend of electronic equipment. Therefore, the thickness of the heat pipe is also reduced due to height restrictions. However, when the thickness of the heat pipe is too thin, the heat dissipation efficiency of the heat pipe is also limited.

Utility model content

Therefore, the purpose of the present invention is to provide a heat pipe, which is applied in an electronic device with a height limit, so as to improve the heat dissipation efficiency of the heat pipe.

To achieve the above purpose, according to an embodiment of the present invention, a heat pipe is provided, which includes a first part and a second part. The second part is connected to one end of the first part and conducts with one end of the first part. The first part extends downward along the short axis of the heat pipe, and the cross-sectional height of the first part is greater than that of the second part.

The heat pipe is flat. Wherein the cross-sectional shape of the heat pipe is L-shaped.

In another embodiment, the heat pipe further includes a third part connected to the other end of the second part and conducting with the other end of the second part. The third part extends downward along the short axis of the heat pipe, and the cross-sectional height of the third part is greater than that of the second part.

Wherein, the cross-sectional shape of the heat pipe may be U-shaped.

Another aspect of the present invention is an electronic device using a heat pipe, including a substrate, an electronic component, and a heat pipe. The electronic component is arranged on the substrate, and the heat pipe is arranged on the electronic component. The portion where the heat pipe extends beyond the electronic component along the minor axis is bent toward the substrate.

The heat pipe is flat.

In one embodiment, the heat pipe includes a first part and a second part. The first part is located outside the electronic component, and the second part is located on the electronic component. The shaft extends toward the base plate, and the first portion has a greater cross-sectional height than the second portion.

The cross-sectional shape of the heat pipe may be L-shaped.

In another embodiment, the heat pipe further includes a third part, located outside the electronic component, connected to the other end of the second part and conducting with the other end of the second part, the third part extends toward the substrate along the short axis of the heat pipe, and the second part The section height of the third section is greater than the section height of the second section.

The cross-sectional shape of the heat pipe may be U-shaped.

The advantage of the utility model is that the heat pipe is bent downward from the outside of the electronic component, effectively utilizing the space between the electronic component and the substrate, and can increase the air flow path of the heat pipe without increasing the overall height of the electronic device, thereby improving The heat dissipation efficiency of the heat pipe.

Description of drawings

In order to make the above and other purposes, features, advantages and embodiments of the present invention more obvious and understandable, the detailed description of the accompanying drawings is as follows:

Fig. 1 is a schematic diagram of an electronic device applying an embodiment of a heat pipe of the present invention;

Fig. 2 is a sectional view of the heat pipe in Fig. 1;

3 is a schematic diagram of an electronic device using another embodiment of the heat pipe of the present invention;

FIG. 4 is a cross-sectional view of the heat pipe in FIG. 3 .

Description of main component symbols

100: Electronics

200: Shell

300: electronic components

400: heat pipe

402: pipe wall

404: capillary structure

406: Air channel

410: Part One

420: Part II

430: Part III

500: Substrate

h1, h2, h3: section height

X: minor axis

Detailed ways

The following will clearly illustrate the spirit of the utility model with the accompanying drawings and detailed descriptions. After any person with ordinary knowledge in the technical field understands the preferred embodiments of the utility model, he or she can change and modify the technology taught by the utility model. modifications without departing from the spirit and scope of the present invention.

Referring to FIG. 1 , it shows a schematic diagram of an electronic device applying an embodiment of the heat pipe of the present invention. The electronic device 100 includes a casing 200 , an electronic component (heat source) 300 , a heat pipe 400 , and a substrate 500 . The substrate 500 is located in the casing 200 , and the electronic component 300 is disposed on the substrate 500 . The heat pipe 400 is disposed on the electronic component 300 and contacts the electronic component 300 to dissipate heat from the electronic component 300 . Considering the current thinning trend, the stacking height of components is also limited. The heat pipe 400 proposed by the utility model can effectively use the space in the electronic device 100, and increase the heat pipe 400 without increasing the height of the heat pipe 400. air duct.

The electronic device 100 can be a notebook computer, a tablet computer, a mobile phone or other handheld electronic devices, the electronic component 300 can be a central processing unit, a chipset or a graphics chip, etc., and the substrate 500 can be a circuit board. Taking this embodiment as an example, the electronic device 100 can be a notebook computer, the electronic component 300 can be a CPU chip, and the substrate 500 is a CPU substrate. The electronic component 300 is disposed on the substrate 500 , and generally the area of the substrate 500 is larger than that of the electronic component 300 , so that a level difference is formed between the electronic component 300 and the substrate 500 . The heat pipe 400 utilizes the space between the electronic component 300 and the substrate 500 to enlarge the air passage in the heat pipe 400 .

Specifically, the heat pipe 400 is roughly flat to match the height limit of the electronic device 100 . One end of the heat pipe 400 along the short axis X extends downward toward the substrate 500 outside the electronic component 300 to locally increase the thickness of the heat pipe 400 . The minor axis X especially refers to the transverse minor axis of the heat pipe 400 after being flattened. In other words, the heat pipe 400 includes a first portion 410 and a second portion 420 , and the first portion 410 extends toward the substrate. In a specific embodiment, the first portion 410 and the second portion 420 are perpendicular to each other. The cross-sectional height h1 of the first portion 410 of the heat pipe 400 protruding from the outer edge of the electronic component 300 is greater than the cross-sectional height h2 of the second portion 420 of the heat pipe 400 located on the electronic component 300 . The first portion 410 may or may not be in contact with the electronic component 300 , and the second portion 420 is in contact with the electronic component 300 . The cross-sectional shape of the heat pipe 400 is approximately L-shaped. Compared with the traditional inline design (only having the first part 410), the heat pipe 400 of the present invention effectively utilizes the space between the electronic component 300 and the substrate 500, and increases the heat pipe without increasing the overall height of the electronic device 100. The air channel in the heat pipe 400 is used to improve the heat dissipation efficiency of the heat pipe 400 .

Referring to FIG. 2 , it is a cross-sectional view of the heat pipe 400 in FIG. 1 . The heat pipe 400 includes a pipe wall 402 and a capillary structure 404 formed on the pipe wall 402 . The air channel 406 is defined by the tube wall 402 for the fluid or the gas converted therein to flow therein. The capillary structure 404 can be microgrooves, sintered particles or metal mesh. The cross-sectional shape of the heat pipe 400 is approximately L-shaped. The heat pipe 400 can be manufactured in one piece, and the first part 410 and the second part 420 are connected to each other and conducted. The section height h1 of the first portion 410 of the heat pipe 400 is greater than the section height h2 of the second portion 420 . The heat pipe 400 adds a first portion 410 extending downward from the side to increase the space of the air channel 406 in the heat pipe 400 and improve the heat dissipation efficiency of the heat pipe 400 .

Referring to FIG. 3 , it shows a schematic diagram of an electronic device applying another embodiment of the heat pipe of the present invention. The electronic device 100 includes a casing 200 , an electronic component 300 , a heat pipe 400 , and a substrate 500 . The substrate 500 is located in the casing 200 , and the electronic component 300 is disposed on the substrate 500 . The heat pipe 400 is disposed on the electronic component 300 and contacts the electronic component 300 to dissipate heat from the electronic component 300 . In this embodiment, in addition to the first part 410 extending from one side of the electronic component 300 to the direction of the substrate 500 and the second part 420 located above the electronic component 300, the heat pipe 400 further includes a heat pipe extending from the other side of the electronic component 300 to the substrate 500. The third portion 430 extends in the direction. That is, one end of the heat pipe 400 is bent downward along the short axis X to form the first portion 410 , and the other end of the heat pipe 400 is bent downward along the short axis X to form the third portion 430 . The first part 410 and the third part 430 are respectively located on opposite sides of the second part 420 , that is, the first part 410 and the third part 430 are located on two sides of the electronic component 300 . The first part 410 and the third part 430 may or may not be in contact with the electronic component 300 , and the second part 420 is in contact with the electronic component 300 . The cross-sectional shape of the heat pipe 400 is approximately U-shaped. Compared with the traditional inline design, the heat pipe 400 of the present invention effectively utilizes the space between the electronic component 300 and the substrate 500 , and increases the air passage in the heat pipe 400 without increasing the overall height of the electronic device 100 . To improve the heat dissipation efficiency of the heat pipe 400 .

Referring to FIG. 4 , it is a cross-sectional view of the heat pipe 400 in FIG. 3 . The heat pipe 400 includes a pipe wall 402 and a capillary structure 404 formed on the pipe wall 402 . The air channel 406 is defined by the tube wall 402 for the fluid or the gas converted therein to flow therein. The capillary structure 404 can be microgrooves, sintered particles or metal mesh. The cross-sectional shape of the heat pipe 400 is approximately U-shaped.

The heat pipe 400 can be manufactured in one piece, and the heat pipe 400 can be bent into the above-mentioned L-shape or U-shape after flattening the pipe diameter. The material of the tube wall 402 of the heat pipe 400 may be copper with good thermal conductivity.

The first part 410 , the second part 420 and the third part 430 are connected to each other and conducted. The section height h1 of the first portion 410 of the heat pipe 400 is greater than the section height h2 of the second portion 420 , and the section height h3 of the third portion 430 of the heat pipe 400 is greater than the section height h2 of the second portion 420 . The heat pipe 400 adds a first portion 410 and a third portion 430 extending downward from the side to increase the space of the air channel 406 in the heat pipe 400 and improve the heat dissipation efficiency of the heat pipe 400 .

In a specific embodiment, the height h1 of the section of the first portion 410 and the height h3 of the section of the third portion 430 may be the same or different depending on actual needs.

The heat pipe 400 can be manufactured in one piece, and the heat pipe 400 can be bent into the above-mentioned L-shape or U-shape after flattening the pipe diameter. The material of the tube wall 402 of the heat pipe 400 may be copper with good thermal conductivity.

It can be seen from the preferred embodiments of the utility model described above that the application of the utility model has the following advantages. The heat pipe is bent downward from the outside of the electronic component, effectively utilizing the space between the electronic component and the substrate, and can increase the air passage of the heat pipe without increasing the overall height of the electronic device, thereby improving the heat dissipation efficiency of the heat pipe.

Claims (10)

1. a heat pipe is characterized in that, this heat pipe comprises:

First; And

Second portion, connect this first an end and with this end conducting of this first, to extending below, the depth of section of this first is greater than the depth of section of this second portion along a minor axis of this heat pipe in this first.

2. heat pipe as claimed in claim 1 is characterized in that this heat pipe is flat.

3. heat pipe as claimed in claim 1 is characterized in that, the cross sectional shape of this heat pipe is L shaped.

4. heat pipe as claimed in claim 1; It is characterized in that; This heat pipe also comprises third part, this third part connect this second portion the other end and with this other end conducting of this second portion, the depth of section of this third part is greater than the depth of section of this second portion.

5. heat pipe as claimed in claim 4 is characterized in that, the cross sectional shape of this heat pipe is a U-shaped.

6. the electronic equipment of an application of heat pipe is characterized in that, this electronic equipment comprises:

Substrate;

Electronic component is arranged on this substrate; And

Heat pipe is arranged on this electronic component, wherein this heat pipe exceed this electronic component along a minor axis part towards this substrate bending.

7. the electronic equipment of application of heat pipe as claimed in claim 6 is characterized in that, this heat pipe comprises:

First is positioned at this electronic component outside; And

Second portion is positioned on this electronic component, connect this first an end and with this end conducting of this first, this first extends towards this substrate along this minor axis of this heat pipe, the depth of section of this first is greater than the depth of section of this second portion.

8. the electronic equipment of application of heat pipe as claimed in claim 7 is characterized in that, the cross sectional shape of this heat pipe is L shaped.

9. the electronic equipment of application of heat pipe as claimed in claim 6; It is characterized in that; This heat pipe also comprises third part, is positioned at this electronic component outside, connect this second portion the other end and with this other end conducting of this second portion; This third part is extended towards this substrate along this minor axis of this heat pipe, and the depth of section of this third part is greater than the depth of section of this second portion.

10. the electronic equipment of application of heat pipe as claimed in claim 9 is characterized in that, the cross sectional shape of this heat pipe is a U-shaped.

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