CN202758928U - Improved LED full-color support structure - Google Patents
Improved LED full-color support structure Download PDFInfo
- Publication number
- CN202758928U CN202758928U CN 201220310578 CN201220310578U CN202758928U CN 202758928 U CN202758928 U CN 202758928U CN 201220310578 CN201220310578 CN 201220310578 CN 201220310578 U CN201220310578 U CN 201220310578U CN 202758928 U CN202758928 U CN 202758928U
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- Prior art keywords
- wafer
- led
- negative pole
- conductive pin
- blue
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- 235000012431 wafers Nutrition 0.000 claims description 64
- 239000000178 monomer Substances 0.000 claims description 17
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 7
- 229920000647 polyepoxide Polymers 0.000 abstract description 7
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract 3
- 230000035939 shock Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000003086 colorant Substances 0.000 description 6
- 239000000084 colloidal system Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
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Abstract
The utility model discloses an improved LED full-color support structure which comprises a support main body. The support main body is provided with a plurality of hollow portions and an LED individual support is formed in each hollow portion. The LED individual support comprises a cathode conductive pin and three anode conductive pins, wherein the cathode conductive pin, the three anode conductive pins and the support main body are formed as a whole. One end of the cathode conductive pin and one ends of the three anode conductive pins are bent to form a wire-welding platform respectively, and the wire-welding platforms protrude outwardly. The upper surfaces of the wire-welding platform of the cathode conductive pin recesses downwards to form a holding groove, wherein the holding groove can holds a red wafer, a yellow wafer and a blue wafer. The beneficial effects are that: according to the improved LED full-color support structure, the red wafer, the yellow wafer and the blue wafer are integrated and integrated epoxy resin packaging is realized through epoxy resin packaging, so that thermal expansion influences on an LED rubber body are greatly reduced; LED performances of water resistance, moisture resistance, temperature shock resistance are improved; and the light source of LED support is suitable for use in outdoor hostile environments.
Description
[technical field]
The utility model relates to led support, relates in particular to a kind of full-color supporting structure of LED of improvement.
[background technology]
Along with the LED full color display is day by day universal, particularly outdoor display screen with its rich color and round-the-clock broadcast performance, is favored by users deeply.Marketing is more and more deep, and is also more and more higher to the pixel-intensive degree requirement of display screen.Existing outdoor display screen mainly uses oval direct insertion LED as light-emitting component, because direct insertion LED discrete component can only show a kind of color, so red, green, blue 3 LEDs could form a base pixel point, so can't realize the small pixel spacing.Although and traditional adopting surface mounted LED can be realized the small pixel spacing, because plastic shell is different from the thermal coefficient of expansion of epoxy resin, is prone to lamp body and makes moist and cause the existing picture that lost efficacy, thereby can only in indoor environment, use.
[summary of the invention]
The purpose of this utility model is effectively to overcome the deficiency of above-mentioned technology, provides a kind of three kinds of color wafers of red, green, blue are integrated, and uses the epoxy resin integral packaging, the full-color supporting structure of the LED of waterproof and dampproof improvement.
The technical solution of the utility model is achieved in that the full-color supporting structure of a kind of LED of improvement, it comprises rack body, described rack body is provided with a plurality of hollow-out parts, in each hollow-out parts, be formed with one red wafer can be installed, the LED monomer frame of yellow wafer and blue wafer, its improvement is: described LED monomer frame comprises and the integrated negative pole conductive pin of rack body and three anodal conductive pins, described negative pole conductive pin has one and is used for and described red wafer, the negative pole link that yellow wafer and blue wafer connect and one and the negative pole stiff end that connects as one of described rack body, described three anodal conductive pins have respectively an anode connection terminal that is connected with described red wafer or yellow wafer or blue wafer and one and the anodal stiff end that links into an integrated entity of described rack body;
The negative pole link of described negative pole conductive pin and the anode connection terminal of three anodal conductive pins form respectively a bonding wire platform protruding upward through bending, and the upper surface of the bonding wire platform of described negative pole conductive pin is recessed to form an accommodating groove that can hold red wafer, yellow wafer and three wafers of blue wafer downwards.
Bonding wire platform corresponding on described three anodal conductive pins is electrically connected with described red wafer, yellow wafer and blue wafer respectively by gold thread.
Described LED monomer frame is " protruding " type structure.
Described accommodating groove is bowl structure.
Described rack body and LED monomer seating face have silver coating.
Than led support of the prior art, the beneficial effects of the utility model are: the utility model is with red, green, blue three primary colors wafer integrates, soon red, green, blue three primary colors wafer is electrically connected on the negative pole conductive pin simultaneously, again with three anodal pins of correspondence respectively with red, green, blue three primary colors wafer is connected to form and independently drives separately the loop, realize the epoxy resin integrative packaging by epoxy encapsulation again, thereby the impact of LED colloid expanded by heating is greatly reduced, promoted the LED waterproof, moistureproof, the resisting temperature impact property, so that the light source of this led support can be applicable to use in the outdoor rugged environment, has good waterproof, moisture effect.
[description of drawings]
Fig. 1 is the front view of the full-color supporting structure of LED of the utility model improvement
Fig. 2 is the vertical view of the full-color supporting structure of LED of the utility model improvement
Fig. 3 is the structural representation of single led monomer frame in the utility model
Fig. 4 is the left view of single led monomer frame in the utility model
Among the figure: rack body 1; LED monomer frame 2; Anodal conductive pin 21(22,24); Anodal stiff end 211(221,241); Bonding wire platform 212(222,232,242); Accommodating groove 243; Negative pole conductive pin 23; Negative pole stiff end 231.
[embodiment]
The utility model will be further described below in conjunction with drawings and Examples.
Referring to figs. 1 through shown in Figure 4, the full-color supporting structure of LED of the improvement that the utility model discloses, it comprises rack body 1, described rack body 1 is provided with a plurality of hollow-out parts 3, in each hollow-out parts 3, be formed with one red wafer can be installed, the LED monomer frame 2 of yellow wafer and blue wafer, described rack body 1 has a plurality of LED monomer framves 2,10 LED monomer framves 2 for example, each LED monomer frame 2 comprises and described rack body 1 an integrated negative pole conductive pin 23 and three anodal conductive pins 21,22,24, namely set firmly four conductive pins at rack body 1, described negative pole conductive pin 23 have one with described red wafer, the negative pole link of the connection of yellow wafer and blue wafer and one and the negative pole stiff end 231 that connects as one of described rack body 1, described three anodal conductive pins 21,22,24 have respectively one with the anode connection terminal that is connected of described red wafer or yellow wafer or blue wafer and one and the anodal stiff end 211 that links into an integrated entity of described rack body, 221,241.
Or with reference to shown in Figure 3, the negative pole link of described negative pole conductive pin 23 and three anodal conductive pins 21,22,24 anode connection terminal forms respectively a bonding wire platform 212 protruding upward through bending, 222,232,242, wherein bonding wire platform 232 surface areas of negative pole conductive pin 23 are larger, other three anodal conductive pins 21,22,24 bonding wire platform 212,222,242 surface areas are less, and these three anodal conductive pins 21,22,24 bonding wire platform 212,222,242 be distributed in respectively negative pole conductive pin 23 bonding wire platform 232 around, better, bonding wire platform 232 upper surfaces of negative pole conductive pin 23 and three anodal conductive pins 21,22,24 bonding wire platform 212,222,242 upper surfaces are positioned at same plane (being defined as the first plane), the negative pole stiff end 231 of negative pole conductive pin 23 and three anodal conductive pins 21,22,24 anodal stiff end 211,221,241 are positioned at same plane (being defined as the second plane), and the first plane is higher than the first plane and forms bonding wire platform 212 protruding upward with this, 222,232,242; In addition, the upper surface of the bonding wire platform 232 of described negative pole conductive pin 23 is recessed to form an accommodating groove 233 that can hold red wafer, yellow wafer and three wafers of blue wafer downwards, the negative pole link that is negative pole conductive pin 23 forms a Lam-cup structure, better, described accommodating groove 233 is bowl structure, be used for red wafer, yellow wafer and three wafers of blue wafer are installed, in addition, described LED monomer frame 2 is " protruding " type (referring to Fig. 4) from the side.
The utility model led support is one-body molded by cold punching technology, and the surface of rack body 1 and LED monomer frame 2 has silver coating; During concrete the application, the red wafer of accommodating groove 243 interior installations (electric connection), yellow wafer and three wafers of blue wafer at the negative pole link of negative pole conductive pin 23, again bonding wire platform 212,222 corresponding on described three anodal conductive pins 21,22,24,242 is electrically connected with described red wafer, yellow wafer and blue wafer respectively by gold thread, with this three wafers are formed and independently drive the loop, at last by packing colloid (epoxy resin) integral type encapsulated moulding.
To sum up, the utility model is with red, green, blue three primary colors wafer integrates, soon red, green, blue three primary colors wafer is electrically connected on the negative pole conductive pin 23 simultaneously, again with three anodal pins of correspondence respectively with red, green, blue three primary colors wafer is connected to form and independently drives separately the loop, realize the epoxy resin integrative packaging by epoxy encapsulation again, thereby the impact of LED colloid expanded by heating is greatly reduced, promoted the LED waterproof, moistureproof, the resisting temperature impact property, so that the light source of this led support can be applicable to use in the outdoor rugged environment, has good waterproof, moisture effect.
Described above only is preferred embodiment of the present utility model, and above-mentioned specific embodiment is not to restriction of the present utility model.In technological thought category of the present utility model, various distortion and modification can appear, and the retouching that all those of ordinary skill in the art make according to above description, revise or be equal to replacement, all belong to the scope that the utility model is protected.
Claims (5)
1. the full-color supporting structure of the LED of an improvement, it comprises rack body, described rack body is provided with a plurality of hollow-out parts, in each hollow-out parts, be formed with one red wafer can be installed, the LED monomer frame of yellow wafer and blue wafer, it is characterized in that: described LED monomer frame comprises and the integrated negative pole conductive pin of rack body and three anodal conductive pins, described negative pole conductive pin has one and is used for and described red wafer, the negative pole link that yellow wafer and blue wafer connect and one and the negative pole stiff end that connects as one of described rack body, described three anodal conductive pins have respectively an anode connection terminal that is connected with described red wafer or yellow wafer or blue wafer and one and the anodal stiff end that links into an integrated entity of described rack body;
The negative pole link of described negative pole conductive pin and the anode connection terminal of three anodal conductive pins form respectively a bonding wire platform protruding upward through bending, and the upper surface of the bonding wire platform of described negative pole conductive pin is recessed to form an accommodating groove that can hold red wafer, yellow wafer and three wafers of blue wafer downwards.
2. the full-color supporting structure of the LED of improvement according to claim 1 is characterized in that: bonding wire platform corresponding on described three anodal conductive pins is electrically connected with described red wafer, yellow wafer and blue wafer respectively by gold thread.
3. the full-color supporting structure of the LED of improvement according to claim 1, it is characterized in that: described LED monomer frame is " protruding " type structure.
4. the full-color supporting structure of the LED of improvement according to claim 1, it is characterized in that: described accommodating groove is bowl structure.
5. the full-color supporting structure of the LED of improvement according to claim 1, it is characterized in that: described rack body and LED monomer seating face have silver coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220310578 CN202758928U (en) | 2012-06-29 | 2012-06-29 | Improved LED full-color support structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220310578 CN202758928U (en) | 2012-06-29 | 2012-06-29 | Improved LED full-color support structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202758928U true CN202758928U (en) | 2013-02-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220310578 Expired - Fee Related CN202758928U (en) | 2012-06-29 | 2012-06-29 | Improved LED full-color support structure |
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| Country | Link |
|---|---|
| CN (1) | CN202758928U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107726062A (en) * | 2017-11-17 | 2018-02-23 | 江门劳士国际电气有限公司 | A kind of direct insertion LED |
-
2012
- 2012-06-29 CN CN 201220310578 patent/CN202758928U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107726062A (en) * | 2017-11-17 | 2018-02-23 | 江门劳士国际电气有限公司 | A kind of direct insertion LED |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160511 Address after: 629000 South Road, airport, Suining economic and Technological Development Zone, Suining, Sichuan Patentee after: Innoquick Electronics Technology Co., Ltd. Address before: Tak Road 629000 in Sichuan province Suining City Economic Development Zone Patentee before: Sichuan Bonshine Optical Electron Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130227 Termination date: 20170629 |
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| CF01 | Termination of patent right due to non-payment of annual fee |