CN203615157U - Lamps and lighting fixtures - Google Patents

Abstract

A lamp and lighting device that not only simplify the installation work of a base plate and an LED module but also have excellent heat dissipation, the lamp (1) includes: a base plate (metal base plate 30), a base plate (11) arranged on the base plate ), a plurality of LED elements (12) mounted on the substrate (11), a light-transmitting cover (20) covering the plurality of LED elements (12) and fixed on the base plate, and bonding the base plate and the base plate (11) TIM material (40).

Description

Lamps and lighting fixtures

technical field

The utility model relates to a lamp and a lighting device, for example, to a straight tube lamp with light emitting elements such as a light emitting diode (LED: Light Emitting Diode) and a lighting device equipped with the straight tube lamp.

Background technique

LEDs are expected to be used as new light sources in various lamps such as conventionally known fluorescent lamps and incandescent lamps because of their high efficiency and long life, and research and development of lamps (LED lamps) using LEDs are progressing.

As an LED lamp, there is a bulb-shaped LED lamp (bulb-shaped LED lamp) instead of a bulb-shaped fluorescent lamp equipped with a luminous tube inside a glass bulb or an incandescent lamp using a filament coil (bulb-shaped LED lamp), or a straight tube instead of a straight tube with electrode coils at both ends. Straight-tube LED lamps (straight-tube LED lamps) of fluorescent lamps, etc. For example, Patent Document 1 discloses a conventional bulb-shaped LED lamp. In addition, Patent Document 2 discloses a conventional straight-tube LED lamp.

An LED module in which a plurality of LEDs are mounted on a substrate is used as an LED lamp. Since the LED generates heat from the LED itself due to light emission, the temperature of the LED rises, the light output of the LED decreases, and the lifetime is shortened. Therefore, a base plate functioning as a heat sink is provided in the LED lamp, and the LED module is mounted on the base plate.

(Prior art literature)

(patent documents)

Patent Document 1 Japanese Patent Application Publication No. 2006-313717

Patent Document 2 Japanese Unexamined Patent Publication No. 2009-043447

For example, in a straight tube type LED lamp, it is possible to arrange a bottom plate made of a long and thin metal in a long and thin cylindrical glass tube. In this case, the LED module is mounted on this base plate. Alternatively, a conceivable configuration of the straight-tube LED lamp is that the elongated frame is divided into two halves along its length. In this case, an elongated bottom plate with an approximately semicircular cross-section whose outer surface is exposed to the outside of the lamp is used, and the LED module is placed on the bottom plate and covered with a light-transmitting cover with an elongated and approximately semi-circular cross-section. In the way of the LED module, the transparent cover is fixed on the bottom plate.

In this straight tube LED lamp, the LED module is fixed on the elongated bottom plate. For example, a considered method is to fix the LED module on the base plate (sliding method) by inserting the base plate of the LED module into a guide rail (groove) provided on the base plate. In addition, it is also possible to fix the LED module to the base plate by locking the base plate of the LED module with locking claws provided on the base plate (claw method).

However, there is a problem that operability is poor in the fixing methods of the sliding method and the claw method. In particular, in the sliding fixing method, since the LED module is inserted from the end of the elongated bottom plate, there is also a problem that a large working space needs to be secured.

Utility model content

In order to solve the above-mentioned problems, the present invention aims to provide a lamp and a lighting device which can not only simplify the installation work of the base plate and the LED module but also have excellent heat dissipation.

In order to achieve the above object, one embodiment of the lamp involved in the present utility model includes: a base plate; a base plate disposed on the base plate, a plurality of light-emitting elements mounted on the base plate; a light-transmitting cover, Covering the plurality of light emitting elements and being fixed to the base plate; and a thermal interface material bonding the base plate and the substrate.

Furthermore, in an embodiment of the lamp according to the present invention, the substrate may include: a metal backing, an insulating layer formed on the metal backing, and an insulating layer formed on the insulating layer. metal wiring.

Furthermore, in one embodiment of the lamp according to the present invention, the insulating layer may be formed of a polyimide-based resin.

Furthermore, in one embodiment of the lamp according to the present invention, the thickness of the insulating layer may be equal to or less than the thickness of the metal backing plate.

Furthermore, in one embodiment of the lamp according to the present invention, the bottom plate may have a wall portion that abuts on the side surface of the substrate.

Furthermore, in one embodiment of the lamp according to the present invention, the base plate and the translucent cover may constitute an elongated cylindrical frame.

Furthermore, in one embodiment of the lamp according to the present invention, the base plate may be formed of metal.

Moreover, one Embodiment of the illuminating device which concerns on this invention is equipped with any one of the above-mentioned lamps.

According to the present invention, not only can the work of assembling the substrate on which the light emitting element is mounted to the bottom plate be simplified, but also the heat generated in the light emitting element can be efficiently dissipated.

Description of drawings

FIG. 1 is an overall perspective view and a partially enlarged view of a lamp according to Embodiment 1 of the present invention.

Fig. 2 is a cross-sectional view of the lamp according to Embodiment 1 of the present invention.

(a) of FIG. 3 is a perspective view of an LED module in a lamp according to Embodiment 1 of the present invention, and (b) of FIG. 3 is a cross-sectional view of an LED element in the LED module.

4( a ) is a cross-sectional view of the lamp according to Embodiment 1 of the present invention (a cross-sectional view when cut along a plane perpendicular to the tube axis), and FIG. 4( b ) shows the lamp in the lamp. An enlarged cross-sectional view of a part of the detailed structure of the junction between the LED module and the metal base.

5 is a cross-sectional view (a cross-sectional view cut along a plane perpendicular to the tube axis) of a lamp according to a modified example of Embodiment 1 of the present invention.

Fig. 6 is a diagram for explaining a method of bonding an LED module and a metal base plate in the lamp according to Embodiment 1 of the present invention.

7( a ) is a cross-sectional view (a cross-sectional view cut along a plane perpendicular to the tube axis) of the lamp according to Embodiment 2 of the present invention, and FIG. 7( b ) shows the lamp in the lamp. An enlarged cross-sectional view of a part of the detailed structure of the junction between the LED module and the metal base.

Fig. 8 is an overview perspective view of a lighting device according to Embodiment 3 of the present invention.

Detailed ways

A lamp and a lighting device according to an embodiment of the present invention will be described below with reference to the drawings. In addition, the embodiment described below is a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement positions and connection forms of the components shown in the following embodiments are all examples, and are not intended to limit the scope of the present invention. Therefore, among the constituent elements of the following embodiments, the constituent elements not described in the independent claims showing the highest concept of the present invention will be described as arbitrary constituent elements.

In addition, each figure is a schematic figure, and is not a strict illustration. In addition, in each figure, the same code|symbol is attached|subjected to the same component. In addition, in the present embodiment, the tube axis direction (longitudinal direction) of the lamp is defined as the X-axis direction, one direction (short direction) perpendicular to the X-axis is defined as the Y-axis direction, and the X-axis and the Y-axis are perpendicular to each other. The direction is taken as the Z-axis direction.

(Embodiment 1)

First, the lamp 1 according to Embodiment 1 of the present invention will be described. Furthermore, the lamp 1 according to the present embodiment is a straight-tube LED lamp instead of a conventional straight-tube fluorescent lamp. Furthermore, the structure of the lamp 1 according to the present embodiment is such that the straight pipe-shaped housing is a split type in which a light-transmitting member and a heat sink (base plate) are separated.

[whole constitution of the light]

The whole structure of the lamp|ramp 1 which concerns on Embodiment 1 of this invention is demonstrated using FIG.1 and FIG.2. Fig. 1 is a perspective view of a lamp according to Embodiment 1 of the present invention, showing an external view of the entire lamp and an enlarged view in which a part of the lamp is extracted. Moreover, FIG. 2 is a cross-sectional view (a cross-sectional view on an XZ plane passing through a tube axis) of the lamp according to Embodiment 1 of the present invention.

As shown in FIGS. 1 and 2 , the lamp 1 according to the present embodiment is a straight-tube LED lamp that replaces the light source for illumination of a conventional straight-tube fluorescent lamp. The lamp 1 includes: an LED module 10 that emits predetermined light, an elongated translucent cover 20 covering the LED module 10, an elongated metal base plate 30 on which the LED module 10 is placed, and an LED module 10 and the metal base plate. 30 thermal interface material (TIM: Thermal Interface Material) 40 for bonding.

In this embodiment, an elongated cylindrical frame (periphery) is constituted by the translucent cover 20 and the metal base plate 30 . That is, by connecting the translucent cover 20 and the metal base plate 30 , a tubular frame having openings at both ends is formed as a peripheral member (insertion pipe). In this embodiment, when the translucent cover 20 is bonded to the metal base plate 30 , the outer contour of the cross section of the frame body perpendicular to the longitudinal direction is a circle. A pair of first bases 50 and second bases 60 are provided at both ends in the longitudinal direction (X-axis direction) of the housing, and the LED module 10 and the like are accommodated in the housing. The lamp 1 is attached to the socket of the lighting fixture through the first base 50 and the second base 60, and is supported by the lighting fixture.

In addition, although not shown in the figure, a connector for passing electric power supplied to the LED module 10 , a lighting circuit for causing the LED module to emit light, and the like are provided in the housing. In addition, the power supply method employed in the lamp 1 of the present embodiment is a one-side power supply method in which power is supplied to the LED module 10 only from the first base 50 . That is, the lamp 1 receives electric power from a lighting fixture or the like only from the first base 50 .

Each component of the lamp 1 will be described in detail below.

[translucent cover]

The translucent cover 20 is a translucent frame. As shown in FIGS. 1 and 2 , the translucent cover 20 is configured to cover the metal base plate 30 on which the LED module 10 is disposed. The translucent cover 20 in this embodiment is a translucent substantially semi-cylindrical translucent member, and has a substantially semicircular cross-sectional shape on a plane (YZ plane) perpendicular to the tube axis (X-axis). The translucent cover 20 is fixed to the metal base plate by being engaged with the step portion of the metal base plate 30 by the edge portions on both sides in the circumferential direction.

The translucent cover 20 is made of a translucent material, and can be formed using a resin material such as acrylic or polycarbonate, for example. In this embodiment, although the translucent cover 20 is made of a resin lamp tube, it is also possible to form the translucent cover 20 using a translucent material other than resin.

Moreover, the light-diffusion part may be formed in the translucent cover 20, and the translucent cover 20 may have the light-diffusion function for diffusing the light from the LED module 10. As shown in FIG. Accordingly, the light emitted from the LED module 10 can be diffused when passing through the translucent cover 20 . As a light-diffusion part, a light-diffusion layer, a light-diffusion film, etc. are formed in the inner surface or the outer surface of the translucent cover 20, for example. Specifically, a milky-white light-diffusing film is formed by applying resin or white pigment containing a light-diffusing material (fine particles) such as silica or calcium carbonate to the inner or outer surface of the translucent cover 20 . As another light diffusing part, a lens structure is provided inside or outside the translucent cover 20 or a recessed part or a convex part is formed in the translucent cover 20 . For example, by printing a dot pattern on the inner or outer surface of the translucent cover 20 and processing a part of the translucent cover 20 , the translucent cover 20 can have a light diffusion function. Alternatively, the translucent cover 20 itself is formed using a resin material in which a light diffusing material is dispersed, so that the translucent cover 20 has a light diffusing function (light diffusing portion).

[metal base plate]

As shown in FIGS. 1 and 2 , the metal base plate 30 is an elongated member covered by the light-transmitting cover 20 . A portion of the metal base plate 30 not covered by the light-transmitting cover 20 is exposed to the outside. That is, the metal base plate 30 forms the periphery of the lamp 1 together with the translucent cover 20 .

The metal base plate 30 is an example of a base plate, and functions as a heat sink for dissipating heat generated in the LED module 10 . Therefore, a part of the metal base plate 30 is configured to be exposed to the outside of the lamp. Furthermore, the metal base plate 30 functions as a mounting table for mounting and fixing the LED module 10 .

Specifically, the inner portion of the metal base plate 30 on the translucent cover 20 side serves as a plate-shaped mounting portion 31 having a mounting surface on which the LED module 10 is mounted. In the present embodiment, the mounting surface of the mounting portion 31 of the metal base plate 30 is an elongated rectangular plane.

In addition, a plurality of heat dissipation fins 32 as heat dissipation parts are provided on the outer portion of the back surface which is the mounting surface of the metal base plate 30 . The heat sink 32 is exposed to the outside of the lamp, and is provided so as to protrude from the mounting portion 31 to the outside of the lamp. A plurality of cooling fins 32 are formed along the length direction of the metal base plate 30 .

Furthermore, at both end portions in the width direction of the metal base plate 30 , stepped portions for engaging the edge portions on both sides in the circumferential direction of the translucent cover 20 are provided. The light-transmitting cover 20 and the metal base plate 30 are locked together by sliding the light-transmitting cover 20 into the metal base plate 30 along the length direction, or by inserting the light-transmitting cover 20 from above the metal base plate 30 put together.

The metal base plate 30 is preferably made of a material with high thermal conductivity such as metal, and is an extruded material made of aluminum in this embodiment. In addition, instead of the metal base plate 30 , a resin base plate made of the same shape as the metal base plate 30 may be used, or a base plate made of a material other than metal or resin may be used. In this case, it is best to use a material with high thermal conductivity. For example, in the case of resin, it is best to use a resin material with high thermal conductivity, or use a material with high thermal conductivity such as metal particles. Resin material.

Moreover, the length of the metal bottom plate 30 is longer than that of the transparent cover 20 . This is because the translucent cover 20 made of resin has a larger coefficient of thermal expansion than the metal base plate 30 made of metal, and therefore the length of the translucent cover 20 is shorter than the length of the metal base plate 30 by the difference in thermal expansion.

Moreover, the transparent cover 20 and the metal bottom plate 30 can also be bonded together by an adhesive as required. In addition, instead of using an adhesive, guide rail grooves may be provided in the longitudinal direction of the metal base plate 30, and the end of the translucent cover 20 in the short direction or the protrusion provided along the longitudinal direction of the translucent cover 20 may be inserted. Through the groove of the guide rail, the transparent cover 20 and the metal bottom plate 30 are snapped together.

[LED module]

The LED module 10 is mounted on the metal base plate 30 through a TIM material (thermal interface material) 40 . In addition, the number of LED modules 10 mounted on the metal base plate 30 may be one or more. In the case of using a plurality of LED modules 10 , for example, the plurality of LED modules 10 are arranged in a row along the length direction of the metal base plate 30 .

Here, the detailed structure of the LED module 10 is demonstrated using FIG. 3. FIG. (a) of FIG. 3 is a perspective view of an LED module in a lamp according to Embodiment 1 of the present invention, and (b) of FIG. 3 is a cross-sectional view of an LED element in the LED module.

As shown in FIG. 3( a ), the LED module 10 is a surface mount (SMD: Surface Mount Device) type light emitting module, and includes a substrate 11 and a plurality of LED elements 12 mounted on the substrate 11 .

The substrate 11 is a mounting substrate on which the LED element 12 is mounted. The substrate 11 in this embodiment is a metal-based substrate, and includes a metal backing board 11a, an insulating layer 11b formed on the metal backing board 11a, a metal wiring 11c patterned on the insulating layer 11b, The protective layer 11d is formed on the insulating layer 11b in a portion where the metal wiring 11c is not formed. Furthermore, as the shape of the substrate 11 , for example, a rectangular shape elongated in the longitudinal direction of the metal base plate 30 can be adopted.

The metal backing plate 11a is a substrate serving as a bottom. As the material of the metal backing plate 11a, for example, a metal having high thermal conductivity such as copper or aluminum can be used.

The insulating layer 11b is formed between the metal backing board 11a and the metal wiring 11c, and insulates the metal backing board 11a and the metal wiring 11c. As a material of the insulating layer 11b, for example, a polyimide-based resin can be used.

The metal wiring 11c is a conductive metal thin film for electrically connecting the LED elements 12 adjacent to each other, and is continuously formed linearly on the insulating layer 11b along the longitudinal direction of the substrate 11 in this embodiment. As a material of the metal wiring 11c, for example, a metal having high thermal conductivity and low resistivity such as copper, aluminum, or silver can be used.

The protective layer 11d is a second insulating layer formed on the surface of the substrate 11, and is formed so that a part of the electrode terminal 13 and the metal wiring 11c can be exposed. At least a portion of the metal wiring 11c that conducts with the LED element 12 is exposed.

Electrode terminals 13 are respectively provided at both ends in the longitudinal direction of the substrate 11 . The electrode terminal 13 is an external connection terminal, and receives direct current for causing the LED element 12 to emit light from the outside of the LED module 10 .

The LED element 12 is an example of a light emitting element, and is mounted on the surface of the substrate 11 . In the present embodiment, as shown in FIG. 3( a ), a plurality of LED elements 12 are arranged in a line along the longitudinal direction of the substrate 11 .

Each LED element 12 is a so-called SMD (surface mount) type light-emitting element LED, which is packaged by a chip and a phosphor. As shown in FIG. The LED chip 12b accommodated in the package 12a, and the sealing member 12c which seals the LED chip 12b. The LED element 12 in this embodiment is a white LED element that emits white light.

The package 12a is molded from white resin or the like, and has an inverted conical recess (cavity). The inner surface of the concave portion is an inclined surface, and is configured to be able to reflect light from the LED chip 12b upward.

The LED chip 12b is an example of a semiconductor light emitting element, and is mounted in a concave portion of the package 12a. The LED chip 12b is a bare chip capable of emitting monochromatic visible light, and is attached and mounted on the bottom surface of the concave portion of the package 12a with a die attach material (die attach material). As the LED chip 12b, for example, a blue LED chip that emits blue light when energized can be used.

The sealing member 12c is a phosphor-containing resin containing a phosphor as a light wavelength converter, and can convert the wavelength of light from the LED chip 12b into a predetermined wavelength (color conversion), and protect the LED chip by sealing the LED chip 12b. 12b. The sealing member 12c is filled in the concave portion of the package body 12a, and is sealed up to the opening surface of the concave portion. As the sealing member 12c, for example, when the LED chip 12b is a blue LED, in order to obtain white light, a phosphor-containing resin in which YAG (yttrium aluminum garnet)-based yellow phosphor particles are dispersed in silicone resin is used. Accordingly, the yellow phosphor particles are excited by the blue light of the blue LED chip to emit yellow light, and white light is emitted from the sealing member 12 c through the excited yellow light and the blue light of the blue LED chip. Moreover, you may make the sealing member 12c contain light-diffusion materials, such as silica.

In this way, the LED element 12 is constructed. Moreover, although not shown in figure, the LED element 12 has two external connection terminals of a positive electrode and a negative electrode, and these external connection terminals are electrically connected to the metal wiring 11c. In addition, in this embodiment, although the LED element 12 is mounted in a linear shape, it is not limited to this. Furthermore, in this embodiment, the plurality of LED elements 12 on the substrate 11 are connected in series by the metal wiring 11c, but they may be connected in parallel or in a combination of series and parallel.

[TIM material]

As shown in FIGS. 1 and 2 , a TIM material (thermal interface material) 40 is arranged between the LED module 10 and the metal base plate 30 . The TIM material 40 is arranged such that one surface is in close contact with the back surface of the substrate 11 of the LED module 10 . More specifically, one surface of the TIM material 40 is in close contact with the metal backing plate 11 a of the substrate 11 . Furthermore, the other surface of the TIM material 40 is in close contact with the mounting surface of the mounting portion 31 of the metal base plate 30 .

The TIM material 40 is a flexible, highly thermally conductive film. In addition, the TIM material 40 in this embodiment has adhesiveness (adhesiveness), is formed in an adhesive tape shape, and is bonded to the LED module 10 and to the metal base plate 30 . That is, the TIM material 40 has the function of an adhesive material for bonding the LED module 10 (substrate 11 ) and the metal base plate 30 , and the LED module 10 (substrate 11 ) and the metal base plate 30 are bonded together by the TIM material 40 .

Moreover, since the TIM material 40 has flexibility, it can deform along with the thermal deformation of the substrate 11 and the metal bottom plate 30 of the LED module 10 . For example, even if the metal base plate 30 is warped due to thermal expansion, the TIM material 40 can be deformed according to the warped shape of the metal base plate 30 .

Furthermore, in order to improve thermal conductivity, a thermally conductive filler may be placed in the TIM material 40 . In this case, the TIM material 40 having a thermal conductivity of 0.8 W/m·K or higher can be obtained. In the present embodiment, the TIM material 40 having a thermal conductivity of 0.15 W/m·K is used without adding a thermally conductive filler to the TIM material 40 in order to emphasize adhesiveness. Also, as the TIM material 40, a material having a thermal conductivity of 0.1 to 1.2 W/m·K can be used.

[first light head]

The first base 50 is a base for power supply for supplying power to the LED elements 12 of the LED module 10 . The first base 50 is also a base for power reception that receives electric power for lighting the LED elements 12 of the LED module 10 from the outside of the lamp (commercial power supply, etc.).

As shown in FIG. 1 , the first lamp holder 50 is provided in a cover shape to cover one end in the longitudinal direction of the elongated frame body formed by the light-transmitting cover 20 and the metal bottom plate 30 . The first base 50 in this embodiment includes a base main body 51 made of synthetic resin such as polybutylene terephthalate (PBT), and a pair of power supply pins 52 made of a metal material such as brass.

The base main body 51 is formed in a slightly bottomed cylindrical shape. A pair of power supply pins 52 are configured to protrude outward from the bottom of the base body 51 . The power supply pin 52 is a pin for lighting the LED element 12 to supply power, and functions as a power receiving pin that receives predetermined power from an external device such as a lighting fixture. For example, when the first base 50 is attached to a socket of a lighting fixture, the pair of power supply pins 52 will be in a state of receiving power from a power supply device incorporated in the lighting fixture. For example, through the pair of power supply pins 52, direct current is supplied to the lighting circuit in the lamp. The lighting circuit rectifies the input DC power and outputs a voltage required for energizing the LED element 12 .

Furthermore, the base main body 51 may be a split type base that can be disassembled into upper and lower halves (XY plane), or may be a non-divided type base that is not divided.

[Second light head]

The second base 60 is a base for non-power supply. That is, the second base 60 functions as a mounting portion for mounting the lamp 1 to a lighting fixture.

As shown in FIG. 1 , the second lamp cap 60 is configured in a cover shape to cover one end in the longitudinal direction of the elongated frame formed by the light-transmitting cover 20 and the metal base plate 30 . The second base 60 in this embodiment includes a base body 61 made of synthetic resin such as PBT, and a non-power supply pin 62 made of metal material such as brass.

The base main body 61 is formed in a slightly bottomed cylindrical shape. The non-power supply pin 62 is configured to protrude outward from the bottom of the base body 61 .

In addition, the second lamp cap 60 may also have a ground wire function. In this case, the non-power supply pin 62 functions as a ground pin, and the metal base plate 30 can be grounded through the lighting fixture by connecting the non-power supply pin 62 to the ground of the metal base plate 30 . Furthermore, the base main body 61 may be a split type base that can be disassembled into upper and lower halves (on the XY plane), or may be a non-divided type base that is not divided.

[The junction between the LED module and the metal base]

Next, the detailed structure of the junction part of the LED module 10 and the metal base plate 30 in the lamp|ramp 1 which concerns on this embodiment is demonstrated using FIG. 4. FIG. 4( a ) is a cross-sectional view of the lamp according to Embodiment 1 of the present invention (a cross-sectional view cut along a plane perpendicular to the tube axis), and FIG. 4( b ) is an LED module in the lamp. An enlarged cross-sectional view of a part of the detailed structure of the junction with the metal base plate. In addition, in (a) of FIG. 4 , each component of the substrate 11 is not shown in the figure.

As shown in (a) and (b) of FIG. 4 , the metal base plate 30 and the substrate 11 are joined by a TIM material 40 . The substrate 11 in the present embodiment is a copper-based substrate, and includes: a metal substrate 11a made of a copper substrate, an insulating layer 11b made of polyimide (thermal conductivity: 0.3W/m·K), and a Metal wiring 11c made of copper wiring, and protective layer 11d as a white protective layer.

In this embodiment, the thickness dMET of the metal substrate 11a (copper substrate) is 50 μm, the thickness dINS of the insulating layer 11 b (polyimide) is 20 μm, and the thickness dLIN of the metal wiring 11 c (copper wiring) is 35 μm. The thickness dRES of the protective layer 11d (white protective layer) was 55 μm.

The thickness of the insulating layer 11 b can be 10 μm. Thus, by using polyimide as the material of the insulating layer 11b, even if the thickness dINS of the insulating layer 11b is less than or equal to the thickness dMET of the metal substrate 11a (dINS≦dMET), the insulation withstand voltage of the substrate 11 can be ensured. In addition, in this embodiment, the metal backing plate 11a and the insulating layer 11b have the same area.

The thermal resistance of the substrate 11 having the above structure (when the thickness of the insulating layer is 10 μm) is 0.7 k·m 2 /K. Accordingly, heat generated in the LED element 12 can be efficiently conducted to the metal base plate 30 through the substrate 11 .

As described above, by using polyimide as the insulating layer 11b, the overall thickness of the substrate 11 can be reduced. For example, by changing the material of the insulating layer 11b from epoxy resin to polyimide resin, the thickness of the insulating layer 11b can be changed from 80 μm to 20 μm. Since the thermal conductivity of the substrate 11 is dominated by the thermal conductivity of the insulating layer 11b, the thermal resistance of the substrate 11 can be reduced by reducing the thickness of the insulating layer 11b. Accordingly, heat generated in the LED element 12 can be efficiently dissipated to the metal base plate 30 .

Furthermore, by reducing the thickness of the insulating layer 11b, the thickness of the entire substrate 11 can be reduced. Accordingly, the substrate 11 can be configured to have flexibility itself. That is, a flexible metal-based substrate can be realized.

In this case, as shown in FIG. 5 , the lamp 1A can be constituted by using a flexible metal-based substrate 11A. 5 is a cross-sectional view of a lamp according to a modified example of Embodiment 1 of the present invention.

As shown in FIG. 5 , in the lamp 1A of this modified example, a metal base plate 30A having a triangular cross-section with a thick central portion 31A is used, and the TIM material 40 and the substrate 11A are placed along the surface shape of the metal base plate 30A. It is arranged so as to protrude and bend toward the translucent cover 20 . In this case, the LED element 12 is mounted on the inclined substrate 11A. Accordingly, it is possible to realize a lamp in which the LED elements 12 are three-dimensionally arranged. As a result, a larger light distribution angle than that of the lamp shown in FIG. 4 can be obtained.

Furthermore, when the insulating layer 11b is made of epoxy resin, since epoxy resin is a brittle material, when the substrate 11 is bent, the insulating layer 11b is also cracked, so that the insulation withstand voltage cannot be ensured. That is, in the substrate 11 using the insulating layer 11b as an epoxy resin, the substrate 11 cannot be fixed to the metal base plate 30A in a bent state as shown in FIG. 5 .

Next, a method of bonding the LED module and the metal base plate will be described with reference to FIG. 6 . Fig. 6 is a diagram for explaining a method of joining an LED module and a metal base plate in the lamp according to Embodiment 1 of the present invention.

First, the film-like TIM material 40 is adhered to the back surface of the substrate 11 of the LED module 10 . In this case, a material for adhering the TIM material 40 may be prepared in advance on the back surface of the LED module 10 (substrate 11 ). At this time, as shown in FIG. 6 , it is preferable to stick a protective film 41 on the exposed surface of the TIM material 40 .

And, prepare the LED module 10 that has the TIM material that has protective film 41 on the back and the metal base plate 30 that mounts LED module 10, as shown in Figure 6, peel protective film 41 from TIM material 40, TIM material 40 The exposed surface is attached to the mounting surface of the metal base plate 30 . Accordingly, the LED module 10 and the metal base plate 30 can be closely contacted and bonded together by the adhesive force of the TIM material 40 .

In summary, with the lamp according to Embodiment 1 of the present invention, the LED module 10 (substrate 11 ) and the metal base plate 30 are bonded together with the TIM material 40 . In this way, since the thermal resistance between the substrate 11 and the metal base plate 30 can be reduced, high heat dissipation characteristics can be obtained. Therefore, since heat generated in the LED element 12 can be efficiently dissipated, a lamp with high heat dissipation can be realized.

Moreover, since the TIM material 40 has flexibility, even if the substrate 11 and the metal bottom plate 30 are thermally expanded and deformed, the TIM material 40 will be elastically deformed along with the deformation. That is, the influence of thermal deformation of the substrate 11 and the metal base plate 30 can be overcome by the TIM material 40 . For example, it is possible to suppress warpage or the like caused by the difference in thermal expansion coefficient between the substrate 11 and the metal base plate 30 .

Moreover, in the present embodiment, since the adhesive method in which the LED module 10 (substrate 11) and the metal base plate 30 are adhered by the TIM material 40 is adopted, it is possible to make the LED module 10 and The installation operation of the metal base plate 30 becomes easy. In addition, since the LED module 10 (substrate 11 ) is bonded to the metal base plate 30 by adhesion, even if the working space is narrow, the lamp can be assembled in a narrow working space.

Moreover, in this embodiment, as the board|substrate 11 of the LED module 10, the board|substrate mainly made of the metal which made polyimide resin the insulating layer 11b was used. In this way, even if the thickness of the substrate 11 is below the conventional limit, the insulation withstand voltage can be ensured. That is, since the substrate 11 arranged between the LED element 12 and the metal base plate 30 can be thinned, heat generated in the LED element 12 can be further efficiently dissipated to the metal base plate 30 . Furthermore, by making the substrate 11 thinner, a flexible metal-based substrate can be realized, and the three-dimensional arrangement of the LED elements 12 can be easily performed. As a result, the arrangement of the LED elements 12 can be adjusted by, for example, expanding the light distribution angle, so that light distribution control can be performed.

(Embodiment 2)

Next, the lamp 1B according to Embodiment 2 of the present invention will be described using FIG. 7 . 7( a ) is a sectional view of the lamp according to Embodiment 2 of the present invention (a sectional view cut along a plane perpendicular to the tube axis), and FIG. 7( b ) is an LED module in the lamp. An enlarged cross-sectional view of a part of the detailed structure of the junction with the metal base plate. In addition, in FIG. 7, the same code|symbol is attached|subjected to the structure similar to Embodiment 1. As shown in FIG. In addition, in (a) of FIG. 7 , each component of the substrate 11 is not shown.

As shown in (a) and (b) of FIG. 7 , the lamp 1B according to this embodiment differs from the lamp 1 according to Embodiment 1 in that the metal base plate 30 has a wall portion 33 .

The wall portion 33 is a protrusion provided to protrude from the mounting portion 31 in the vertical direction (Z-axis direction) of the mounting surface, and is provided at each of both ends in the short direction of the metal base plate 30 . In addition, the wall portion 33 has a plate shape and is extended along the longitudinal direction of the metal base plate 30 . The wall part 33 in this embodiment is a part of the metal bottom plate 30 and is formed when the metal bottom plate 30 is extruded.

The substrate 11 of the LED module 10 is arranged to be sandwiched by a pair of wall portions 33 . That is, the substrate 11 is placed on the metal base plate 30 in a state where the side surface of the substrate 11 is in contact with the side surface of the wall portion 33 .

In summary, according to the lamp 1B according to this embodiment, since the wall portion 33 is provided on the metal base plate 30, the following effects can be achieved.

Generally speaking, in the adhesive method of bonding the LED module 10 and the metal base plate 30 together by adhesion (TIM material 40), if the position of the LED module 10 and the metal base plate 30 deviates, it cannot be simply re-installed. The LED module 10 is bonded to the metal base plate 30 .

In this embodiment, since the wall portion 33 is provided on the metal base plate 30, when the LED module 10 (substrate 11) is placed on the metal base plate 30, the wall portion 33 can be used as a position for the LED module 10 (substrate 11). Since the regulation part functions, the LED module 10 can be mounted on the predetermined position of the metal base plate 30 with high precision. According to this, since a positional shift does not occur between the LED module 10 and the metal base plate 30, it is possible to manufacture a lamp having uniform desired light distribution characteristics.

Furthermore, according to the present embodiment, the side surface of the substrate 11 is in contact with the wall portion 33 . That is, the substrate 11 is not only in contact with the TIM material 40 but also in contact with the metal bottom plate 30 . Accordingly, the heat generated in the LED module 10 is directly conducted to the metal base plate 30 not only through the TIM material 40 but also from the side surface of the substrate 11 through the wall portion 33 . Therefore, the heat dissipation of the LED module 10 can be further improved.

Furthermore, according to the present embodiment, the plate-shaped wall portion 33 is extended along the longitudinal direction of the metal base plate 30 . Accordingly, the shape of the upper end portion of the portion of the wall portion 33 that blocks light from the LED module 10 in the tube axis direction (X-axis direction) can be linear. According to this, the light from the LED module 10 can be blocked by the wall part 33 uniformly linearly. Therefore, it is possible to make the light emitted from the lamp 1B look more beautiful, and thus it is possible to make the lamp 1B more beautiful when it emits light. In this case, by adjusting the height of the wall portion 33, it is possible to control the light distribution characteristic (light distribution angle) of the lamp 1B.

In addition, in this embodiment, a rail groove for engaging the translucent cover 20 and the metal bottom plate 30 may also be provided. In this case, rail grooves are provided in the wall portion 33 . For example, the rail groove can be formed such that the outer side surface of the wall portion 33 becomes the bottom surface of the recess.

(Embodiment 3)

Next, the illuminating device 2 which concerns on Embodiment 3 of this invention is demonstrated using FIG. 8. FIG. Fig. 8 is an overview perspective view of a lighting device according to Embodiment 3 of the present invention.

As shown in FIG. 8 , the lighting device 2 according to the embodiment of the present invention is basic lighting, and includes a lamp 1 and a lighting fixture 100 .

The lamp 1 is a straight-tube LED lamp according to Embodiment 1, and is used as a light source for illumination of the lighting device 2 . Moreover, in this embodiment, as shown in FIG. 8, two lamps 1 are used. In addition, in this embodiment, the lamps 1A and 1B described above may not be used.

The lighting fixture 100 is electrically connected to the straight tube LED lamp 1 and includes a pair of sockets 110 holding the lamp 1 and a fixture main body 120 to which the sockets 110 are attached. The tool body 120 is formed, for example, by pressing an aluminum steel plate or the like. And the inner surface of the apparatus main body 120 becomes a reflection surface, and can reflect the light emitted from the straight tube type LED lamp 1 to a predetermined direction (for example, downward).

The lighting fixture 100 having such a configuration is attached to a ceiling or the like by a fixing fixture, for example. Furthermore, a circuit for controlling the lighting of the lamp 1 and the like may be incorporated in the lighting fixture 100 . In addition, a cover member may be provided to cover the lamp 1 .

(other)

As mentioned above, although the lamp|ramp and the illuminating device which concern on this invention were demonstrated based on embodiment, this invention is not limited by said embodiment.

For example, in the above-mentioned embodiment, although the single-side power supply mode in which only the first lamp cap 50 supplies power to all the LEDs in the frame is adopted, a double-sided power supply method in which two-way power supply can also be adopted from the lamp caps on both sides Way.

In addition, in the above-mentioned embodiment, although the fixing of the TIM material 40 and the substrate 11 is bonded and fixed by the adhesive layer formed on the TIM material 40, it is also possible not to form an adhesive layer on the TIM material 40, but by The lowermost layer of the substrate 11 is fixed by forming an adhesive layer.

In addition, in the above-mentioned embodiment, although the first base 50 employs an L-shaped base having a pair of L-shaped power supply pins 52 , a G13 base may also be used. Similarly, the second lamp base 60 can also adopt a G13 lamp base. In this way, one of the two lamp caps can also be used as a pin (1 pin), and the other side can be used as a 1-pin/2-pin lamp cap structure with two pins (2 pins). 2-pin/2-pin lamp head structure with two pins (2 pins).

In addition, in the above-mentioned embodiment, although the first base 50 is configured to receive direct current, it may also receive alternating current. Furthermore, when the first base 50 receives alternating current, the lighting circuit incorporated in the lamp 1 includes a circuit for converting the alternating current into direct current.

Moreover, in the above-mentioned embodiment, although the SMD type LED module which encapsulated the LED element 12 was used as the LED module 10, it is not limited to this. For example, a COB (Chip On Board: chip on board) type LED module may be used in which a plurality of LED chips are directly mounted on the substrate 11 and the plurality of LED chips are packaged together with a phosphor-containing resin.

In addition, in the above-mentioned embodiment, although the LED module 10 (LED element 12 ) is configured to emit white light from the blue LED chip and the yellow phosphor, it is not limited thereto. For example, a phosphor-containing resin containing a red phosphor and a green phosphor may be used to emit white light by combining it with a blue LED. Alternatively, by using an ultraviolet LED chip that emits ultraviolet light with a wavelength shorter than that of a blue LED chip, and blue phosphor particles, green phosphor particles, and red phosphor particles that are mainly excited by ultraviolet light to emit blue light, red light, and green light, Phosphor particles emit white light.

In addition, in the above-mentioned embodiment, an LED was shown as an example of a light-emitting element, but a semiconductor light-emitting element such as a semiconductor laser, an EL element such as an organic EL (ElectroLuminescence: electroluminescence) or an inorganic EL, or other solid state elements may also be used. light emitting element.

In addition, in the above-mentioned embodiment, the straight-tube LED lamp having a structure in which a part of the metal base plate 30 is exposed to the outside has been described as an example, but it is not limited thereto. For example, instead of the translucent cover 20, an elongated cylindrical translucent frame (glass tube, plastic tube, etc.) may be employed, and the metal base plate 30 is housed in the translucent frame.

In addition, in the above-mentioned embodiment, although the straight tube lamp was described as an example, it can also be applied to a bulb-shaped lamp or a spherical lamp. In this case, what is necessary is just to form the board|substrate 11 on which the LED element 12 is mounted according to the outer shape of a lamp.

In addition, embodiments obtained by implementing various modifications conceivable by those skilled in the art of each embodiment, and arbitrary combinations of constituent elements and functions in each embodiment within the range not departing from the gist of the present invention And the implementation mode that realizes is included in the utility model.

The present invention can be utilized as a lamp using light-emitting elements such as LEDs, and can be widely used as, for example, a straight-tube LED lamp and a lighting device including the straight-tube LED lamp.

Symbol Description

1, 1A, 1B lights

2 Lighting device

10 LED modules

11, 11A substrate

11a Metal lining

11b insulation layer

11c Metal wiring

11d protective layer

12 LED components

12a package

12b LED chip

12c Sealing parts

13 Electrode terminal

20 Translucent cover

30, 30A metal bottom plate

31, 31A loading part

32 heat sink

33 wall

40 TIM material

41 Protective film

50 first light head

51, 61 Lamp holder body

52 power supply pins

60 second lamp head

62 non-powered pins

100 lighting fixtures

110 socket

120 appliance body

Claims (8)

1. a lamp, is characterized in that, possesses:

Base plate;

Substrate, is configured on described base plate,

Multiple light-emitting components, are installed on described substrate;

Diffuser, covers described multiple light-emitting component, and is fixed in described base plate; And

Thermal interfacial material, engages with described substrate described base plate.

2. lamp as claimed in claim 1, is characterized in that,

Described substrate comprises: metal backing, be formed on the insulating barrier on described metal backing and be formed on the metal wiring on described insulating barrier.

3. lamp as claimed in claim 2, is characterized in that,

The resin that described insulating barrier by polyimides is forms.

4. lamp as claimed in claim 3, is characterized in that,

The thickness of described insulating barrier is, below the thickness of described metal backing.

5. the lamp as described in any one of claim 1 to 4, is characterized in that,

Described base plate has the wall portion with the side butt of described substrate.

6. the lamp as described in any one of claim 1 to 4, is characterized in that,

Described base plate is made up of metal.

7. the lamp as described in any one of claim 1 to 4, is characterized in that,

Described base plate and described diffuser form the framework of elongated tubular.

8. a lighting device, is characterized in that, possesses the lamp described in any one of claim 1 to 7.

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