CN214426890U - A differential pressure sensor - Google Patents
A differential pressure sensor Download PDFInfo
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- CN214426890U CN214426890U CN202022859091.8U CN202022859091U CN214426890U CN 214426890 U CN214426890 U CN 214426890U CN 202022859091 U CN202022859091 U CN 202022859091U CN 214426890 U CN214426890 U CN 214426890U
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- 230000001681 protective effect Effects 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 4
- 230000003750 conditioning effect Effects 0.000 abstract description 3
- 238000005259 measurement Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
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Abstract
本实用新型提供一种差压传感器，包括：相互组配的第一盖板和第二盖板，以及位于所述第一盖板和所述第二盖板之间的差压传感器主体部；其中，所述差压传感器主体部包括：基板，所述基板设置有容纳腔以及与所述容纳腔相连通的第三进压孔及第四进压孔；压力敏感芯片，所述压力敏感芯片位于所述容纳腔内，所述压力敏感芯片将所述容纳腔间隔为高压腔、低压腔；以及，所述高压腔与所述第三进压孔相连通，所述低压腔与所述第四进压孔相连通。本实用新型的差压传感器，体积小巧、结构简单，安装方便，便于用户信号调理并且极大的降低了成本。
The utility model provides a differential pressure sensor, comprising: a first cover plate and a second cover plate assembled with each other, and a differential pressure sensor main body part located between the first cover plate and the second cover plate; Wherein, the main body of the differential pressure sensor includes: a base plate, the base plate is provided with a accommodating cavity, a third pressure inlet hole and a fourth pressure inlet hole communicated with the accommodating cavity; a pressure sensitive chip, the pressure sensitive chip Located in the accommodating cavity, the pressure-sensitive chip divides the accommodating cavity into a high-pressure cavity and a low-pressure cavity; and the high-pressure cavity is communicated with the third pressure inlet hole, and the low-pressure cavity and the The four inlet pressure holes are connected. The differential pressure sensor of the utility model has the advantages of small size, simple structure, convenient installation, convenient signal conditioning for users and greatly reduced cost.
Description
Technical Field
The utility model belongs to the technical field of the sensor, concretely relates to differential pressure sensor.
Background
A differential pressure sensor is a sensor used to measure the pressure difference between two media or two pressure fields. The differential pressure sensor is widely applied to the fields of medical instruments, heating ventilation air conditioners, pneumatic control and the like.
An existing differential pressure sensor generally includes a housing having a first cavity connection port and a second cavity connection port, and an elastic diaphragm is disposed in the housing, and the elastic diaphragm divides an inner cavity of the housing into a first cavity and a second cavity. The mode has the advantages of complex structure, low production efficiency, low measurement precision and higher cost.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least, provide a differential pressure sensor.
The utility model discloses an aspect provides a differential pressure sensor, include:
the differential pressure sensor comprises a first cover plate, a second cover plate and a differential pressure sensor main body part, wherein the first cover plate and the second cover plate are assembled with each other;
wherein the differential pressure sensor main body portion includes:
the base plate is provided with an accommodating cavity, and a third pressure inlet hole and a fourth pressure inlet hole which are communicated with the accommodating cavity;
the pressure sensitive chip is positioned in the accommodating cavity, and the accommodating cavity is divided into a high-pressure cavity and a low-pressure cavity by the pressure sensitive chip; and the number of the first and second groups,
the high-pressure cavity is communicated with the third pressure inlet hole, and the low-pressure cavity is communicated with the fourth pressure inlet hole.
Optionally, the first cover plate includes a first pressure guiding pipe communicated with the outside, a first chamber communicated with the differential pressure sensor main body portion, and a first pressure inlet hole connecting the first pressure guiding pipe and the first chamber; and/or the second cover plate comprises a second pressure guiding pipe communicated with the outside, a second chamber communicated with the main body part of the differential pressure sensor, and a second pressure inlet hole connected with the second pressure guiding pipe and the second chamber.
Optionally, the first chamber is in communication with the low pressure chamber.
Optionally, the second chamber is in communication with the high pressure chamber.
Optionally, a protective cover is further included to cover over the receiving cavity.
Optionally, the fourth pressure inlet hole is arranged on the protective cover.
Optionally, the pressure sensitive chip is a piezoresistive pressure sensitive chip; or, the pressure sensitive chip adopts an MEMS resistance pressure sensor.
Optionally, the pressure-sensitive chip further comprises a waterproof breathable film, and the waterproof breathable film covers the surface of the pressure-sensitive chip.
Optionally, the first cover plate and the second cover plate are symmetrically arranged.
Optionally, the first cover plate and the second cover plate are hermetically connected with the base plate.
The utility model discloses a differential pressure sensor can utilize first pressure pipe and second to draw and press the pipe and introduce the pressure that awaits measuring respectively to low pressure chamber and high-pressure intracavity to obtain differential pressure signal via the measurement of forced induction layer, thereby realize the measurement of pressure differential value. The differential pressure sensor of this embodiment, first apron is the same completely with second apron structure, has saved the die sinking cost greatly. The pressure difference value can be measured by utilizing one pressure sensitive chip, and the pressure sensor has the advantages of small volume, simple structure, convenience in installation and convenience in signal amplification and conditioning design.
Drawings
Fig. 1 is a schematic structural diagram of a differential pressure sensor according to an embodiment of the present invention.
Fig. 2 is a schematic structural view of a main body portion of the differential pressure sensor in fig. 1.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, the overall structure of the differential pressure sensor according to the present embodiment is schematically shown.
The differential pressure sensor includes a first cover plate 1 and a second cover plate 3 assembled with each other, and a differential pressure sensor main body portion 2 located between the first cover plate 1 and the second cover plate 3.
The first cover plate 1 comprises a first pressure guiding pipe 11 communicated with the outside, a first chamber 13 communicated with the differential pressure sensor main body part 2 and a first pressure inlet hole 12 for connecting the first pressure guiding pipe 11 and the first chamber 13;
correspondingly, the second cover plate 3 includes a second pressure introduction pipe 31 communicating with the outside, a second chamber 33 communicating with the differential pressure sensor main body portion 2, and a second pressure inlet hole 32 connecting the second pressure introduction pipe 31 and the second chamber 33. Specifically, the differential pressure sensor main body 2 has a structure as shown in fig. 2, and the differential pressure sensor main body 2 includes a substrate 21 and a pressure sensitive chip 22. The base plate 21 is provided with an accommodating cavity 211 and a third pressure inlet hole 212 communicated with the accommodating cavity 211. The pressure sensitive chip 22 is located in the containing cavity 211, and the pressure sensitive chip 22 divides the containing cavity 211 into a high pressure cavity 221 and a low pressure cavity 222. The high pressure chamber 221 is communicated with the third pressure inlet hole 212, and further comprises a protective cover 23 covering the upper portion of the accommodating chamber 211, a fourth pressure inlet hole 231 communicated with the first chamber 13 is arranged on the protective cover 23, and the low pressure chamber 222 is communicated with the accommodating chamber 211 and the fourth pressure inlet hole 231.
Specifically, as shown in fig. 1, when the differential pressure sensor of the present embodiment is used for measurement, the pressure to be measured may be introduced through the first pressure introduction pipe 11 and the second pressure introduction pipe 31, respectively, and then may be transferred to the first chamber 13 and the second chamber 33 through the first pressure inlet hole 12 and the second pressure inlet hole 32, respectively. As shown in fig. 2, the pressure difference is respectively transmitted to the high pressure chamber 221 and the low pressure chamber 222 of the pressure sensing layer through the third pressure inlet hole 212 and the fourth pressure inlet hole 231, the pressure sensing layer generates an electrical signal according to the pressure difference in the high pressure chamber 221 and the low pressure chamber 222, and the electrical signal is led out through a signal connection terminal (not shown), so that the measurement of the pressure difference is realized.
The differential pressure sensor of this embodiment utilizes first pressure hole and second pressure hole to advance to introduce the pressure that awaits measuring respectively in high-pressure chamber and the low pressure chamber to obtain differential pressure signal through the measurement of pressure-sensitive layer, thereby realize the measurement of pressure difference. The differential pressure sensor of the embodiment has the advantages of small size, simple structure, convenience in installation, convenience in signal conditioning of a user and great reduction in cost.
Illustratively, as shown in fig. 2, the pressure sensitive chip 22 corresponds to the first pressure inlet 212, that is, as shown in fig. 2, the pressure sensitive chip 22 is disposed near the third pressure inlet 212, that is, as shown in fig. 2, the pressure sensitive chip 22 is disposed above the third pressure inlet 212. Of course, besides this, those skilled in the art can adjust the setting according to actual needs, and the present embodiment does not limit this.
For example, as shown in fig. 2, in order to further improve the differential pressure measurement accuracy, the high pressure chamber 221 directly communicates with the third pressure inlet hole 212, that is, the high pressure chamber 221 may be attached to the third pressure inlet hole 212. The low pressure chamber 222 communicates with the fourth pressure inlet 231 through the receiving chamber 211.
Illustratively, as shown in fig. 2, the pressure sensitive chip 22 is adhesively fixed in the accommodating cavity 211, so that the high pressure cavity 221 is in sealed communication with the third pressure inlet hole 212.
For example, the pressure sensitive chip 22 may be a piezoresistive pressure sensitive chip, for example, a MEMS resistance pressure sensor, etc., and besides, a person skilled in the art may select other pressure sensitive chips according to actual needs, which is not limited in this embodiment.
For example, in order to make the pressure sensitive chip waterproof, a waterproof breathable film or other waterproof measures can be covered on the surface of the pressure sensing layer. The specific type of the waterproof breathable film is not limited, and can be selected by the person skilled in the art according to the actual needs.
Illustratively, as shown in fig. 2, the accommodating cavity 211 includes a first bottom wall 211a, and a first side wall 211b and a second side wall 211c extending from both ends of the first bottom wall 211a in a direction away from the first pressure leading pipe 212. Wherein the second sidewall 211c is disposed opposite to the first sidewall 211 b. The structural arrangement of the accommodating cavity 211 can ensure the accuracy of pressure transmission and is convenient for installation. As shown in fig. 2, the pressure sensitive chip 22 is closely attached to the first bottom wall 211a, and a gap exists between the pressure sensitive chip 22 and the first side wall 211b and the second side wall 211 c.
The utility model discloses a differential pressure sensor can realize the accurate measurement to pressure differential value to simple structure, simple to operate, manufacturing cost are lower, are applicable to multiple fields such as pneumatic control, industrial monitoring, medical instrument and equipment.
Before use, the differential pressure sensor is mounted as follows: as shown in fig. 1, the second cover plate 3 is first attached to the lower side of the differential pressure sensor base plate 21. Next, as shown in fig. 2, the pressure sensitive chip 22 is mounted in the accommodating cavity 211, then the connection of the electrical signal is performed, then the surface of the pressure sensitive chip 22 is covered with a waterproof breathable film (not shown), and then the protective cover 23 is mounted. As shown in fig. 1 again, the first cover plate 1 is finally installed.
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A differential pressure sensor, comprising:
the differential pressure sensor comprises a first cover plate, a second cover plate and a differential pressure sensor main body part, wherein the first cover plate and the second cover plate are assembled with each other;
wherein the differential pressure sensor main body portion includes:
the base plate is provided with an accommodating cavity, and a third pressure inlet hole and a fourth pressure inlet hole which are communicated with the accommodating cavity;
the pressure sensitive chip is positioned in the accommodating cavity, and the accommodating cavity is divided into a high-pressure cavity and a low-pressure cavity by the pressure sensitive chip; and the number of the first and second groups,
the high-pressure cavity is communicated with the third pressure inlet hole, and the low-pressure cavity is communicated with the fourth pressure inlet hole.
2. The differential pressure sensor according to claim 1, wherein the first cover plate comprises a first pressure introduction pipe communicating with the outside, a first chamber communicating with the differential pressure sensor main body portion, and a first pressure inlet hole connecting the first pressure introduction pipe and the first chamber; and/or the second cover plate comprises a second pressure guiding pipe communicated with the outside, a second chamber communicated with the main body part of the differential pressure sensor, and a second pressure inlet hole connected with the second pressure guiding pipe and the second chamber.
3. The differential pressure sensor of claim 2, wherein the first chamber is in communication with the low pressure chamber.
4. The differential pressure sensor of claim 2, wherein the second chamber is in communication with the high pressure chamber.
5. The differential pressure sensor of claim 1, further comprising a protective cover overlying the receiving cavity.
6. The differential pressure sensor of claim 5, wherein the fourth pressure inlet hole is provided on the protective cover.
7. The differential pressure sensor according to any one of claims 1 to 6, wherein the pressure sensitive chip is a piezoresistive pressure sensitive chip; or, the pressure sensitive chip adopts an MEMS resistance pressure sensor.
8. The differential pressure sensor according to any one of claims 1 to 6, further comprising a waterproof gas permeable membrane covering a surface of the pressure sensitive die.
9. The differential pressure sensor according to any one of claims 1 to 6, wherein the first cover plate and the second cover plate are symmetrically disposed.
10. The differential pressure sensor of any of claims 1-6, wherein the first cover plate, the second cover plate are sealingly connected to the base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022859091.8U CN214426890U (en) | 2020-12-02 | 2020-12-02 | A differential pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022859091.8U CN214426890U (en) | 2020-12-02 | 2020-12-02 | A differential pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214426890U true CN214426890U (en) | 2021-10-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022859091.8U Active CN214426890U (en) | 2020-12-02 | 2020-12-02 | A differential pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214426890U (en) |
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2020
- 2020-12-02 CN CN202022859091.8U patent/CN214426890U/en active Active
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Address after: No. 100-17 Dicui Road, Liyuan Development Zone, Wuxi City, Jiangsu Province, 214000 Patentee after: WUXI SENCOCH SEMICONDUCTOR Co.,Ltd. Address before: 214000 north side of 3 / F podium, building A10, No. 777, Jianshe West Road, Binhu District, Wuxi City, Jiangsu Province Patentee before: WUXI SENCOCH SEMICONDUCTOR Co.,Ltd. |
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| CP03 | Change of name, title or address |
Address after: No. 100-17 Dicui Road, Liyuan Development Zone, Wuxi City, Jiangsu Province, 214000 Patentee after: Wuxi Xingan Intelligent Technology Co.,Ltd. Country or region after: China Address before: No. 100-17 Dicui Road, Liyuan Development Zone, Wuxi City, Jiangsu Province, 214000 Patentee before: WUXI SENCOCH SEMICONDUCTOR Co.,Ltd. Country or region before: China |