CN214625013U

CN214625013U - Laser chip sintering clamp

Info

Publication number: CN214625013U
Application number: CN202120057973.4U
Authority: CN
Inventors: 费华; 卢昆忠
Original assignee: Wuhan Raycus Fiber Laser Technologies Co Ltd
Current assignee: Wuhan Raycus Fiber Laser Technologies Co Ltd
Priority date: 2021-01-11
Filing date: 2021-01-11
Publication date: 2021-11-05
Anticipated expiration: 2031-01-11

Abstract

The utility model relates to a laser chip sintering technical field provides a laser chip sintering anchor clamps, including base, stopper, preforming support and preforming, be equipped with the constant head tank on the base, treat that the sintering ladder is fixed a position in the constant head tank, the stopper be used for through the setting element with the ladder is fixed a position the connection to be used for the restriction place in treat sintering COS chip's on the ladder that the ladder is heat sink horizontal and longitudinal displacement, the preforming support be equipped with each the corresponding locating hole of step, the through-hole has been seted up to the stopper, the preforming can pass under the action of gravity in proper order the locating hole with the through-hole is pressed and is located the COS chip. The utility model provides a laser chip sintering anchor clamps can avoid influencing the light path of COS chip because COS chip off normal, has improved the product quality of laser chip, has improved the finished product yield.

Description

Laser chip sintering clamp

Technical Field

The utility model relates to a laser chip sintering technical field especially relates to a laser chip sintering anchor clamps.

Background

The semiconductor laser is more and more widely applied in the fields of communication, military, medical treatment and the like. The semiconductor laser provides a light source foundation for direct semiconductor laser equipment and high-performance and high-power optical fiber lasers. With the development of semiconductor material epitaxy technology, semiconductor laser waveguide structure optimization technology, semiconductor cavity surface passivation technology, high-stability packaging technology and the like, and under the promotion of direct semiconductor laser industrial application and processing and pumping requirements of high-power optical fiber lasers, high-power and high-beam-quality semiconductor lasers are developed rapidly.

In order to obtain high power output, reduce the sintering difficulty of chips and achieve good heat dissipation requirements, currently, a single chip is independently packaged into a COS chip (COS refers to a chip on submount, which is a laser packaged on a submount), and then a plurality of COS chips are connected in series or in parallel and sintered on a heat sink to form a high power module, or a plurality of high power modules are electrically connected in series again to meet the higher power requirements of a semiconductor laser.

For a laser module with output power of tens of watts or even hundreds of watts, several or even dozens of COS chips are generally required to be assembled, and higher requirements are put on sintering quality. If a sintering cavity appears when the COS chip is sintered, the heat dissipation of the chip can be influenced, and the reliability of the laser is reduced. In order to avoid sintering voids, a certain pressure needs to be applied during sintering. At present, the common method is to put solder on a heat sink, put a COS chip on the solder, apply a certain pressure to the COS chip by using a gravity block, and then sinter the COS chip. Before sintering, the positions of the heat sink, the solder and the COS chips are not fixed, and especially when the number of the chips is large, the COS chips are difficult to avoid position deviation in the operation process, so that light paths of the chips are interfered, and the product quality of the laser is seriously influenced.

SUMMERY OF THE UTILITY MODEL

The utility model provides a laser chip sintering anchor clamps for when solving among the prior art a plurality of COS chips sintering on heat sink, easily take place COS chip offset, the light path that leads to a plurality of chips takes place to interfere, influences product quality's problem.

The utility model provides a laser chip sintering anchor clamps, including base, stopper, preforming support and preforming, the base is equipped with the constant head tank, treats sintering ladder heat sink location in the constant head tank, the stopper be used for through the setting element with ladder heat sink location is connected, and be used for the restriction place in treat sintering COS chip's horizontal and longitudinal displacement on the ladder heat sink step of ladder, the preforming support be equipped with each the corresponding locating hole of step, the through-hole has been seted up to the stopper, the preforming can pass in proper order under the action of gravity the locating hole with the through-hole is pressed and is located the COS chip.

According to the utility model provides a pair of laser chip sintering jig, the lateral wall of through-hole corresponds to each the step is equipped with horizontal spacing portion and vertical spacing portion, horizontal spacing portion rather than corresponding the vertical side of step contacts, vertical spacing portion rather than corresponding the horizontal side of step contacts, horizontal spacing portion with vertical spacing portion all is higher than its correspondence the upper surface of step.

According to the utility model provides a pair of laser chip sintering jig, horizontal spacing portion and/or vertical spacing portion with be equipped with spacing boss on the face that the step contacted, the COS chip spacing in the upper surface of step with between the side of spacing boss.

According to the utility model provides a pair of laser chip sintering anchor clamps, the setting element is the dowel, the stopper is equipped with a plurality of cotter holes, and is a plurality of the cotter hole with a plurality of locating hole one-to-ones on the ladder is heat sink, the dowel is inserted and is located the cotter hole with the locating hole.

According to the utility model provides a pair of laser chip sintering anchor clamps, the base is the graphite material.

According to the utility model provides a pair of laser chip sintering fixture still includes the locating piece, the locating piece is positioned the constant head tank, the locating piece is equipped with the locating hole, the ladder is heat sink to be positioned in the locating hole.

According to the utility model provides a pair of laser chip sintering fixture, the preforming is rectangular shape sheet structure, the preforming is from being close to the one end that the ladder was heat sink is to keeping away from the width crescent of the one end that the ladder was heat sink.

According to the utility model provides a pair of laser chip sintering anchor clamps, the preforming support includes first support, first support demountable installation in the base, first support is located to the locating hole.

According to the utility model provides a pair of laser chip sintering anchor clamps still includes the second support, the second support mounting in first support, the locating hole runs through first support and second support.

According to the utility model provides a pair of laser chip sintering anchor clamps still includes the third support, two third support parallel arrangement is a plurality of first support spanes install in two the third support, the quantity of constant head tank is a plurality of, each the constant head tank is used for fixing a position one the ladder is heat sink, first support with the constant head tank one-to-one sets up.

The utility model provides a laser instrument chip sintering anchor clamps, through setting up stopper 2, and utilize the stopper in advance to limit the COS chip on the step that the ladder was heat sink, exert pressure for the COS chip in the sintering process through the preforming again, can prevent that the COS chip from taking place the off normal in the operation process, also can prevent that the sintering in-process leads to the COS chip to take place the off normal because the mobility of solder, thereby avoid influencing the light path of COS chip because COS chip off normal, the product quality of laser instrument chip has been improved, the finished product yield has been improved.

Drawings

In order to more clearly illustrate the technical solutions of the present invention or the prior art, the following briefly introduces the drawings required for the embodiments or the prior art descriptions, and obviously, the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a laser chip sintering fixture provided by the present invention;

fig. 2 is a side view of a laser chip sintering fixture provided by the present invention;

FIG. 3 is a front view of a partial structure of a sintering fixture for laser chips according to the present invention;

fig. 4 is a schematic structural diagram of a part of a sintering fixture for a laser chip provided by the present invention;

fig. 5 is a schematic view of an installation structure of a stopper and a stepped heat sink of the laser chip sintering fixture provided by the present invention;

fig. 6 is a schematic structural diagram of a limiting block in the laser chip sintering fixture provided by the present invention;

FIG. 7 is an enlarged view of a portion of the sintering fixture for laser chips shown in FIG. 6 at A;

reference numerals:

1. a base; 11. Positioning a groove; 2. A limiting block;

21. a through hole; 22. A transverse limiting part; 23. A longitudinal position-limiting part;

24. a limiting boss; 25. A pin hole; 3. Tabletting;

41. a stepped heat sink; 42. COS chips; 5. A positioning member;

6. positioning holes; 7. Positioning blocks; 71. Positioning holes;

81. a first bracket; 82. A second bracket; 83. And a third bracket.

Detailed Description

To make the objects, technical solutions and advantages of the present invention clearer, the drawings of the present invention are combined to clearly and completely describe the technical solutions of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the embodiments of the present invention, it should be noted that the terms "first" and "second" are used for clearly indicating the numbering of the product parts and do not represent any substantial difference unless explicitly stated or limited otherwise. The specific meaning of the above terms in the embodiments of the present invention can be understood by those skilled in the art according to specific situations.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may for example be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The utility model provides a laser chip sintering anchor clamps, as shown in fig. 1 the utility model provides a laser chip sintering anchor clamps's schematic structure drawing, as shown in fig. 2 do the utility model provides a laser chip sintering anchor clamps's side view, as shown in fig. 3 do the utility model provides a laser chip sintering anchor clamps's partial structure elevation view. The laser chip sintering clamp comprises a base 1, a limiting block 2, a pressing sheet support and a pressing sheet 3, wherein the base 1 is provided with a positioning groove 11. As shown in fig. 4, the laser chip sintering fixture according to the present invention has a schematic partial structure, and the stepped heat sink 41 to be sintered is positioned in the positioning groove 11. The stopper 2 is used for being connected with the ladder heat sink 41 through the setting element 5 to the horizontal and longitudinal displacement of the COS chip 42 of treating sintering of restriction placing on the step of ladder heat sink 41, as shown in fig. 5 be the utility model provides a stopper and the heat sink's of ladder mounting structure schematic diagram of laser chip sintering anchor clamps. The wafer support is provided with positioning holes 6 corresponding to each step of the stepped heat sink 41. The limiting block 2 is provided with a through hole 21, and the pressing sheet 3 can sequentially penetrate through the positioning hole 6 and the through hole 21 under the action of gravity and is pressed on the COS chip 42.

Specifically, the space of the side edge of the bar of the pressing sheet 3, the positioning hole 6 and the COS chip 42 corresponds to each other in the vertical direction, so that the pressing sheet 3 can be naturally pressed on the COS chip 42 under the action of gravity. Wherein, two pressing sheets 3 can be adopted to respectively press the two sides of the bar of the same COS chip; or each pressing sheet 3 is provided with two pressing heads which respectively press the two sides of the bar of the same COS chip. The lateral displacement of the COS chip 42 is a displacement in the width direction thereof, the longitudinal displacement of the COS chip 42 is a displacement in the length direction thereof, and the bars are arranged along the length direction of the COS chip 42.

When in use, firstly, solder is placed on the upper surface of the step of the stepped heat sink 41, the COS chips 42 are placed on the solder on the corresponding step, and then the positioning piece 5 is used for positioning and connecting the positioning piece 2 and the stepped heat sink 41, so that the positioning piece 2 is used for limiting the horizontal and vertical positions of the COS chips 42 on each step, and the chips and the solder are prevented from moving horizontally and vertically before sintering and in the sintering process; then, the stepped heat sink 41 and the stopper 2 are positioned in the positioning groove 11 as a whole; finally, the pressing sheet 3 is inserted into the positioning hole 6 and the through hole 21 one by one, so that the lower end of the pressing sheet 3 is pressed on the COS chip 42. After sintering is completed and cooling is performed, each pressed sheet 3 is taken out, and then the limiting block 2 is detached from the stepped heat sink 41, so that the whole sintering process is completed.

The embodiment of the utility model provides a laser chip sintering clamp, through setting up stopper 2, and utilize the stopper in advance to limit the COS chip on the step that the ladder was heat sink, exert pressure for the COS chip in the sintering process through the preforming again, can prevent that the COS chip from taking place the off normal in the operation process, also can prevent that the sintering process from leading to the COS chip to take place the off normal because the mobility of solder, thereby avoid influencing the light path of COS chip because COS chip off normal, the product quality of laser chip has been improved, the finished product yield has been improved.

In the embodiment of the present invention, the lateral wall of the through hole 21 is provided with the horizontal limiting portion 22 and the vertical limiting portion 23 corresponding to each step of the stepped heat sink 41. As shown in fig. 6, the utility model provides a structure schematic diagram of stopper in laser chip sintering clamp, the vertical side of horizontal spacing portion 22 rather than the step that corresponds contacts, and the horizontal side of vertical spacing portion 23 rather than the step that corresponds contacts. The lateral stopper portion 22 and the longitudinal stopper portion 23 are each higher than the upper surface of the step corresponding thereto. The shape and size of the upper surface of the step are the same as those of the COS chip 42, the plurality of steps of the stepped heat sink 41 are arranged in the width direction of the COS chip 42, the longitudinal side surfaces of the steps are the side surfaces thereof parallel to the length direction of the COS chip 42, and the lateral side surfaces of the steps are the side surfaces thereof parallel to the width direction of the COS chip 42.

Specifically, the lateral position-limiting portion 22 includes a first position-limiting column formed by extending from a side wall of the through hole 21 along the length direction of the COS chip 42, a side surface of the first position-limiting column contacts with a longitudinal side surface of a corresponding step, and the first position-limiting column is higher than an upper surface of the step in the vertical direction, so that when the COS chip 42 is placed on the step, a position limitation is formed in the width direction of the COS chip 42. The horizontal limiting part 22 further comprises a second limiting column formed by extending from the side wall of the through hole 21 along the width direction of the COS chip 42, the end face of the second limiting column is in contact with the longitudinal side face of the step at the outermost edge, and the second limiting column is higher than the upper surface of the step in the vertical direction, so that limiting in the width direction of the COS chip 42 placed on the step at the outermost edge is achieved. The COS chip 42 on the highest step is completely confined between the first and second confinement posts in its width direction; the COS chip 42 on the lowest step is completely confined between the second confinement column and the longitudinal side of the adjacent step in its width direction; the COS chips 42 on the other steps are completely confined between the first confinement column and the longitudinal sides of the adjacent steps in the width direction thereof. Wherein, the two opposite side walls of the two through holes 21 can be symmetrically provided with first limiting columns. The second position-limiting pillars on the same side may be symmetrically disposed with respect to the center line of the COS chip 42.

The longitudinal position-limiting portion 23 includes a third position-limiting column formed by extending from the side wall of the through hole 21 along the length direction of the COS chip 42, the end surface of the third position-limiting column contacts with the lateral side surface of the corresponding step and the third position-limiting column is higher than the upper surface of the step in the vertical direction, so that when the COS chip 42 is placed on the step, the position limitation on the length direction of the COS chip 42 is formed. The two opposite side walls of the through hole 21 in the length direction of the COS chip 42 may be symmetrically provided with third position-limiting pillars, so that the COS chip 42 is completely positioned between the two opposite third position-limiting pillars in the length direction. The third limiting columns on the same side may be symmetrically disposed with respect to the center line of the COS chip 42.

The embodiment of the utility model provides a laser chip sintering anchor clamps sets up spacing portion through the lateral wall at through-hole 21 and carries on spacingly to COS chip 42, can reserve certain space between the lateral wall of through-hole 21 and COS chip 42, is favorable to the heat dissipation in the sintering process to prevent that stopper 2 and solder from taking place to bond.

Further, a limiting boss 24 is arranged on the contact surface of the transverse limiting part and/or the longitudinal limiting part and the step, and the COS chip 42 is limited between the upper surface of the step and the side surface of the limiting boss 24. Specifically, the limiting boss 24 is convexly arranged on the surface of the horizontal limiting part or the vertical limiting part, which is contacted with the step, and the limiting boss 24 is positioned above the COS chip 42, so that the upper limit of the COS chip in the thickness direction is positioned between the upper surface of the step and the side surface of the limiting boss 24, which is close to the COS chip 42, thereby realizing the limitation of the COS chip 42 in a three-dimensional space. As shown in fig. 7, which is a partial enlarged view of a portion a of the laser chip sintering jig in fig. 6, a limiting boss 24 on a first limiting column extending along the length direction of the COS chip 42, a second limiting column extending along the width direction of the COS chip 42, and a third limiting column extending along the length direction of the COS chip 42 may be provided with corresponding limiting bosses.

The embodiment of the utility model provides an in, setting element 5 is the dowel, and stopper 2 is equipped with a plurality of cotter holes 25, a plurality of dowel holes 25 and the heat sink 41 a plurality of locating holes one-to-one of ladder, and the dowel inserts and locates dowel hole 25 and locating hole. The step heat sink 41 and the limiting block 2 can be assembled and positioned more accurately and quickly through the plurality of positioning pins 5.

In the embodiment of the present invention, the base 1 is made of graphite. The graphite material has better heat dispersion and heat conductivility, and ladder heat sink 41 laminates with the face of base 1 when being positioned in constant head tank 11, makes direction base 1 that the heat that produces can be better dispel the heat in the sintering process, is favorable to improving sintering quality.

As shown in fig. 1-4, the embodiment of the present invention provides a laser chip sintering fixture, which further includes a positioning block 7, wherein the positioning block 7 is positioned in the positioning groove 11, the positioning block 7 is provided with a positioning hole 71, and the stepped heat sink 41 is positioned in the positioning hole 71. When the stepped heat sink 41 is positioned in the positioning hole 71, the bottom surface of the stepped heat sink 41 is in contact with the bottom of the positioning groove 11, so that the heat of the stepped heat sink 41 can be in direct contact with the graphite base 1 with high thermal conductivity, and a high-efficiency heat dissipation effect is achieved. By replacing the positioning blocks 7 with different sizes of the positioning holes 71, the base 1 with the same size can be adaptive to sintering of the stepped heat sinks 41 with different specifications and sizes, and the universality of the base 1 is improved.

The embodiment of the utility model provides an in, preforming 3 is rectangular shape sheet structure, and preforming 3 reduces to the width that is close to the one end of ladder heat sink 41 from the one end of keeping away from ladder heat sink 41 gradually. The width of one end of the pressing sheet 3 close to the stepped heat sink 41 is equivalent to the length of the COS chip 42. The pressing sheet 3 with the sheet structure is beneficial to avoiding the bars on the COS chip 42. By providing the pressing sheet 3 having a width gradually increasing, the weight of the pressing sheet 3 can be increased with a constant thickness of the pressing sheet 3. Further, the pressing sheet 3 is of a bilateral symmetry structure, so that the center of gravity of the pressing sheet 3 is stable, and stable pressure can be applied to the COS chip 42.

The embodiment of the utility model provides an in, the preforming support includes first support 81, and first support 81 demountable installation is in base 1, and first support 81 is located to locating hole 6. Specifically, the first bracket 81 is detachably mounted on the base 1 by a bolt, and spans over the through hole 21 of the stopper 2. The pressing sheet 3 is pressed on the COS chip 42 after passing through the positioning hole 6 and the through hole 21 of the first bracket 81. The positioning hole 6 can be a through hole with a certain length in the vertical direction, so that the pressing sheet 3 can be positioned on the vertical surface and cannot shake.

Further, as shown in fig. 1 to 4, the positioning device further includes a second bracket 82, the second bracket 82 is mounted on the first bracket 81, and the positioning hole 6 penetrates through the first bracket 81 and the second bracket 82. Specifically, the second bracket 82 is detachably mounted above the first bracket 81 through a bolt, the first bracket 81 and the second bracket 82 are both constructed in a gantry structure, and the positioning hole 6 penetrates through the first bracket 81 and the second bracket 82, so that the pressing sheet 3 is positioned by the first bracket 81 and the second bracket 82 at two different heights in the vertical direction, and the whole weight of the pressing sheet bracket can be reduced. Of course, the first bracket 81 and the second bracket 82 may be formed integrally.

Further, as shown in fig. 1 to 4, the heat sink further includes a third bracket 83, two third brackets 83 are arranged in parallel, the plurality of first brackets 81 are installed across the two third brackets 83, the number of the positioning grooves 11 is plural, each positioning groove 11 is used for positioning one stepped heat sink 41 to be sintered, and the first brackets 81 and the positioning grooves 11 are arranged in a one-to-one correspondence manner. The third bracket 83 is detachably mounted on the base 1 by a bolt, and the first bracket 81 is detachably mounted on the third bracket 83 by a bolt. The embodiment of the utility model provides an in, can set up a plurality of constant head tanks 11 according to base 1's size, each constant head tank 11 is used for fixing a ladder heat sink 41, makes a base 1 can fix a position a plurality of ladder heat sinks 41 simultaneously. Through setting up two third supports 83, according to the quantity of constant head tank 11, set up a plurality of first supports 81 on two third supports 83 to make a plurality of first supports 81 and a plurality of constant head tank 11 one-to-one, thereby can realize the sintering to a plurality of lasers with same anchor clamps simultaneously, improved sintering efficiency.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. The laser chip sintering clamp is characterized by comprising a base, a limiting block, a pressing sheet support and a pressing sheet, wherein the base is provided with a positioning groove, a step heat sink to be sintered is positioned in the positioning groove, the limiting block is used for being in positioning connection with the step heat sink through a positioning piece and limiting the transverse and longitudinal displacement of a COS chip to be sintered, which is placed on a step of the step heat sink, the pressing sheet support is provided with a positioning hole corresponding to each step, the limiting block is provided with a through hole, and the pressing sheet can sequentially penetrate through the positioning holes and the through hole under the action of gravity and is pressed on the COS chip.

2. The laser chip sintering jig according to claim 1, wherein the side wall of the through hole is provided with a lateral limiting portion and a longitudinal limiting portion corresponding to each step, the lateral limiting portion is in contact with a longitudinal side of the step corresponding thereto, the longitudinal limiting portion is in contact with a lateral side of the step corresponding thereto, and both the lateral limiting portion and the longitudinal limiting portion are higher than an upper surface of the step corresponding thereto.

3. The laser chip sintering jig as claimed in claim 2, wherein a limiting boss is provided on a surface of the transverse limiting portion and/or the longitudinal limiting portion contacting the step, and the COS chip is limited between an upper surface of the step and a side surface of the limiting boss.

4. The laser chip sintering jig of claim 1, wherein the positioning member is a positioning pin, the limiting block is provided with a plurality of pin holes, the plurality of pin holes correspond to the plurality of positioning holes on the stepped heat sink one by one, and the positioning pin is inserted into the pin holes and the positioning holes.

5. The laser chip sintering fixture of claim 1, wherein the base is graphite.

6. The laser chip sintering fixture of claim 1, further comprising a positioning block positioned in the positioning slot, the positioning block being provided with a positioning hole, the stepped heat sink being positioned in the positioning hole.

7. The laser chip sintering jig of claim 1, wherein the pressing sheet is an elongated sheet-shaped structure, and the width of the pressing sheet gradually increases from an end close to the stepped heat sink to an end far away from the stepped heat sink.

8. The clamp for sintering the laser chip as claimed in any one of claims 1 to 7, wherein the pressing sheet support comprises a first support, the first support is detachably mounted on the base, and the positioning hole is formed in the first support.

9. The laser chip sintering jig of claim 8, further comprising a second bracket mounted to the first bracket, the positioning hole extending through the first and second brackets.

10. The laser chip sintering jig of claim 8, further comprising a third support, two of the third supports are arranged in parallel, a plurality of the first supports are mounted across the two third supports, the number of the positioning grooves is multiple, each positioning groove is used for positioning one stepped heat sink, and the first supports and the positioning grooves are arranged in a one-to-one correspondence.