CN215683035U - heat sink - Google Patents
heat sink Download PDFInfo
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- CN215683035U CN215683035U CN202121538496.XU CN202121538496U CN215683035U CN 215683035 U CN215683035 U CN 215683035U CN 202121538496 U CN202121538496 U CN 202121538496U CN 215683035 U CN215683035 U CN 215683035U
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- heat dissipation
- pipeline
- dissipation device
- container
- working fluid
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- 239000012530 fluid Substances 0.000 claims abstract description 99
- 230000017525 heat dissipation Effects 0.000 claims description 112
- 230000002093 peripheral effect Effects 0.000 claims description 37
- 238000004891 communication Methods 0.000 claims description 16
- 238000012546 transfer Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- -1 acryl Chemical group 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a heat sink, comprising: a conductive container, a first pipeline, a second pipeline and a pump. The conductive container is used for containing working fluid. The first pipeline is communicated with the conduction container, and working fluid flows through the first pipeline. The second pipeline is arranged in the first pipeline, and working fluid flows through the second pipeline. The pump is communicated with the second pipeline and is used for circulating the working fluid in the conduction container through the first pipeline and the second pipeline. The heat sink of the present invention has the second pipeline set inside the first pipeline, and this can simplify the structure of the heat sink, lower the number of components and lower the cost of the heat sink.
Description
Technical Field
The utility model relates to a heat dissipation device.
Background
The existing fans are usually installed in devices such as personal computers or electronic devices for heat dissipation, and the existing fans cannot perform automatic detection. Generally, when the existing fan cannot rotate or fails, a user can know that the existing fan has failed and must be replaced, so that equipment such as a personal computer or an electronic device provided with the fan must be stopped sometimes, so as to avoid the danger that the equipment is too hot due to no heat dissipation of the fan, and the user is greatly inconvenienced due to the stop of the equipment, so that improvement is necessary.
SUMMERY OF THE UTILITY MODEL
The utility model provides a heat sink. In one embodiment, the heat dissipation device includes: a conductive container, a first pipeline, a second pipeline and a pump. The conductive container is used for containing working fluid. The first pipeline is communicated with the conduction container, and working fluid flows through the first pipeline. The second pipeline is arranged in the first pipeline, and working fluid flows through the second pipeline. The pump is communicated with the second pipeline and is used for circulating the working fluid in the conduction container through the first pipeline and the second pipeline.
The utility model provides a heat dissipation device, wherein the heat dissipation device comprises:
a conductive container for containing the working fluid;
the first pipeline is communicated with the conduction container, and working fluid flows through the first pipeline;
the second pipeline is arranged in the first pipeline, and working fluid circulates in the second pipeline; and
and the pump is communicated with the second pipeline and is used for circulating the working fluid in the conduction container through the first pipeline and the second pipeline.
The heat dissipation device as described above, wherein the conductive container includes a heat conductive plate, the heat conductive plate has a first surface and a second surface, the first surface contacts the working fluid in the conductive container, the second surface is opposite to the first surface, and the second surface is used to thermally connect an object to be dissipated.
The heat dissipation device further includes an accommodating body disposed on the first surface of the heat conducting plate, wherein the accommodating body and the heat conducting plate form an accommodating space for accommodating the working fluid.
The heat dissipation device as described above, wherein the accommodating body includes a casing and a first peripheral portion, the first peripheral portion is disposed at the periphery of the casing, and the first peripheral portion is disposed on the first surface of the heat conducting plate.
The heat dissipating device as described above, wherein the conductive container further comprises a clamping member for clamping the accommodating body and the heat conductive plate.
The heat dissipating device as described above, wherein the clamping member includes a second peripheral portion and a top portion, the second peripheral portion is disposed on the periphery of the first peripheral portion, the top portion extends inward from the second peripheral portion, and the top portion extends toward the first peripheral portion, so that the top portion is against the first peripheral portion.
The heat dissipating device further includes a first ring groove disposed between the second peripheral portion and the abutting portion, wherein the first ring groove is used for disposing a first O-ring.
The heat dissipating device further includes a through hole disposed in the housing, and a guiding member is disposed in the through hole and connected to the first pipeline.
The heat dissipation device as described above, wherein the housing is a transparent housing.
The heat dissipation device as described above, wherein the first surface of the heat conductive plate includes a second annular groove, the second annular groove is used for disposing a second O-ring, and the second annular groove is disposed under the first peripheral portion.
The heat dissipating device as described above, wherein the first surface of the heat conducting plate has a plurality of protruding pillars.
The heat dissipation device as described above, wherein the first surface of the heat conductive plate has a capillary structure.
The heat dissipation device as described above, wherein the second surface of the heat conducting plate includes a heat conducting area for thermally connecting the object to be dissipated.
The heat dissipating device as described above, wherein the second pipe includes a first end and a second end, the first end is located in the conductive container, and the second end is connected to the pump.
The heat dissipation device further includes a storage container for containing the working fluid, and the first pipeline is communicated with the conduction container and the storage container.
The heat dissipating device as set forth above, wherein the pump includes a first communicating end and a second communicating end, the first communicating end is connected to the second end for receiving the working fluid from the second pipeline, and the second communicating end is used for outputting the working fluid to the storage container.
The heat dissipating device of the present invention further includes a pump connected to the second pipe and the conducting container, wherein the pump includes a first communicating end and a second communicating end, the first communicating end is connected to the second end for outputting the working fluid to the second pipe and to the conducting container, and the second communicating end is used for receiving the working fluid from the storage container.
The heat dissipating device as set forth above, wherein the pump is disposed in the storage container.
The heat dissipation device as described above, wherein the first pipeline includes a first connection end, the first connection end is connected to the conduction container, and a distance between the first connection end of the first pipeline and the first end of the second pipeline is greater than or equal to a quarter of a depth of the conduction container.
The heat dissipation device as described above, wherein the depth of the conductive container is a height from a top surface to a bottom surface of the conductive container.
The heat dissipation device as described above, wherein the depth of the conductive container is a length from a first side to a second side of the conductive container.
The heat dissipation device as described above, wherein the working fluid has a predetermined color.
The heat dissipating device further includes at least one heat dissipating fin set disposed outside the storage container, and the heat dissipating fin set is configured to conduct the temperature of the working fluid in the storage container, so that the temperature of the working fluid is conducted to the heat dissipating fin set.
The heat dissipating device further includes at least one fan facing the at least one heat dissipating fin set, wherein the fan is configured to reduce a temperature of the at least one heat dissipating fin set.
The heat dissipation device as described above, wherein the first pipeline includes a first section and a second section, the first section includes a first connection end, the second section includes a second connection end, the first connection end is connected to the conduction container, and the second connection end is connected to the pump.
The heat dissipation device as described above, wherein the pump includes a first connection end and a second connection end, and the first connection end is connected to the second connection end of the first pipeline.
The heat dissipating device further includes at least one heat dissipating fin set disposed outside the second section of the first pipeline, and the heat dissipating fin set is configured to conduct the temperature of the working fluid in the first pipeline, so that the temperature of the working fluid is conducted to the heat dissipating fin set.
The heat dissipating device further includes at least one fan facing the at least one heat dissipating fin set, wherein the fan is configured to reduce a temperature of the at least one heat dissipating fin set.
The heat dissipation device further includes at least one cooler disposed outside the second section of the first pipeline, wherein the cooler is configured to conduct the temperature of the working fluid in the first pipeline, so as to lower the temperature of the working fluid.
The heat dissipating device as described above, wherein the second pipe includes a first portion, a second portion and a third portion, the first portion is connected to the second portion, the second portion is connected to the third portion, the first portion includes a first end, the third portion includes a second end, the first end is disposed in the conductive container, and the second end is connected to the pump.
The heat dissipation device as described above, wherein the second portion of the second pipeline is disposed inside the first pipeline, and the first portion and the third portion are disposed outside the first pipeline.
The heat dissipating device of the present invention, wherein the second portion of the second pipe is disposed in the first section of the first pipe.
The heat dissipation device as described above, wherein a distance between the first connection end of the first pipeline and the first end of the second pipeline is greater than or equal to a quarter of a depth length of the conductive container.
The heat dissipation device as described above, wherein the depth of the conductive container is a height from a top surface to a bottom surface of the conductive container.
The heat dissipation device as described above, wherein the depth of the conductive container is a length from a first side to a second side of the conductive container.
The heat dissipating device further includes a storage container disposed in the third portion of the second pipeline, wherein the storage container is used for containing the working fluid.
The heat sink of the present invention utilizes the second pipeline to arrange in the first pipeline, can simplify the structure of the heat sink of the present invention, reduce the assembly of the heat sink of the present invention, and can reduce the overall cost of the heat sink of the present invention.
Drawings
The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes, the proportional sizes, and the like of the respective members in the drawings are merely schematic for facilitating the understanding of the present invention, and do not specifically limit the shapes, the proportional sizes, and the like of the respective members of the present invention. Those skilled in the art, having the benefit of the teachings of this invention, may choose from the various possible shapes and proportional sizes to implement the utility model as a matter of case.
FIG. 1 is a schematic view of a heat dissipation device according to an embodiment of the present invention;
FIG. 2 is an exploded perspective view of a conductive container of a heat dissipation device according to an embodiment of the present invention;
FIG. 3 is an assembled cross-sectional view of a conductive container of a heat dissipation device according to an embodiment of the present invention;
FIG. 4 is a schematic view of a heat dissipation device according to another embodiment of the present invention; and
fig. 5 is a schematic view of a heat dissipation device according to another embodiment of the utility model.
Description of reference numerals:
10 heat sink
11: storage container
12: a conductive container
13 first pipeline
14 second pipeline
15: pump
16 radiating fin group
17: fan
30 parts to be cooled
50 heat sink
51 conducting container
52 first pipeline
53 second pipeline
54 pump
55 storage container
56 radiating fin group
57 fan
58 cooler
111 working fluid
121 heat conducting plate
121A first surface
121B second surface
121C second annular groove
121D second O-ring
121E convex column
121F capillary structure
121G heat transfer area
122 accommodating body
122A casing
122B first peripheral portion
122C through hole
122D guide connecting piece
123 clamping member
123A second peripheral portion
123B resisting part
123C extension part
123D first ring groove
123E first O-ring
124 top surface
125 bottom surface
126 first side face
127 the second side face
131 the first connection end
141 first end
142 the second end
151 first communication terminal
152 second communication end
511 heat conducting plate
513 top surface
514 bottom surface
521 first section
522 second section
523 first connection end
524 the second connecting end
531 first part
532 second part
533 a third part
534 first end
535 second end
541, first connection end
542 second communicating end
D is distance
H: height (depth length)
L length (depth length)
Detailed Description
The details of the present invention can be more clearly understood in conjunction with the accompanying drawings and the description of the embodiments of the present invention. However, the specific embodiments of the present invention described herein are for the purpose of illustration only and are not to be construed as limiting the utility model in any way. Any possible variations based on the present invention may be conceived by the skilled person in the light of the teachings of the present invention, and these should be considered to fall within the scope of the present invention.
Fig. 1 is a schematic view illustrating a heat dissipation device according to an embodiment of the utility model. Referring to fig. 1, in an embodiment, the heat dissipation device 10 of the present invention includes: a storage container 11, a conductive container 12, a first pipeline 13, a second pipeline 14 and a pump 15. The heat dissipation device 10 of the present invention can be disposed on an object 30 to be dissipated for reducing the temperature of the object 30 to be dissipated, and the object 30 to be dissipated can be an electronic device such as a chip, but not limited thereto.
In one embodiment, the storage container 11 is used for containing the working fluid 111. The conductive container 12 is in communication with the storage container 11 for containing the working fluid 111. The working fluid 111 may be a fluid such as a cooling fluid, water, etc., and the working fluid 111 may have a predetermined color. The first pipeline 13 connects the storage container 11 and the conduction container 12, and the working fluid 111 flows through the first pipeline 13, for example, the working fluid 111 flows from the storage container 11 to the conduction container 12 through the first pipeline 13.
In one embodiment, the second pipeline 14 is disposed in the first pipeline 13, and the working fluid 111 flows through the second pipeline 14. The pump 15 is connected to the second pipeline 14 for circulating the working fluid 111 in the storage container 11 and the conduction container 12 through the first pipeline 13 and the second pipeline 14. In one embodiment, the second pipe 14 includes a first end 141 and a second end 142, the first end 141 is located in the conductive container 12, the first end 141 is close to the object 30 to be cooled, and the second end 142 is connected to the pump 15. The pump 15 includes a first connection end 151 and a second connection end 152, the first connection end 151 is connected to the second end 142 of the second pipeline 14 for receiving the working fluid 111 from the second pipeline 14, and the second connection end 152 is used for outputting the working fluid 111 to the storage container 11. Therefore, the working fluid 111 flows from the conducting container 12 to the pump 15 through the second pipeline 14 and is output to the storage container 11, and the working fluid 111 can flow from the storage container 11 to the conducting container 12 through the first pipeline 13, so that the working fluid 111 can circulate in the storage container 11 and the conducting container 12 through the first pipeline 13 and the second pipeline 14.
In one embodiment, the working fluid 111 may flow from the conducting vessel 12 to the storage vessel 11 through the first pipe 13, i.e. in the opposite direction to that shown in fig. 1. The working fluid 111 can be pumped from the storage container 11 by the pump 15 and output to the conduction container 12 through the second pipe 14. Similarly, the direction in which the working fluid 111 flows through the second pipe 14 is opposite to the direction shown in fig. 1. Therefore, the working fluid 111 can be pumped from the storage container 11 through the second connection end 152 of the pump 15, and output to the second pipeline 14 and the conduction container 12 through the first connection end 151 of the pump 15, and the working fluid 111 can flow from the conduction container 12 to the storage container 11 through the first pipeline 13, so that the working fluid 111 can circulate in the storage container 11 and the conduction container 12 through the first pipeline 13 and the second pipeline 14.
In an embodiment, the heat dissipation device 10 of the present invention utilizes the second pipeline 14 disposed in the first pipeline 13 to form a pipe-in-pipe structure design, which can simplify the structure of the heat dissipation device 10 of the present invention, reduce the components of the heat dissipation device 10 of the present invention, and reduce the overall cost of the heat dissipation device 10 of the present invention.
Fig. 2 is an exploded perspective view of a conductive container of a heat dissipation device according to an embodiment of the present invention. Fig. 3 is an assembled cross-sectional view of a conductive container of a heat dissipation device according to an embodiment of the present invention. Referring to fig. 1 to 3, in an embodiment, the conductive container 12 includes a heat conductive plate 121 having a first surface 121A and a second surface 121B, the first surface 121A contacts the working fluid 111 in the conductive container 12, the second surface 121B is opposite to the first surface 121A, and the second surface 121B is used for thermally connecting the object 30 to be heat-dissipated. In an embodiment, the second surface 121B may directly contact the object 30 to be cooled, or a heat conducting medium may be disposed between the second surface 121B and the object 30 to be cooled, for example: thermal adhesive sheet (thermal pad), or thermal paste, etc. to improve the heat dissipation efficiency.
In one embodiment, the conductive container 12 further includes an accommodating body 122, the accommodating body 122 is disposed on the first surface 121A of the heat conducting plate 121, and the accommodating body 122 and the heat conducting plate 121 form an accommodating space for accommodating the working fluid 111. In one embodiment, the accommodating body 122 includes a casing 122A and a first peripheral portion 122B, the first peripheral portion 122B is disposed on the periphery of the casing 122A and is disposed on the first surface 121A of the heat conducting plate 121. The accommodating body 122 further includes a through hole 122C disposed in the housing 122A for disposing a guiding member 122D, and the guiding member 122D can be connected to the first pipeline 13. In one embodiment, the housing 122A may be a transparent housing, such as: glass or acryl, etc. to see the flowing state of the working fluid 111 in the housing 122A, and the working fluid 111 has a set color to provide a visual viewing effect.
In one embodiment, the conductive container 12 further includes a clamping member 123 for clamping the accommodating body 122 and the heat conductive plate 121. The clamping member 123 includes a second peripheral portion 123A, a top portion 123B and an extending portion 123C. The second peripheral portion 123A is disposed at the periphery of the first peripheral portion 122B. The abutting portion 123B extends inward from the second peripheral portion 123A, and the abutting portion 123B extends toward the first peripheral portion 122B to abut on the first peripheral portion 122B for pressing the first peripheral portion 122B. The extension portion 123C extends outward from the second peripheral portion 123A, the extension portion 123C can be used to be fixedly connected with a setting component (not shown), and the setting component can be a circuit board or a substrate for carrying the object 30 to be heat dissipated.
In one embodiment, the clamping member 123 further includes a first ring groove 123D disposed between the second peripheral portion 123A and the abutting portion 123B for disposing a first O-ring 123E. Also, the first O-ring 123E is disposed on the first peripheral portion 122B of the conductive container 12. In one embodiment, the first surface 121A of the thermal plate 121 includes a second annular groove 121C for disposing a second O-ring 121D under the first peripheral portion 122B of the conductive container 12. By using the first O-ring 123E and the second O-ring 121D, a better sealing effect can be provided to prevent the working fluid 111 from leaking out of the conductive container 12. In one embodiment, when the housing 122A is made of glass, the first O-ring 123E and the second O-ring 121D can provide a buffering effect to prevent the housing 122A from being broken during the pressing and fixing process. In one embodiment, the first O-ring 123E and the second O-ring 121D can be made of rubber or silicone
In one embodiment, the first surface 121A of the heat conducting plate 121 has a plurality of protruding pillars 121E. The first surface 121A of the heat conducting plate 121 further has a capillary structure 121F, which can be formed on the first surface 121A by thermal spraying (spray welding) or sintering. The plurality of convex columns 121E and the capillary structure 121F can enable the working fluid 111 to rapidly take away heat generated by the object 30 to be cooled, so as to improve the cooling efficiency. In one embodiment, the second surface 121B of the heat conducting plate 121 further includes a heat conducting area 121G for thermally connecting the object 30 to be heat-dissipated. The heat transfer area 121G of the second surface 121B can directly contact the object 30 to be heat dissipated, or a heat conducting medium can be disposed between the heat transfer area 121G of the second surface 121B and the object 30 to be heat dissipated, such as: thermal adhesive sheet (thermal pad), or thermal paste, etc. to improve the heat dissipation efficiency.
In one embodiment, to avoid the problem of poor circulation of the working fluid 111 caused by the close distance between the first connection end 131 of the first pipeline 13 and the first end 141 of the second pipeline 14, the distance D between the first connection end 131 of the first pipeline 13 and the first end 141 of the second pipeline 14 may be greater than or equal to one-fourth of a depth of the conductive container 12. In one embodiment, the depth of the conductive container 12 may be a height H (see fig. 1) from a top surface 124 to a bottom surface 125 of the conductive container 12, or the depth of the conductive container 12 may be a length L (see fig. 3) from a first side surface 126 to a second side surface 127 of the conductive container 12.
In one embodiment, the pump 15 is disposed within the storage container 11. In an embodiment, the heat dissipating device 10 of the present invention further includes at least one heat dissipating fin set 16 and at least one fan 17, wherein the heat dissipating fin set 16 is disposed outside the storage container 11 for conducting the temperature of the working fluid 111 in the storage container 11, so that the temperature of the working fluid 111 is conducted to the heat dissipating fin set 16. Moreover, the fan 17 faces the heat sink fin assembly 16 to lower the temperature of the heat sink fin assembly 16. That is, when the working fluid 111 in the conduction container 12 flows through the first surface 121A of the heat conduction plate 121, the heat generated by the object 30 to be radiated is removed, so that the temperature of the working fluid 111 in the conduction container 12 is increased, the working fluid 111 is transferred to the pump 15 and the storage container 11 through the second pipeline 14, the temperature of the working fluid 111 in the storage container 11 is also increased, the temperature of the working fluid 111 in the storage container 11 is reduced through the heat radiation fin set 16 and the fan 17, and is transferred to the conduction container 12 through the first pipeline 13 again, and the working fluid 111 circulates to dissipate the heat generated by the object 30 to be radiated, thereby improving the heat radiation effect of the heat dissipation device 10 of the present invention.
Fig. 4 is a schematic view of a heat dissipation device according to another embodiment of the utility model. Referring to fig. 4, in an embodiment, the heat dissipation device 50 of the present invention includes: a conductive container 51, a first pipe 52, a second pipe 53 and a pump 54. The heat dissipation device 50 of the present invention can be disposed on an object 30 to be dissipated for reducing the temperature of the object 30 to be dissipated.
In one embodiment, the conductive container 51 is used for containing the working fluid 111. The first pipe 52 is connected to the conductive container 51, and the working fluid 111 flows through the first pipe 52. The second pipeline 53 is disposed in the first pipeline 52, and the working fluid 111 flows through the second pipeline 53. The pump 54 is connected to the first pipeline 52 and the second pipeline 53, and is used for circulating the working fluid 111 in the conduction container 51 through the first pipeline 52 and the second pipeline 53.
In one embodiment, the first conduit 52 includes a first section 521 and a second section 522. The first section 521 includes a first connecting end 523, and the second section 522 includes a second connecting end 524. The first connection terminal 523 is connected to the conductive container 51, and the second connection terminal 524 is connected to the pump 54. The pump 54 includes a first connection 541 and a second connection 542. The first connection end 541 is connected to the second connection end 524 of the first pipeline 52. The second pipeline 53 includes a first portion 531, a second portion 532 and a third portion 533. The first portion 531 is connected to the second portion 532, and the second portion 532 is connected to the third portion 533. The first portion 531 includes a first end 534, and the third portion 533 includes a second end 535, the first end 534 being disposed within the conductive container 51, the second end 535 being connected to the second communication end 542 of the pump 54. Therefore, the working fluid 111 in the conduction container 51 can be pumped by the pump 54 from the second pipeline 53, output to the first pipeline 52 by the pump 54, and input into the conduction container 51, so that the working fluid 111 can circulate in the conduction container 51 through the first pipeline 52 and the second pipeline 53.
In an embodiment, the heat dissipation device 50 of the present invention utilizes the second pipeline 53 disposed in the first pipeline 52 to form a pipe-in-pipe structure design, which can simplify the structure of the heat dissipation device 50 of the present invention, reduce the components of the heat dissipation device 50 of the present invention, and reduce the overall cost of the heat dissipation device 50 of the present invention.
In one embodiment, the conductive container 51 includes a thermally conductive plate 511, and the thermally conductive plate 511 is thermally connected to the object 30 to be heat-dissipated. In one embodiment, the heat conducting plate 511 may directly contact the object 30 to be dissipated, or a heat conducting medium may be disposed between the heat conducting plate 511 and the object 30 to be dissipated, such as: heat-conducting film, or heat-dissipating paste, etc. to improve heat-dissipating efficiency.
In one embodiment, the first section 521 and the second section 522 of the first pipeline 52 are connected, and the pipe diameter of the first section 521 is larger than that of the second section 522.
In one embodiment, the heat dissipation device 50 further includes at least one heat dissipation fin set 56 and at least one fan 57. The heat sink fin set 56 is disposed outside the second section 522 of the first pipeline 52 for conducting the temperature of the working fluid 111 in the first pipeline 52, so that the temperature of the working fluid 111 is conducted to the heat sink fin set 56. The fan 57 faces the heat dissipating fin set 56 to lower the temperature of the heat dissipating fin set 56. The heat dissipation device 50 further includes at least one cooler (Radiator)58 disposed outside the second section 522 of the first pipeline 52 for conducting the temperature of the working fluid 111 in the first pipeline 52 to lower the temperature of the working fluid 111. That is, when the working fluid 111 in the conduction container 51 flows through the heat conduction plate 511, the heat generated by the object 30 to be radiated is removed, so that the temperature of the working fluid 111 in the conduction container 51 is raised, the working fluid 111 flows through the second pipeline 53 to the pump 54 and the first pipeline 52, the temperature of the working fluid 111 in the first pipeline 52 can be lowered by the heat dissipation fin set 56 and the fan 57 or the cooler 58, the working fluid 111 with lowered temperature is input into the conduction container 51 through the first pipeline 52, and the working fluid 111 circulates to dissipate the heat generated by the object 30 to be radiated, thereby enhancing the heat dissipation effect of the heat dissipation device 50 of the present invention.
In one embodiment, the second portion 532 of the second conduit 53 is disposed within the first conduit 52, and the first portion 531 and the third portion 533 are disposed outside the first conduit 52. Also, the second portion 532 of the second conduit 53 is disposed within the first section 521 of the first conduit 52.
Fig. 5 is a schematic view of a heat dissipation device according to another embodiment of the utility model. Referring to fig. 5, in an embodiment, the heat dissipation device 50 further includes a storage container 55 disposed on the third portion 533 of the second pipeline 53 for containing the working fluid 111.
In one embodiment, to avoid the problem of poor circulation of the working fluid 111 caused by the close distance between the first connection end 523 of the first pipe 52 and the first end 534 of the second pipe 53, the distance D between the first connection end 523 of the first pipe 52 and the first end 534 of the second pipe 53 may be greater than or equal to one-fourth of a depth length of the conductive container 51. In one embodiment, the depth of the conductive container 51 may be the height H from a top surface 513 to a bottom surface 514 of the conductive container 51, or the depth of the conductive container 51 may be the length from a first side to a second side of the conductive container 51.
The above embodiments are merely illustrative of the principles and effects of the present invention, and do not limit the present invention. Modifications and variations of the above-described embodiments may be made by those skilled in the art without departing from the spirit of the utility model. The scope of the claims of the present invention should be determined with reference to the appended claims.
Claims (36)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110118197A TWI784533B (en) | 2021-05-20 | 2021-05-20 | heat sink |
| TW110118197 | 2021-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215683035U true CN215683035U (en) | 2022-01-28 |
Family
ID=79978978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121538496.XU Active CN215683035U (en) | 2021-05-20 | 2021-07-07 | heat sink |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN215683035U (en) |
| TW (1) | TWI784533B (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104515415A (en) * | 2013-09-30 | 2015-04-15 | 江苏维创散热器制造有限公司 | Sleeve type radiator |
-
2021
- 2021-05-20 TW TW110118197A patent/TWI784533B/en active
- 2021-07-07 CN CN202121538496.XU patent/CN215683035U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI784533B (en) | 2022-11-21 |
| TW202246721A (en) | 2022-12-01 |
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