CN216671569U - Hot-pressing head for chip-on-film packaging - Google Patents
Hot-pressing head for chip-on-film packaging Download PDFInfo
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- CN216671569U CN216671569U CN202123007701.2U CN202123007701U CN216671569U CN 216671569 U CN216671569 U CN 216671569U CN 202123007701 U CN202123007701 U CN 202123007701U CN 216671569 U CN216671569 U CN 216671569U
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- pressure head
- head body
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- piece
- adjusting
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- 238000007731 hot pressing Methods 0.000 title claims abstract description 15
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 238000003825 pressing Methods 0.000 claims abstract description 28
- 230000007246 mechanism Effects 0.000 claims abstract description 24
- 238000001179 sorption measurement Methods 0.000 claims abstract description 12
- 238000009434 installation Methods 0.000 claims description 15
- 230000001105 regulatory effect Effects 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 13
- 230000006872 improvement Effects 0.000 description 9
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000007906 compression Methods 0.000 description 4
- 238000002788 crimping Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The utility model discloses a hot pressing head for chip on film packaging, which comprises a pressing head body, an upper supporting piece arranged on the pressing head body and a plurality of pressing head adjusting mechanisms, wherein the upper supporting piece is arranged on the pressing head body; the pressure head adjusting mechanisms are arranged at intervals along the extending direction of the upper supporting piece; the pressure head adjusting mechanism comprises a positioning piece and an adjusting piece arranged on the positioning piece; the positioning piece is provided with a positioning part positioned on the upper supporting piece and a free end arranged outwards from the positioning part, and the adjusting piece is in threaded connection with the positioning piece and is provided with a butting part butted on the pressure head body. The pressure head adjusting mechanism is provided with the positioning piece and the adjusting piece, the adjusting piece is abutted to the pressure head body, the pressure-connected position of the pressure head body, which is pressed by the adjusting piece, is deformed relative to the non-pressure-connected position, and the deformation can be reflected to the bottom surface of the pressure head body, so that the concave-convex condition of the bottom surface of the pressure head body can be changed, the pressure head is suitable for adsorption of various chips, and the applicability of the pressure head is improved.
Description
Technical Field
The utility model relates to the technical field of chip-on-film packaging, in particular to a hot pressing head for chip-on-film packaging.
Background
With the improvement of semiconductor technology, the liquid crystal display has the advantages of low power consumption, light weight, high resolution, high color saturation, and long lifetime, and thus is widely applied to the liquid crystal display of mobile phone, notebook computer or desktop computer, and the liquid crystal television and other life-related electronic products. Among them, a driver IC (driver IC) of a display is an essential element of a liquid crystal display. In the prior art, a driver Chip of a liquid crystal display device is generally packaged by a TAB (tape automated bonding) package technique, and a Chip-On-Film (COF) package structure is one of the package structures using the TAB package technique.
The Chip package process of the Chip-On-Film (COF) package structure is as follows: after the circuit on the flexible substrate and the bump on the chip are manufactured, Inner Lead Bonding (ILB) is performed in a thermal compression (thermocompression) manner, so that the bump on the chip and the inner lead on the flexible substrate are eutectic bonded and electrically connected. Then, the chip and the inner lead lines on the flexible substrate are sealed with an encapsulating resin, and after electrical inspection, Outer Lead Bonding (OLB) is performed. The outer pins are formed by extending the inner pins on the flexible substrate outwards, and the flexible substrate is electrically connected with a circuit substrate or other elements by the outer pins in a hot-pressing mode.
In the thermal compression process, a thermal compression head is generally used to adsorb the chip, and the chip is adsorbed above the positioning table of the flexible substrate and electrically connected with the flexible substrate adsorbed on the positioning table. In the process of bonding the bump on the chip and the pin on the flexible substrate, in order to ensure the bonding strength of the bump and the pin, certain requirements are required on the flatness of the bottom surface of the hot-pressing head for adsorbing the chip. In the prior art, generally, a hot pressing head manufacturer grinds the bottom surface of a hot pressing head into a concave, convex or flat state according to a certain requirement. However, in the actual production process, the pressing heads with different planeness are often needed for different chip products, the flatness of the bottom surface of the pressing head needs to be finely adjusted to a certain degree, and the hot pressing head in the prior art obviously cannot meet the actual requirement.
In view of the above, it is desirable to provide a thermal head for chip on film packaging with improved applicability.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a hot-pressing head for chip-on-film packaging, which can be used for solving the defects in the prior art, and can generate deformation on the bottom surface of a pressing head body, so that the concave-convex condition of the bottom surface of the pressing head body can be changed, the adsorption of various chips is suitable, and the applicability of the pressing head is improved.
The utility model provides a hot pressing head for chip on film packaging, which comprises a pressing head body, an upper supporting piece and a plurality of pressing head adjusting mechanisms, wherein the upper supporting piece is arranged on the pressing head body; the pressure head adjusting mechanisms are arranged at intervals along the extending direction of the upper supporting piece;
the pressure head adjusting mechanism comprises a positioning part and an adjusting part arranged on the positioning part; the locating part has the location and is in go up the location portion on the support piece and from the outside free end that sets up that extends of location portion, regulating part threaded connection in the locating part and have the butt on the butt portion on the pressure head body.
As a further improvement of the present invention, the indenter body has a length direction and a width direction, and the upper support member is provided at a central position in the width direction of the indenter body and extends in the length direction of the indenter body.
As a further improvement of the utility model, the upper supporting piece is provided with a supporting rod arranged in parallel with the upper surface of the pressure head body and connecting rods arranged on two opposite sides of the supporting rod and fixedly connected with the pressure head body; the gap between the support rod and the pressure head body forms an installation space.
As a further improvement of the utility model, the positioning part is a pressing plate positioned in the installation space, the positioning part is arranged in the middle of the pressing plate and is used for abutting against the supporting rod, and the two ends of the pressing plate are respectively in threaded connection with the adjusting parts.
As a further development of the utility model, the dimension of the positioning element in the vertical direction is adapted to the height of the installation space in the vertical direction.
As a further improvement of the present invention, the indenter body is provided with a pressure receiving portion disposed opposite to the abutting portion, and a distance from the pressure receiving portion to an edge of the indenter body in the width direction is not less than a quarter of a width of the indenter body.
As a further improvement of the utility model, the adjusting member is a bolt screwed on the positioning member, and one end of the bolt penetrates through the positioning member and abuts against the pressure head body.
As a further improvement of the utility model, one end of the bolt, which is far away from the pressure head body, is provided with an inner hexagonal nut.
As a further improvement of the present invention, a plurality of vacuum suction holes are formed at the bottom of the indenter body, the vacuum suction holes extend along the length direction of the indenter body, and the upper support member is disposed on one side of the indenter body, which is away from the vacuum suction holes, and is opposite to the vacuum suction holes.
As a further improvement of the present invention, the indenter body further has a through hole penetrating along a length direction of the indenter body, and the positioning element is opposite to the through hole.
Compared with the prior art, the pressure head adjusting mechanism is provided with the pressure head adjusting mechanism, the pressure head adjusting mechanism is provided with the positioning piece positioned on the upper supporting piece, the positioning piece is provided with the free end which extends outwards and is positioned on the pressure head body, the adjusting piece is in threaded connection with the free end of the positioning piece and abuts against the pressure head body, the pressure head body is provided with the bearing part matched with the abutting part, the position, which is crimped by the adjusting piece, on the pressure head body can be deformed relative to the position, which is not crimped, of the adjusting piece, and the deformation can be reflected to the bottom surface of the pressure head body, so that the concave-convex condition of the bottom surface of the pressure head body can be changed, the adsorption to various chips can be applied, and the applicability of the pressure head is improved.
Drawings
Fig. 1 is a schematic view of a first structure of a thermal head for chip-on-film package according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a second structure of a thermal head for chip-on-film package according to an embodiment of the present invention;
fig. 3 is a front view of a thermal head for chip-on-film package according to an embodiment of the disclosure;
fig. 4 is a schematic structural diagram of a head body in a thermal head for chip-on-film packaging according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a positioning element in a thermal head for chip-on-film packaging according to an embodiment of the present invention;
fig. 6 is a schematic view of a first structure of a regulating member in a thermal head for chip-on-film package according to an embodiment of the present invention;
fig. 7 is a schematic diagram of a second structure of a regulating member in a thermal head for chip-on-film package according to an embodiment of the present invention;
description of reference numerals: description of reference numerals: 1-pressure head body, 10-vacuum adsorption hole, 11-perforation, 2-upper support piece, 21-support rod, 22-connecting rod, 3-pressure head adjusting mechanism, 31-positioning piece, 311-positioning part, 312-free end, 32-adjusting piece, 321-abutting part and 4-installation space.
Detailed Description
The embodiments described below with reference to the drawings are illustrative only and should not be construed as limiting the utility model.
The embodiment of the utility model comprises the following steps: as shown in fig. 1-7, a hot-pressing head for chip-on-film packaging is disclosed, which adsorbs a chip during chip-on-film packaging, moves the adsorbed chip onto a carrying table of a flexible substrate, adsorbs and positions the flexible substrate on the carrying table of the flexible substrate, and connects a bump on the chip with a pin on the flexible substrate in a hot-pressing manner.
The hot pressing head for chip on film packaging in the embodiment specifically comprises a pressing head body 1, an upper support member 2 arranged on the pressing head body 1, and a plurality of pressing head adjusting mechanisms 3; the pressure head adjusting mechanisms 3 are arranged at intervals along the extending direction of the upper supporting piece 2;
the pressure head adjusting mechanism 3 comprises a positioning part 31 and an adjusting part 32 arranged on the positioning part 31; the positioning member 31 has a positioning portion 311 positioned on the upper support member 2 and a free end 312 extending outward from the positioning portion 311, and the adjusting member 32 is screwed on the positioning member 31 and has an abutting portion 321 abutting on the indenter body 1.
As shown in fig. 4, be provided with pressure head adjustment mechanism 3 in this embodiment, pressure head adjustment mechanism 3 has location piece 31 of location on last support piece 2, location piece 31 has the free end 312 that outwards extends and be located on pressure head body 1, adjustment piece 32 then threaded connection is on the free end 312 of location piece 31 and the butt is in on pressure head body 1, be provided with on pressure head body 1 with the accepting part of butt looks adaptation, the position that is pressed by adjustment piece 32 on pressure head body 1 relatively not can be out of shape by the position of crimping, this kind of deformation can react the bottom surface of pressure head body 1 to can change the unsmooth condition of pressure head body 1 bottom surface, so as to be suitable for the absorption to multiple chip, thereby can be provided with the deformation of a plurality of location pieces 31 realization different positions in this embodiment.
It should be noted that the bending degree of the chip itself is very small in the actual use process, namely, on the order of micrometers, and therefore, the change formed only by applying pressure to the corresponding position on the upper portion of the indenter body 1 is enough to satisfy the requirements of different concave-convex of the chip. Through the setting of above-mentioned structure carrying out the crimping power of difference on pressure head body 1 through adjusting regulating part 32 in the position that needs are unsmooth and applying and realize to the convenient different unsmooth regulation of lower surface that has realized pressure head body 1 makes the demand that the crimping head can use multiple chip, has improved the suitability of crimping head.
Specifically, pressure head body 1 has length direction and width direction, upper strut spare 2 sets up the central point on the 1 width direction of pressure head body puts and follows the length direction extension setting of pressure head body 1. Set up upper support piece 2 the central point on the 1 width direction of pressure head puts the realization pressure head body 1 that can be more stable to upper support piece 2's stable support.
Since chips in the prior art are generally rectangular in configuration, the indenter body 1 is also provided with a rectangular configuration corresponding to the configuration of the chip. Set up upper support piece 2 central point on the 1 width direction of pressure head body and extend the setting along the length of pressure head body 1, can make the setting element 31 of location on upper support piece 2 can extend the setting along the length direction of pressure head body 1, thereby the orientation that makes setting element 31 arrange on pressure head body 1 is along the length direction by the adsorbed chip, also generally all have different crooked requirements in the length direction of chip among the prior art, consequently the adjustment of the realization that the setting of above-mentioned structure can be better to the crooked degree on the length direction of adsorbed chip.
Specifically, the upper support member 2 is provided with a support rod 21 arranged parallel to the upper surface of the indenter body 1 and a connecting rod 22 arranged on two opposite sides of the support rod 21 and fixedly connected with the indenter body 1; the gap between the support rod 21 and the indenter body 1 forms an installation space 4.
Of course, in another embodiment, the support rod 21 of the upper support frame 2 may also be fixed on the indenter body 1 through the connecting rod 22 on one side, but the support stability of the indenter adjustment mechanism 3 is poorer than that of a scheme in which both sides of the support rod 21 are connected and fixed with the indenter body 1 through the connecting rod 22.
In this embodiment, the positioning member 31 is a pressing plate positioned in the installation space 4, the positioning portion 311 is disposed in the middle of the pressing plate and used for abutting against the supporting rod 21, and the two ends of the pressing plate are respectively connected with the adjusting member 32 through threads.
In this embodiment, the top of the middle position of the positioning member 31 forms the positioning portion 311, the positioning portion 311 abuts against the bottom end of the supporting rod 21, the abutting acting force of the positioning portion 311 and the supporting rod 21 comes from the adjusting members 32 at the two ends of the positioning member 31, and the adjusting members 32 are screwed with the positioning member 31, so that the adjusting members 32 and the positioning member 31 are practically mutually limited in the axial direction of the adjusting members 32, and when the adjusting members 32 abut against the upper surface of the ram body 1, the adjusting members 32 can act on the positioning member 31 to abut against, so that the middle position of the positioning member 31 abuts against and is positioned in the installation space 4 and abuts against the bottom of the supporting rod 21.
Of course, in another embodiment, the positioning member 31 may also be a plate-shaped structure fixed on the supporting rod 21, the adjusting member 32 is screwed on one end of the positioning member 31 far away from the supporting rod 21, and the positioning members 31 may be disposed on two opposite sides of the supporting rod 21.
In the embodiment that the positioning member 31 is directly fixed to the support rod 21, the installation space 4 may not be provided between the support rod 21 and the indenter body 1, and the support rod 21 may be directly fixed on the upper side of the indenter body 1, that is, the upper support member 2 is actually a structure formed by the indenter body 1 protruding upwards, but a gap is required between the positioning member 31 and the indenter body 1 after the positioning member 31 extends outwards from the upper support member 2, and the positioning member 31 may be provided on the side wall of the upper support member 2 and near the top.
In the present exemplary embodiment, the dimension of the positioning element 31 in the vertical direction is adapted to the height of the installation space 4 in the vertical direction. The setting of setting element 31 is in installation space 4, and the ascending size of setting element 31 in vertical direction slightly is less than installation space 4 height in vertical direction, and the installation that realizes setting element 31 that the setting up of above-mentioned structure can be convenient is fixed.
The pressure head comprises a pressure head body 1 and is characterized in that a pressure bearing part opposite to the abutting part is arranged on the pressure head body 1, and the distance between the pressure bearing part and the edge of the pressure head body 1 in the width direction is not less than one fourth of the width of the pressure head body 1. The arrangement of the above structure enables the abutting position of the adjusting piece 32 of the indenter adjusting mechanism 3 to be located at a quarter position of the width of the indenter body 1, and the arrangement of the structure enables the acting force of the adjusting piece 32 to be better applied to the indenter body 1.
In this embodiment, the adjusting member 32 is a bolt screwed on the positioning member 31, and one end of the bolt penetrates through the positioning member 31 and abuts against the indenter body 1. Preferably, an inner hexagonal nut is arranged at one end of the bolt, which is far away from the pressure head body 1. The adjusting piece 32 can be better adjusted and fixed by adopting the inner hexagonal nut, so that the effect of better compression fixation is achieved.
Further, four pressure head adjusting mechanisms 3 are arranged, the four pressure head adjusting mechanisms 3 are arranged along the length direction of the pressure head body 1, and the four pressure head adjusting mechanisms 3 are arranged from the center of the length direction of the pressure head body 1 to two sides.
The bottom of pressure head body 1 is formed with a plurality of vacuum adsorption holes 10, vacuum adsorption holes 10 extend along the length direction of pressure head body 1 and set up, upper support piece 2 sets up deviate from on the pressure head body 1 one side of vacuum adsorption holes 10 and with the position in vacuum adsorption holes 10 is relative.
The pressure head body 1 is further provided with a through hole 11 penetrating along the length direction of the pressure head body 1, and the positioning piece 31 is opposite to the through hole 11.
The construction, features and functions of the present invention are described in detail in the embodiments illustrated in the drawings, which are only preferred embodiments of the present invention, but the present invention is not limited by the drawings, and all equivalent embodiments modified or changed according to the idea of the present invention should fall within the protection scope of the present invention without departing from the spirit of the present invention covered by the description and the drawings.
Claims (10)
1. A hot pressing head for chip on film packaging is characterized by comprising a pressing head body, an upper supporting piece arranged on the pressing head body and a plurality of pressing head adjusting mechanisms; the pressure head adjusting mechanisms are arranged at intervals along the extending direction of the upper supporting piece;
the pressure head adjusting mechanism comprises a positioning part and an adjusting part arranged on the positioning part; the locating part has the location and is in go up the location portion on the support piece and from the outside free end that sets up that extends of location portion, regulating part threaded connection in the locating part and have the butt on the butt portion on the pressure head body.
2. The thermal head for chip-on-film package according to claim 1, wherein: the pressure head body has length direction and width direction, last support piece sets up the central point in the pressure head body width direction puts and follows the length direction extension setting of pressure head body.
3. The thermal head for chip-on-film package according to claim 1, wherein: the upper supporting piece is provided with a supporting rod arranged in parallel with the upper surface of the pressure head body and connecting rods arranged on two opposite sides of the supporting rod and fixedly connected with the pressure head body; the supporting rod and a gap between the pressure head bodies form an installation space.
4. The thermal head for chip-on-film package according to claim 3, wherein: the locating part is a pressing plate positioned in the installation space, the positioning part is arranged in the middle of the pressing plate and used for being abutted to the supporting rod, and the two ends of the pressing plate are respectively in threaded connection with the adjusting part.
5. The thermal head for chip-on-film package according to claim 3, wherein: the size of the positioning piece in the vertical direction is matched with the height of the installation space in the vertical direction.
6. The thermal head for chip-on-film package according to claim 1, wherein: the pressure head comprises a pressure head body and is characterized in that a pressure bearing part opposite to the abutting part is arranged on the pressure head body, and the distance between the pressure bearing part and the edge of the pressure head body in the width direction is not less than one fourth of the width of the pressure head body.
7. The thermal head for chip-on-film package according to claim 1, wherein: the adjusting piece is a bolt in threaded connection with the positioning piece, and one end of the bolt penetrates through the positioning piece and abuts against the pressure head body.
8. The thermal head for chip-on-film package according to claim 7, wherein: and one end of the bolt, which deviates from the pressure head body, is provided with an inner hexagonal nut.
9. The thermal head for chip-on-film package according to claim 1, wherein: the bottom of pressure head body is formed with a plurality of vacuum adsorption holes, the vacuum adsorption hole extends the setting along the length direction of pressure head body, it sets up to go up the support piece the pressure head body is gone up and is deviated from one side in vacuum adsorption hole and with the position in vacuum adsorption hole is relative.
10. The thermal head for chip-on-film package according to claim 1, wherein: the pressure head body is also provided with a through hole penetrating along the length direction of the pressure head body, and the positioning piece is opposite to the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123007701.2U CN216671569U (en) | 2021-12-02 | 2021-12-02 | Hot-pressing head for chip-on-film packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123007701.2U CN216671569U (en) | 2021-12-02 | 2021-12-02 | Hot-pressing head for chip-on-film packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216671569U true CN216671569U (en) | 2022-06-03 |
Family
ID=81788542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123007701.2U Active CN216671569U (en) | 2021-12-02 | 2021-12-02 | Hot-pressing head for chip-on-film packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216671569U (en) |
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2021
- 2021-12-02 CN CN202123007701.2U patent/CN216671569U/en active Active
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