CN217011189U - Microphone structure and electronic equipment - Google Patents
Microphone structure and electronic equipment Download PDFInfo
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- CN217011189U CN217011189U CN202220699944.2U CN202220699944U CN217011189U CN 217011189 U CN217011189 U CN 217011189U CN 202220699944 U CN202220699944 U CN 202220699944U CN 217011189 U CN217011189 U CN 217011189U
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Abstract
The utility model discloses a microphone structure and electronic equipment, wherein the microphone structure comprises a shell, a sealing sleeve and a silicon microphone assembly, the shell is provided with an installation cavity and a sound hole communicated with the installation cavity, the sealing sleeve is arranged in the installation cavity and is in sealing butt joint with the inner wall of the installation cavity, the sealing sleeve is provided with a containing cavity and a sound passing hole communicated with the containing cavity, the sound passing hole is correspondingly communicated with the sound hole, the silicon microphone assembly is arranged in the containing cavity, and the silicon microphone assembly is provided with a sound hole corresponding to the sound passing hole. The utility model aims to provide a microphone structure which is simple to assemble and can effectively prevent sound leakage, effectively improves the sound insulation effect, and can avoid the influence of the internal vibration and other noises of the whole microphone on the performance of the microphone.
Description
Technical Field
The present invention relates to the field of acoustic design technologies, and in particular, to a microphone structure and an electronic device using the same.
Background
With the increasing popularity of artificial intelligence and speech enhancement technologies, silicon microphones are being used and developed in a great deal. The acoustic path of the silicon microphone needs to be sealed to prevent acoustic leakage from affecting the microphone performance. In the related art, the shell of the microphone and the component is thin, so that the sound insulation effect in the whole machine is not ideal, and the performance of the microphone is easily influenced by the internal vibration and other noises of the whole machine. And the complexity of microphone and complete machine assembly is difficult for troubleshooting the problem point, also is difficult for maintaining and changing the microphone subassembly to bring bigger quality risk.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a microphone structure and electronic equipment, and aims to provide the microphone structure which is simple to assemble and can effectively prevent sound leakage.
In order to achieve the above object, the present invention provides a microphone structure, including:
the sound hole is communicated with the mounting cavity;
the sealing sleeve is sleeved in the mounting cavity and is in sealing butt joint with the inner wall of the mounting cavity, the sealing sleeve is provided with a containing cavity and a sound passing hole communicated with the containing cavity, and the sound passing hole is correspondingly communicated with the sound hole; and
the silicon microphone assembly is arranged in the containing cavity and is provided with a sound hole corresponding to the sound passing hole.
In one embodiment, the sealing sleeve is provided with a mounting gap, and the mounting gap is communicated with the accommodating cavity and is spaced from the sound passing hole;
wherein, the silicon microphone assembly is arranged in the containing cavity through the mounting gap.
In one embodiment, the sealing sleeve comprises a base and an upper cover, one end of the upper cover is integrally connected with the base, the upper cover and the base enclose to form the accommodating cavity and the mounting gap, and the upper cover is provided with the sound passing hole;
the silicon microphone assembly is in sealing and abutting connection with the upper cover.
In one embodiment, the base is provided with two mounting notches which are communicated with the accommodating cavity and the mounting gap, and the two mounting notches are positioned at two opposite sides of the base;
the silicon-wheat assembly comprises a main circuit board and a silicon-wheat monomer, the main circuit board and the silicon-wheat monomer are arranged in the containing cavity, two ends of the main circuit board respectively penetrate through the two installation notches, and the silicon-wheat monomer is arranged on the main circuit board and is electrically connected with the main circuit board;
the silicon microphone monomer is provided with the sound holes corresponding to the sound passing holes; or, the main circuit board is provided with a first sound hole corresponding to the sound passing hole, the silicon microphone monomer is provided with a second sound hole corresponding to the first sound hole, and the second sound hole is correspondingly communicated with the first sound hole to form the sound hole.
In an embodiment, one side of the main circuit board, which is opposite to the silicon microphone body, is in sealing abutment with the upper cover, two ends of the main circuit board respectively penetrate through the two mounting notches and are clamped between the base and the upper cover, the main circuit board is provided with the first sound hole corresponding to the sound passing hole, and the silicon microphone body is provided with the second sound hole corresponding to the first sound hole.
In one embodiment, the silicon monomer includes:
the silicon microphone circuit board is arranged on one side, back to the upper cover, of the main circuit board and is electrically connected with the main circuit board, and the silicon microphone circuit board is provided with the second sound hole corresponding to the first sound hole;
the protective shell is arranged on one side, back to the main circuit board, of the silicon microphone circuit board and surrounds the silicon microphone circuit board to form an accommodating cavity; and
and the chip is arranged on one side, facing the protective shell, of the silicon microphone circuit board and is positioned in the accommodating cavity, and the chip corresponds to the second sound hole and is electrically connected with the silicon microphone circuit board.
In an embodiment, the microphone structure further includes a waterproof member, and the waterproof member is disposed between the sealing sleeve and the inner wall of the mounting cavity and covers the sound hole and the sound passing hole.
In one embodiment, a mounting groove is formed in one side, facing the sound hole, of the sealing sleeve, the sound passing hole penetrates through the bottom wall of the mounting groove, and the waterproof piece is accommodated and limited in the mounting groove;
and/or the waterproof piece is made into a waterproof membrane by adopting a waterproof sound-transmitting material;
and/or the waterproof piece is connected to the sealing sleeve through adhesive tape or double-sided adhesive tape;
and/or the sealing sleeve is made of flexible sealing materials.
In one embodiment, the housing includes:
the casing is provided with a limiting groove and a connecting column, the connecting column is spaced from the limiting groove, and the sound hole penetrates through the bottom wall of the limiting groove; and
the rear shell is opposite to the outer shell and provided with an accommodating groove and a connecting lug, the accommodating groove is opposite to the limiting groove, and the connecting lug is provided with a connecting hole corresponding to the connecting column;
the connecting column penetrates through the connecting hole, the limiting groove and the accommodating groove are matched to form the mounting cavity, and two ends of the sealing sleeve are respectively limited in the limiting groove and the accommodating groove in a sealing mode.
The utility model also provides electronic equipment which comprises an equipment main body and the microphone structure, wherein the microphone structure is connected with the equipment main body.
According to the microphone structure, the sealing sleeve is arranged in the mounting cavity of the shell, and the sealing sleeve is sleeved outside the silicon microphone assembly, so that the sound hole of the silicon microphone assembly is just communicated with the sound hole of the shell through the sound passing hole of the sealing sleeve, the silicon microphone assembly can receive sound through the sound hole, the sealing sleeve can be used for sealing the silicon microphone assembly, and the sealing performance of water resistance and sound leakage is improved; meanwhile, the sealing sleeve is in sealing butt joint with the inner wall of the shell mounting cavity, so that the risk of sound leakage between the sealing sleeve and the inner wall of the mounting cavity is further avoided after sound enters the sound hole, and the sound is effectively ensured to enter the sound hole of the silicon microphone assembly through the sound hole and the sound passing hole; furthermore, the sealing sleeve is sleeved outside the silicon microphone assembly, so that the sealing sleeve can be used for shielding the internal vibration of the whole microphone and isolating the influence of other noises on the silicon microphone assembly, and the performance of the microphone is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a microphone structure according to an embodiment of the utility model;
fig. 2 is a schematic structural diagram of another perspective of the microphone structure according to an embodiment of the present invention;
FIG. 3 is an exploded view of a microphone structure according to an embodiment of the utility model;
fig. 4 is a schematic cross-sectional view of a microphone structure according to an embodiment of the utility model.
The reference numbers illustrate:
the implementation, functional features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
Also, the meaning of "and/or" and/or "appearing throughout is meant to encompass three scenarios, exemplified by" A and/or B "including scenario A, or scenario B, or scenarios where both A and B are satisfied.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
With the increasing popularity of artificial intelligence and speech enhancement technologies, silicon microphones are being used and developed in a great deal. The silicon microphone has higher and higher requirements on water resistance, the more complicated and complicated water-proof design is, the water resistance is also the sealing for the acoustic path, and the complicated sealing design causes the inconvenience of maintenance of the electronic product.
It will be appreciated that the acoustic path of the silicon microphone needs to be sealed to prevent acoustic leakage from affecting the microphone performance. In the related art, the shell of the microphone and the component is thin, so that the sound insulation effect in the whole machine is not ideal, and the performance of the microphone is easily influenced by the internal vibration and other noises of the whole machine. And the complexity of microphone and complete machine assembly is difficult for troubleshooting the problem point, also is difficult for maintaining and changing the microphone subassembly to bring bigger quality risk. Such problems may degrade the performance of the microphone, especially the microphone array, and may not achieve the desired noise reduction and speech recognition effects. In addition, the whole product cannot or is inconvenient to maintain when the microphone has problems.
Based on the above-mentioned concepts and problems, the present invention proposes a microphone structure 100. The microphone structure 100 is a modular design for the sealing and securing structure. It will be appreciated that the microphone structure 100 applies to electronic devices. The electronic device may be an electronic product for receiving sound, such as an earphone, a mobile phone, and a sound box, and is not limited herein.
Referring to fig. 1 to 4, in an embodiment of the present invention, the microphone structure 100 includes a housing 1, a sealing sleeve 2, and a silicon microphone assembly 3, where the housing 1 is provided with an installation cavity 11 and a sound hole 121 communicating with the installation cavity 11, the sealing sleeve 2 is disposed in the installation cavity 11 and is in sealing contact with an inner wall of the installation cavity 11, the sealing sleeve 2 is provided with a containing cavity 22 and a sound passing hole 21 communicating with the containing cavity 22, the sound passing hole 21 is correspondingly communicated with the sound hole 121, the silicon microphone assembly 3 is disposed in the containing cavity 22, and the silicon microphone assembly 3 is provided with a sound hole 31 corresponding to the sound passing hole 21.
In this embodiment, the casing 1 of the microphone structure 100 plays a role of protecting, installing and fixing the sealing sleeve 2 and the silicon microphone assembly 3, and the structure of the casing 1 may be a box body, or an installation structure having an installation cavity 11 such as a cavity or a cavity, and the like, which is not limited herein. It can be understood that, in order to improve the structural strength of the housing 1 and protect the housing 1, the housing 1 may be made of a metal material or a hard material. Of course, the housing 1 may be made of plastic for aesthetic appearance, weight reduction and cost reduction, and is not limited herein.
It will be appreciated that the housing 1 may be of unitary construction, so as to improve the sealing and waterproofing properties of the mounting cavity 11 of the housing 1. Certainly, the housing 1 may also adopt a split structure, as shown in fig. 1 to 4, the housing 1 includes a housing 12 and a rear housing 13, and the housing 12 and the rear housing 13 may be connected into a whole in a fixed connection or a detachable connection manner, so that the housing 12 and the rear housing 13 enclose and form a mounting cavity 11, and the mounting cavity 11 may be a sealed cavity or a cavity structure communicating with the outside, which is not limited herein.
In this embodiment, by providing the sealing sleeve 2, the sealing sleeve 2 has the cavity 22, so that the cavity 22 of the sealing sleeve 2 is conveniently utilized to install and mount the silicon microphone assembly 3, that is, the sealing sleeve 2 is sleeved outside the silicon microphone assembly 3, so that the silicon microphone assembly 3 and the sealing sleeve 2 form a modular structure, the sealing sleeve 2 can be utilized to seal the silicon microphone assembly 3, and the modular structure formed by the silicon microphone assembly 3 and the sealing sleeve 2 can be conveniently mounted in the mounting cavity 11 of the housing 1, thereby simplifying the mounting structure of the microphone structure 100, and improving the water-proof and sound-leaking tightness of the microphone structure 100.
It will be understood that the silicon microphone assembly 3 generally comprises a MEMS chip and an ASIC (application specific Integrated Circuit) chip electrically connected thereto, wherein the MEMS chip comprises a substrate and a diaphragm and a back electrode fixed to the substrate, the diaphragm and the back electrode forming a capacitor and being Integrated on a silicon wafer. The sound hole 121 penetrates through the housing 1 and is communicated with the mounting cavity 11, so that sound enters from the sound hole 121 of the housing 1, enters the silicon microphone component 3 through the sound passing hole 21 of the sealing sleeve 2 and the sound hole 31 of the silicon microphone component 3, acts on the vibrating diaphragm of the MEMS chip, and changes the distance between the vibrating diaphragm and the back electrode through the vibration of the vibrating diaphragm, thereby converting a sound signal into an electric signal.
According to the microphone structure 100, the sealing sleeve 2 is arranged in the mounting cavity 11 of the shell 1, and the sealing sleeve 2 is sleeved outside the silicon microphone assembly 3, so that the sound hole 31 of the silicon microphone assembly 3 is just communicated with the sound hole 121 of the shell 1 through the sound passing hole 21 of the sealing sleeve 2, the silicon microphone assembly 3 can receive sound through the sound hole 121, the sealing sleeve 2 can be used for sealing the silicon microphone assembly 3, and the water-proof and sound leakage tightness is improved; meanwhile, the sealing sleeve 2 is in sealing butt joint with the inner wall of the mounting cavity 11 of the shell 1, so that the risk of sound leakage between the sealing sleeve 2 and the inner wall of the mounting cavity 11 is further avoided after the sound enters the sound hole 121, the sound is effectively ensured to enter the sound hole 31 of the silicon microphone assembly 2 through the sound hole 121 and the sound passing hole 21, and the sound leakage phenomenon is avoided; further, the sealing sleeve 2 is sleeved outside the silicon microphone assembly 3, so that the sealing sleeve 2 can be used for shielding the internal vibration of the whole microphone and isolating the influence of other noises on the silicon microphone assembly 3, and the microphone performance is improved.
In one embodiment, the sealing sleeve 2 is provided with a mounting gap 23, and the mounting gap 23 is communicated with the accommodating cavity 22 and is spaced from the sound passing hole 21; wherein, the silicon microphone assembly 3 is installed in the cavity 22 through the installation gap 23.
In the present embodiment, as shown in fig. 2 and 3, by providing the mounting gap 23 on the sealing sleeve 2, the silicon microphone assembly 3 can be conveniently mounted in the cavity 22 through the mounting gap 23. It is understood that the mounting slot 23 may be a slit or a narrow hole structure formed by cutting, and is not limited herein.
It will be appreciated that in order to ensure that the silicon microphone assembly 3 is mounted in the receiving space 22 of the sealing sleeve 2 via the mounting slot 23 without damaging the silicon microphone assembly 3. Optionally, the sealing sleeve 2 is made of flexible sealing material. For example, the sealing sleeve 2 is made of plastic, rubber, or silica gel, and is not limited herein.
In one embodiment, the sealing sleeve 2 comprises a base 24 and an upper cover 25, one end of the upper cover 25 is integrally connected with the base 24, the upper cover 25 and the base 24 enclose to form a cavity 22 and a mounting gap 23, and the upper cover 25 is provided with a sound passing hole 21; the silicon microphone assembly 3 is in sealing abutment with the upper cover 25.
In this embodiment, as shown in fig. 2 to 4, by arranging the sealing sleeve 2 as the base 24 and the upper cover 25, the base 24 has a cavity structure, one side of the upper cover 25 is connected with the base 24 as an integrated piece, that is, the other sides of the upper cover 25 are not connected with the base 24, at this time, the upper cover 25 covers the opening of the cavity structure of the base 24, so that the upper cover 25 and the base 24 enclose the cavity 22, and the other sides of the upper cover 25 and the end of the base 24 form the mounting gap 23, for example, when the silicon microphone assembly 3 is mounted, the cavity structure opening of the base 24 is opened by the flexible or soft upper cover 25 through the mounting gap 23, and then the cavity structure opening of the base 24 is covered by the upper cover 25, so as to facilitate the mounting of the silicon microphone assembly 3.
It can be understood that, in order to further avoid the occurrence of the sound leakage phenomenon, the silicon microphone assembly 3 is installed in the cavity 22 of the sealing sleeve 2, and the silicon microphone assembly 3 is in sealing abutment with the upper cover 25, for example, in this case, the implementation is realized by gluing or pressing, and the like, which is not limited herein. In this embodiment, the upper cover 25 of the sealing sleeve 2 is provided with a sound passing hole 21, and at this time, a sound hole 31 is formed on the side of the silicon microphone assembly 3 installed in the cavity 22, which is hermetically connected with the upper cover 25, corresponding to the sound passing hole 21.
In one embodiment, the base 24 is provided with two mounting notches 26 communicating the accommodating cavity 22 and the mounting slit 23, and the two mounting notches 26 are located at two opposite sides of the base 24; the silicon-wheat assembly 3 comprises a main circuit board 32 and a silicon-wheat monomer 33 which are arranged in the cavity 22, two ends of the main circuit board 32 are respectively arranged in the two mounting notches 26 in a penetrating manner, and the silicon-wheat monomer 33 is arranged on the main circuit board 32 and is electrically connected with the main circuit board 32; the silicon microphone monomer 33 is provided with a sound hole 31 corresponding to the sound passing hole 21; alternatively, the main circuit board 32 is provided with a first tone hole 321 corresponding to the sound passing hole 21, the silicon microphone 33 is provided with a second tone hole 3311 corresponding to the first tone hole 321, the second tone hole 3311 is communicated with the first tone hole 321 correspondingly, and a tone hole 31 is formed.
In this embodiment, in order to further ensure that the silicon microphone assembly 3 is hermetically connected to the upper cover 25, two mounting notches 26 are disposed on the base 24, and the two mounting notches 26 are located on two opposite sides of the base 24, which are not integrally connected to the upper cover 25, so that when the silicon microphone assembly 3 is installed in the accommodating cavity 22, two ends of the circuit board 32 of the silicon microphone assembly 3 respectively penetrate through the two mounting notches 26, that is, the mounting notches 26 can be used to achieve positioning and mounting of the silicon microphone assembly 3, and it can be ensured that the silicon microphone assembly 3 enables the main circuit board 32 to be electrically connected and conducted with the circuit of the whole machine through the mounting notches 26, and certainly, the mounting notches 26 of the base 24 can also be used to achieve a certain degree of supporting effect on the main circuit board 32.
It can be understood that the silicon microphone assembly 3 may be a bottom type or Top type microphone, and in order to ensure that the sound hole 31 of the silicon microphone assembly 3 is correspondingly communicated with the sound passing hole 21 of the sealing sleeve 2 and avoid sound leakage, the sound hole 31 may be provided in the silicon microphone single body 33; alternatively, the sound hole 31 is formed in the main circuit board 32, and the sound hole 31 is formed by matching the first sound hole 321 of the main circuit board 32 and the second sound hole 3311 of the silicon microphone unit 33, which is not limited herein.
In this embodiment, the main circuit board 32 may be selected as a hard circuit board for implementing control and signal transmission.
In an embodiment, as shown in fig. 3 and 4, a side of the main circuit board 32 facing away from the silicon microphone unit 33 is in sealing contact with the upper cover 25, two ends of the main circuit board 32 respectively penetrate through the two mounting notches 26 and are sandwiched between the base 24 and the upper cover 25, the main circuit board 32 is provided with a first sound hole 321 corresponding to the sound passing hole 21, and the silicon microphone unit 33 is provided with a second sound hole 3311 corresponding to the first sound hole 321.
In this embodiment, the main circuit board 32 is attached to the upper cover 25 of the sealing sleeve 2 in a sealing manner, and two ends of the main circuit board 32 respectively penetrate through the two mounting notches 26 and are clamped between the base 24 and the upper cover 25, so as to further ensure the sealing performance between the upper cover 25 of the sealing sleeve 2 and the main circuit board 32, and prevent the sound from leaking between the upper cover 25 and the main circuit board 32 after entering from the first sound hole 321, so as to ensure that the sound all enters the second sound hole 3311 from the first sound hole 321, and thus enters the silicon microphone unit 33.
In an embodiment, the silicon microphone unit 33 includes a silicon microphone circuit board 331, a protective shell 332 and a chip 334, wherein the silicon microphone circuit board 331 is disposed on a side of the main circuit board 32 opposite to the upper cover 25 and electrically connected to the main circuit board 32, the silicon microphone circuit board 331 is provided with a second sound hole 3311 corresponding to the first sound hole 321, the protective shell 332 is disposed on a side of the silicon microphone circuit board 331 opposite to the main circuit board 32 and encloses with the silicon microphone circuit board 331 to form an accommodating cavity 333, the chip 334 is disposed on a side of the silicon microphone circuit board 331 opposite to the protective shell 332 and located in the accommodating cavity 333, and the chip 334 is disposed corresponding to the second sound hole 3311 and electrically connected to the silicon microphone circuit board 331.
In this embodiment, as shown in fig. 4, the silicon microphone circuit board 331 of the silicon microphone unit 33 may be a hard circuit board or a flexible circuit board, and the silicon microphone circuit board 331 is used for implementing control and signal transmission of the chip 334. It will be appreciated that the chip 334 may be a MEMS chip and/or an ASIC chip, the chip 334 including a substrate and a diaphragm and a back-plate fixed to the substrate, the diaphragm and the back-plate constituting a capacitor and being integrated on a silicon wafer of the silicon microphone board 331. The chip 334 is used to convert the sound signal into an electrical signal, thereby achieving electrical signal transmission through the silicon microphone circuit board 331 and the main circuit board 32.
As shown in fig. 4, the main circuit board 32 and the silicon microphone board 331 are stacked, and the chip 334 is disposed on a side of the silicon microphone board 331 opposite to the main circuit board 32. The protective shell 332 is connected to the silicon microphone circuit board 331 and encloses to form an accommodating cavity 333. As will be appreciated, the main circuit board 32 is used to power the silicon microphone body 33 and provide a microphone signal transmission channel. The silicon microphone circuit board 331 is used to transmit the electrical signal converted by the chip 334 to the main circuit board 32.
In the present embodiment, the sound holes 31 include a first sound hole 321 opened in the main circuit board 32 and a second sound hole 3311 opened in the silicon microphone circuit board 331, and the first sound hole 321 and the second sound hole 3311 are disposed opposite to the sound passing hole 21 of the sealing sleeve 2. That is, the sound hole 121, the sound passing hole 21, the first sound hole 321 and the second sound hole 3311 are coaxially disposed and are sequentially and oppositely communicated.
In an embodiment, the microphone structure 100 further includes a waterproof member 4, and the waterproof member 4 is disposed between the sealing sleeve 2 and the inner wall of the mounting cavity 11 and covers the sound hole 121 and the sound passing hole 21.
In order to prevent water droplets and the like from entering the mounting cavity 11 of the housing 1 from the sound hole 121 and thereby affecting the performance of the silicon microphone assembly 3. As shown in fig. 3 and 4, the waterproof 4 is provided between the sound hole 121 and the sound transmitting hole 21. It is understood that the waterproof member 4 can prevent water drops and the like from entering the silicone single body 33 through the sound through hole 21 and the tone hole 31 to affect the performance of the silicone single body 33, but the waterproof member 4 can allow sound to pass smoothly.
Optionally, the waterproof member 4 is made of a waterproof sound-transmitting material to form a waterproof membrane. It is understood that the waterproof member 4 may be disposed in the sound hole 121, the sound passing hole 21, or the sound hole 31, which is not limited herein. In this embodiment, the flashing 4 may be arranged between the sealing sleeve 2 and the inner wall of the installation cavity 11.
In one embodiment, as shown in fig. 3 and 4, a mounting groove 27 is formed on one side of the sealing sleeve 2 facing the sound hole 121, the sound passing hole 21 penetrates through a bottom wall of the mounting groove 27, and the waterproof member 4 is accommodated and limited in the mounting groove 27.
In this embodiment, a mounting groove 27 is formed in one side, facing the sound hole 121, of the upper cover 25 of the sealing sleeve 2, so that the waterproof member 4 is positioned and mounted in a limited manner by using the mounting groove 27, and a gap is prevented from occurring between the upper cover 25 of the sealing sleeve 2 and the inner wall of the mounting cavity 11 by the waterproof member 4, so that sound leakage and other phenomena occur. It is understood that the mounting groove 27 may be provided on the inner wall of the mounting cavity 11 of the housing 1, and the sound hole 121 is formed through the bottom wall of the mounting groove 27.
In the present embodiment, in order to further improve the mounting stability of the waterproof member 4, the waterproof member 4 is connected to the sealing sleeve 2 by an adhesive tape or a double-sided tape 5. As shown in fig. 3 and 4, the double-sided adhesive tape 5 is disposed in a circular ring shape, and the waterproof member 4 is fixedly disposed in the mounting groove 27 through the circular double-sided adhesive tape 5, and at this time, the double-sided adhesive tape 5 is disposed around the sound emission hole 21.
In order to further prevent impurities such as dust from entering the mounting cavity 11 of the housing 1 through the sound hole 121 and affecting the performance of the silicon microphone assembly 3, a dust screen may be disposed between the sound hole 121 and the sound passing hole 21. It will be appreciated that the dust screen may be a gauze or dust grid structure or the like. The dust screen has a plurality of pores, which may facilitate sound to pass through the pores.
It is understood that the dust screen may be disposed in the sound hole 121, or may be disposed in the sound passing hole 21 or the sound hole 31. Of course, the dust screen may be disposed between the upper cover 25 of the sealing sleeve 2 and the inner wall of the mounting cavity 11, which is not limited herein.
In the present embodiment, in order to improve the electrostatic shielding effect of the microphone structure 100 and protect the silicon microphone component 3, in the present embodiment, the microphone structure 100 includes a shielding cover or a shielding mesh, and the shielding cover or the shielding mesh may be disposed at intervals in the sound hole 121, or may be disposed on the sound passing hole 21 and the sound hole 31, which is not limited herein. Of course, in other embodiments, the shielding can may also be formed by stacking multiple layers of metal materials, which is not limited herein.
It can be understood that the shielding case is used for shielding static electricity and preventing the static electricity from entering the silicon microphone assembly 3 from the sound hole 121 and the sound passing hole 21, thereby preventing damage to the silicon microphone assembly 3 when the static electricity is released. In this embodiment, the shielding case is made of metal. The shield can be disposed inside the sound hole 121 and covers the sound hole 121, that is, the periphery of the shield is connected to the hole wall of the sound hole 121, thereby shielding static electricity entering the sound hole 121. Optionally, the shield is integrally formed in the sound hole 121 of the housing 1. Of course, the shield cover may be provided in the sound passing hole 21 or the sound hole 31, and is not limited thereto as long as it can shield static electricity entering from the sound hole 121.
In one embodiment, the casing 1 includes an outer casing 12 and a rear casing 13, wherein the outer casing 12 is provided with a limiting groove 122 and a connecting column 123, the connecting column 123 is spaced from the limiting groove 122, the sound hole 121 penetrates through a bottom wall of the limiting groove 122, the rear casing 13 is opposite to the outer casing 12, the rear casing 13 is provided with a containing groove 131 and a connecting lug 132, the containing groove 131 is opposite to the limiting groove 122, and the connecting lug 132 is provided with a connecting hole 133 corresponding to the connecting column 123; the connecting column 123 is disposed through the connecting hole 133, so that the limiting groove 122 and the accommodating groove 131 cooperate to form the mounting cavity 11, and two ends of the sealing sleeve 2 are sealed and limited in the limiting groove 122 and the accommodating groove 131 respectively.
In the present embodiment, as shown in fig. 1 to 4, by providing the housing 1 as a two-part structure of the outer shell 12 and the rear shell 13, the assembly of the module formed by the silicon microphone assembly 3 and the sealing sleeve 2 is facilitated, and the assembly effect is improved. It can be understood that, by arranging the limiting groove 122 on the side of the outer shell 12 facing the rear shell 13 and arranging the accommodating groove 131 on the side of the rear shell 13 facing the outer shell 12, the accommodating groove 131 is opposite to the limiting groove 122, so that the sealing sleeve 2 is positioned and mounted in a limiting manner by using the limiting groove 122 and the accommodating groove 131, and meanwhile, the sound hole 121 of the outer shell 12 is ensured to be communicated with the sound passing hole 21 of the sealing sleeve 2.
It can be understood that, through set up spliced pole 123 in the one side that shell 12 faced back shell 13 to the storage tank 131 periphery at back shell 13 sets up engaging lug 132, makes engaging lug 132 correspond spliced pole 123 and is equipped with connecting hole 133, so usable spliced pole 123 wears to locate in connecting hole 133, realizes that shell 12 and back shell 13's connection is fixed, and makes spacing groove 122 and storage tank 131 cooperation form installation cavity 11.
In this embodiment, shell 12 and the backshell 13 of casing 1 adopt the connected mode that spliced pole 123 wore to locate in the connecting hole 133, realize on the one hand that shell 12 and backshell 13 are connected fixedly, and on the other hand, usable shell 12 and backshell 13 extrude each other and make the spacing groove 122 bottom of shell 12 and the upper cover 25 of seal cover 2 realize sealing connection, avoid sound to get into the sound hole 121 after, reveal from between spacing groove 122 bottom and the upper cover 25 of seal cover 2. Meanwhile, the mounting gap 23 of the sealing sleeve 2 is in a sealed closed state by mutual extrusion of the outer shell 12 and the rear shell 13, the main circuit board 32 at the mounting notch 26 is clamped by the upper cover 25 of the sealing sleeve 2 and the base 24, and the main circuit board 32 is ensured to be in sealed connection with the upper cover 25 of the sealing sleeve 2, so that the leakage between the main circuit board 32 and the upper cover 25 of the sealing sleeve 2 after sound enters the sound passing hole 21 is further avoided.
The microphone structure 100 of the present invention is configured to package the sealing sleeve 2 outside the silicon microphone assembly 3, so that the sealing sleeve 2 and the silicon microphone assembly 3 form an independent microphone module. The silicon microphone module is assembled in a whole machine product, the whole machine circuit is electrically connected with the main circuit board 32 of the silicon microphone assembly 3 through the elastic piece or the Pogo pin, the maintainability is good, and the module can be directly replaced or a part of the module can be directly replaced to achieve the purpose of maintenance.
The utility model also provides an electronic device, which comprises a device body and the microphone structure 100, wherein the microphone structure 100 is connected with the device body. The specific structure of the microphone structure 100 refers to the foregoing embodiments, and since the electronic device adopts all the technical solutions of all the foregoing embodiments, at least all the beneficial effects brought by the technical solutions of the foregoing embodiments are achieved, and no further description is given here.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A microphone structure, characterized in that the microphone structure comprises:
the sound hole is communicated with the mounting cavity;
the sealing sleeve is sleeved in the mounting cavity and is in sealing butt joint with the inner wall of the mounting cavity, the sealing sleeve is provided with a containing cavity and a sound passing hole communicated with the containing cavity, and the sound passing hole is correspondingly communicated with the sound hole; and
the silicon microphone assembly is arranged in the containing cavity and is provided with a sound hole corresponding to the sound passing hole.
2. The microphone structure of claim 1, wherein the sealing sleeve is provided with a mounting gap, the mounting gap is communicated with the cavity and is spaced from the sound passing hole;
wherein, the silicon microphone assembly is arranged in the containing cavity through the mounting gap.
3. The microphone structure as claimed in claim 2, wherein the sealing sleeve comprises a base and an upper cover, one end of the upper cover is integrally connected with the base, the upper cover and the base enclose the cavity and the mounting gap, and the upper cover is provided with the sound passing hole;
the silicon microphone assembly is in sealing and abutting connection with the upper cover.
4. The microphone structure according to claim 3, wherein the base is provided with two mounting notches communicating the cavity and the mounting gap, the two mounting notches being located on opposite sides of the base;
the silicon-wheat assembly comprises a main circuit board and a silicon-wheat monomer, the main circuit board and the silicon-wheat monomer are arranged in the containing cavity, two ends of the main circuit board respectively penetrate through the two installation notches, and the silicon-wheat monomer is arranged on the main circuit board and is electrically connected with the main circuit board;
the silicon microphone monomer is provided with the sound holes corresponding to the sound passing holes; or, the main circuit board is provided with a first sound hole corresponding to the sound passing hole, the silicon microphone monomer is provided with a second sound hole corresponding to the first sound hole, and the second sound hole is correspondingly communicated with the first sound hole and forms the sound hole.
5. The microphone structure of claim 4, wherein a side of the main circuit board facing away from the silicon microphone unit is in sealing contact with the upper cover, two ends of the main circuit board respectively penetrate through the two mounting notches and are clamped between the base and the upper cover, the main circuit board is provided with the first sound hole corresponding to the sound passing hole, and the silicon microphone unit is provided with the second sound hole corresponding to the first sound hole.
6. The microphone structure of claim 5, wherein the silicon microphone body comprises:
the silicon microphone circuit board is arranged on one side, back to the upper cover, of the main circuit board and is electrically connected with the main circuit board, and the silicon microphone circuit board is provided with the second sound hole corresponding to the first sound hole;
the protective shell is arranged on one side, back to the main circuit board, of the silicon microphone circuit board and surrounds the silicon microphone circuit board to form an accommodating cavity; and
and the chip is arranged on one side, facing the protective shell, of the silicon microphone circuit board and is positioned in the accommodating cavity, and the chip corresponds to the second sound hole and is electrically connected with the silicon microphone circuit board.
7. The microphone structure according to any one of claims 1 to 6, further comprising a waterproof member provided between the seal sleeve and the inner wall of the mounting chamber and covering the sound hole and the sound transmission hole.
8. The microphone structure of claim 7, wherein a mounting groove is formed in a side of the sealing sleeve facing the sound hole, the sound passing hole penetrates through a bottom wall of the mounting groove, and the waterproof member is accommodated and limited in the mounting groove;
and/or the waterproof piece is made into a waterproof membrane by adopting a waterproof sound-transmitting material;
and/or the waterproof piece is connected to the sealing sleeve through an adhesive or a double-sided adhesive;
and/or the sealing sleeve is made of flexible sealing materials.
9. The microphone structure of claim 7, wherein the housing comprises:
the casing is provided with a limiting groove and a connecting column, the connecting column is spaced from the limiting groove, and the sound hole penetrates through the bottom wall of the limiting groove; and
the rear shell is opposite to the outer shell and provided with an accommodating groove and a connecting lug, the accommodating groove is opposite to the limiting groove, and the connecting lug is provided with a connecting hole corresponding to the connecting column;
the connecting column penetrates through the connecting hole, the limiting groove and the accommodating groove are matched to form the mounting cavity, and two ends of the sealing sleeve are respectively sealed and limited in the limiting groove and the accommodating groove.
10. An electronic device, comprising a device body and a microphone structure according to any one of claims 1 to 9, the microphone structure being connected to the device body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220699944.2U CN217011189U (en) | 2022-03-28 | 2022-03-28 | Microphone structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220699944.2U CN217011189U (en) | 2022-03-28 | 2022-03-28 | Microphone structure and electronic equipment |
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| Publication Number | Publication Date |
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| CN217011189U true CN217011189U (en) | 2022-07-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220699944.2U Active CN217011189U (en) | 2022-03-28 | 2022-03-28 | Microphone structure and electronic equipment |
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| Country | Link |
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| CN (1) | CN217011189U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025138288A1 (en) * | 2023-12-29 | 2025-07-03 | 深圳市韶音科技有限公司 | Acoustic device |
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2022
- 2022-03-28 CN CN202220699944.2U patent/CN217011189U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025138288A1 (en) * | 2023-12-29 | 2025-07-03 | 深圳市韶音科技有限公司 | Acoustic device |
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