CN217238465U

CN217238465U - Optical module

Info

Publication number: CN217238465U
Application number: CN202220431935.5U
Authority: CN
Inventors: 路绪刚
Original assignee: HEBEI HYMAX OPTOELECTRONIC Inc
Current assignee: HEBEI HYMAX OPTOELECTRONIC Inc
Priority date: 2022-03-02
Filing date: 2022-03-02
Publication date: 2022-08-19
Anticipated expiration: 2032-03-02

Abstract

The application provides an optical module, including: the upper cover is provided with a heat conduction platform and a containing groove, the bottom shell is provided with a heat dissipation surface, the upper cover and the bottom shell are connected and assembled through screws to form an optical module cavity for containing the heat conduction plate, the circuit board and the light emission secondary module, the heat conduction plate is provided with a mounting surface and a heat conduction surface, heat conduction glue is coated between the heat conduction surface and the heat conduction platform, the heat conduction plate is pasted on the heat conduction platform, redundant heat conduction glue flows in the containing groove after extrusion, and the light emission secondary module is mounted on the mounting surface and is connected with the circuit board through gold wire bonding. In the embodiment of the application, the accommodating groove accommodates redundant heat-conducting glue, so that the redundant heat-conducting glue is prevented from flowing into the light emission submodule to influence or damage the light emission submodule; the heat of the transmitter optical subassembly is quickly and effectively conducted to the cavity of the optical module through the heat conducting plate, and then the heat of the cavity of the optical module is dissipated to the atmosphere through the radiator tightly attached to the radiating surface.

Description

Optical module

Technical Field

The utility model relates to an optical communication technical field especially relates to an optical module.

Background

The steady development of the global telecommunication industry and the steady growth of broadband users lay a solid foundation for the development of the optical communication industry. With the continuous improvement of global bandwidth demand and the expansion of data centers and application fields of security monitoring optical communication industries, optical fiber broadband access has become a mainstream communication mode. Under the promotion of popularization of terminals such as smart phones and the like and applications such as video and cloud computing and the like, telecom operators continuously invest in building and upgrading mobile broadband and optical fiber broadband networks, and the investment scale of optical communication equipment is further expanded.

The rapid development of the optical communication industry drives the updating of the optical module. Under the market competition environment where optical communication is increasingly intense at present, the demand of communication equipment for reducing the size of the equipment and increasing the interface density is also increasing. To meet this demand, optical modules are also being developed in a small package with high integration. The QSFP (Small Form-factor Pluggable optical module), QSFP +, CFP/CFP2/CFP4, QSFP28, QSFP-DD and the like are all optical modules with Small-sized Pluggable high-density interfaces, at present, the QSFP28 optical module is provided with four electric channels, the running speed of each channel is 10Gbps or 25Gbps, 40G and 100G Ethernet applications are supported, the number of the channels of a brand-new product FP-DD (Pluggable dual-density) optical module is increased to 8, the running speed of each channel is increased to 25Gbps through MRZ modulation or 50Gbps through PAM4 modulation, and therefore 200Gbps or 400Gbps are supported. The QSFP-DD optical module can meet or exceed the requirements of high-speed enterprise, telecommunication and data network equipment on the density of Ethernet, optical fiber channels and InfiniBand ports, thereby meeting the continuously improved requirements on 200Gbps and 400Gbps network solutions. The high-speed and high-power optical module generates much heat during working, the stable work of the optical module can be ensured only by timely dissipating the heat, heat conducting glue needs to be smeared between the optical module and the shell to enable the heat generated by the optical module to be timely and effectively conducted on the shell, and redundant heat conducting glue flows in the optical module easily after being extruded, so that the work of the optical module is influenced or the optical module is damaged, and therefore the problem that the redundant heat conducting glue flows needs to be solved by the optical module.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model aims at providing an optical module to solve the heat conduction glue trickling problem of present high-power high-rate optical module.

In order to achieve the above object, an embodiment of the present invention provides an optical module, including: upper cover, drain pan, heat-conducting plate, circuit board and transmitter optical subassembly.

The upper cover is provided with a heat conduction table and a containing groove, and the containing groove is an annular groove arranged on the upper surface of the heat conduction table, so that heat conduction glue coated on the surface of the heat conduction table can flow into the containing groove from the 360-degree direction of the surface of the heat conduction table after being extruded by the heat conduction plate;

the bottom shell and the upper cover are connected and assembled by adopting screws to form an optical module cavity, the optical module cavity is used for accommodating the heat-conducting plate, the circuit board and the light emission secondary module, and a heat dissipation surface is arranged;

the circuit board is provided with a through hole;

the heat conducting plate is provided with a heat conducting surface and a mounting surface, the light emission secondary module is mounted and adhered to the mounting surface, after heat conducting glue is coated between the heat conducting surface and the heat conducting platform, the mounted and adhered heat conducting plate and the light emission secondary module penetrate through the through hole and are mounted on the heat conducting platform, and redundant heat conducting glue is accommodated in the accommodating groove after being extruded;

the light emission secondary module is used for converting the electric signal of the optical module into an optical signal and is connected with the circuit board by gold wire bonding.

In the optical module, the bottom case is provided with a locking surface, and after the optical module is inserted into the cage, the locking surface is blocked by the locking plate of the cage, so that the optical module is locked in the cage in an inserting manner.

In the optical module, the optical module further includes a zipper, the zipper is provided with an unlocking block and a handle, when the optical module exits the cage, the handle is pulled by a hand, the handle drives the unlocking block to jack up the locking plate to be separated from the locking surface, and the optical module is unlocked and pulled out of the cage.

In the optical module, the optical module further includes a light receiving sub-module, and the light receiving sub-module is configured to convert an optical signal into an electrical signal and is connected to the circuit board by gold wire bonding.

In the embodiment of the application, the accommodating groove accommodates redundant heat-conducting glue, so that the redundant heat-conducting glue is prevented from flowing into the light emission submodule to influence or damage the light emission submodule; the heat of the transmitter optical subassembly is quickly and effectively conducted to the cavity of the optical module through the heat conducting plate, and then the heat of the cavity of the optical module is dissipated to the atmosphere through the radiator tightly attached to the radiating surface.

Drawings

FIG. 1 is an exploded view of an embodiment of an optical module according to the present application;

fig. 2 is a schematic diagram of an upper cover of an optical module according to an embodiment of the present application;

fig. 3 is a schematic bottom view of an optical module according to an embodiment of the present application;

FIG. 4 is an exploded view of a circuit board, a transmitter optical subassembly and a receiver optical subassembly of an embodiment of an optical module of the present application;

FIG. 5 is a schematic diagram illustrating an assembly of a circuit board, a transmitter optical subassembly, and a receiver optical subassembly of an embodiment of an optical module of the present application;

FIG. 6 is a cross-sectional view of an embodiment of an optical module according to the present invention, illustrating an assembly of a heat-conducting plate and a heat-conducting platform (a groove contains a heat-conducting glue);

FIG. 7 is a schematic diagram of a circuit board of an optical module according to an embodiment of the present application;

FIG. 8 is a first diagram illustrating a thermal plate according to an embodiment of an optical module of the present application;

FIG. 9 is a second diagram of a thermal conductive plate according to an embodiment of an optical module of the present application;

FIG. 10 is a first assembly view (with the top cover removed) of an embodiment of an optical module according to the present application;

FIG. 11 is a second assembly view of an optical module according to an embodiment of the present application (with the bottom shell and the zipper removed);

fig. 12 is a third assembly schematic diagram of an optical module embodiment of the present application;

FIG. 13 is a fourth schematic assembly diagram of an optical module according to an embodiment of the present application;

FIG. 14 is a diagram illustrating a zipper of an optical module according to an embodiment of the present application;

FIG. 15 is a schematic view of a cage, heat sink and latch of a mating assembly of an embodiment of a light module of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As shown in fig. 1 to 15, an embodiment of the present invention provides an optical module, including: the upper cover 100, the bottom case 200, the heat conductive plate 410, the circuit board 440 and the TOSA 420,

as shown in fig. 2 and 6, the upper cover 100 has a heat conducting platform 110 and a receiving groove 111, the receiving groove 111 is an annular groove formed on the upper surface of the heat conducting platform 110, so that the heat conducting glue 700 coated on the surface of the heat conducting platform 110 can flow into the receiving groove 111 from the 360-degree direction of the surface of the heat conducting platform 110 after being extruded by the heat conducting plate 410;

as shown in fig. 3 and 13, the bottom case 200 and the top case 100 are assembled by screws 810 to form an optical module cavity for accommodating the heat conducting plate 410, the circuit board 440 and the tosa 420, and have a heat dissipating surface 210;

as shown in fig. 7, the circuit board 440 is provided with a through hole 441;

as shown in fig. 4 to 9, the heat conducting plate 410 is provided with a heat conducting surface 412 and a mounting surface 411, the tosa 420 is mounted and adhered to the mounting surface 411, after the heat conducting glue 700 is coated between the heat conducting surface 412 and the heat conducting platform 110, the mounted and adhered heat conducting plate 410 and tosa 420 are mounted on the heat conducting platform 110 through the through hole 441, the excess heat conducting glue 700 flows into the accommodating groove 111 after being squeezed by the heat conducting plate 410, and the excess heat conducting glue 700 is prevented from flowing into the tosa 420 or other components in the optical module cavity;

as shown in fig. 4, the tosa 420 is used to convert an electrical signal of an optical module into an optical signal, and is connected to the circuit board 440 by gold wire bonding.

As shown in fig. 3 and 15, the bottom housing 200 is provided with a locking surface 220, and after the optical module is inserted into the cage 900, the locking surface 220 blocks a locking piece 930 of the cage 900, so that the optical module is inserted into the cage 900.

As shown in fig. 14 and 15, the optical module further includes a fastener 500, the fastener 500 includes an unlocking block 510 and a handle 520, and when the optical module is ejected from the cage 900, the handle 520 is pulled by a hand, the handle 520 drives the unlocking block 510 to jack up the locking piece 930 to separate from the locking surface 220, so that the optical module is unlocked and pulled out of the cage 900.

As shown in fig. 4 and 5, the optical module further includes a light-receiving sub-module 430, and the problem of the heat dissipation assembly manner or the flowing of the thermal conductive adhesive 700 between the light-receiving sub-module 430 and the cavity of the optical module is the same as the solution of the light-emitting sub-module 420, and will not be described in detail herein, the light-receiving sub-module 430 is configured to convert an optical signal into an electrical signal, and is connected to the circuit board 440 by gold wire bonding.

As shown in fig. 3 and fig. 15, after the optical module is inserted and locked in the cage 900, the heat sink 910 is tightly attached to the heat dissipation surface 210 of the bottom chassis 200 by being clamped and pressed by the latch 920, so that the heat of the optical module cavity is conducted to the heat sink 910 and then dissipated to the atmosphere.

As shown in fig. 4 and 5, the optical module further includes a protective cover 425 and a protective cover 435, and after the tosa 420 and the rosa 430 are completely coupled and assembled, the protective cover 425 and the protective cover 435 are respectively attached to the space above the tosa 420 and the rosa 430 for protecting the tosa 420 and the rosa 430.

As shown in fig. 1, 12, and 15, after the optical module exits the cage 900, the pulling force applied to the knob 520 disappears, and the slider 500 returns the slider 500 to the original position by the biasing force of the return spring 820.

In the embodiment of the application, under the extrusion of the heat conducting plate and the heat conducting table, the accommodating groove 111 accommodates the excessive flowing heat conducting glue 700, so as to prevent the excessive heat conducting glue 700 from flowing into the tosa 420 or other components in the cavity of the optical module, thereby influencing or damaging the tosa 420 and other components; the heat of the tosa 420 is quickly and effectively conducted to the optical module cavity through the heat conducting plate 410, and then the heat of the optical module cavity is dissipated to the atmosphere through the heat sink 910 tightly attached to the heat dissipating surface 210,

the present invention has been described in terms of the preferred embodiment, and not by way of limitation, and it is to be understood that the terminology which has been used is intended to be in the nature of words of description and illustration, rather than of limitation. As the present invention may be embodied in several forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the meets and bounds of the claims, or equivalences of such meets and bounds are therefore intended to be embraced by the appended claims.

Claims

1. A light module, comprising: an upper cover, a bottom shell, a heat conducting plate, a circuit board and a transmitter optical subassembly, which is characterized in that,

the circuit board is provided with a through hole;

the heat conducting plate is provided with a heat conducting surface and a mounting surface, the transmitter secondary module is mounted and adhered to the mounting surface, after heat conducting glue is coated between the heat conducting surface and the heat conducting platform, the mounted and adhered heat conducting plate and the transmitter secondary module pass through the through hole and are mounted on the heat conducting platform, and redundant heat conducting glue is accommodated in the accommodating groove after being extruded;

2. The optical module of claim 1, wherein the bottom housing is provided with a locking surface, and after the optical module is inserted into the cage, the locking surface is engaged with a locking plate of the cage to lock the optical module into the cage.

3. The optical module according to claim 2, further comprising a zipper, wherein the zipper is provided with an unlocking block and a handle, when the optical module is withdrawn from the cage, the handle is pulled by a hand, the handle drives the unlocking block to jack up the locking plate to be separated from the locking surface, and the optical module is unlocked and is pulled out of the cage.

4. The optical module of claim 3, further comprising a light receiving sub-module, wherein the light receiving sub-module is used for converting optical signals into electrical signals and is connected with the circuit board by gold wire bonding.