CN219087655U - Electronic equipment and its heat dissipation grounding structure - Google Patents

Abstract

The present disclosure relates to an electronic device and a heat dissipation grounding structure thereof, the heat dissipation grounding structure comprising: a printed circuit board including a heating element; the radiator is arranged on one side of the printed circuit board, provided with the heating element, and is used for radiating heat of the heating element; the elastic support is arranged on one side of the printed circuit board, which is far away from the radiator; and the conductive elastic piece and the conductive fastener are used for connecting the elastic support, the printed circuit board and the radiator, the conductive elastic piece is sleeved on the circumference of the conductive fastener, one end of the conductive elastic piece is connected with the conductive fastener, and the other end of the conductive elastic piece is connected with the bonding pad on the printed circuit board. The radiator is directly grounded to the printed circuit board by utilizing the conductive fastener and the conductive elastic piece sleeved on the conductive fastener, so that the area of a bonding pad on the printed circuit board can be reduced, the manufacturing cost is reduced, and meanwhile, the occupied area of the printed circuit board is also saved.

Description

Electronic equipment and its heat dissipation grounding structure

technical field

The present disclosure relates to the technical field of electronic appliance design, and in particular, relates to an electronic device and a heat dissipation grounding structure thereof.

Background technique

The devices on the printed circuit board of the electronic equipment will generate heat during operation, for example, a graphics card, in order to ensure its normal operation, a radiator is usually provided for heat dissipation and cooling. Due to the PCIE protocol (peripheral component interconnect express, high-speed serial computer expansion bus standard) there is a height limit requirement on the back of the graphics card, that is, the maximum height of any mechanism or component installed on the back of the graphics card cannot be more than 2.67 from the back of the PCB (printed circuit board). mm, so under the development trend of increasing power consumption, the radiator is getting heavier and heavier, so the traditional spring screw design alone cannot provide enough elastic force to lock the radiator under this height limit.

Most of the existing mid-to-high-end graphics card designs abandon the previous method of fixing the radiator with four spring screws, and use a leaf spring to fix the radiator. The spring bracket can provide sufficient elastic force. The torque generated is very small, and the deformation of the PCB board will be small, thereby reducing the risk of solder joint cracking and improving the reliability of the main chip, and it is locked from the back, which can ensure the integrity of the radiator fins on the front and improve the reliability of the main chip. The heat dissipation capability of the product.

In the related art, in order to solve the grounding problem of the heat sink in the elastic bracket structure, additional costs need to be increased, and multiple ground shrapnels are connected between the front surface of the printed circuit board and the metal heat sink. At the position of the pad, it takes up a lot of valuable space on the printed circuit board.

Utility model content

The purpose of the present disclosure is to provide an electronic device and its heat dissipation grounding structure. The heat dissipation grounding structure uses conductive fasteners and conductive elastic members sleeved on the conductive fasteners to directly ground the heat sink to the printed circuit board, which can reduce the The area of the pad on the printed circuit board reduces the manufacturing cost, and also saves the occupied area of the printed circuit board.

In order to achieve the above object, the first aspect of the present disclosure provides a heat dissipation grounding structure of an electronic device, the heat dissipation grounding structure includes:

Printed circuit boards, including heating elements;

A radiator, located on the side of the printed circuit board where the heating element is provided, is used for heat dissipation of the heating element;

an elastic bracket, located on the side of the printed circuit board away from the heat sink; and

A conductive elastic member and a conductive fastener, the conductive fastener is used to connect the elastic support, the printed circuit board and the heat sink, the conductive elastic member is sleeved on the conductive fastener circumferential direction, and one end of the conductive elastic member is connected to the conductive fastener, and the other end is connected to the pad on the printed circuit board.

Optionally, the heat dissipation grounding structure includes a backplane, the backplane is arranged on the side of the printed circuit board away from the heat sink, and the elastic bracket is arranged on the printed circuit board and the backplane between.

Optionally, the conductive elastic member is configured as a spring, and the conductive fastener is configured as a screw;

The elastic bracket is provided with a first mounting hole for the screw to pass through; the printed circuit board is provided with a second mounting hole for the screw to pass through and corresponding to the first mounting hole;

The screw is connected to the radiator after passing through the first mounting hole and the second mounting hole, the spring is sleeved on the screw and is located in the first mounting hole, and one end of the spring It is in contact with the pad, and the other end is connected with the screw.

Optionally, the spring is a tower spring.

Optionally, the pad is arranged around the circumference of the second installation hole, and the inner diameter of the pad coincides with the outer diameter of the second installation hole, and the outer diameter of the pad is larger than the outer diameter of the second installation hole. The diameter of the large end of the conical spring.

Optionally, the tower spring is configured to be compressible to a wire diameter along its height direction.

Optionally, the screw includes a screw head and a screw rod for connecting with the radiator;

The diameter of the screw head is larger than the diameter of the first installation hole.

Optionally, a counterbore arranged coaxially with the first installation hole is provided on a side of the first mounting hole away from the printed circuit board, and a diameter of the counterbore is larger than a diameter of the screw head.

Optionally, the screw rod includes an intermediate rod segment and a lower rod segment, one end of the intermediate rod segment is connected to the screw head, and the other end is connected to the lower rod segment, and an external thread portion is formed on the lower rod segment , and the diameter of the lower rod segment is smaller than the diameter of the middle rod segment.

Optionally, the difference between the diameter of the middle rod segment and the diameter of the lower rod segment is greater than or equal to 0.9 mm.

Optionally, the screw further includes an upper rod segment, the diameter of the upper rod segment is smaller than the diameter of the middle rod segment, and larger than the diameter of the lower rod segment.

Optionally, the spring is a tower spring, the diameter of the small end of the tower spring is greater than or equal to the diameter of the upper rod section and smaller than the diameter of the middle rod section; the diameter of the large end of the tower spring is less than The diameter of the first installation hole is larger than the diameter of the second installation hole.

Optionally, the side of the backboard facing the printed circuit board is provided with a receiving portion for installing the elastic bracket

Optionally, the minimum gap between the elastic bracket and the bottom wall of the receiving part is 0.1 mm;

The gap between the elastic support and the printed circuit board is 0.1-0.9 mm.

According to a second aspect of the present disclosure, an electronic device is further provided, and the electronic device includes the above-mentioned heat dissipation grounding structure.

Through the above technical solution, that is, the heat dissipation grounding structure of the present disclosure, the elastic support is provided on the side of the printed circuit board away from the heat sink to support the printed circuit board and the heat sink on it, and the conductive fastener is used Connect the elastic bracket, the printed circuit board and the heat sink, and set the conductive elastic piece on the conductive fastener, so that the elastic bracket can provide enough elastic force to lock the heat sink and avoid the deformation of the printed circuit board. At the same time, the conductive elastic Connect the pads on the side of the printed circuit board away from the heat sink with the heat sink using hardware and conductive fasteners to achieve grounding of the heat sink. With the above structure, the heat sink is directly grounded to the printed circuit board by using the conductive fastener and the conductive elastic member sleeved on the conductive fastener, which can reduce the area of the pad on the printed circuit board, reduce the manufacturing cost, and save occupied area of the printed circuit board.

Other features and advantages of the present disclosure will be described in detail in the detailed description that follows.

Description of drawings

The accompanying drawings are used to provide a further understanding of the present disclosure, and constitute a part of the description, together with the following specific embodiments, are used to explain the present disclosure, but do not constitute a limitation to the present disclosure. In the attached picture:

FIG. 1 is a disassembled view of a heat dissipation grounding structure of an electronic device provided by some embodiments of the present disclosure;

Fig. 2 is a connection structure diagram of elastic brackets, screws and springs of the heat dissipation grounding structure of electronic equipment provided by some embodiments of the present disclosure;

3 is a disassembled view of a printed circuit board, an elastic bracket, a screw and a spring of a heat dissipation grounding structure of an electronic device provided by some embodiments of the present disclosure;

4 is a connection structure diagram of screws and springs of the heat dissipation grounding structure of electronic equipment provided by some embodiments of the present disclosure;

FIG. 5 is a structural diagram of screws of a heat dissipation grounding structure of an electronic device provided by some embodiments of the present disclosure;

Fig. 6 is a structural diagram of a tower spring of a heat dissipation grounding structure of an electronic device provided by some embodiments of the present disclosure;

Fig. 7 is a side cross-sectional view of a first form of a heat dissipation grounding structure of an electronic device provided by some embodiments of the present disclosure;

Fig. 8 is based on the partial enlarged view in Fig. 7;

Fig. 9 is a side cross-sectional view of a second form of a heat dissipation grounding structure of an electronic device provided by some embodiments of the present disclosure;

FIG. 10 is a partial enlarged view based on FIG. 9 .

Explanation of reference signs

100-radiator; 200-printed circuit board; 200a-welding pad; 200b-second mounting hole; 300-elastic bracket; 300a-first mounting hole; 305-screw; 305a-screw head; 305b-upper rod section; 305c-middle pole section; 305d-lower pole section; 310-tower spring; 310a-small end; 310b-big end; 400-back plate; 405-accommodating part.

Detailed ways

Specific embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.

In this disclosure, unless stated otherwise, the used orientation words such as "up, down, left, and right" generally refer to the upper, lower, left, and right of the corresponding drawings; "inner, outer" refers to The inside and outside of the outline of the corresponding part; "far and near" means that the corresponding structure or the corresponding part is far away from or close to another structure or part. In addition, the terms "first", "second" and the like used in the present disclosure are for distinguishing one element from another element, and do not have sequence or importance. Furthermore, in the following description, when referring to the drawings, the same reference numerals in different drawings denote the same or similar elements unless otherwise explained. The above definitions are only used to explain and describe the present disclosure, and should not be construed as limiting the present disclosure.

As shown in Figures 1 to 10, in order to achieve the above purpose, the first aspect of the present disclosure provides a heat dissipation grounding structure for electronic equipment, the heat dissipation grounding structure includes: a printed circuit board 200, including a heating element; wherein the heating element Including but not limited to a graphics card, the heating element is disposed on the upper side of the printed circuit board 200 . The heat sink 100 is located on the side of the printed circuit board 200 where the heating element is provided, and is used for heat dissipation of the heating element; the heat sink 100 can be made of metal material, and can be any suitable structure, which is not specifically limited in the present disclosure. The elastic bracket 300 is located on the side of the printed circuit board 200 away from the heat sink 100, and is used to provide an elastic force toward the lower surface of the printed circuit board 200, support the printed circuit board 200 and the heat sink 100, and reduce the deformation of the printed circuit board 200. Therefore, the risk of cracking of solder joints can be reduced, and the reliability of the main chip can be improved, and it is locked from the back, which can ensure the integrity of the fins of the radiator 100 on the front, and improve the heat dissipation capacity of the product. And conductive elastic parts and conductive fasteners, the conductive fasteners are used to connect the elastic support 300, the printed circuit board 200 and the heat sink 100, the conductive elastic parts are sleeved in the circumferential direction of the conductive fasteners, and the conductive elastic parts One end is connected to the conductive fastener, for example, it may be a fixed connection or an abutment, which is not specifically limited here, and the other end is connected to the pad 200 a on the printed circuit board 200 .

Through the above technical solution, that is, the heat dissipation grounding structure of the present disclosure, the side of the printed circuit board 200 away from the heat sink 100 is used to support the printed circuit board 200 and the heat sink 100 on the elastic bracket 300, and the conductive The fastener connects the elastic bracket 300, the printed circuit board 200 and the radiator 100, and a conductive elastic member is sleeved on the conductive fastener, so that the elastic bracket 300 can provide enough elastic force to lock the radiator 100, preventing the printed circuit from The board 200 is deformed, and at the same time, the solder pad 200a on the side of the printed circuit board 200 away from the heat sink 100 is electrically connected to the heat sink 100 by using conductive elastic members and conductive fasteners, so as to realize the grounding of the heat sink 100 . With the above structure, the heat sink 100 is directly grounded to the printed circuit board 200 by using the conductive fastener and the conductive elastic member sleeved on the conductive fastener, which can reduce the area of the pad 200a on the printed circuit board 200 and reduce the manufacturing cost. , and also save the occupied area of the printed circuit board 200 .

In some embodiments, the heat dissipation grounding structure further includes a backplane 400 disposed on a side of the printed circuit board 200 away from the heat sink 100 , and the elastic bracket 300 is disposed between the printed circuit board 200 and the backplane 400 . The backboard 400 can also be fixedly connected to the side of the printed circuit board 200 facing away from the radiator 100, the upper side of the elastic bracket 300 can be in contact with the printed circuit board 200, and the lower side can be in contact with the backboard 400, and the elastic bracket 300 The elasticity is used to support the printed circuit board 200 , which facilitates the fastening of the printed circuit board 200 and the heat sink 100 disposed on the printed circuit board 200 .

In some embodiments, the conductive elastic member can be configured as a spring, and the conductive fastener can be configured as a screw 305; the elastic bracket 300 is provided with a first mounting hole 300a for the screw 305 to pass through; The screw 305 passes through the second mounting hole 200b corresponding to the first mounting hole 300a; the screw 305 is connected to the radiator 100 after passing through the first mounting hole 300a and the second mounting hole 200b, and the spring is sleeved on the screw 305 and Located in the first installation hole 300a, one end of the spring abuts against the pad 200a, and the other end is connected to the screw 305.

It can be understood that the first installation hole 300a on the elastic bracket 300 and the second installation hole 200b on the printed circuit board 200 are multiple, and one-to-one correspondence can meet the requirements of the elastic bracket 300, the printed circuit board 200 and heat dissipation. It is enough that the device 100 is firmly connected.

As shown in FIG. 1 , in some embodiments, the number of the first mounting holes 300a and the second mounting holes 200b may both be four and arranged in a rectangular shape. It should be noted that the elastic bracket 300 can be constructed using any suitable structure. The elastic bracket 300 can be configured as an elastic part and a plurality of connecting parts connected to the circumference of the elastic part. The first mounting hole 300a can be provided on the connecting part. The upper side of the elastic portion is at least partially abutted against the lower side of the printed circuit board 200 , and the lower side of the connecting portion is at least partially abutted against the backplane 400 to form a support between the backplane 400 and the printed circuit board 200 .

The spring can be made of any conductive spring structure, and in some embodiments, the spring can be a tower spring 310 . Compared with other types of springs, the tower spring 310 can be further compressed in the height direction to reduce the height dimension, so as to meet the height limit requirement of the PCIE protocol, that is, the maximum height of any mechanism or component installed on the back of the graphics card cannot be separated from The back side of the printed circuit board 200 exceeds 2.67 mm.

It should be noted that it is exemplary that the above-mentioned heating element is a graphics card, and the heating element can also be other elements in electronic equipment that need to dissipate heat, such as a CPU (central processing unit), a camera module, etc. The elastic support 300 and the backplane 400 on the back of the 200 are no longer limited by the height limit requirements of the PCIE protocol, that is, they can be any suitable height for the corresponding arrangement position. Therefore, the present disclosure is not limited only by the height limit requirements of the PCIE protocol. The design below can also be designed for other similar or similar structures that are not limited by the height of the back.

As shown in FIG. 3 , in some embodiments, the pad 200a is arranged around the circumference of the second mounting hole 200b, and the inner diameter of the pad 200a coincides with the outer diameter of the second mounting hole 200b, and the outer diameter of the pad 200a larger than the diameter of the big end 310b of the tower spring 310 . Wherein, the welding pad 200a can be arranged on the ring structure of the lower side of the printed circuit board 200, and the inner diameter of the ring structure is opposite to the outer diameter of the second mounting hole 200b, and its outer diameter is larger than that of the tower spring 310 at the large end 310b. diameter, and the diameter of the big end 310b of the tower spring 310 needs to be larger than the diameter of the second mounting hole 200b, so that the big end 310b of the tower spring 310 can also abut against the pad 200a when compressed, ensuring grounding requirements and ground quality.

It should be noted that, in some embodiments, in order to ensure the reliability of grounding, the diameter of the large end 310b of the tower spring 310 needs to be at least 1mm larger than the diameter of the second mounting hole 200b on the printed circuit board 200, and the diameter of the pad 200a The outer diameter needs to be at least 2mm larger than the diameter of the big end 310b of the tower spring 310 .

In order to further reduce the assembly height of the backplane 400 and the elastic bracket 300 on the back (lower side) of the printed circuit board 200, as shown in FIGS. 9 and 10 , in some embodiments, the tower spring 310 is configured to be able to Its height direction is compressed to a wire diameter height.

Wherein, the number of turns and the wire diameter of the tower spring 310 can be designed accordingly according to the actual situation, and the selection should satisfy that all the turns should be pressed on a plane when it is compressed to the maximum compression amount, that is, the tower spring 310 can be pressed to The height of a wire diameter, so that the height value at this point can reach a limit value, so as to meet the height limit requirements of the PCIE protocol.

In some embodiments, the screw 305 includes a screw head 305a and a screw rod for connecting with the heat sink 100; the diameter of the screw head 305a is larger than the diameter of the first mounting hole 300a. Wherein, the underside of the heat sink 100 is provided with screw holes or stud structures corresponding to the first mounting hole 300a and the second mounting hole 200b, so that the screw rod of the screw 305 can be installed sequentially through the first mounting hole 300a and the second mounting hole. The hole 200b passes through and is connected to the heat sink 100, thereby connecting the elastic bracket 300, the printed circuit board 200 and the heat sink together.

In some embodiments, the side of the first mounting hole 300a away from the printed circuit board 200 is provided with a counterbore coaxially arranged with the first mounting hole 300a, and the diameter of the counterbore is larger than the diameter of the screw head 305a. The screw head 305a of the screw 305 can be arranged in the counterbore, which can also save the occupation in the thickness direction to a certain extent. It can be understood that the depth of the counterbore can be greater than or equal to the length of the screw head 305a, so that the entire screw head 305a can be completely inside the counterbore without being exposed, so that the elastic bracket 300 can directly abut against the backplane 400 .

It should be noted that, when the screw 305 is locked to the elastic support 300, the strength and assembly requirements are ensured by the sufficiently large supporting contact surface and thickness of the screw head 305a. The screw head 305a can be a flat head screw 305 or an oblique head screw 305, and The contact surface of the elastic bracket 300 can be selected from oblique contact and plane contact. The oblique contact has a self-positioning function and can provide strong support strength, and the plane contact can absorb more installation tolerances.

In some embodiments, the screw may include a middle rod section 305c and a lower rod section 305d, one end of the middle rod section 305c is connected to the screw head 305a, and the other end is connected to the lower rod section 305d, and the lower rod section 305d is formed with an external thread portion, And the diameter of the lower rod segment 305d is smaller than the diameter of the middle rod segment 305c. Wherein, the external thread portion is used to connect with the screw hole or screw hole on the radiator 100, and the diameter of the lower rod segment 305d having the external thread portion is smaller than the diameter of the middle rod segment 305c, which can form a locking and positioning function and ensure a stop position. At the same time, when the lower rod section 305d reaches the bottom of the stop lock, a support platform can be provided for supporting the radiator 100.

In order to ensure the connection with the radiator 100 and to form a sufficiently large supporting platform, in some embodiments, the difference between the diameter of the middle rod segment 305c and the diameter of the lower rod segment 305d is greater than or equal to 0.9mm, which is used to connect the middle rod segment 305c and the lower rod segment 305d. The joints of the lower rod sections 305d form a supporting platform with a large enough area to ensure the stop accuracy.

As shown in FIG. 5 , in some embodiments, the screw further includes an upper shaft section 305b, the diameter of the upper shaft section 305b is smaller than the diameter of the middle shaft section 305c, and larger than the diameter of the lower shaft section 305d. A concave surface is formed at the upper rod section 305b relative to the screw head 305a and the middle rod section 305c, so that the small end 310a of the tower spring 310 can be connected inside the concave surface, and the positioning of the tower spring 310 is facilitated.

As shown in Figure 6, in other embodiments, the spring is a tower spring 310, the diameter of the small end 310a of the tower spring 310 is greater than or equal to the diameter of the upper rod section 305b and less than the diameter of the middle rod section 305c; the tower spring 310 The diameter of the big end 310b is smaller than the diameter of the first mounting hole 300a and larger than the diameter of the second mounting hole 200b. Wherein, the diameter size of the small end 310a and the large end 310b of the tower spring 310 is further limited, so that the small end 310a of the tower spring 310 can be hooked in the concave surface at the upper rod section 305b, so that the screw 305 can be connected with the tower. The spring 310 can be assembled into one body, which is convenient for transportation and production line assembly. At the same time, the diameter of the upper rod section 305b needs to be smaller than the diameter of the middle rod section 305c, and the minimum diameter of the upper rod section 305b is not less than the diameter of the lower rod section 305d of the screw rod, so as to avoid increasing the tower spring 310 after installation. The offset is prone to structural interference.

It can be understood that the present disclosure does not limit the type of the screw 305 , and the heat sink 100 of different sizes can be locked by using the screw 305 of different types, as long as the above size relationship is satisfied and it can be manufactured.

In order to further reduce the height of components on the back of the printed circuit board 200 , as shown in FIG. 1 , in some embodiments, the side of the back plate 400 facing the printed circuit board 200 is provided with a receiving portion 405 for installing the elastic bracket 300 . Wherein, the shape of the receiving portion 405 corresponds to the shape of the elastic support 300, so that at least part of the elastic support 300 can be in the receiving portion 405 and be in contact with the bottom of the receiving portion 405; Under the action, at least part of the upper side of the elastic bracket 300 abuts against the lower side of the printed circuit board 200 . At the same time, the above-mentioned backboard 400 does not need to hollow out the corresponding elastic support 300 of the backboard 400 in order to meet the height requirement, and at the same time improves the aesthetic design of the product.

It should be noted that, in some embodiments, the depth of the receiving portion 405 may be smaller than the thickness of the back plate 400 and smaller than the thickness of the elastic support 300, that is, it can ensure that the elastic support 300 is partly in the receiving portion 405, and at the same time It is also possible to use the back plate 400 without digging holes in the direction toward the heat sink 100 , while improving the overall aesthetics.

Wherein, the backplane 400 can be connected to the lower side of the printed circuit board 200 by any suitable structure, for example, it can also be fixedly connected to the printed circuit board 200 by a plurality of screws.

In some embodiments, the minimum gap between the elastic bracket 300 and the bottom wall of the receiving portion 405 is 0.1 mm; the gap between the elastic bracket 300 and the printed circuit board 200 is 0.1-0.9 mm, under the condition that the elastic support is satisfied , It can also meet the requirements of the PCIE protocol that the back of the graphics card cannot exceed 2.67mm.

The second aspect of the present disclosure further provides an electronic device, which includes the above-mentioned heat dissipation grounding structure. Therefore, the electronic device also has all the advantages of the above-mentioned heat dissipation grounding structure, which will not be repeated here.

In a specific embodiment of the present disclosure, M2.5 screw 305 is used as an example to describe the dimensional relationship between various structures or components. Of course, in actual use, the specific size can be adjusted according to different screw 305 models, as long as the The following size relationship, and can be manufactured.

The screw head 305a of the screw 305 has a thickness ranging from 0.5-0.6mm (±0.1mm), a diameter ranging from 6.6-7.2mm, and a diameter ranging from 5.6-6.2mm on the first mounting hole 300a on the elastic bracket 300 . The selected diameter of the screw head 305a is at least 1 mm larger than the selected diameter of the first installation hole 300a.

The diameter of the male thread of the lower rod section 305d of the screw 305 is 2.5mm, and the length of the lower rod section 305d should be greater than 5 pitches, which needs to be adapted to the size of the female thread on the radiator 100. For example, a relatively large radiator 100 will also use The screw 305 of M3.0 specification is adapted, that is, the diameter of the lower rod section 305d is 3.0 mm.

The diameter of the middle rod section 305c of the screw 305 is 3.4mm. The diameter of the middle rod section 305c needs to be at least 0.9mm larger than the diameter of the lower rod section 305d to ensure the stop accuracy of the screw 305 during assembly.

The diameter of the upper rod section 305b on the screw 305 is 2.8mm, the diameter of the upper rod section 305b needs to be 0.5mm smaller than the diameter of the middle rod section 305c, and the minimum diameter of the upper rod section 305b is not less than the nominal diameter of the screw 305 (that is, the diameter of the male thread of the lower rod section 305d), in order to avoid increasing the offset of the tower spring 310 after installation, which is prone to structural interference.

The diameter of the second mounting hole 200b on the printed circuit board 200 is 3.8 mm, and the diameter of the middle screw should be at least 0.3 mm smaller than the diameter of the second mounting hole 200 b, or the assembly may not be affected after tolerance calculation.

The initial height of the tower spring 310 is 3 mm, the total number of turns is 2.5 turns, and the wire diameter is 0.3 mm (±0.03 mm). The number of coils and the wire diameter of the tower spring 310 are designed to meet the requirements that all the coils can be pressed onto a plane when the maximum compression is reached, that is, the height of a wire diameter can be pressed.

The diameter of the small end 310a of the tower spring 310 is 3.2-3.3mm. The diameter of the small end 310a is 0.1-0.3 mm smaller than the diameter of the middle rod section of the screw 305 .

The diameter of the big end 310b of the tower spring 310 ranges from 5.3 to 5.8. The diameter of the big end 310b should be selected to be at least 0.4mm smaller than the diameter of the first mounting hole 300a on the elastic bracket 300. At the same time, it needs to be adapted. If there is an interference problem , the diameter range of the large end 310b of the tower spring 310 can be appropriately reduced, or the diameter of the first mounting hole 300a can be increased. The diameter of the big end 310b is larger than the diameter of the second mounting hole 200b on the printed circuit board 200 by at least 1 mm.

The outer diameter of the pad 200a on the printed circuit board 200 is 7.6 mm. The outer diameter of the welding pad 200 a needs to be at least 2 mm larger than the diameter of the big end 310 b of the tower spring 310 .

The wall thickness of the back plate 400 may be 1 mm, and the thickness of the receiving portion 405 of the back plate 400 at the position corresponding to the elastic bracket 300 is 0.5 mm (+0.1 mm).

The thickness of the elastic bracket 300 can be 1mm, the gap between the elastic bracket 300 and the receiving part 405 of the backplane 400 is 0.1mm after installation, and the distance between the elastic bracket 300 and the printed circuit board 200 after installation is floating between 0.1mm-0.9mm .

Due to the tolerances of the chip, the printed circuit board 200 and the structural parts, after the elastic support 300 is assembled, the gap between the elastic support 300 and the printed circuit board 200 will have a certain floating range. When the gap is the largest, the elastic support 300 is the farthest from the printed circuit board 200 , and the tower spring 310 is in a stacked state when viewed from the side, as shown in FIG. 7 and FIG. 8 . It is necessary to ensure that this situation can also meet the requirement of the PCIE protocol that the back of the graphics card should not exceed 2.67mm. According to the design value, the height of the tower spring 310 at this time is 1.2mm, plus the thickness of the screw head 305a is 0.7mm, plus The distance between the upper elastic bracket 300 and the back plate 400 is 0.1 mm, plus the thickness of the receiving portion 405 is 0.5 mm (+0.1 mm), equal to 2.6 mm<2.67 mm, so the requirement of 2.67 mm can be met. When the gap was the smallest, the bracket was the closest to the printed circuit board 200, and now the tower spring 310 was in a state close to being crushed, that is, the height of the tower spring 310 at this moment was 0.4mm (the height of the crushed state was 0.33mm). In this case, the requirement of 2.67mm can be met (2.5 layers of tower springs 310 are stacked to a height of 0.4mm, plus the thickness of the screw head 305a is 0.7mm, and the distance between the elastic support 300 and the back plate 400 is 0.1mm, and then Adding the thickness at the receiving portion 405 is 0.5 mm (+0.1 mm), equal to 1.8 mm<2.67 mm).

In order to meet the minimum spacing requirement of 0.1mm between the elastic bracket 300 and the printed circuit board 200 under the maximum compression amount, the tower spring 310 cannot be in contact with the first mounting hole 300a and the first mounting hole 300a of the elastic bracket 300 under the maximum compression amount. Structural interference occurs in the pad 200 a of the printed circuit board 200 . For the design parameters of the number of coils, the wire diameter and the diameter of each coil of the tower spring 310, when the tower spring 310 is pressed to the maximum compression amount, all the coils are pressed onto a plane, that is, it can be pressed to the height of a wire diameter , as shown in Figure 9 and Figure 10. Because the tower spring 310 is pressed to a wire diameter that occupies a height of 0.3mm, the outer diameter of the large end 310b of the tower spring 310 is also smaller than the aperture of the first mounting hole 300a of the elastic support 300, so its occupied height of 0.3mm can be Eaten by the thickness of the first installation hole 300a of the elastic bracket 300, that is, the compressed tower spring 310 is hidden in the first installation hole 300a of the elastic bracket 300, so that the distance between the elastic bracket 300 and the printed circuit board after installation can be satisfied. The spacing of 200 is required to be 0.1mm. The tower spring 310 will not interfere structurally with the first installation hole 300a on the elastic bracket 300 at the maximum compression amount, and the outer diameter of the pad 200a needs to be at least 2mm larger than the diameter of the big end 310b of the tower spring 310, so It will not exceed the diameter of the pad 200 a of the printed circuit board 200 .

According to the above-mentioned design parameters, it is concluded that the height range of the tower spring 310 after assembly is floating between 0.4-1.2mm, according to the wire diameter, the number of turns, the material of the selected tower spring 310 and the compression of the original height of 3mm to 1.2mm The amount of displacement can provide an elastic force greater than 4N to ensure the minimum grounding impedance requirement at high frequency.

It is worth noting that in this disclosure, the diameter of each rod section of the screw 305 is guaranteed to be able to pass through the first installation hole 300a and the second installation hole 200b, so as to ensure that different radiators 100 can be matched; at the same time, the spring is limited. The size of the specification ensures that its design can be integrated with the screw 305, and that the spring can pass through the first mounting hole 300a of the elastic bracket 300 smoothly when it is installed, and that the spring will not fall into the second installation of the printed circuit board 200 when it is installed. The hole 200b is fully in contact with the pad 200a of the printed circuit board 200 to ensure the grounding effect.

To sum up, the electronic device and its heat dissipation grounding structure of the present disclosure can save the cost of extra reserved multiple grounding shrapnels by directly adopting the spring grounding at the position of the mounting hole of the screw 305. At the same time, since no additional A plurality of ground springs are designed, thus saving the valuable space of the printed circuit board 200 .

Due to the innovative design of the present disclosure, the outer diameter of the pad 200a at the second mounting hole 200b of the printed circuit board 200 can be reduced from 10mm to 7.6mm, further saving the space used for the printed circuit board 200 .

The elastic bracket 300 of the present disclosure is connected and fixed by the tower spring 310 and the screw 305, which ensures sufficient contact strength and can provide lower grounding impedance, thereby reducing electromagnetic radiation, which is more helpful than the traditional grounding shrapnel.

The tower spring 310 of the present disclosure can be assembled on the upper rod section 305b of the screw 305, so that when the integrated tower spring 310 and the screw 305 are designed to be assembled, the tower spring 310 can smoothly pass through the first installation hole of the elastic bracket 300 300a and reliable contact with the pad 200a of the printed circuit board 200, and does not cause any production line assembly reliability problems.

Under the height limit of PCIE, the solution of the present disclosure can still use a complete design of the backplane 400 without hollowing out the corresponding elastic bracket 300 of the backplane 400, while improving the aesthetic design of the product.

The preferred embodiments of the present disclosure have been described in detail above in conjunction with the accompanying drawings. However, the present disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure. These simple modifications all belong to the protection scope of the present disclosure.

In addition, it should be noted that the various specific technical features described in the above specific implementation manners may be combined in any suitable manner if there is no contradiction. In order to avoid unnecessary repetition, various possible combinations are not further described in this disclosure.

In addition, various implementations of the present disclosure can be combined arbitrarily, as long as they do not violate the idea of the present disclosure, they should also be regarded as the content disclosed in the present disclosure.

Claims (15)

1. A heat dissipation grounding structure of an electronic device, the heat dissipation grounding structure comprising:

a printed circuit board (200) including a heating element;

a radiator (100) arranged on one side of the printed circuit board (200) provided with the heating element and used for radiating heat of the heating element;

an elastic support (300) arranged on one side of the printed circuit board (200) far away from the radiator (100); and

the heat radiator comprises a conductive elastic piece and a conductive fastener, wherein the conductive fastener is used for connecting the elastic support (300), the printed circuit board (200) and the heat radiator (100), the conductive elastic piece is sleeved on the circumference of the conductive fastener, one end of the conductive elastic piece is connected with the conductive fastener, and the other end of the conductive elastic piece is connected with a bonding pad (200 a) on the printed circuit board (200).

2. The heat dissipating and grounding structure of claim 1, wherein the heat dissipating and grounding structure comprises a back plate (400), the back plate (400) is disposed on a side of the printed circuit board (200) away from the heat sink (100), and the elastic support (300) is disposed between the printed circuit board (200) and the back plate (400).

3. The heat dissipating grounding structure of claim 1, wherein said conductive elastic member is configured as a spring and said conductive fastener is configured as a screw (305);

the elastic support (300) is provided with a first mounting hole (300 a) for the screw (305) to pass through; a second mounting hole (200 b) which is used for the screw (305) to pass through and corresponds to the first mounting hole (300 a) is arranged on the printed circuit board (200);

the screw (305) passes through the first mounting hole (300 a) and the second mounting hole (200 b) and then is connected to the radiator (100), the spring is sleeved in the screw (305) and is positioned in the first mounting hole (300 a), one end of the spring is abutted to the bonding pad (200 a), and the other end of the spring is connected with the screw (305).

4. A heat dissipating, grounding structure according to claim 3, characterized in that said spring is a tower-shaped spring (310).

5. The heat dissipation grounding structure as defined in claim 4, wherein the pad (200 a) is circumferentially surrounded by the second mounting hole (200 b), and an inner diameter of the pad (200 a) coincides with an outer diameter of the second mounting hole (200 b), and an outer diameter of the pad (200 a) is larger than a diameter of a large end (310 b) of the tower spring (310).

6. The heat dissipating and grounding structure of claim 4, wherein said tower spring (310) is configured to be compressible to a wire diameter height along its height direction.

7. The heat dissipating ground structure of any one of claims 3-6, wherein said screw (305) comprises a screw head (305 a) and a screw for connection with said heat sink (100);

the screw head (305 a) has a diameter greater than the diameter of the first mounting hole (300 a).

8. The heat dissipating and grounding structure of claim 7, wherein a side of said first mounting hole (300 a) remote from said printed circuit board (200) is provided with a counterbore coaxially arranged with said first mounting hole (300 a), said counterbore having a diameter larger than a diameter of said screw head (305 a).

9. The heat radiation grounding structure as defined in claim 7, wherein the screw comprises a middle rod section (305 c) and a lower rod section (305 d), one end of the middle rod section (305 c) is connected with the screw head (305 a), the other end is connected with the lower rod section (305 d), the lower rod section (305 d) is formed with an external thread portion, and the diameter of the lower rod section (305 d) is smaller than the diameter of the middle rod section (305 c).

10. The heat dissipating and grounding structure of claim 9, wherein the difference between the diameter of the middle pole section (305 c) and the diameter of the lower pole section (305 d) is 0.9mm or more.

11. The heat dissipating and grounding structure of claim 9, wherein said screw further comprises an upper rod section (305 b), said upper rod section (305 b) having a diameter smaller than the diameter of said middle rod section (305 c) and larger than the diameter of said lower rod section (305 d).

12. The heat dissipating and grounding structure of claim 11, wherein said spring is a tower spring (310), a small end (310 a) of said tower spring (310) having a diameter greater than or equal to a diameter of said upper pole section (305 b) and less than a diameter of said middle pole section (305 c); the diameter of the large end (310 b) of the tower-shaped spring (310) is smaller than the diameter of the first mounting hole (300 a) and larger than the diameter of the second mounting hole (200 b).

13. The heat radiation grounding structure according to claim 2, wherein a side of the back plate (400) facing the printed circuit board (200) is provided with a receiving portion (405) for mounting the elastic bracket (300).

14. The heat dissipating and grounding structure of claim 13, wherein a minimum clearance between said elastic support (300) and a bottom wall of said housing (405) is 0.1mm;

the clearance between the elastic support (300) and the printed circuit board (200) is 0.1-0.9mm.

15. An electronic device comprising a heat dissipating ground structure as recited in any one of claims 1-14.

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