[go: up one dir, main page]

CN219477087U - USB device and electronic equipment - Google Patents

USB device and electronic equipment Download PDF

Info

Publication number
CN219477087U
CN219477087U CN202223502768.8U CN202223502768U CN219477087U CN 219477087 U CN219477087 U CN 219477087U CN 202223502768 U CN202223502768 U CN 202223502768U CN 219477087 U CN219477087 U CN 219477087U
Authority
CN
China
Prior art keywords
circuit board
usb device
usb interface
usb
flexible circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202223502768.8U
Other languages
Chinese (zh)
Inventor
赵亚卫
汪源
孙健
高伟
王旭阳
姚文星
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honor Device Co Ltd
Original Assignee
Honor Device Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Priority to CN202223502768.8U priority Critical patent/CN219477087U/en
Application granted granted Critical
Publication of CN219477087U publication Critical patent/CN219477087U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Telephone Set Structure (AREA)

Abstract

The application provides a USB device and electronic equipment, this electronic equipment includes: a frame having an opening formed in a wall thereof; the USB device comprises a body and a pin unit, wherein an elastic sealing ring is arranged on one side, close to the pin unit, of the body; the USB device is mounted on the frame, the pin unit is located in the opening, and the elastic sealing ring and the wall of the opening form a seal. The Z-direction sealing can be provided in the opening hole for the USB device on the frame of the electronic equipment, so that the positioning structure of the frame and the USB device is simplified, the installation and the disassembly of the USB device are facilitated, and the electronic equipment is light and thin.

Description

一种USB器件及电子设备A kind of USB device and electronic equipment

技术领域technical field

本申请涉及电子技术领域,尤其涉及一种USB器件及电子设备。The present application relates to the field of electronic technology, in particular to a USB device and electronic equipment.

背景技术Background technique

诸如手机等电子设备通常会配置诸如Type-C的USB(Universal Serial Bus(通用串行总线))接口,通过USB接口可以为手机提供充电、数据传输等功能。由于USB接口需要连接设备外部的器件(例如充电器、手机等)和设备内部的器件(例如处理器、电池等),因此USB接口部分(例如引脚部分)位于电子设备外部,部分(例如USB芯片部分)位于电子设备内部,这导致对于具有防水功能的电子设备,USB接口必须满足一定的防水要求。然而,随着用户对产品的重量要求的提升,产品的轻量化越来越重要,整机的轻量化对产品防水功能的实现提出了更高的挑战。Electronic devices such as mobile phones are usually equipped with a USB (Universal Serial Bus (Universal Serial Bus)) interface such as Type-C, through which functions such as charging and data transmission can be provided for the mobile phone. Since the USB interface needs to connect devices outside the device (such as chargers, mobile phones, etc.) Chip part) is located inside the electronic device, which leads to the fact that for electronic devices with waterproof function, the USB interface must meet certain waterproof requirements. However, as users' requirements for product weight increase, product weight reduction is becoming more and more important, and the weight reduction of the whole machine poses a higher challenge to the realization of the product's waterproof function.

实用新型内容Utility model content

为了解决上述技术问题,本申请提供一种USB器件及电子设备。在电子设备中,在框架上用于USB器件的开孔中提供Z向密封,从而简化框架和USB器件的定位结构,利于USB器件的安装拆卸,以及电子设备的轻薄化。In order to solve the above technical problems, the present application provides a USB device and electronic equipment. In the electronic equipment, Z-direction sealing is provided in the opening for the USB device on the frame, thereby simplifying the positioning structure of the frame and the USB device, facilitating the installation and disassembly of the USB device, and thinning the electronic device.

第一方面,本申请提供一种电子设备,包括:框架,在所述框架的壁上形成有开孔;In a first aspect, the present application provides an electronic device, comprising: a frame, an opening is formed on a wall of the frame;

USB器件,所述USB器件包括本体和引脚单元,在所述本体靠近所述引脚单元的一侧设置有弹性密封圈;A USB device, the USB device includes a body and a pin unit, and an elastic sealing ring is provided on a side of the body close to the pin unit;

所述USB器件安装在所述框架上,所述引脚单元位于所述开孔中,所述弹性密封圈与所述开孔的孔壁形成密封。The USB device is installed on the frame, the pin unit is located in the opening, and the elastic sealing ring forms a seal with the hole wall of the opening.

根据第一方面,本申请通过在USB器件上增加弹性密封圈,当USB器件安装到框架上时,弹性密封圈与框架上的开孔的孔壁彼此挤压形成Z向密封,这样便无需在框和USB器件上制作定位特征和限位特征,从而不仅便于USB器件的拆卸和安装,而且降低了框架和USB器件的结构复杂度,以及空间占用,利于电子设备的轻薄化。According to the first aspect, the application adds an elastic sealing ring on the USB device. When the USB device is installed on the frame, the elastic sealing ring and the hole wall of the opening on the frame are pressed against each other to form a Z-direction seal, so that there is no need to The positioning features and limit features are made on the frame and the USB device, which not only facilitates the disassembly and installation of the USB device, but also reduces the structural complexity and space occupation of the frame and the USB device, which is beneficial to the thinning and thinning of electronic equipment.

根据第一方面,或者以上第一方面的任意一种实现方式,所述弹性密封圈通过注塑形成在所述USB器件的本体上。According to the first aspect, or any implementation manner of the above first aspect, the elastic sealing ring is formed on the body of the USB device by injection molding.

根据第一方面,或者以上第一方面的任意一种实现方式,所述弹性密封圈套设在所述USB器件的本体上。According to the first aspect, or any implementation manner of the above first aspect, the elastic sealing ring is sleeved on the body of the USB device.

根据第一方面,或者以上第一方面的任意一种实现方式,在所述框架上还安装有第一电路板和第二电路板,所述USB器件设置在所述第二电路板上。According to the first aspect, or any implementation manner of the above first aspect, a first circuit board and a second circuit board are further installed on the frame, and the USB device is arranged on the second circuit board.

根据第一方面,或者以上第一方面的任意一种实现方式,在所述框架上还安装有第一电路板和第二电路板;According to the first aspect, or any implementation manner of the above first aspect, a first circuit board and a second circuit board are further installed on the frame;

所述USB器件还包括柔性电路板,所述本体与所述柔性电路板固定连接,所述柔性电路板与所述第一电路板或所述第二电路板连接。The USB device further includes a flexible circuit board, the body is fixedly connected to the flexible circuit board, and the flexible circuit board is connected to the first circuit board or the second circuit board.

根据第一方面,或者以上第一方面的任意一种实现方式,所述USB器件还包括补强板,所述补强板设置在所述柔性电路板与所述本体重叠的区域,所述柔性电路板位于所述本体和所述补强板之间。According to the first aspect, or any implementation manner of the above first aspect, the USB device further includes a reinforcement plate, the reinforcement plate is arranged in the area where the flexible circuit board overlaps the body, and the flexible circuit board The circuit board is located between the body and the reinforcing plate.

第二方面,本申请提供一种USB器件,包括本体,以及与所述本体连接的引脚单元;In a second aspect, the present application provides a USB device, including a body, and a pin unit connected to the body;

弹性密封圈,所述弹性密封圈设置在所述本体靠近所述引脚单元的一侧。An elastic sealing ring, the elastic sealing ring is arranged on a side of the body close to the pin unit.

根据第二方面,或者以上第二方面的任意一种实现方式,所述弹性密封圈通过注塑形成在所述USB器件的本体上。According to the second aspect, or any implementation manner of the above second aspect, the elastic sealing ring is formed on the body of the USB device by injection molding.

根据第二方面,或者以上第二方面的任意一种实现方式,所述弹性密封圈套设在所述USB器件的本体上。According to the second aspect, or any implementation manner of the above second aspect, the elastic sealing ring is sleeved on the body of the USB device.

根据第二方面,或者以上第二方面的任意一种实现方式,还包括:柔性电路板,所述柔性电路板与所述本体固定连接;According to the second aspect, or any implementation manner of the above second aspect, further comprising: a flexible circuit board, the flexible circuit board is fixedly connected to the body;

补强板,所述补强板设置在所述柔性电路板与所述本体的重叠区域,所述柔性电路板位于所述本体和所述补强板之间。A reinforcing plate, the reinforcing plate is arranged in the overlapping area of the flexible circuit board and the body, and the flexible circuit board is located between the body and the reinforcing plate.

附图说明Description of drawings

图1为示例性示出的一种电子设备的结构示意图;FIG. 1 is a schematic structural diagram of an electronic device exemplarily shown;

图2为示例性示出的一种电子设备的中框的结构示意图;FIG. 2 is a schematic structural diagram of a middle frame of an electronic device;

图3为示例性示出的图2所示中框沿A-A方向的剖视图;Fig. 3 is an exemplary cross-sectional view of the middle frame shown in Fig. 2 along the direction A-A;

图4为示例性示出的具有第一防水结构的中框在A-A方向的局部放大剖视图,图中USB接口处于安装过程;Fig. 4 is a partial enlarged cross-sectional view of the middle frame with the first waterproof structure in the A-A direction, in which the USB interface is in the installation process;

图5为示例性示出的具有第二防水结构的中框在A-A方向的局部放大剖视图,图中USB接口已安装在中框上;Fig. 5 is a partially enlarged cross-sectional view in the A-A direction of the middle frame with the second waterproof structure, in which the USB interface has been installed on the middle frame;

图6为根据本申请一实施例的具有第三防水结构的中框在A-A方向的局部放大剖视图,图中USB接口已安装在中框上;Fig. 6 is a partially enlarged cross-sectional view in the direction A-A of the middle frame with a third waterproof structure according to an embodiment of the present application, in which the USB interface has been installed on the middle frame;

图7为根据本申请另一实施例的具有第三防水结构的中框在A-A方向的局部放大剖视图,图中USB接口已安装在中框上;Fig. 7 is a partially enlarged cross-sectional view in the A-A direction of a middle frame with a third waterproof structure according to another embodiment of the present application, in which the USB interface has been installed on the middle frame;

图8为根据本申请一实施例的USB器件的结构示意图之一;FIG. 8 is one of the structural schematic diagrams of a USB device according to an embodiment of the present application;

图9为根据本申请一实施例的USB器件的结构示意图之一;FIG. 9 is one of the structural schematic diagrams of a USB device according to an embodiment of the present application;

图10为根据本申请一实施例的USB器件的结构示意图之一。FIG. 10 is one of the structural schematic diagrams of a USB device according to an embodiment of the present application.

具体实施方式Detailed ways

下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

本文中术语“和/或”,仅仅是一种描述关联对象的关联关系,表示可以存在三种关系,例如,A和/或B,可以表示:单独存在A,同时存在A和B,单独存在B这三种情况。The term "and/or" in this article is just an association relationship describing associated objects, which means that there can be three relationships, for example, A and/or B can mean: A exists alone, A and B exist simultaneously, and there exists alone B these three situations.

本申请实施例的说明书和权利要求书中的术语“第一”和“第二”等是用于区别不同的对象,而不是用于描述对象的特定顺序。例如,第一目标对象和第二目标对象等是用于区别不同的目标对象,而不是用于描述目标对象的特定顺序。The terms "first" and "second" in the description and claims of the embodiments of the present application are used to distinguish different objects, rather than to describe a specific order of objects. For example, the first target object, the second target object, etc. are used to distinguish different target objects, rather than describing a specific order of the target objects.

在本申请实施例中,“示例性的”或者“例如”等词用于表示作例子、例证或说明。本申请实施例中被描述为“示例性的”或者“例如”的任何实施例或设计方案不应被解释为比其它实施例或设计方案更优选或更具优势。确切而言,使用“示例性的”或者“例如”等词旨在以具体方式呈现相关概念。In the embodiments of the present application, words such as "exemplary" or "for example" are used as examples, illustrations or illustrations. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of the present application shall not be interpreted as being more preferred or more advantageous than other embodiments or design schemes. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete manner.

在本申请实施例的描述中,除非另有说明,“多个”的含义是指两个或两个以上。例如,多个处理单元是指两个或两个以上的处理单元;多个系统是指两个或两个以上的系统。In the description of the embodiments of the present application, unless otherwise specified, "plurality" means two or more. For example, multiple processing units refer to two or more processing units; multiple systems refer to two or more systems.

本申请实施例提供一种终端设备,终端设备可以是手机、平板电脑、个人数字助理(personal digital assistant,PDA)、车载电脑等集成有USB接口等器件的电子设备。本申请实施例对上述电子设备的具体形式不作限定。如图1所示,以下为了方便说明,以终端设备是手机为例进行说明。An embodiment of the present application provides a terminal device, which may be a mobile phone, a tablet computer, a personal digital assistant (personal digital assistant, PDA), a vehicle-mounted computer, and other electronic devices integrated with components such as a USB interface. The embodiment of the present application does not limit the specific form of the foregoing electronic device. As shown in FIG. 1 , for the convenience of description, the terminal device is a mobile phone as an example for description below.

为了便于清楚描述后续各结构特征及结构特征的位置关系,以X轴方向、Y轴方向及Z轴方向来规定手机内各结构的位置关系。其中,如图2所示,X轴方向为手机的宽度方向,Y轴方向为手机的长度方向,Z轴方向为手机的厚度方向。In order to clearly describe the subsequent structural features and the positional relationship of the structural features, the positional relationship of the various structures in the mobile phone is specified in the X-axis direction, the Y-axis direction and the Z-axis direction. Wherein, as shown in FIG. 2 , the X-axis direction is the width direction of the mobile phone, the Y-axis direction is the length direction of the mobile phone, and the Z-axis direction is the thickness direction of the mobile phone.

如图1所示,手机100包括显示屏10、中框20以及后壳(未示出)。显示屏10、中框20和后壳可以围成容纳腔体。容纳腔体内可以安装各种电子器件,例如电路板、电池、USB器件等,这些电子器件一般固定在中框20上或者依托中框20固定。中框20以及后壳可以根据需要采用各种合适的形状和结构,在此不做具体限定。As shown in FIG. 1 , a mobile phone 100 includes a display screen 10 , a middle frame 20 and a rear case (not shown). The display screen 10 , the middle frame 20 and the rear case can form an accommodating cavity. Various electronic devices, such as circuit boards, batteries, USB devices, etc., can be installed in the accommodating cavity, and these electronic devices are generally fixed on the middle frame 20 or fixed by the middle frame 20 . The middle frame 20 and the rear shell can adopt various suitable shapes and structures according to needs, which are not specifically limited here.

如图2所示,在中框20上安装有电路板,示例性地电路板包括主板21和副板(或小板)22。主板21上设置有手机100的主要芯片,例如SOC(片上系统)、存储芯片、摄像头芯片等。副板(或小板)22上设置有手机所需要的其它芯片或电子器件,例如显示芯片或电源管理芯片等。主板21和副板22可以通过诸如排线等连接件进行电连接和通信。As shown in FIG. 2 , a circuit board is installed on the middle frame 20 . Exemplarily, the circuit board includes a main board 21 and a sub board (or small board) 22 . The main chips of the mobile phone 100 are arranged on the motherboard 21 , such as SOC (system on chip), memory chip, camera chip and so on. The sub-board (or small board) 22 is provided with other chips or electronic devices required by the mobile phone, such as a display chip or a power management chip. The main board 21 and the sub-board 22 can be electrically connected and communicated through connectors such as cables.

在副板22上安装有USB接口23。USB接口23例如为Type-C USB接口,其用于与外部USB数据线40连接,从而使手机100与外部充电器或其它终端电连接或通信,从而进行充电或与外部设备进行数据交互。A USB interface 23 is installed on the sub-board 22 . The USB interface 23 is, for example, a Type-C USB interface, which is used to connect with the external USB data cable 40, so that the mobile phone 100 can be electrically connected or communicated with an external charger or other terminals, so as to perform charging or perform data interaction with external devices.

如图1和图3所示,在中框20上还设置开孔30,USB接口23通过开孔30将USB接口23的引脚从容纳腔体内伸出到腔体外部,以能与外部USB数据线40连接。开孔30的截面例如为中间矩形加两端半圆的形状。开孔30的截面形状为沿与手机的长度方向Y相垂直的剖切面截取的平面的形状。As shown in Figures 1 and 3, an opening 30 is also provided on the middle frame 20, and the USB interface 23 extends the pins of the USB interface 23 from the accommodating cavity to the outside of the cavity through the opening 30, so as to be able to communicate with the external USB The data line 40 is connected. The cross section of the opening 30 is, for example, a rectangle in the middle plus semicircles at both ends. The cross-sectional shape of the opening 30 is the shape of a plane taken along a sectional plane perpendicular to the longitudinal direction Y of the mobile phone.

对于具有防水功能的电子设备,USB接口23必须满足一定的防水要求,即在开孔30处需要满足一定的防水要求。如图3所示,一般在开孔30与容纳腔体交界的B位置处(也称为密封位置)在中框20和USB接口23上增加防水结构,从而使得USB接口23满足防水要求,以避免外部水分通过开孔30进入到手机100内部(即容纳腔),对手机100内部的电子器件造成损伤。For an electronic device with a waterproof function, the USB interface 23 must meet certain waterproof requirements, that is, the opening 30 must meet certain waterproof requirements. As shown in FIG. 3 , a waterproof structure is generally added to the middle frame 20 and the USB interface 23 at the position B (also called the sealing position) at the junction of the opening 30 and the receiving cavity, so that the USB interface 23 meets the waterproof requirements, and Prevent external moisture from entering the interior of the mobile phone 100 (that is, the housing cavity) through the opening 30 , causing damage to the electronic devices inside the mobile phone 100 .

下面结合图4和图5对手机100的中框20和USB接口23在密封位置的防水结构进行详细介绍。The waterproof structure of the middle frame 20 and the USB interface 23 of the mobile phone 100 at the sealing position will be described in detail below with reference to FIG. 4 and FIG. 5 .

目前手机100的中框20和USB接口23在密封位置B的防水结构为Y向密封结构。第一种方式如图4所示,在中框20上在密封位置B处形成密封特征,例如为台阶结构、槽结构或其它结构,在USB接口23上形成密封软胶231,该密封软胶231可以通过点胶等方式形成在USB接口23上。当将USB接口23插入开孔30后,密封软胶231与中框的密封特征形成过盈配合,从而使得USB接口23和开孔30在密封位置B实现密封,为内部容纳腔体提供密封环境。并且为了使密封软胶231与中框20的密封特征形成过盈配合,在中框20的C1和D2位置处形成定位特征,在USB接口23的C2和D2位置处形成限位特征,当将USB接口23插入开孔30后,C1和C2以及D1和D2位置处的定位特征和限位特征会提供Y方向的作用力使得密封软胶231与中框20的密封特征形成过盈配合。C1和C2以及D1和D2位置处的定位特征和限位特征的配合方式可以参考图5中的C和D位置的对应特征。这种通过Y向作用力实现过盈配合来实现密封的方式在本文中被称为Y向密封。At present, the waterproof structure of the middle frame 20 and the USB interface 23 of the mobile phone 100 at the sealing position B is a Y-direction sealing structure. In the first way, as shown in Figure 4, a sealing feature is formed at the sealing position B on the middle frame 20, such as a step structure, a groove structure or other structures, and a sealing soft glue 231 is formed on the USB interface 23, the sealing soft glue 231 may be formed on the USB interface 23 by dispensing glue or the like. When the USB interface 23 is inserted into the opening 30, the soft sealing glue 231 forms an interference fit with the sealing feature of the middle frame, so that the USB interface 23 and the opening 30 are sealed at the sealing position B, providing a sealed environment for the internal cavity . And in order to form an interference fit between the sealing soft glue 231 and the sealing feature of the middle frame 20, the positioning features are formed at the C1 and D2 positions of the middle frame 20, and the limiting features are formed at the C2 and D2 positions of the USB interface 23. When the After the USB interface 23 is inserted into the opening 30 , the positioning features and limit features at the positions of C1 and C2 and D1 and D2 will provide a force in the Y direction so that the sealing rubber 231 forms an interference fit with the sealing features of the middle frame 20 . The matching manner of the positioning features and limit features at positions C1 and C2 and D1 and D2 can refer to the corresponding features at positions C and D in FIG. 5 . This method of implementing interference fit through Y-direction force to achieve sealing is referred to as Y-direction sealing herein.

这种方式虽然可以使得USB接口23和开孔30在密封位置B实现密封,但是由于组装过程中USB接口23需要先焊接到副板22上,而副板22相对USB接口23而言尺寸巨大,因此在将USB接口23插入开孔30的过程中只能采用倾斜插入的方式,并且由于上述定位特征和限位特征的存在无论是安装USB接口23还是拆卸USB接口23均非常不便,很容易损坏造成部分区域损坏。而且随着手机轻薄化的要求,在中框上设置定位特征会给手机内部的电路板和器件布局以及安装带来更多困难。Although this method can make the USB interface 23 and the opening 30 be sealed at the sealing position B, because the USB interface 23 needs to be welded to the sub-board 22 first during the assembly process, and the sub-board 22 is huge in size compared to the USB interface 23, Therefore, in the process of inserting the USB interface 23 into the opening 30, only an oblique insertion method can be used, and due to the existence of the above-mentioned positioning features and limit features, it is very inconvenient to install the USB interface 23 or remove the USB interface 23, and it is easy to damage. cause damage to some areas. Moreover, with the requirement of thinner and lighter mobile phones, setting positioning features on the middle frame will bring more difficulties to the layout and installation of circuit boards and components inside the mobile phone.

第二方式如图5所示,在密封位置B处在中框20和USB接口23之间贴合密封泡棉232来实现密封,为内部容纳腔体提供密封环境。并且与图4所示类似,在C和D位置在中框20和USB接口23上分别形成定位特征和限位特征,当将USB接口23插入开孔30后,C和D位置处的定位特征和限位特征会提供Y向作用力,从而使密封泡棉232在密封位置B处贴合更牢固,进而实现使得USB接口23和开孔30在密封位置B的密封效果更好。此外,为了便于将USB接口23安装到中框20的开孔30中,USB接口23先与柔性电路板233焊接在一起,当将USB接口23安装到中框20的开孔30后,再将柔性电路板233连接到主板21或副板22上。这样由于无需先将USB接口23焊接在副板22上,因此在USB接口23安装过程中由于没有与副板22固定在一起,USB接口23的安装相对容易。但是由于上述限位特征和定位特征的存在,这种密封方式仍然存在拆卸困难的问题,并且上述定位特征和限位特征的需求导致中框20和USB接口23的制作工艺繁琐,并且会占用手机的内部空间,这对手机的轻薄化是不利的。The second method is as shown in FIG. 5 , at the sealing position B, a sealing foam 232 is pasted between the middle frame 20 and the USB interface 23 to realize sealing, so as to provide a sealed environment for the internal cavity. And similar to that shown in FIG. 4 , positioning features and limiting features are respectively formed on the middle frame 20 and the USB interface 23 at positions C and D. When the USB interface 23 is inserted into the opening 30, the positioning features at positions C and D The and limiting feature will provide a Y-direction force, so that the sealing foam 232 can fit more firmly at the sealing position B, thereby achieving a better sealing effect between the USB interface 23 and the opening 30 at the sealing position B. In addition, in order to facilitate the installation of the USB interface 23 into the opening 30 of the middle frame 20, the USB interface 23 is first welded together with the flexible circuit board 233, and after the USB interface 23 is installed in the opening 30 of the middle frame 20, the The flexible circuit board 233 is connected to the main board 21 or the sub-board 22 . In this way, since there is no need to weld the USB interface 23 on the sub-board 22 first, the installation of the USB interface 23 is relatively easy because it is not fixed with the sub-board 22 during the installation of the USB interface 23 . However, due to the existence of the above-mentioned limiting features and positioning features, this sealing method still has the problem of difficult disassembly, and the requirements of the above-mentioned positioning features and limiting features lead to cumbersome manufacturing processes for the middle frame 20 and USB interface 23, and will occupy the mobile phone. The internal space of the mobile phone is not good for the thinning and lightening of the mobile phone.

本申请实施例基于以上描述提供一种用于USB接口的密封结构,其使得USB接口的安装和拆卸更容易进行,并且可以减小内部空间的占用,利于手机的轻薄化要求。The embodiment of the present application provides a sealing structure for a USB interface based on the above description, which makes the installation and removal of the USB interface easier, and can reduce the occupation of internal space, which is conducive to the thinner and lighter requirements of the mobile phone.

如图6所示,在USB接口23与密封位置B对应的位置处设置弹性密封圈234,弹性密封圈234的尺寸大于USB接口23插入到开孔30后中框20与USB接口23在密封位置B处的间隙,因此当将USB接口23插入到开孔30后,在密封位置B处,中框20会与弹性密封圈234会在Z方向上相互挤压,从而实现密封。由于这种密封方式通过Z方向的作用力实现密封,因此在本文中被称为Z向密封。与图4和图5所示的Y向密封相比,Z向密封由于不再需要Y作用力,因此无需在中框20和USB接口23上制作定位特征和限位特征,如图6虚线区域所示,在中框20和USB接口23上没有图4和图5所示的定位特征和限位特征。这样不仅使得USB接口23的安装和拆卸更易进行,而且大大减少了中框20和USB接口23的制作复杂度,降低了成本,并且减少了对手机100内部空间的占用,利于手机实现进一步的轻薄化。As shown in Figure 6, an elastic sealing ring 234 is provided at the position corresponding to the USB interface 23 and the sealing position B. The size of the elastic sealing ring 234 is larger than that of the USB interface 23 and inserted into the opening 30. After the middle frame 20 and the USB interface 23 are at the sealing position The gap at B, therefore, when the USB interface 23 is inserted into the opening 30 , at the sealing position B, the middle frame 20 and the elastic sealing ring 234 will squeeze each other in the Z direction, thereby achieving sealing. Since this sealing method achieves sealing through the force in the Z direction, it is called Z-direction sealing in this article. Compared with the Y-direction seal shown in Figure 4 and Figure 5, the Z-direction seal does not require Y force, so there is no need to make positioning features and limit features on the middle frame 20 and USB interface 23, as shown in the dotted line area in Figure 6 As shown, there are no positioning features and limit features shown in FIG. 4 and FIG. 5 on the middle frame 20 and the USB interface 23 . This not only makes the installation and disassembly of the USB interface 23 easier, but also greatly reduces the manufacturing complexity of the middle frame 20 and the USB interface 23, reduces the cost, and reduces the occupation of the internal space of the mobile phone 100, which is conducive to further thinning of the mobile phone. change.

与图5所示类似,在图6所示的方案中,为了便于将USB接口23安装到中框20的开孔30中,USB接口23先与柔性电路板233焊接在一起,当将USB接口23安装到中框20的开孔30后,再将柔性电路板233连接到主板21或副板22上。这样由于无需先将USB接口23焊接在副板22上,因此在USB接口23的安装过程中由于没有与副板22固定在一起,USB接口23的安装相对容易。并且由于柔性电路板233的存在,可以根据需要使USB接口23通过柔性电路板233直接与主板21上的芯片(例如SOC)进行连接和通信,而无需先连接到副板22上,再通过副板22与主板21上的芯片通信。Similar to that shown in FIG. 5 , in the solution shown in FIG. 6 , in order to facilitate the installation of the USB interface 23 into the opening 30 of the middle frame 20 , the USB interface 23 is first welded together with the flexible circuit board 233 . After the flexible circuit board 233 is installed in the opening 30 of the middle frame 20, the flexible circuit board 233 is connected to the main board 21 or the sub-board 22. In this way, since there is no need to weld the USB interface 23 on the sub-board 22 first, the installation of the USB interface 23 is relatively easy because it is not fixed with the sub-board 22 during the installation process of the USB interface 23 . And because of the existence of the flexible circuit board 233, the USB interface 23 can be directly connected and communicated with the chip (such as SOC) on the main board 21 through the flexible circuit board 233 as required, without first being connected to the sub-board 22, and then through the sub-board 22. The board 22 communicates with chips on the motherboard 21 .

应当理解的是,虽然USB接口23可以通过柔性电路板233直接与主板21上的芯片进行连接和通信,但是这并不是必须的,在其它实施例中,USB接口23仍然可以通过柔性电路板233先与副板22通信连接,再通过副板22与主板21上的芯片进行通信也是可行的。It should be understood that although the USB interface 23 can directly connect and communicate with the chip on the motherboard 21 through the flexible circuit board 233, this is not necessary. In other embodiments, the USB interface 23 can still be It is also feasible to communicate with the sub-board 22 first, and then communicate with the chips on the main board 21 through the sub-board 22 .

如图7所示,在USB接口23与密封位置B对应的位置处设置弹性密封圈234,弹性密封圈234的尺寸大于USB接口23插入到开孔30后中框20与USB接口23在密封位置B处的间隙,因此当将USB接口23插入到开孔30后,在密封位置B处,中框20会与弹性密封圈234会在Z方向上相互挤压,从而实现密封。由于这种密封方式通过Z方向的作用力实现密封,因此在本文中被称为Z向密封。与图4和图5所示的Y向密封相比,Z向密封由于不再需要Y作用力,因此无需在中框20和USB接口23上制作定位特征和限位特征,如图7虚线区域所示,在中框20和USB接口23上没有图4和图5所示的定位特征和限位特征。这样不仅使得USB接口23的安装和拆卸更易进行,而且大大减少了中框20和USB接口23的制作复杂度,降低了成本,并且减少了对手机100内部空间的占用,利于手机实现进一步的轻薄化。As shown in Figure 7, an elastic sealing ring 234 is provided at the position corresponding to the USB interface 23 and the sealing position B. The size of the elastic sealing ring 234 is larger than that of the USB interface 23 and inserted into the opening 30. After the middle frame 20 and the USB interface 23 are in the sealing position The gap at B, therefore, when the USB interface 23 is inserted into the opening 30 , at the sealing position B, the middle frame 20 and the elastic sealing ring 234 will squeeze each other in the Z direction, thereby achieving sealing. Since this sealing method achieves sealing through the force in the Z direction, it is called Z-direction sealing in this article. Compared with the Y-direction seal shown in Figures 4 and 5, the Z-direction seal does not require Y force, so there is no need to make positioning features and limit features on the middle frame 20 and USB interface 23, as shown in the dotted line area in Figure 7 As shown, there are no positioning features and limit features shown in FIG. 4 and FIG. 5 on the middle frame 20 and the USB interface 23 . This not only makes the installation and disassembly of the USB interface 23 easier, but also greatly reduces the manufacturing complexity of the middle frame 20 and the USB interface 23, reduces the cost, and reduces the occupation of the internal space of the mobile phone 100, which is conducive to further thinning of the mobile phone. change.

与图6所示不同,在图7所示的方案中,USB接口23连接在副板22上,然而由于在中框20和USB接口23上没有图4和图5所示的定位特征和限位特征,因此即使先将USB接口23连接在副板22上,在安装时通过倾斜插入的方式也很容易安装到开孔30中。Different from that shown in FIG. 6, in the solution shown in FIG. 7, the USB interface 23 is connected to the sub-board 22. However, since there are no positioning features and limitations shown in FIGS. Therefore, even if the USB interface 23 is connected to the sub-board 22 first, it can be easily installed into the opening 30 by inserting it obliquely during installation.

应当理解的是图6和图7所示的中框20和USB接口23的具体结构并不构成对本申请的限定,其仅是示例性的。本申请的核心在于在USB接口23和中框20之间采用Z向密封,从而无需在中框20和USB接口23上制作定位特征和限位特征,不仅可以方便的安装和拆卸USB接口,而且大大减少了中框20和USB接口23的制作复杂度,降低了成本,并且减少了对手机100内部空间的占用,利于手机实现进一步的轻薄化。It should be understood that the specific structures of the middle frame 20 and the USB interface 23 shown in FIG. 6 and FIG. 7 do not limit the present application, and are only exemplary. The core of this application is to adopt Z-direction sealing between the USB interface 23 and the middle frame 20, so that there is no need to make positioning features and limit features on the middle frame 20 and the USB interface 23, not only the USB interface can be easily installed and disassembled, but also The manufacturing complexity of the middle frame 20 and the USB interface 23 is greatly reduced, the cost is reduced, and the occupation of the internal space of the mobile phone 100 is reduced, which is conducive to further thinning and thinning of the mobile phone.

图8为根据本申请一实施例的USB器件的结构示意图之一;图9为根据本申请一实施例的USB器件的结构示意图之一;图10为根据本申请一实施例的USB器件的结构示意图之一。Fig. 8 is one of the schematic structural diagrams of a USB device according to an embodiment of the present application; Fig. 9 is one of the structural schematic diagrams of a USB device according to an embodiment of the present application; Fig. 10 is a structure of a USB device according to an embodiment of the present application One of the diagrams.

如图8至图10所示,本申请实施例提供的USB器件200包括器件本体201、引脚单元202、安装部203、弹性密封圈204、柔性电路板205和补强板206。器件本体201包括诸如线路、芯片、壳体等部分。引脚单元202包括多个USB引脚。引脚单元202与本体201固定连接。安装部203设置在本体201上,用于将USB器件安装在电子设备中,并与电子设备的框架(例如手机的中框)连接,从而将USB器件固定在电子设备的框架上。弹性密封圈204设置在本体201靠近引脚单元202的一侧。弹性密封圈例如采用橡胶等弹性材料制作。其可以通过注塑方式形成在本体201上,也可以套设在本体201上,或者采用其它方式形成在本体201上。弹性密封圈204用于与电子设备中的USB器件的开孔形成密封。本体201与柔性电路板205通过焊接等方式连接在一起。补强板206设置在本体201与柔性电路板205的重叠区域,柔性电路板205位于本体201和补强板206之间,通过补强板206为柔性电路板205提供支撑性能。补强板206可以采用各种具有一定刚性的材料,例如各种金属材料。示例性地,在本申请实施例补强板206可以采用钢片。补强板206可以通过诸如焊接、粘合等方式与柔性电路板205和本体201连接固定。As shown in FIG. 8 to FIG. 10 , the USB device 200 provided by the embodiment of the present application includes a device body 201 , a pin unit 202 , a mounting part 203 , an elastic sealing ring 204 , a flexible circuit board 205 and a reinforcement board 206 . The device body 201 includes parts such as circuits, chips, housings and the like. The pin unit 202 includes a plurality of USB pins. The pin unit 202 is fixedly connected with the body 201 . The installation part 203 is arranged on the body 201, and is used for installing the USB device in the electronic device, and connecting with the frame of the electronic device (such as the middle frame of the mobile phone), so as to fix the USB device on the frame of the electronic device. The elastic sealing ring 204 is disposed on a side of the body 201 close to the pin unit 202 . The elastic sealing ring is, for example, made of elastic materials such as rubber. It can be formed on the body 201 by injection molding, or can be sleeved on the body 201 , or formed on the body 201 in other ways. The elastic sealing ring 204 is used to form a seal with the opening of the USB device in the electronic device. The body 201 and the flexible circuit board 205 are connected together by welding or the like. The reinforcement board 206 is disposed in the overlapping area of the body 201 and the flexible circuit board 205 , the flexible circuit board 205 is located between the body 201 and the reinforcement board 206 , and the reinforcement board 206 provides support for the flexible circuit board 205 . The reinforcing plate 206 can be made of various materials with certain rigidity, such as various metal materials. Exemplarily, steel sheets may be used for the reinforcing plate 206 in this embodiment of the present application. The reinforcement board 206 can be connected and fixed with the flexible circuit board 205 and the main body 201 by means such as welding and bonding.

以上所述,以上实施例仅用以说明本申请的技术方案,而非对其限制;尽管参照前述实施例对本申请进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still understand the foregoing The technical solutions described in each embodiment are modified, or some of the technical features are replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the various embodiments of the application.

Claims (10)

1. An electronic device, comprising:
a frame having an opening formed in a wall thereof;
the USB device comprises a body and a pin unit, wherein an elastic sealing ring is arranged on one side, close to the pin unit, of the body;
the USB device is mounted on the frame, the pin unit is located in the opening, and the elastic sealing ring and the wall of the opening form a seal.
2. The electronic device of claim 1, wherein the elastic sealing ring is formed on the body of the USB device by injection molding.
3. The electronic device of claim 1, wherein the elastic sealing ring is sleeved on the body of the USB device.
4. The electronic device of any one of claims 1-3, wherein a first circuit board and a second circuit board are also mounted on the frame, the USB device being disposed on the second circuit board.
5. The electronic device of any one of claims 1-3, wherein a first circuit board and a second circuit board are also mounted on the frame;
the USB device further comprises a flexible circuit board, wherein the body is fixedly connected with the flexible circuit board, and the flexible circuit board is connected with the first circuit board or the second circuit board.
6. The electronic device of claim 5, wherein the USB device further comprises a stiffener disposed in an area where the flexible circuit board overlaps the body, the flexible circuit board being located between the body and the stiffener.
7. A USB device, comprising:
a body, and a pin unit connected with the body;
the elastic sealing ring is arranged on one side of the body, which is close to the pin unit.
8. The USB device of claim 7, wherein the elastomeric seal ring is formed on the body of the USB device by injection molding.
9. The USB device of claim 7, wherein the resilient sealing ring is sleeved over a body of the USB device.
10. The USB device of claim 7, further comprising:
the flexible circuit board is fixedly connected with the body;
the stiffening plate is arranged in the overlapping area of the flexible circuit board and the body, and the flexible circuit board is positioned between the body and the stiffening plate.
CN202223502768.8U 2022-12-26 2022-12-26 USB device and electronic equipment Active CN219477087U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223502768.8U CN219477087U (en) 2022-12-26 2022-12-26 USB device and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223502768.8U CN219477087U (en) 2022-12-26 2022-12-26 USB device and electronic equipment

Publications (1)

Publication Number Publication Date
CN219477087U true CN219477087U (en) 2023-08-04

Family

ID=87463618

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223502768.8U Active CN219477087U (en) 2022-12-26 2022-12-26 USB device and electronic equipment

Country Status (1)

Country Link
CN (1) CN219477087U (en)

Similar Documents

Publication Publication Date Title
CN102280607A (en) Battery assembly for battery powered portable devices
CN114466093A (en) Electronic device
CN217240720U (en) Flexible circuit board modules and terminals
CN113455108A (en) Circuit board assembly and electronic equipment
US10439340B2 (en) Earphone socket with housing and support bracket
CN113795075B (en) an electronic device
CN219477087U (en) USB device and electronic equipment
CN115002256B (en) A bracket, module component and electronic device
CN113437550B (en) Electronic device
CN209134701U (en) A housing assembly and electronic device
CN106505358B (en) Mobile terminal, earphone seat and manufacturing method of earphone seat
CN106329212A (en) Mobile terminal, earphone holder, and method for manufacturing the earphone holder
CN217936414U (en) Electronic equipment
CN219322440U (en) an electronic device
CN218920754U (en) Electronic equipment
CN202496134U (en) Combination device of thin battery and circuit board
CN218940037U (en) An electronic device module and terminal equipment
CN222674739U (en) Electronic equipment
CN206922048U (en) Connector assembly, power supply module and terminal device
CN221860916U (en) A motherboard with high space utilization
CN113727566B (en) Circuit board assembly and electronic equipment
CN220570009U (en) An adapter board, connecting cable and electronic equipment
KR20140096735A (en) Socket reinforcing apparatus for electronic device
CN223274260U (en) Circuit boards and terminal equipment
CN220139966U (en) Cable clamp structure, functional components and electronic equipment

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: Unit 3401, unit a, building 6, Shenye Zhongcheng, No. 8089, Hongli West Road, Donghai community, Xiangmihu street, Futian District, Shenzhen, Guangdong 518040

Patentee after: Honor Terminal Co.,Ltd.

Country or region after: China

Address before: 3401, unit a, building 6, Shenye Zhongcheng, No. 8089, Hongli West Road, Donghai community, Xiangmihu street, Futian District, Shenzhen, Guangdong

Patentee before: Honor Device Co.,Ltd.

Country or region before: China