CN219978821U - A new structure 2U type radiator - Google Patents

Abstract

A new structure 2U type radiator, including a base plate, a heat pipe group, a fin group, a heat source and spring bolts. The base plate includes a base, a fin group and a groove; the heat pipe group is composed of several heat pipes distributed in parallel arrays, and the heat pipes are U The tube includes a flattened portion, two bent portions connected to both ends of the flattened portion, and two ends connected to the two bent portions respectively. The bottom of the heat pipe is nested inside the groove; the fin set is It is composed of several single-piece fins connected, and the single-piece fin is X-shaped, and the end is in contact with the fin group; the heat source is in contact with the bottom of the base plate; the spring bolt includes a screw and a gasket arranged sequentially from the top to the bottom of the screw. Spring, gasket b and circlip, the bottom end of the screw is provided with external threads, and the spring bolt is used to fix the contact between the radiator and the heat source. The heat sink has the advantages of fast heat conduction speed, good temperature uniformity effect, high heat conduction efficiency, simple process and can be manufactured in large quantities, and can meet the heat dissipation needs of high heat flow density and high power consumption heating chips.

Description

A new structure 2U type radiator

Technical field

The utility model belongs to the technical field of server cooling equipment, and specifically relates to a new structure 2U-shaped radiator.

Background technique

The miniaturization of electronic devices and the high integration of electronic components have caused problems such as heat concentration and inability to dissipate in time when the electronic devices are working. The complexity of data operations and graphics processing has caused the power of CPU and GPU to continue to increase. The increase in power also leads to an increase in thermal power consumption. The increase in thermal power consumption causes the local temperature of electronic components to rise sharply. High temperature not only makes the electronic components unstable and dangerous when working, but also increases the aging of electronic component materials and reduces their service life.

Currently, server-based heat dissipation is mostly based on air-cooling, which uses fan-assisted radiators to dissipate server chips. This type of radiator is usually designed with aluminum fins and a copper base. For some high-power server chips, heat pipes are added to assist in heat transfer and heat dissipation. In view of this, this application provides a new structure of high-efficiency 2U heat pipe radiator for 2U servers.

Utility model content

Technical problems solved: In view of the above technical problems, the present utility model provides a new structure 2U type radiator, which is optimized for the structure. While reducing the manufacturing cost and weight of the radiator, it can simultaneously improve the performance of high-power chips. The heat dissipation effect. In addition, this application also introduces the processing technology of the radiator in detail to ensure that the technology is simple, effective and practical.

Technical solution: a new structure 2U type radiator, including a base plate, a heat pipe group, a fin group, a heat source and a spring bolt. The base plate includes a base, a fin group located on the base and several groups of concave holes located at the bottom of the base. slot, the base is a square base, the four corners of the base are provided with through holes, the through holes are step holes, and the fin group is composed of several single fins distributed in parallel arrays;

The heat pipe group is composed of several heat pipes distributed in parallel arrays. The heat pipe is a U-shaped pipe, including a flattened portion, two bent portions respectively connected to both ends of the flattened portion, and two bent portions respectively connected to each other. At the two ends of the heat pipe, each heat pipe corresponds to a groove, and the bottom of the heat pipe is nested inside the groove;

The fin set is a fin set composed of several single fins connected through the fin folding and buckling fin processes. The single fin is X-shaped, and there are several sets of key holes on the single fin. and perforations, the keyholes correspond to the number of the ends and match one by one, the ends are in contact with the fin group, the number and position of the perforations correspond to the through holes and match one by one;

The heat source is a CPU or GPU chip, and the heat source is in contact with the bottom of the substrate;

The spring bolt includes a screw, a gasket a, a spring, a gasket b and a circlip arranged in sequence from the top to the bottom of the screw. The bottom end of the screw is provided with an external thread. The spring bolt is used to fix the radiator in close contact with the heat source. The spring bolt The through hole is passed through the through hole through the gasket b and the circlip, and the through hole is passed through the bottom end of the screw for fixing the heat source.

Preferably, the substrate is copper, copper alloy, aluminum or aluminum alloy substrate. Other metal materials can also be used.

Preferably, the outer contour size of the substrate is 105×80 mm, and the thickness is 6 mm.

As a preferred option, the thickness of a single fin in the fin group is 0.5 mm, the fin spacing is 2 mm, and the fin height is 7 mm.

Preferably, the heat pipe group consists of 6 heat pipes, and the heat pipes are copper or copper alloy heat pipes.

Preferably, the length of the heat pipe is 190mm and the diameter is 6mm.

Preferably, there are 6 grooves, and the groove radius is 4.9 mm.

Preferably, the fins are at least one of sheet-shaped ribs and cylindrical fins, wherein sheet-shaped ribs are further divided into rectangular sheet-shaped ribs and triangles, and cylindrical ribs are also divided into cylindrical, rectangular and needle-shaped.

Preferably, the outer outline size of the fin is 118×110mm, the thickness of a single fin is 0.3mm, and the fin spacing is 1.3mm.

Preferably, the spring bolt is an M3 bolt with a total length of 30mm.

Beneficial effects: The new type of radiator has the advantages of fast heat conduction speed, good temperature uniformity effect, high heat conduction efficiency, simple process and can be manufactured in large quantities, and can meet the heat dissipation needs of high heat flow density and high power consumption heating chips. In terms of heat dissipation capacity, under the same working conditions, compared with a full-size radiator under the same space volume, simulation calculations show that the new structure radiator can reduce the surface temperature of the heat source by approximately 5.3%. In terms of weight, compared with a full-size radiator in the same space volume, the weight of the radiator is reduced by about 10%. The reduction in materials will lead to lower manufacturing costs.

Description of the drawings

Figure 1 is an overall view of the radiator of this new type;

Figure 2 is a diagram of the radiator substrate of the new model;

Figure 3 is a diagram of the heat pipe group of the radiator according to the present invention;

Figure 4 is a diagram of the radiator fin assembly of the new model;

Figure 5 is a diagram of the spring bolt of the new type;

Figure 6 is a diagram of the assembly process of the radiator of the present invention;

Figure 7 is a schematic structural diagram of the radiator of the present invention, in which (a) is a top view, (b) is a main view, (c) is a right view, and (d) is a bottom view.

The numbers in the figure represent the following: 1. Base plate; 2. Heat pipe group; 3. Fin group; 4. Heat source; 5. Spring bolt; 6. Base; 7. Fin group; 8. Groove; 9. Pass Hole; 2-1. Bent part; 2-2. Flattened part; 2-3. End; 3-1. Key hole; 3-2. Perforation; 5-1. Screw; 5-2. Gasket a; 5-3. Spring; 5-4. Gasket b; 5-5. Snap spring.

Detailed ways

The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

Example 1

A new structure 2U-shaped radiator, see Figure 1-7, including a base plate 1, a heat pipe group 2, a fin group 3, a heat source 4 and a spring bolt 5. The base plate 1 includes a base 6 and ribs provided on the base 6 The fin group 7 and several sets of grooves 8 are provided at the bottom of the base 6. The base 6 is a square base. The four corners of the base 6 are provided with through holes 9. The through holes are step holes. The fin group 7 is composed of several single pieces distributed in a parallel array. Composed of ribs.

The heat pipe group 2 is composed of several heat pipes distributed in parallel arrays. The heat pipe is a U-shaped pipe, including a flattened portion 2-2 and two bent portions 2-2 respectively connected to both ends of the flattened portion 2-2. 1 and two end portions 2-3 respectively connected to the two bending portions 2-1. Each heat pipe corresponds to a groove 8, and the bottom of the heat pipe is nested inside the groove 8.

The fin set 3 is a fin set composed of several single-piece fins connected through folding and buckling fin processes. The single-piece fins are X-shaped, and there are several sets of keys on the single-piece fins. Hole 3-1 and perforation 3-2, the keyhole 3-1 corresponds to the number of the end 2-3 and matches one by one, the number and position of the perforation 3-2 corresponds to the through hole 9 and matches one by one , the end 2-3 is in contact with the fin group 3.

The heat source 4 is a CPU or GPU chip, and the heat source 4 is in contact with the bottom of the substrate 1 .

The spring bolt 5 includes a screw rod 5-1 and a gasket a 5-2, a spring 5-3, a gasket b 5-4 and a circlip 5-5 arranged sequentially from the top to the bottom of the screw rod 5-1. The screw rod 5- 1 The bottom end is provided with external threads, and the spring bolt 5 is used to fix the radiator in close contact with the heat source 4. The spring bolt 5 passes through the through hole 3-2 and is clamped in the through hole 9 through the gasket b 5-4 and the retaining spring 5-5. Inside, the bottom end of the screw 5-1 passes through a through hole 9 for fixing the heat source 4.

Example 2

Same as Embodiment 1, the difference is that the substrate 1 is copper, copper alloy, aluminum or aluminum alloy substrate, and may also include other suitable metals and alloys.

The outer contour size of the substrate 1 is 105×80 mm, and the thickness is 6 mm. The base plate is integrally formed by machining. The base plate 1 is processed with a fin group 7, a groove 8 and a through hole 9. The fins are at least one of sheet-shaped fins and cylindrical fins. The sheet-shaped ribs are further divided into They are rectangular sheet-shaped ribs and triangles, etc. Cylindrical ribs are also divided into cylindrical, rectangular, needle-shaped, etc. The thickness of the sheet-shaped ribs is 0.3mm-3mm, and the fin spacing is 1.5mm-3mm. The sheet-shaped fins can be processed by at least one of machining processes such as shovel teeth and CNC, and the cylindrical fins can be processed by at least one of machining processes such as CNC. In this embodiment, they are rectangular fins.

The thickness of a single fin in fin group 7 is 0.5 mm, the fin spacing is 2 mm, and the fin height is 7 mm. There are six grooves 8 with a groove radius of 4.9 mm, which are used for nested connection with heat pipes. There are four through holes 9, which are used to assemble spring bolt holes.

The heat pipe group 2 is composed of 6 heat pipes. The heat pipes are copper or copper alloy heat pipes (commonly available on the market, with a diameter of generally 5-10 mm). They are composed of a tube shell, a capillary structure and a working fluid. The capillary structure is a groove, Copper powder sintering or copper mesh sintering (in this embodiment, copper powder sintering), the working medium is ultrapure water, and in this embodiment, it is a copper alloy heat pipe). The heat pipe length is 190mm and the diameter is 6mm. The heat pipe is a high thermal conductivity element for rapid heat transfer, and the equivalent thermal conductivity is about 20 times more than that of copper. The heat pipe is bent and flattened into a U shape to obtain a bent portion 2-1, a flattened portion 2-2 (semi-circular) and an end portion 2-3. The heat pipe flattened portion 2-2 and the groove 8 connect the base plate 1 and the heat pipe group 2 through pipe rolling and soldering processes. The coplanar position between the rolled tube and the welded base plate 1 and the heat pipe has a high degree of flatness and can be in good contact with the heat source. The flattened portion 2-2 is in direct contact with the heat source 4, which means that the heat pipe is in direct contact with the heat source, and the end portion 2-3 is in contact with the fin group 3. The advantage of this type of heat pipe design that directly contacts the chip is that it can quickly conduct the chip temperature to the fins and dissipate it into the air through convection.

The fin set 3 is made of at least one of copper, copper alloy, aluminum and aluminum alloy. The external outline size of a single fin is 118×110mm, and the thickness of a single fin is 0.3-0.5mm (0.3 in this embodiment) mm), the fin spacing is 1.2-2mm (1.3mm in this embodiment). The fins are specially designed to be X-shaped based on the comprehensive consideration of boundary layer theory and field synergy theory, which can effectively reduce air flow resistance and at the same time increase the flow heat transfer coefficient of the fin group, thus improving the heat dissipation capacity of the radiator. Under the same working conditions, compared with a full-size radiator in the same space volume, simulation calculations show that the new structure radiator can reduce the surface temperature of the heat source from 73.4°C to 69.5°C, a decrease of approximately 5.3%. The fins are punched from a single piece by a die, and the fin set is punched into an X shape to obtain a keyhole 3-1 and a perforation 3-2. The key hole 3-1 is used to pierce the heat pipe and the solder paste is applied through this hole. In this embodiment, the heat pipe is connected to the fin group 3 through a reflow soldering process. The through hole 3-2 is a spring bolt mounting hole. The fins are connected by folded fins and buckled fins to form a fin set, and the fin set and the heat pipe are connected by at least one of through-fin and reflow soldering. Folding refers to folding the edges of the fins to a certain angle and height. After folding, the fins are separated by a certain distance by an equidistant fold. This distance is defined as the spacing between the fins. The fins are fastened together through bayonet joints to make the overall fin set have high strength. After folding and buckling the fins, the fin set can be made solid as a whole and maintain a good equidistant relationship. Fin penetration refers to a way of connecting materials at low temperatures, that is, through the action of external force and the elasticity between materials, the fins are tightly "embedded" into the heat pipe to achieve heat conduction. The penetration fin process is an interference fit. Reflow soldering is to solder the fins firmly to the heat pipe. Usually the shape of the hole used to penetrate the heat pipe in the reflow soldering process is similar to a keyhole, and the hole diameter is larger than the diameter of the heat pipe. The specific process of reflow soldering is: first brush solder on the heat pipe, then insert the fins into the heat pipe, and finally put the radiator into the reflow soldering machine for heating. After the solder paste is heated, the gap between the heat pipe and the fin is filled due to gravity and capillary action, and the finished product is finally obtained.

The size of the heat source 4 is 69×50mm, which is a CPU or GPU chip or a simulated heat source. The heat source 4 is in contact with the radiator substrate 1. In order to reduce the contact thermal resistance between the substrate 1 and the heat source 4, the heat source 4 and the radiator substrate 1 can be connected. Apply thermal paste or add thermal pads.

The spring bolt 5 is an M3 bolt with a total length of 30mm. Spring bolts 5 are used to secure the radiator to the heat source.

The new structure 2U type radiator is mainly processed by machining, soldering, die cutting, fin folding, fin buckling, reflow soldering or fin penetration.

Specific steps are as follows:

① The bottom surface of the base plate 1 is machined to form 6 grooves 8, and the front surface is processed into a rectangular fin group 7 through shovel teeth or machining, and is perforated at the four corners to process 4 through holes 9;

② 8 cylindrical straight heat pipes are formed into U-shaped heat pipes through the bending process;

③ Place the U-shaped heat pipe into the substrate groove 8 processed in step ①. The heat pipe is nested into the groove 8 through the pipe rolling process. In order to prevent the heat pipe from being damaged and deformed, the heat pipe needs to be heated to about 100°C while rolling the pipe. In addition, in order to ensure that the shape of the heat pipe remains unchanged during pipe rolling, it needs to be matched with a mold. In order to improve the close contact between the heat pipe and the substrate groove 8, soldering can be used to fill the gap after rolling the pipe. Finally, after the pipe is rolled, the flat surface of the heat pipe is flush with the bottom end of the substrate 1 and has a high flatness;

④The single fin is punched into an X shape by the mold. With the matching of the mold, insert the fins one by one into the heat pipe in step 3 from bottom to top. The fins are connected through the process of folding and buckling fins. After the fins are installed The heat pipe and the fins are tightly connected by reflow soldering. Finally, install the radiator to the upper surface of the heat source through four spring bolts 5.

Claims (10)

1. A new structure 2U type radiator, characterized by including a base plate (1), a heat pipe group (2), a fin group (3), a heat source (4) and a spring bolt (5). The base plate (1) ) includes a base (6), a fin group (7) located on the base (6), and several sets of grooves (8) located at the bottom of the base (6). The base (6) is a square base, and the base (6) There are through holes (9) at the four corners, the through holes (9) are step holes, and the fin group (7) is composed of several single fins distributed in parallel arrays; The heat pipe group (2) is composed of several heat pipes distributed in parallel arrays. The heat pipe is a U-shaped pipe, including a flattened portion (2-2) and two heat pipes connected to both ends of the flattened portion (2-2). A bending part (2-1) and two ends (2-3) connected to the two bending parts (2-1) respectively. Each heat pipe corresponds to a groove (8), and the bottom of the heat pipe is nested Inside the groove (8); The fin set (3) is a fin set composed of several single fins connected through the fin folding and buckling fin processes. The single fin is X-shaped, and there are several fins on the single fin. Set keyholes (3-1) and perforations (3-2), the keyholes (3-1) correspond to the number of the ends (2-3) and match one by one, the ends (2-3) and the fins The sheet set (3) is in contact, and the number and position of the perforations (3-2) correspond to the through holes (9) and match one by one; The heat source (4) is a CPU or GPU chip, and the heat source (4) is in contact with the bottom of the substrate (1); The spring bolt (5) includes a screw (5-1) and a gasket a (5-2), a spring (5-3), and a gasket b (5-) arranged in sequence from the top to the bottom of the screw (5-1). 4) and circlip (5-5), the bottom end of the screw (5-1) is provided with external threads, the spring bolt (5) is used to fix the contact between the radiator and the heat source (4), and the spring bolt (5) passes through the hole ( 3-2) The gasket b (5-4) and the circlip (5-5) are clamped in the through hole (9), and the bottom end of the screw (5-1) passes through the through hole (9) for fixation. Heat source (4). 2. A new structure 2U-shaped radiator according to claim 1, characterized in that the substrate (1) is copper, copper alloy, aluminum or aluminum alloy substrate. 3. A new structure 2U-shaped radiator according to claim 1, characterized in that the outer contour size of the substrate (1) is 105×80 mm and the thickness is 6 mm. 4. A new structure 2U-shaped radiator according to claim 1, characterized in that the thickness of a single fin in the fin group (7) is 0.5 mm, the fin spacing is 2 mm, and the fin height is 7 mm. 5. A new structure 2U-shaped radiator according to claim 1, characterized in that the heat pipe group (2) consists of 6 heat pipes, and the heat pipes are copper or copper alloy heat pipes. 6. A new structure 2U-shaped radiator according to claim 5, characterized in that the length of the heat pipe is 190mm and the diameter is 6mm. 7. A new structure 2U-shaped radiator according to claim 6, characterized in that there are six grooves (8) and the groove radius is 4.9 mm. 8. A new structure 2U-shaped radiator according to claim 1, characterized in that the fins are at least one of sheet-shaped ribs and cylindrical fins, wherein the sheet-shaped ribs include rectangular sheet-shaped ribs and triangular, cylindrical ribs include cylindrical, rectangular, and needle shapes. 9. A new structure 2U-shaped radiator according to claim 1, characterized in that the external outline size of the fins is 118×110mm, the thickness of a single fin is 0.3mm, and the fin spacing is 1.3mm. 10. A new structure 2U-shaped radiator according to claim 1, characterized in that the spring bolt (5) is an M3 bolt with a total length of 30 mm.