CN210573898U - Electronic tag and vehicle glass - Google Patents
Electronic tag and vehicle glass Download PDFInfo
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- CN210573898U CN210573898U CN201921823389.4U CN201921823389U CN210573898U CN 210573898 U CN210573898 U CN 210573898U CN 201921823389 U CN201921823389 U CN 201921823389U CN 210573898 U CN210573898 U CN 210573898U
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- 239000011521 glass Substances 0.000 title claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims abstract description 200
- 239000002184 metal Substances 0.000 claims abstract description 200
- 239000000758 substrate Substances 0.000 claims description 43
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- 230000003068 static effect Effects 0.000 abstract description 16
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- 238000009413 insulation Methods 0.000 description 3
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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Abstract
The application relates to an electronic tag and vehicle glass. The electronic tag includes an antenna assembly, a chip assembly, and a first metal layer. The chip assembly is electrically connected with the antenna assembly. The first metal layer covers one side of the chip assembly. The first metal layer and the chip assembly are arranged in an insulating mode, and the first metal layer is used for being grounded. The chip assembly is connected to the antenna assembly through which the chip assembly can receive or transmit data information. The first metal layer covers one side of the chip assembly and has the function of preventing the chip assembly from being struck by lightning or being shocked by electricity. The first metal layer and the chip assembly are arranged in an insulating mode, and static electricity accumulated by the first metal layer is prevented from affecting the chip assembly. After the first metal layer is grounded, static electricity can be released, and the purpose of protecting the chip assembly is achieved.
Description
Technical Field
The application relates to the field of traffic, in particular to an electronic tag and vehicle glass.
Background
With the development of scientific technology, the intelligent, dynamic and informatization intelligent car networking management mode is more and more widely applied. The use of electronic license plates is pushed by using electronic tags by adopting a radio frequency identification technology, which is an important development direction. Electronic tags, also known as radio frequency tags, transponders, and data carriers, are widely used at present, including RFID tags.
The inventor finds that the electronic tag is used as a carrier of license plate information and applied to the front windshield of an automobile, and the realization of the electronic application of the glass is an important direction. However, when the electronic tag is disposed on the front windshield, it is vulnerable to external static electricity, such as lightning strike or electric shock gun.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide an electronic tag and a vehicle glass, which are susceptible to static electricity when the sub-tag is disposed on the front glass of the vehicle.
An electronic tag applied to vehicle glass comprises:
an antenna assembly;
a chip assembly electrically connected with the antenna assembly;
the first metal layer covers one side of the chip assembly, the first metal layer and the chip assembly are arranged in an insulating mode, and the first metal layer is used for being grounded.
In one embodiment, the chip module further includes a second metal layer, the chip module is sandwiched between the first metal layer and the second metal layer, the second metal layer and the chip module are arranged in an insulating manner, and the second metal layer is used for grounding.
In one embodiment, the chip component is sandwiched between the first metal layer and the second metal layer, the second metal layer is insulated from the chip component, and the second metal layer is electrically connected to the first metal layer.
In one embodiment, the chip module further comprises an insulating layer covering the surface of the chip module, and the first metal layer and the second metal layer are insulated from the chip module through the insulating layer.
In one embodiment, two sides of the first metal layer and two sides of the second metal layer are respectively connected to form a tubular or annular structure, and the chip assembly and the insulating layer are arranged in the tubular or annular structure.
In one embodiment, the second metal layer is electrically connected to the antenna assembly.
In one embodiment, the chip assembly includes:
a substrate;
the chip is arranged on the substrate;
a wire through which the substrate and the chip are electrically connected;
the antenna assembly comprises a vibrator and a matching ring, the substrate is welded to the matching ring, and the chip is electrically connected with the matching ring through the substrate.
In one embodiment, at least one of the first metal layer and the second metal layer covers the chip by a vertical projection of the substrate.
In one embodiment, the matching ring has a notch, the substrate is soldered in the notch, the electronic tag further includes a conductive connection portion, one end of the conductive connection portion is electrically connected to the second metal layer, and the other end of the conductive connection portion is electrically connected to the matching ring through a solder joint between the substrate and the notch.
In one embodiment, the chip assembly further comprises a ground portion electrically connected to the first metal layer and/or the second metal layer.
The vehicle glass comprises the electronic tag, a first glass layer and a second glass layer, wherein the electronic tag is arranged between the first glass layer and the second glass layer.
The electronic tag and the vehicle glass provided by the embodiment of the application. A chip component is connected to the antenna component through which the chip component can receive or transmit data information. The first metal layer covers one side of the chip assembly. The first metal layer is used for grounding and has the function of preventing the chip assembly from being struck by lightning or being shocked by electricity. The first metal layer and the chip assembly are arranged in an insulating mode, and static electricity accumulated by the first metal layer is prevented from affecting the chip assembly. After the first metal layer is grounded, static electricity can be released, and the purpose of protecting the chip assembly is achieved.
Drawings
Fig. 1 is a cross-sectional view of an electronic tag provided in an embodiment of the present application;
FIG. 2 is a cross-sectional view of an electronic tag according to another embodiment of the present application;
FIG. 3 is an exploded view of a chip assembly provided by an embodiment of the present application;
fig. 4 is a connection diagram of a first metal layer and a second metal layer provided in an embodiment of the present application;
fig. 5 is a perspective view of an electronic tag provided in an embodiment of the present application;
fig. 6 is a partial schematic view of an electronic tag provided in an embodiment of the present application;
FIG. 7 is a cross-sectional view of a vehicle glass provided in an embodiment of the present application.
Description of reference numerals:
Vibrator 110
Matching ring 120
Wire 230
Packaging adhesive film 330
Connecting part 340
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and those skilled in the art will be able to make similar modifications without departing from the spirit of the application and it is therefore not intended to be limited to the embodiments disclosed below.
The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings). In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "above," and "over" a second feature may mean that the first feature is directly above or obliquely above the second feature, or that only the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1, an electronic tag 10 is provided in the present embodiment. The electronic tag 10 is applied to a vehicle glazing 20. The vehicle can be an automobile, an electric vehicle, a rickshaw and the like. The electronic tag 10 may be embedded in or attached to a front windshield of the vehicle. The electronic tag 10 comprises an antenna component 100, a chip component 200 and a first metal layer 260. The chip assembly 200 is electrically connected to the antenna assembly 100. The first metal layer 260 covers one side of the chip assembly 200. The first metal layer 260 is insulated from the chip assembly 200. The first metal layer 260 may be used for grounding.
The antenna assembly 100 is used to transmit or receive data information. The chip assembly 200 is used for storing data information. For example, the chip assembly 200 may store information such as a license plate of a vehicle. Data information in the chip assembly 200 may be transmitted to the outside through the antenna assembly 100. When a reader is in close proximity to the electronic tag 10, the reader may read the data information transmitted by the antenna assembly 100. And after reading and decoding the data information, the reader can send the data information to a related system for processing.
The first metal layer 260 may be made of conductive materials such as aluminum, copper, gold, etc. The first metal layer 260 may be a metal sheet or a metal film. The first metal layer 260 covers one side of the chip assembly 200, so that the first metal layer 260 can block an external electric shock from affecting the chip assembly 200. It is understood that the first metal layer 260 covers one side of the chip assembly 200, i.e. the first metal layer 260 at least partially covers the chip assembly 200 in a vertical projection of the chip assembly 200. The first metal layer 260 may have an effect of preventing the chip assembly 200 from being struck by a lightning or a shock gun. The shape of the first metal layer 260 may be adjusted according to the position and distance of the ground. The first metal layer 260 may be grounded through a wire or a metal sheet. The first metal layer 260 may also be in direct contact with a metal structure in the vehicle, such as a window jamb. Therefore, the first metal layer 260 may release static electricity.
The insulation between the first metal layer 260 and the chip assembly 200 can prevent static electricity accumulated in the first metal layer 260 from affecting or damaging the chip assembly 200. The first metal layer 260 may be spaced apart from the chip assembly 200. An insulating material insulation, such as an insulating layer 290, may be filled between the first metal layer 260 and the chip assembly 200. The first metal layer 260 and the chip assembly 200 may be insulated from each other by air.
The electronic tag 10 provided by the embodiment of the application. The chip assembly 200 is connected to the antenna assembly 100, and the chip assembly 200 can receive or transmit data information through the antenna assembly 100. The first metal layer 260 covers one side of the chip assembly 200, and has an effect of preventing the chip assembly 200 from being struck by lightning or from being electrically shocked. The first metal layer 260 is insulated from the chip assembly 200, so that the chip assembly 200 can be prevented from being affected by static electricity accumulated in the first metal layer 260. After the first metal layer 260 is grounded, static electricity can be discharged, so that the chip assembly 200 can be protected.
Referring to fig. 2, in an embodiment, the electronic tag 10 further includes a second metal layer 270. The chip assembly 200 is sandwiched between the first metal layer 260 and the second metal layer 270. The second metal layer 270 is insulated from the chip assembly 200. The second metal layer 270 is used for grounding. The second metal layer 270 may be a metal sheet or a metal film. An insulating material may be filled between the second metal layer 270 and the chip assembly 200. The first metal layer 260 and the second metal layer 270 may be disposed in parallel. The second metal layer 270 may further enlarge the area of the chip assembly 200 covered by the surface, thereby reducing the probability of damage or breakage of the chip assembly 200 caused by electric shock. The second metal layer 270 is used for grounding, and static electricity accumulated in the second metal layer 270 can be rapidly discharged, so that the chip assembly 200 can be protected. It can be understood that the first metal layer 260 and the second metal layer 270 may be connected to a metal structure in a vehicle through a wire, a metal sheet, or the like, so as to achieve the purpose of grounding.
In one embodiment, the second metal layer 270 and the first metal layer 260 are electrically connected. Therefore, static electricity accumulated in the first metal layer 260 and the second metal layer 270 may be discharged to the ground through the second metal layer 270 and also may be discharged to the ground through the first metal layer 260. The second metal layer 270 and the first metal layer 260 may be connected by a metal wire or a metal sheet.
In one embodiment, the electronic tag 10 further comprises an insulating layer 290. The insulating layer 290 covers the surface of the chip assembly 200. The first metal layer 260 and the second metal layer 270 are insulated from the chip assembly 200 by the insulating layer 290, respectively. In one embodiment, the insulating layer 290 may be two parts, one part is sandwiched between the first metal layer 260 and the chip assembly 200, and the other part is sandwiched between the second metal layer 270 and the chip assembly 200. Therefore, the insulation layer 290 can insulate the first metal layer 260 and the second metal layer 270 from the chip assembly 200. The material of the insulating layer 290 may be rubber, plastic, ceramic, mica, or asbestos.
Referring to fig. 3, in one embodiment, the insulating layer 290 may be wound on the surface of the chip assembly 20. The insulating layer 290 may form a ring structure at this time. The chip assembly 200 is encapsulated within the inner cavity of the ring structure. After the chip assembly 200 is placed in the cavity of the ring structure, the first metal layer 260 and the second metal layer 270 are respectively disposed on two opposite sides of the insulating layer 290. Therefore, the chip assembly 200 can be protected by the first metal layer 260 and the second metal layer 270. The mode is simple and convenient to manufacture, and the production efficiency can be improved.
In one embodiment, two sides of the first metal layer 260 and two sides of the second metal layer 270 are respectively connected to form a tubular or ring structure. That is, the first metal layer 260, the second metal layer 270, and the connection portions 340 at both sides of the first metal layer 260 and the second metal layer 270 constitute a tubular structure or a ring structure. When the width of the connection portion 340 is the same as the widths of the first and second metal layers 260 and 270, the first and second metal layers 260 and 270 and the connection portion 340 constitute the tubular structure.
Referring to fig. 4, when the width of the connection portion at the two sides of the first metal layer 260 and the second metal layer 270 is smaller than the width of the first metal layer 260 and the second metal layer 270, for example, when the connection portion 340 at the two sides of the first metal layer 260 and the second metal layer 270 is a conductive wire or a metal strip with a smaller width, the first metal layer 260, the second metal layer 270 and the connection portion 340 form the ring structure. It is understood that the first metal layer 260 and the second metal layer 270 may be integrally formed to form the tubular or ring-shaped structure.
The shape of the tubular or annular structure cavity may be designed according to the morphology of the chip assembly 200. For example, when the chip assembly 200 is a rectangular parallelepiped, the inner cavity of the tubular or annular structure may be a rectangular parallelepiped structure to adapt to the shape of the chip assembly 200. In one embodiment, the tubular or annular structure is rectangular in cross-section. The chip assembly 200 has a rectangular parallelepiped structure. And the two ends of the cuboid structure are open, thereby facilitating the placement of the chip assembly 200 within the tubular or annular structure. The assembly process of the tubular or ring-shaped structure with the chip assembly 200 is simpler than attaching the first metal layer 260 and the second metal layer 270 to both sides of the chip assembly 200, respectively.
In one embodiment, the second metal layer 270 is electrically connected to the antenna assembly 100. The antenna assembly 100 is electrically connected to the second metal layer 270, while the second metal layer 270 is electrically connected to the first metal layer 260. Since the first metal layer 260 and the second metal layer 270 are used for grounding, static electricity accumulated in the antenna assembly 100 may be discharged to the outside through the second metal layer 270, the first metal layer 260 in sequence, or may be discharged to the outside through the first metal layer 260 and the second metal layer 270 at the same time.
It is understood that the antenna assembly 100 may also be directly connected to the first metal layer 260. Static electricity accumulated in the antenna assembly 100 can be discharged directly through the first metal layer 260.
In one embodiment, the chip assembly 200 includes a substrate 210, a chip 220, and wires 230. The chip 220 is disposed on the substrate 210. The substrate 210 and the chip 220 are electrically connected by the wires 230. The chip 220 may be an integrated circuit chip. The chip 220 can store the data information of the license plate. The chip 220 may be fixed to the substrate 210 by a Chip On Board (COB) technology. The substrate 210 may be provided with a power supply port, the wire 230 may connect the power supply port and the chip 220, and the substrate 210 may supply power to the chip 220 through the power supply port. In one embodiment, the number of the wires 230 may be two. One end of each of the two wires 230 may be connected to two interfaces of the chip 220, and the other end of each of the two wires 230 may be connected to two power supply ports of the substrate 210, so as to form a power supply loop. The substrate 210 may be an insulating material or a metal material. The substrate 210 may be provided with a plurality of pins as needed to facilitate data information transmission with the chip 220.
Referring to fig. 5, the antenna assembly 100 includes a vibrator 110 and a matching loop 120. The substrate 210 is soldered to the matching ring 120. The chip 220 is electrically connected to the matching ring 120 through the substrate 210. The vibrator 110 has a function of guiding and amplifying an electromagnetic wave to increase the intensity of a signal received by the antenna assembly 100. The matching loop 120 may adjust an input impedance of the antenna assembly 100, and the antenna assembly 100 and the chip assembly 200 may be conjugate-matched by adjusting a size of the matching loop 120. In one embodiment, the matching loop 120 may have a rectangular frame structure, and the vibrator 110 may have a bar structure. After the substrate 210 is soldered to the matching ring 120, the chip 220 is also fixed relative to the matching ring 120. After the chip 220 is fixed on the substrate 210, the pins on the chip 220 may contact the pads on the substrate 210. The matching ring 120 may be electrically connected to the pad on the substrate 210, and thus the chip 220 may be electrically connected to the matching ring 120 through the pad of the substrate 210. The chip 220 may receive or transmit data information to the outside through the matching loop 120.
In one embodiment, at least one of the first metal layer 260 and the second metal layer 270 covers the chip 220 by vertical projection on the substrate 210. Therefore, the protective effect of the first metal layer 260 and the second metal layer 270 on the chip 220 may be improved. In one embodiment, the first metal layer 260 and the second metal layer 270 may have the same size and shape. The length of the first metal layer 260 and/or the second metal layer 270 may be 0.5 to 0.8 times the length of the substrate 210. The width of the first metal layer 260 and/or the second metal layer 270 may be 1.1 to 1.3 times the width of the substrate 210. Within this range, the chip 220 may be fully protected by the first metal layer 260 and the second metal layer 270, and the use of the electronic tag 10 may be prevented from being affected by the oversize of the first metal layer 260 and the second metal layer 270.
Referring to fig. 6, in one embodiment, the matching ring 120 has a notch 122. The substrate 210 is soldered in the notch 122. The electronic tag 10 further comprises a conductive connection portion 250. One end of the conductive connection portion 250 is electrically connected to the second metal layer 270. The other end of the conductive connection portion 250 is electrically connected to the matching ring 120 through a solder 280 between the substrate 210 and the notch 122. The substrate 210 is soldered in the notch 122, so that the matching ring 120 forms a complete closed-loop structure. Both ends of the substrate 210 may be welded to both ends of the gap 122 by a welding point 280. In one embodiment, the substrate 210 may be the same thickness as the matching ring 120. The substrate 210 and the matching ring 120 may be disposed in a plane. The projections of the first metal layer 260 and the second metal layer 270 in a plane perpendicular to the plane of the matching loop 120 may not cover the matching loop 120 and the vibrator 110. Therefore, the influence of the first metal layer 260 and the second metal layer 270 on the transceiving of data information by the antenna assembly 100 can be reduced.
The matching ring 120 is fixed to the substrate 210 by the solder 280. Both ends of the conductive connection portion 250 are respectively connected to the second metal layer 270 and the solder 280, so that the matching ring 120 is electrically connected to the conductive connection portion 250 through the solder 280. Static electricity in the matching ring 120 may be discharged to the outside through the solder joint 280, the second metal layer 270, and the first metal layer 260. In one embodiment, the conductive connection part 250 may be a sheet metal structure. The morphology of the sheet metal structure may be determined according to the locations of the solder joint 280 and the second metal layer 270. For example, the conductive connection portion 250 may be a bent sheet metal structure. The conductive connection part 250 may be connected to the first metal layer 260 through a mechanical structure. The conductive connection part 250 may be integrally formed with the first metal layer 260. In one embodiment, there may be two conductive connection portions 250, one end of each of the two conductive connection portions 250 is connected to two sides of the second metal layer 270, and the other end of each of the two conductive connection portions 250 may be connected to the solder points at two ends of the gap 120.
In one embodiment, the chip assembly 200 further includes a grounding portion 240. The grounding part 240 is electrically connected to the first metal layer 260 and/or the second metal layer 270. That is, the ground portion 240 may be electrically connected to both the first metal layer 260 and the second metal layer 270, or may be electrically connected to only one of the first metal layer 260 and the second metal layer 270. The grounding portion 240 may be used for grounding, and the grounding portion 240 may be connected to a metal portion in a vehicle, so as to release static electricity in the first metal layer 260. In one embodiment, the grounding portion 240 may be a metal sheet with a strip structure or a metal wire. The grounding part 240 may be connected to the first metal layer 260 by a mechanical structure. The ground portion 240 may be integrally formed with the first metal layer 260.
Based on an unmodified electronic tag and the electronic tag 10 modified by the embodiment, an electric shock comparison test is performed, a 30kV electric shock gun is used for electric shock, the electronic tag before modification is subjected to electric shock for 20 times, the electronic tag is invalid, and the electronic tag 10 after modification is subjected to electric shock for 200 times, so that the electronic tag 10 can still be normally used.
Referring to fig. 7, the present embodiment further provides a vehicle glass 20. The vehicle glass 20 includes the electronic tag 10 according to the above embodiment. The vehicle glazing 20 further comprises a first glass layer 310 and a second glass layer 320. The electronic tag 10 is fixedly disposed between the first glass layer 310 and the second glass layer 320. The first glass layer 310 and the second glass layer 320 may be disposed in relatively parallel. An encapsulation adhesive film 330 may be filled between the first glass layer 310 and the second glass layer 320, and the encapsulation adhesive film may be polyvinyl butyral (PVB). The electronic tag 10 may be embedded in the packaging film. Because the electronic tag 10 has the anti-static and anti-electric shock capabilities, the service life of the vehicle glass 20 can be prolonged, and the frequency of replacing the vehicle glass 20 is reduced.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (11)
1. An electronic tag is applied to vehicle glass and is characterized by comprising:
an antenna assembly (100);
a chip assembly (200) electrically connected with the antenna assembly (100);
the chip component comprises a first metal layer (260) covering one side of the chip component (200), the first metal layer (260) and the chip component (200) are arranged in an insulating mode, and the first metal layer (260) is used for being grounded.
2. The electronic tag according to claim 1, further comprising a second metal layer (270), wherein the chip assembly (200) is sandwiched between the first metal layer (260) and the second metal layer (270), the second metal layer (270) is disposed in an insulating manner from the chip assembly (200), and the second metal layer (270) is used for grounding.
3. An electronic label according to claim 2, characterized in that the second metal layer (270) and the first metal layer (260) are electrically connected.
4. The electronic tag according to claim 3, further comprising an insulating layer (290) covering a surface of the chip assembly (200), wherein the first metal layer (260) and the second metal layer (270) are insulated from the chip assembly (200) by the insulating layer (290).
5. The electronic tag according to claim 4, wherein both sides of the first metal layer (260) and both sides of the second metal layer (270) are connected to form a tubular or ring structure, respectively, and the chip assembly (200) and the insulating layer (290) are disposed in the tubular or ring structure.
6. An electronic tag as claimed in claim 3, characterized in that the second metal layer (270) is electrically connected to the antenna component (100).
7. An electronic label according to claim 6, characterized in that the chip assembly (200) comprises:
a substrate (210);
a chip (220) disposed on the substrate (210);
a wire (230), the substrate (210) and the chip (220) being electrically connected by the wire (230);
the antenna assembly (100) comprises a vibrator (110) and a matching ring (120), the substrate (210) is welded to the matching ring (120), and the chip (220) is electrically connected with the matching ring (120) through the substrate (210).
8. The electronic tag according to claim 7, wherein a perpendicular projection of at least one of the first metal layer (260) and the second metal layer (270) on the substrate (210) covers the chip (220).
9. The electronic tag according to claim 7, wherein the matching ring (120) has a notch (122), the substrate (210) is soldered in the notch (122), the electronic tag (10) further comprises a conductive connection portion (250), one end of the conductive connection portion (250) is electrically connected to the second metal layer (270), and the other end of the conductive connection portion (250) is electrically connected to the matching ring (120) through a solder joint (280) between the substrate (210) and the notch (122).
10. The electronic tag according to claim 3, further comprising a grounding portion (240), the grounding portion (240) being electrically connected to the first metal layer (260) and/or the second metal layer (270).
11. A vehicle glazing comprising an electronic label (10) according to any of claims 1 to 10, further comprising a first glass layer (310) and a second glass layer (320), the electronic label (10) being disposed between the first glass layer (310) and the second glass layer (320).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921823389.4U CN210573898U (en) | 2019-10-28 | 2019-10-28 | Electronic tag and vehicle glass |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921823389.4U CN210573898U (en) | 2019-10-28 | 2019-10-28 | Electronic tag and vehicle glass |
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| CN210573898U true CN210573898U (en) | 2020-05-19 |
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| CN112884110A (en) * | 2021-02-03 | 2021-06-01 | 上海坤锐电子科技有限公司 | Label inlay and electronic label |
| CN113054447A (en) * | 2021-03-15 | 2021-06-29 | 深圳市维力谷无线技术股份有限公司 | Multifunctional circular BOX charging pile antenna |
| JPWO2022210251A1 (en) * | 2021-03-29 | 2022-10-06 | ||
| WO2024217562A1 (en) * | 2023-04-20 | 2024-10-24 | 福耀玻璃工业集团股份有限公司 | Laminated assembly, connector structure for laminated assembly, and vehicle |
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2019
- 2019-10-28 CN CN201921823389.4U patent/CN210573898U/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112884110A (en) * | 2021-02-03 | 2021-06-01 | 上海坤锐电子科技有限公司 | Label inlay and electronic label |
| CN113054447A (en) * | 2021-03-15 | 2021-06-29 | 深圳市维力谷无线技术股份有限公司 | Multifunctional circular BOX charging pile antenna |
| JPWO2022210251A1 (en) * | 2021-03-29 | 2022-10-06 | ||
| WO2022210251A1 (en) * | 2021-03-29 | 2022-10-06 | Ａｇｃ株式会社 | Grounding structure-equipped glass laminate for vehicles |
| WO2024217562A1 (en) * | 2023-04-20 | 2024-10-24 | 福耀玻璃工业集团股份有限公司 | Laminated assembly, connector structure for laminated assembly, and vehicle |
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