CN210741197U

CN210741197U - Heat exchanger based on heat superconducting heat exchange plate

Info

Publication number: CN210741197U
Application number: CN201921055268.XU
Authority: CN
Inventors: 仝爱星; 唐必洪; 曾巧; 孙会会
Original assignee: Zhejiang Jiaxi Optoelectronic Equipment Manufacturing Co ltd
Current assignee: Zhejiang Jiaxi Technology Co.,Ltd.
Priority date: 2019-07-08
Filing date: 2019-07-08
Publication date: 2020-06-12
Anticipated expiration: 2029-07-08

Abstract

The utility model provides a heat exchanger based on heat superconducting heat transfer board, include: a plurality of heat superconducting heat transfer plates, each heat superconducting heat transfer plate all includes: the air conditioner comprises a first frame, a first cover plate, a second cover plate, a first guide plate, a second frame, a second guide plate, a third cover plate, a refrigerant inlet and a refrigerant outlet; the first frame is attached to one surface of the first cover plate; the second cover plate is attached to the surface, away from the first cover plate, of the first frame; the first guide plate is positioned in the first sealed cavity; the second frame is attached to the surface, far away from the first guide plate, of the second cover plate; the third cover plate is attached to the surface, far away from the second cover plate, of the second frame; the second guide plate is positioned in the second sealed cavity; the refrigerant inlet is positioned on the second frame; the refrigerant outlet is positioned on the second frame; and the plurality of radiating fins and the plurality of heat superconducting heat exchange plates are alternately arranged. The utility model discloses a each regional temperature of the whole face of heat exchanger based on heat superconducting heat transfer board is even, has the characteristics that heat conduction rate is fast, the temperature uniformity is good.

Description

Heat exchanger based on heat superconducting heat exchange plate

Technical Field

The utility model belongs to the technical field of heat transfer, especially, relate to a heat exchanger based on heat superconducting heat transfer board.

Background

Most of the existing heat exchangers adopt a composite aluminum plate of a single pipeline system, and a refrigerant enters from one end and flows out from the other end after flowing through a pipeline in the composite aluminum plate. The problems with the above heat exchangers include: because of the limitation of the heat conductivity coefficient of the aluminum material and the thickness of the composite aluminum plate, the heat conduction resistance of the existing heat exchanger is large, and a refrigerant pipeline cannot cover the surface of the whole heat exchanger, so that the temperature of the whole plate surface of the heat exchanger is uneven, the local overheating or supercooling phenomenon exists, and the heat exchange area of the whole heat exchanger cannot be fully exerted; the heat exchange area of the refrigerant pipeline is small, so that the energy efficiency of the heat exchange plate is low; in order to meet the required strength requirement, the thickness of the heat exchanger is generally thicker, and the whole weight of the heat exchanger is heavier, so that the heat exchanger is inconvenient to carry, install and use.

SUMMERY OF THE UTILITY MODEL

In view of the above disadvantages of the prior art, an object of the present invention is to provide a heat exchanger based on a thermal superconducting heat exchange plate, which is used to solve the problems existing in the prior art that the temperature of the surface of the heat exchanger is not uniform, the local overheating or overcooling phenomenon occurs, and the heat exchange area of the whole heat exchanger cannot be fully developed; the energy efficiency of the heat exchanger is low; the thickness of the heat exchanger is generally thicker, and the whole weight of the heat exchanger is larger, thus being inconvenient to carry, install and use and the like.

In order to achieve the above objects and other related objects, the utility model provides a heat exchanger based on heat superconducting heat transfer board, heat exchanger based on heat superconducting heat transfer board includes:

a plurality of heat superconducting heat transfer plates, each heat superconducting heat transfer plate all includes: the air conditioner comprises a first frame, a first cover plate, a second cover plate, a first guide plate, a second frame, a second guide plate, a third cover plate, a refrigerant inlet and a refrigerant outlet; the first frame is attached to one surface of the first cover plate; the second cover plate is attached to the surface, away from the first cover plate, of the first frame, so that a first sealing cavity is formed between the first cover plate and the second cover plate; the first guide plate is positioned in the first sealed cavity to form a sealed heat transfer channel in the first sealed cavity, and a thermal superconducting heat transfer working medium is filled in the sealed heat transfer channel; the second frame is attached to the surface, away from the first guide plate, of the second cover plate; the third cover plate is attached to the surface, away from the second cover plate, of the second frame, so that a second sealed chamber is formed between the second cover plate and the third cover plate; the second guide plate is positioned in the second sealed cavity so as to form a refrigerant channel in the second sealed cavity; the refrigerant inlet is positioned on the second frame and communicated with the refrigerant channel; the refrigerant outlet is positioned on the second frame and communicated with the refrigerant channel;

the heat dissipation fins and the heat superconducting heat exchange plates are alternately arranged and are attached to the surfaces of the heat superconducting heat exchange plates.

Optionally, the heat exchanger based on a thermal superconducting heat exchange plate further comprises:

the first outer side cover plate is attached to one surface of a laminated structure formed by alternately arranging the plurality of heat superconducting heat exchange plates and the plurality of radiating fins;

and the second outer side cover plate is attached to the surface of the laminated structure far away from the first outer side cover plate.

Optionally, the height of the first baffle is the same as the thickness of the first frame, and the height of the second baffle is the same as the thickness of the second frame.

Optionally, the first guide plate includes a plurality of first guide strips arranged in parallel along a first direction, the first guide strips include a plurality of first protrusions arranged at intervals along a second direction, and bottoms of adjacent first protrusions in the second direction are integrally connected; the first direction is perpendicular to the second direction

The second guide plate comprises a plurality of second guide strips arranged in parallel at intervals in the first direction, the second guide strips comprise a plurality of second convex parts arranged at intervals in the second direction, and the bottoms of the second convex parts are integrally connected and are adjacent to each other in the second direction.

Optionally, the first convex portions on two adjacent rows of the first guide strips are arranged in a one-to-one correspondence or staggered manner, and the second convex portions on two adjacent rows of the second guide strips are arranged in a one-to-one correspondence or staggered manner.

Optionally, the heat superconducting heat exchange plate further includes a first gas-liquid balance channel and a second gas-liquid balance channel, the first gas-liquid balance channel and the second gas-liquid balance channel are arranged at intervals on two opposite sides of the first guide plate along the first direction, and extend along the second direction, and the first gas-liquid balance channel and the second gas-liquid balance channel are both located between the second guide plate and the second frame.

Optionally, the second sealed chamber comprises a first chamber portion, a second chamber portion, and a third chamber portion; the first cavity part is parallel to the third cavity part, the second cavity part is perpendicular to the first cavity part and the third cavity part, and the second cavity part is communicated with the first cavity part and the third cavity part; the refrigerant inlet is communicated with the first cavity part, the refrigerant outlet is communicated with the third cavity part, the refrigerant inlet is located on one side, away from the second cavity part, of the first cavity part, and the refrigerant outlet is located on one side, away from the second cavity part, of the third cavity part.

Optionally, a liquid storage strip is further arranged in the second frame, and the liquid storage strip is located at a joint of the first cavity part and the second cavity part and located on an inner wall of the first cavity part, which is close to the third cavity part.

Optionally, in the superconducting heat exchange plate, the number of the second frames, the second cover plate, the second guide plate, the refrigerant inlets, and the refrigerant outlets is multiple, and the number of the second frames, the second cover plate, the second guide plate, the refrigerant inlets, and the refrigerant outlets is the same; the second frames are arranged on the surface, far away from the first guide plate, of the second cover plate at intervals in parallel; the third cover plates are correspondingly attached to the surfaces, far away from the second cover plates, of the second frames to form a plurality of independent second sealed chambers; the guide plates are positioned in the second sealed cavities; the refrigerant inlet and the refrigerant outlet are arranged on each second frame.

the first through pipe extends along the arrangement direction of the plurality of heat superconducting heat exchange plates and sequentially connects and communicates the refrigerant inlets in the heat superconducting heat exchange plates in series;

the second through pipe extends along the arrangement direction of the plurality of heat superconducting heat exchange plates and sequentially connects and communicates the refrigerant outlets in the heat superconducting heat exchange plates in series;

one end of the refrigerant inlet pipe is communicated with the inside of the first through pipe;

and one end of the refrigerant outlet pipe is communicated with the inside of the second through pipe.

Optionally, the heat dissipation fin includes a plurality of fin protrusions arranged at intervals along the horizontal direction; the bottoms of the fin convex parts adjacent to each other in the horizontal direction are integrally connected.

Optionally, the heat dissipation fin includes a plurality of fin protrusions arranged at intervals in a vertical direction; the bottoms of the fin convex parts adjacent to each other in the vertical direction are integrally connected.

Optionally, the extending direction of the fin convex part is inclined to a preset included angle compared with the horizontal direction, and the preset included angle is greater than 0 ° and smaller than 90 °.

As above, the utility model discloses a heat exchanger with heat superconducting heat transfer board has following beneficial effect: the heat superconducting heat exchange plate in the heat exchanger based on the heat superconducting heat exchange plate adopts the heat superconducting heat transfer technology, so that the temperature of each area of the whole plate surface is uniform, and the heat exchanger has the characteristics of high heat transfer rate and good temperature uniformity; the heat exchanger based on the heat superconducting heat exchange plate has large heat exchange area of the refrigerant and higher energy efficiency; the utility model discloses a heat superconducting heat transfer board in heat exchanger based on heat superconducting heat transfer board inside is first sealed cavity and second sealed cavity to set up first guide plate and second guide plate in first sealed cavity and second sealed cavity respectively, first guide plate and second guide plate play the reinforcing effect promptly, make first apron, second apron and third cover plate thickness can attenuate, the bearing capacity increases, intensity improves, alleviate the weight and the thickness of heat superconducting heat transfer board, increase the heat transfer area of inside again, strengthen the superconductive heat-sinking capability of heat superconduction; the utility model discloses a fin convex part among the radiating fin in the heat exchanger based on heat superconducting heat transfer board is arranged or is arranged along vertical direction interval and the extending direction of fin convex part is compared and is predetermine the contained angle in the horizontal direction slope when the fin convex part is arranged along vertical direction interval, and the comdenstion water that produces when the surface temperature of the heat exchanger based on heat superconducting heat transfer board is less than air dew point temperature can discharge smoothly.

Drawings

Fig. 1 is a schematic diagram illustrating an explosion structure of a heat exchanger based on a thermal superconducting heat exchange plate according to a first embodiment of the present invention.

Fig. 2 is a schematic diagram showing an explosion structure of a first heat superconducting heat exchange plate in a heat exchanger based on heat superconducting heat exchange plates according to a first embodiment of the present invention.

Fig. 3 is a schematic structural diagram of a first heat superconducting heat exchange plate in a heat exchanger based on heat superconducting heat exchange plates according to a first embodiment of the present invention.

Fig. 4 is a schematic top view of a first guide plate of a first heat superconducting heat exchange plate in a heat exchanger based on heat superconducting heat exchange plates according to a first embodiment of the present invention, the first guide plate being disposed in a first frame.

Fig. 5 is a schematic top view showing that the second frame of the first heat superconducting heat exchange plate is attached to the surface of the second cover plate far away from the first guide plate and the second guide plate is arranged in the second frame in the heat exchanger based on the heat superconducting heat exchange plate provided in the first embodiment of the present invention.

Fig. 6 is a schematic diagram illustrating an explosion structure of a second heat superconducting heat exchange plate in a heat exchanger based on heat superconducting heat exchange plates according to a first embodiment of the present invention.

Fig. 7 is a schematic structural diagram of a second heat superconducting heat exchange plate in a heat exchanger based on heat superconducting heat exchange plates according to a first embodiment of the present invention.

Fig. 8 is a schematic top view showing a second frame of a second heat superconducting heat exchange plate in a heat exchanger based on heat superconducting heat exchange plates according to a first embodiment of the present invention, the second frame is attached to a surface of a second cover plate, which is away from a first guide plate, and the second guide plate is disposed in the second frame.

Fig. 9 is a schematic diagram illustrating an explosion structure of a third heat superconducting heat exchange plate in a heat exchanger based on heat superconducting heat exchange plates according to an embodiment of the present invention.

Fig. 10 is a schematic structural diagram of a third heat superconducting heat exchange plate in a heat exchanger based on heat superconducting heat exchange plates according to an embodiment of the present invention.

Fig. 11 is a schematic top view showing that the second frame of the third heat superconducting heat exchange plate in the heat exchanger based on the heat superconducting heat exchange plate provided in the first embodiment of the present invention is attached to the surface of the second cover plate away from the first guide plate, and the second guide plate is disposed in the second frame.

Fig. 12 is a schematic diagram showing an explosion structure of a heat superconducting heat exchange plate in a heat exchanger based on a heat superconducting heat exchange plate according to a second embodiment of the present invention.

Fig. 13 is a schematic perspective view illustrating a heat dissipation fin of a heat exchanger based on a thermal superconducting heat exchange plate according to a second embodiment of the present invention.

Description of the element reference numerals

1 heat superconducting heat exchange plate

10 first cover plate

11 first frame

111 filling opening

12 second cover plate

13 first sealed cavity

131 first gas-liquid balance channel

132 second gas-liquid equilibrium channel

14 first guide plate

141 first guide strip

142 first convex part

15 second frame

151 stock solution strip

152 division bar

16 third cover plate

17 second sealed chamber

171 first cavity part

172 second chamber portion

173 third chamber portion

18 second baffle

181 second diversion strip

182 second projection

191 refrigerant inlet

192 refrigerant outlet

2 Heat radiating fin

21 fin projection

3 first outer side cover plate

4 second outside cover plate

5 first through pipe

6 second through pipe

7 refrigerant inlet pipe

8 refrigerant exit tube

Detailed Description

The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

Please refer to fig. 1 to 13. It should be noted that the drawings provided in the present embodiment are only schematic and illustrative of the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.

Example one

Referring to fig. 1 to 3, the present invention provides a heat exchanger based on a heat superconducting heat exchange plate, which includes: a plurality of heat superconducting heat transfer plates 1, each heat superconducting heat transfer plate 1 all includes: a first frame 11, a first cover plate 10, a second cover plate 12, a first guide plate 14, a second frame 15, a second guide plate 18, a third cover plate 16, a refrigerant inlet 191 and a refrigerant outlet 192; wherein, the first frame 11 is attached to a surface of the first cover plate 10; the second cover plate 12 is attached to the surface of the first frame 11 away from the first cover plate 10, so as to form a first sealed chamber 13 between the first cover plate 10 and the second cover plate 12; the first guide plate 14 is located in the first sealed cavity 13 to form a sealed heat transfer channel (not shown) in the first sealed cavity 13, and the sealed heat transfer channel is filled with a thermal superconducting heat transfer working medium (not shown); the second frame 15 is attached to the surface of the second cover plate 12 away from the first baffle 14; the third cover 16 is attached to the surface of the second frame 15 away from the second cover 12, so as to form a second sealed cavity 17 between the second cover 12 and the third cover 16; the second baffle 18 is located in the second sealed chamber 17, so as to form a refrigerant channel (not shown) in the second sealed chamber 17; the refrigerant inlet 191 is located on the second frame 15, and the refrigerant inlet 191 is communicated with the refrigerant channel; the refrigerant outlet 192 is located on the second frame 15, and the refrigerant outlet 192 is communicated with the refrigerant channel; the heat-conducting heat-exchanging plate comprises a plurality of heat-radiating fins 2, wherein the plurality of heat-radiating fins 2 and the plurality of heat-conducting heat-exchanging plates 1 are alternately arranged, and the heat-radiating fins 2 are attached to the surfaces of the heat-conducting heat-exchanging plates 1.

It should be noted that, because the inner side of the first frame 11 is a hollow area, after the first cover plate 10 and the second cover plate 12 are attached to two opposite surfaces of the first frame 11, the first sealed cavity 13 is formed inside the first cover plate 10, the second cover plate 12 and the first frame 11; similarly, since the inner side of the second frame 15 is a hollow region, the second cover plate 12 and the third cover plate 16 are attached to two opposite surfaces of the second frame 15, and then the second sealed chamber 17 is formed inside the second cover plate 12, the third cover plate 16 and the second frame 15.

The heat superconducting heat transfer technology comprises a heat pipe technology of filling working media in a closed mutually communicated micro-channel system and realizing heat superconducting heat transfer through evaporation and condensation phase change of the working media; and the phase change suppression (PCI) heat transfer technology for realizing high-efficiency heat transfer by controlling the microstructure state of the working medium in a closed system, namely, in the heat transfer process, the boiling of the liquid medium (or the condensation of the gaseous medium) is suppressed, and the consistency of the microstructure of the working medium is achieved on the basis. In this embodiment, the thermal superconducting heat transfer working medium may be a phase change suppression heat transfer working medium, at this time, boiling or condensation of the thermal superconducting heat transfer working medium is suppressed in the heat transfer process, and on this basis, consistency of the working medium microstructure is achieved to achieve heat transfer. In this embodiment, the thermal superconducting heat transfer working medium can also continuously perform phase change circulation of evaporation heat absorption and condensation heat release in the heat transfer process to realize rapid heat transfer.

By way of example, the thermal superconducting heat transfer working medium is a fluid, preferably, the thermal superconducting heat transfer working medium may be a gas or a liquid or a mixture of a gas and a liquid, and more preferably, in the present embodiment, the thermal superconducting heat transfer working medium is a mixture of a liquid and a gas.

As an example, the first baffle 14 has a height equal to the thickness of the first frame 11, and the second baffle 18 has a height equal to the thickness of the second frame 15. The height of the first baffle 14 is set to be the same as the height of the first frame 11, and the height of the second baffle 18 is set to be the same as the thickness of the second frame 15, so that the maximum welding area between the first baffle 14 and the solder layer and the second baffle 15 can be ensured, and the welding strength can be increased.

In one example, as shown in fig. 2, the first frame 11 may include, but is not limited to, a circular frame. One side of the first frame 11 is provided with a filling hole 111 penetrating through the side wall. After the first cover plate 10 and the second cover plate 12 are welded with the first frame 11 and the first guide plate 14, one end of a filling tube (not shown) is inserted into the filling hole 111, and the heat superconducting heat transfer working medium can be filled into the sealed heat transfer channel. After the thermal superconducting heat transfer working medium is filled, the filling hole 111 is closed so as to seal the sealed heat transfer channel.

As an example, as shown in fig. 2 and fig. 4, the first guide plate 14 includes a plurality of first guide strips 141 arranged in parallel along a first direction, the first guide strips 141 include a plurality of first protrusions 142 arranged at intervals along a second direction, and bottoms of the first protrusions 142 adjacent to each other in the second direction are integrally connected; the first direction is perpendicular to the second direction. The first protrusion 142 may extend in a square wave shape along the second direction, or may extend in a wave shape. In the second direction, the first protrusions 142 are recessed. After the first cover plate 10, the second cover plate 12, the first frame 11 and the first baffle 14 are welded together, the gap between the first protrusion 142 of the first baffle 14 and the first cover plate 10, the gap between the recess between the adjacent first protrusions 142 along the second direction and the second cover plate 12, and the gap between the adjacent first guide strips 141 together form the sealed heat transfer channel.

As an example, the first guide strips 141 may be integrally connected, and specifically, a connection strip (not shown) may be disposed at one end of each of the first guide strips 141, and the connection strip extends along the arrangement direction of the first guide strips 141 and sequentially connects the first guide strips 141 in series.

As an example, the first protrusions 142 on two adjacent rows of the first guide strips 141 may be disposed in a one-to-one correspondence manner, that is, the first protrusions 142 on each first guide strip 141 are disposed in a one-to-one correspondence manner along the first direction (i.e., the direction in which the first guide strips 141 are arranged). Of course, in other examples, the first protrusions 142 on two adjacent rows of the first gibs 141 may also be arranged in a staggered manner, and the staggered arrangement of the first protrusions 142 on two adjacent rows of the first gibs 141 means that the side edges of the first protrusions 142 on two adjacent rows of the first gibs 141 are staggered; the offset distance of the first protrusions 142 of two adjacent rows of the first flow guide strips 141 may be smaller than the width of the first protrusions 142, and the offset distance of the first protrusions 142 of two adjacent rows of the first flow guide strips 141 may also be equal to the width of the first protrusions 142, at this time, the first protrusions 142 of one row of the first flow guide strips 141 are aligned with the recesses between the first protrusions 142 of one row of the first flow guide strips 141 adjacent thereto. It should be noted that, when the first convex portions 142 on the two adjacent rows of the first guide strips 141 are arranged in a staggered manner, the first convex portions 142 on the first guide strips 141 in alternate rows are arranged in a one-to-one correspondence manner, that is, the first convex portions 142 on the first guide strips 141 in odd rows are arranged in a staggered manner with the first convex portions 142 on the first guide strips 141 in even rows, the first convex portions 142 on the first guide strips 141 in odd rows are arranged in a one-to-one correspondence manner, and the second convex portions 142 on the first guide strips 141 in even rows are also arranged in a one-to-one correspondence manner.

As an example, referring to fig. 4, the superconducting heat exchange plate 1 further includes a first gas-liquid balance channel 131 and a second gas-liquid balance channel 132, the first gas-liquid balance channel 131 and the second gas-liquid balance channel 132 are arranged at intervals along the first direction on two opposite sides of the first guide plate 14, the first gas-liquid balance channel 131 and the second gas-liquid balance channel 132 extend along the second direction, and both the first gas-liquid balance channel 131 and the second gas-liquid balance channel 132 are located between the second guide plate 14 and the second frame 15. By arranging the first gas-liquid balance channel 131 and the second gas-liquid balance channel 132, the flow resistance of the heat superconducting heat transfer working medium along the second direction can be reduced, and the heat superconducting heat transfer working medium in the sealed heat transfer channel can be effectively balanced, so that the whole heat superconducting heat exchange plate 1 is in a uniform temperature state.

As an example, the second baffle 18 includes a plurality of second flow guide strips 181 arranged in parallel and at intervals along the first direction, the second flow guide strips 181 include a plurality of second protrusions 182 arranged at intervals along the second direction, and bottoms of adjacent second protrusions 182 in the second direction are integrally connected. The second protrusion 182 may extend in a square wave shape along the second direction, or may extend in a wave shape. In the second direction, the second protrusions 182 are adjacent to each other in a concave shape. After the second cover plate 12, the third cover plate 16, the second frame 15 and the second baffle 18 are welded together, a gap between the second protrusion 182 of the second flow guide strip 18 and the second cover plate 12, a gap between the second protrusion 182 adjacent to the second protrusion 182 along the second direction and the third cover plate 16, and a gap between the adjacent second flow guide strips 181 jointly form the refrigerant channel.

As an example, the plurality of second guide strips 181 may be integrally connected, and specifically, a connection strip (not shown) may be disposed at one end of the plurality of second guide strips 181, and the connection strip extends along the direction in which the plurality of second guide strips 181 are arranged, and connects the plurality of second guide strips 181 in series.

As an example, the second protrusions 182 on two adjacent rows of the second flow guiding strips 181 may be disposed in a one-to-one correspondence, that is, the second protrusions 182 on each second flow guiding strip 181 are disposed in a one-to-one correspondence along the first direction. Of course, in other examples, the second protrusions 182 on two adjacent rows of the second flow guide strips 181 may also be arranged in a staggered manner, and the staggered arrangement of the second protrusions 182 on two adjacent rows of the second flow guide strips 181 means that the side edges of the second protrusions 182 on two adjacent rows of the second flow guide strips 181 are staggered; the second protrusions 182 of two adjacent rows of the second flow guide strips 181 may be staggered by a distance less than the width of the second protrusions 182, and the second protrusions 182 of two adjacent rows of the second flow guide strips 181 may also be staggered by a distance equal to the width of the second protrusions 182, at this time, the second protrusions 182 of one row of the second flow guide strips 181 are aligned with the recesses between the second protrusions 182 of one row of the second flow guide strips 181 adjacent thereto. It should be noted that when the second protrusions 182 on the two adjacent rows of the second guide strips 181 are arranged in a staggered manner, the second protrusions 182 on each row of the second guide strips 181 are arranged in a one-to-one correspondence manner, that is, the second protrusions 182 on the odd-numbered rows of the second guide strips 181 are arranged in a staggered manner with the second protrusions 182 on the even-numbered rows of the second guide strips 181, the second protrusions 182 on each odd-numbered row of the second guide strips 181 are arranged in a one-to-one correspondence manner, and the second protrusions 182 on each even-numbered row of the second guide strips 181 are also arranged in a one-to-one correspondence manner.

As an example, referring to fig. 2 and 5, the second seal chamber 17 includes a first chamber portion 171, a second chamber portion 172, and a third chamber portion 173; the first cavity part 171 is parallel to the third cavity part 173, the second cavity part 172 is perpendicular to the first cavity part 171 and the third cavity part 173, and the second cavity part 172 is communicated with the first cavity part 171 and the third cavity part 173; the refrigerant inlet 191 is communicated with the first cavity part 171, the refrigerant outlet 192 is communicated with the third cavity part 173, the refrigerant inlet 191 is located on one side of the first cavity part 171, which is far away from the second cavity part 172, and the refrigerant outlet 192 is located on one side of the third cavity part 173, which is far away from the second cavity part 172, that is, the refrigerant inlet 191 and the refrigerant outlet 192 are located on the same side of the second sealed cavity 17.

By way of example, the second rim 15 may include, but is not limited to, a U-shaped rim, and the second sealed chamber 17 may include, but is not limited to, a U-shaped cavity portion.

By way of example, the third cover 16 may comprise a U-shaped cover. After the third cover plate 16 is attached to a side of the second frame 15 away from the second cover plate 12, the third cover plate 16 completely covers the second frame 15. Specifically, in the superconducting heat exchange plate 1, each side edge of the third cover plate 16 is aligned with each corresponding side edge of the second frame 15 and each corresponding side edge of the second cover plate 12.

For example, referring to fig. 2 and 5, a liquid storage strip 151 is further disposed in the second frame 15, and the liquid storage strip 151 is located at a connection position of the first cavity portion 171 and the second cavity portion 172, and is located on an inner wall of the first cavity portion 171 adjacent to the third cavity portion 173. The reservoir strip 151 may extend in a first direction. The liquid storage bar 151 can play a role in guiding the refrigerant.

In another example, referring to fig. 6 to 8, the second frame 15 may also be an annular frame, a separating strip 152 is further disposed in the second frame 15, one end of the separating strip 152 is fixedly connected to an inner wall of the second frame 15, and the length of the separating strip 152 is smaller than the dimension of the second sealed cavity 17 along the length direction of the separating strip 152; the first cavity portion 171 and the third cavity portion 173 are respectively located at two opposite sides of the separation strip 152, and the second cavity portion 172 is located between the free end of the separation strip 152 and the second frame 15; when the liquid storage bar 151 is arranged on the heat superconducting heat exchange plate 1, the liquid storage bar 151 is located at the free end of the separation bar 152, and the liquid storage bar 151 is perpendicular to the separation bar 152. Other structures of the heat superconducting heat exchange plate in the embodiment are completely the same as those of the heat superconducting heat exchange plate in the first embodiment, and refer to the first embodiment specifically, and will not be described herein again.

As an example, the number of the second frame 15, the third cover 16, the second baffle 18, the refrigerant inlet 191, and the refrigerant outlet 192 is one.

For example, three sides of the second frame 15 are aligned with three sides corresponding to the second air deflector 18 and three sides corresponding to the second cover plate 12 in a one-to-one correspondence manner, for example, a bottom side of the second frame 15 is aligned with a bottom side of the second air deflector 18 and a bottom side of the second cover plate 12, two sides of the second frame 15 adjacent to the bottom side are aligned with two sides of the second air deflector 18 adjacent to the bottom side respectively, and two sides of the second cover plate 12 adjacent to the bottom side are aligned with one another.

In another example, referring to fig. 9 to 11, in the superconducting heat exchange plate 1, the number of the second frames 15, the number of the third cover plates 16, the number of the second flow guide plates 18, the number of the refrigerant inlets 191 and the number of the refrigerant outlets 192 are all multiple, and the number of the second frames 15, the number of the third cover plates 16, the number of the second flow guide plates 18, the number of the refrigerant inlets 191 and the number of the refrigerant outlets 192 are the same; the second frames 15 are arranged on the surface of the second cover plate 12 away from the first baffle 14 at intervals in parallel; a plurality of third cover plates 16 are correspondingly attached to the surface of each second frame 15 away from the second cover plate 12 to form a plurality of independent second sealed chambers 17; the second baffle 18 is located within each of the second sealed chambers 17; the refrigerant inlet 191 and the refrigerant outlet 192 are disposed on each of the second frames 15.

By way of example, with continuing reference to fig. 1, the heat exchanger based on heat superconducting heat exchange plates further comprises: the first outer side cover plate 3 is attached to one surface of a laminated structure formed by alternately arranging the plurality of heat superconducting heat exchange plates 1 and the plurality of radiating fins 2; and the second outer side cover plate 4 is attached to the surface of the laminated structure far away from the first outer side cover plate 3.

As an example, the number of the heat dissipation fins 2 between adjacent heat superconducting heat exchange plates 1, between the heat superconducting heat exchange plates 1 and the first outer side cover plate 3, and between the heat superconducting heat exchange plates 1 and the second outer side cover plate 4 may be one or more, as shown in fig. 1.

By way of example, with continuing reference to fig. 1, the heat exchanger based on heat superconducting heat exchange plates further comprises: the first through pipe 5 extends along the arrangement direction of the plurality of heat superconducting heat exchange plates 1, and the refrigerant inlets 191 in the heat superconducting heat exchange plates 1 are sequentially connected in series and communicated through the first through pipe 5; the second through pipe 6 extends along the arrangement direction of the plurality of heat superconducting heat exchange plates 1, and the refrigerant outlets 192 in the heat superconducting heat exchange plates 1 are sequentially connected in series and communicated through the second through pipe 6; a refrigerant inlet pipe 7, wherein one end of the refrigerant inlet pipe 7 is communicated with the inside of the first through pipe 6; and one end of the refrigerant outlet pipe 8 is communicated with the inside of the second through pipe 6.

In an example, with continuing reference to fig. 1, the heat dissipation fin 2 may include a plurality of fin protrusions 21 arranged at intervals along the horizontal direction; the bottoms of the fin convex parts 21 adjacent to each other in the horizontal direction are integrally connected; that is, several fin protrusions 21 of the heat dissipating fin 2 may extend in the vertical direction, and at this time, a depression (not shown) extending in the vertical direction is provided between adjacent fin protrusions 21 in the horizontal direction. The heat dissipation fins 2 and the depressed parts between the heat superconducting heat exchange plates 1, the first outer side cover plate 3 and the second outer side cover plate 4 form air passages.

The heat superconducting heat exchange plate 1 in the heat exchanger based on the heat superconducting heat exchange plate of the utility model adopts the heat superconducting heat transfer technology, so that the temperature of each area of the whole plate surface is uniform, and the heat exchanger has the characteristics of high heat transfer rate and good temperature uniformity; the heat exchanger based on the heat superconducting heat exchange plate has large heat exchange area of the refrigerant and higher energy efficiency; the utility model discloses an in the heat exchanger based on heat superconducting heat transfer board 1 inside do first sealed cavity 13 with second sealed cavity 17, and first sealed cavity 13 reaches set up respectively in the second sealed cavity 17 first guide plate 14 reaches second guide plate 18, first guide plate 14 reaches second guide plate 18 plays the reinforcing effect promptly, makes the thickness of first apron 10, second apron 12 and third apron 16 can attenuate, and bearing capacity increases, and intensity improves, alleviates the weight and the thickness of heat exchanger based on heat superconducting heat transfer board, increases the heat transfer area of inside again, reinforcing heat superconducting heat-sinking capability; the utility model discloses an in the heat exchanger based on heat superconducting heat transfer board among the radiating fin 2 fin convex part 21 is arranged along the horizontal direction interval, and the comdenstion water that produces when the surface temperature of the heat exchanger based on heat superconducting heat transfer board is less than air dew point temperature can discharge smoothly.

Example two

Referring to fig. 12 in conjunction with fig. 1 to 11, the present embodiment further provides a heat exchanger based on a thermal superconducting heat exchange plate, and the structure of the heat exchanger based on a thermal superconducting heat exchange plate in the present embodiment is substantially the same as that of the heat exchanger based on a thermal superconducting heat exchange plate in the first embodiment, and the difference between the structures of the heat dissipation fins 2 is different; specifically, in the first embodiment, the heat dissipation fin 2 includes a plurality of fin protrusions 21 arranged at intervals in the horizontal direction, and bottoms of the fin protrusions 21 adjacent to each other in the horizontal direction are integrally connected, that is, the plurality of fin protrusions 21 in the heat dissipation fin 2 extend in the vertical direction; in the embodiment, the heat dissipation fin 2 includes a plurality of fin protrusions 21 arranged at intervals in the vertical direction; the bottoms of the fin protrusions 21 adjacent to each other in the vertical direction are integrally connected, that is, a plurality of the fin protrusions 21 in the heat dissipation fin 2 extend in the horizontal (or approximately horizontal) direction.

As an example, in the present embodiment, the extending direction of the fin protruding portion 21 is inclined by a preset included angle compared with the horizontal direction, and the preset included angle is greater than 0 ° and smaller than 90 °. The utility model discloses an in the heat exchanger based on heat superconducting heat transfer board among the radiating fin 2 fin convex part 21 is arranged just along vertical direction interval the extending direction of fin convex part 21 is compared and is predetermine the contained angle in the horizontal direction slope, and the comdenstion water that produces when the surface temperature of the heat exchanger based on heat superconducting heat transfer board is less than air dew point temperature can discharge smoothly.

To sum up, the utility model provides a heat exchanger based on heat superconducting heat transfer board, heat exchanger based on heat superconducting heat transfer board includes: a plurality of heat superconducting heat transfer plates, each heat superconducting heat transfer plate all includes: the air conditioner comprises a first frame, a first cover plate, a second cover plate, a first guide plate, a second frame, a second guide plate, a third cover plate, a refrigerant inlet and a refrigerant outlet; the first frame is attached to one surface of the first cover plate; the second cover plate is attached to the surface, away from the first cover plate, of the first frame, so that a first sealing cavity is formed between the first cover plate and the second cover plate; the first guide plate is positioned in the first sealed cavity to form a sealed heat transfer channel in the first sealed cavity, and a thermal superconducting heat transfer working medium is filled in the sealed heat transfer channel; the second frame is attached to the surface, away from the first guide plate, of the second cover plate; the third cover plate is attached to the surface, away from the second cover plate, of the second frame, so that a second sealed chamber is formed between the second cover plate and the third cover plate; the second guide plate is positioned in the second sealed cavity so as to form a refrigerant channel in the second sealed cavity; the refrigerant inlet is positioned on the second frame and communicated with the refrigerant channel; the refrigerant outlet is positioned on the second frame and communicated with the refrigerant channel; the heat dissipation fins and the heat superconducting heat exchange plates are alternately arranged and are attached to the surfaces of the heat superconducting heat exchange plates. The heat superconducting heat exchange plate in the heat exchanger based on the heat superconducting heat exchange plate adopts the heat superconducting heat transfer technology, so that the temperature of each area of the whole plate surface is uniform, and the heat exchanger has the characteristics of high heat transfer rate and good temperature uniformity; the heat exchanger based on the heat superconducting heat exchange plate has large heat exchange area of the refrigerant and higher energy efficiency; the utility model discloses a heat superconducting heat transfer board in heat exchanger based on heat superconducting heat transfer board inside is first sealed cavity and second sealed cavity to set up first guide plate and second guide plate in first sealed cavity and second sealed cavity respectively, first guide plate and second guide plate play the reinforcing effect promptly, make first apron, second apron and third cover plate thickness can attenuate, the bearing capacity increases, intensity improves, alleviate the weight and the thickness of heat superconducting heat transfer board, increase the heat transfer area of inside again, strengthen the superconductive heat-sinking capability of heat superconduction; the utility model discloses a fin convex part among the radiating fin in the heat exchanger based on heat superconducting heat transfer board is arranged or is arranged along vertical direction interval and the extending direction of fin convex part is compared and is predetermine the contained angle in the horizontal direction slope when the fin convex part is arranged along vertical direction interval, and the comdenstion water that produces when the surface temperature of the heat exchanger based on heat superconducting heat transfer board is less than air dew point temperature can discharge smoothly.

The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. A heat exchanger based on heat superconducting heat exchange plates, characterized in that the heat exchanger based on heat superconducting heat exchange plates comprises:

a plurality of heat superconducting heat transfer plates, each heat superconducting heat transfer plate all includes: the air conditioner comprises a first frame, a first cover plate, a second cover plate, a first guide plate, a second frame, a second guide plate, a third cover plate, a refrigerant inlet and a refrigerant outlet; the first frame is attached to one surface of the first cover plate; the second cover plate is attached to the surface, away from the first cover plate, of the first frame, so that a first sealing cavity is formed between the first cover plate and the second cover plate; the first guide plate is positioned in the first sealed cavity so as to form a sealed heat transfer channel in the first sealed cavity, and a thermal superconducting heat transfer working medium is filled in the sealed heat transfer channel; the second frame is attached to the surface, away from the first guide plate, of the second cover plate; the third cover plate is attached to the surface, away from the second cover plate, of the second frame, so that a second sealed chamber is formed between the second cover plate and the third cover plate; the second guide plate is positioned in the second sealed cavity so as to form a refrigerant channel in the second sealed cavity; the refrigerant inlet is positioned on the second frame and communicated with the refrigerant channel; the refrigerant outlet is positioned on the second frame and communicated with the refrigerant channel;

2. A heat exchanger based on heat superconducting heat exchange plates according to claim 1, characterized in that: the heat exchanger based on the heat superconducting heat exchange plate further comprises:

3. A heat exchanger based on heat superconducting heat exchange plates according to claim 1, characterized in that: the height of the first guide plate is the same as the thickness of the first frame, and the height of the second guide plate is the same as the thickness of the second frame.

4. A heat exchanger based on heat superconducting heat exchange plates according to claim 1, characterized in that:

the first guide plate comprises a plurality of first guide strips which are arranged in parallel along a first direction, the first guide strips comprise a plurality of first convex parts which are arranged at intervals along a second direction, and the bottoms of the adjacent first convex parts in the second direction are integrally connected; the first direction is perpendicular to the second direction

5. Heat exchanger based on heat superconducting heat exchange plates, according to claim 4, characterized in that: the first convex parts on the first guide strips in two adjacent rows are arranged in a one-to-one corresponding mode or in a staggered mode, and the second convex parts on the second guide strips in two adjacent rows are arranged in a one-to-one corresponding mode or in a staggered mode.

6. Heat exchanger based on heat superconducting heat exchange plates, according to claim 4, characterized in that: the heat superconducting heat exchange plate further comprises a first gas-liquid balance channel and a second gas-liquid balance channel, the first gas-liquid balance channel and the second gas-liquid balance channel are arranged on two opposite sides of the first guide plate at intervals along the first direction and extend along the second direction, and the first gas-liquid balance channel and the second gas-liquid balance channel are located between the second guide plate and the second frame.

7. A heat exchanger based on heat superconducting heat exchange plates according to claim 1, characterized in that: the second sealed chamber comprises a first chamber part, a second chamber part and a third chamber part; the first cavity part is parallel to the third cavity part, the second cavity part is perpendicular to the first cavity part and the third cavity part, and the second cavity part is communicated with the first cavity part and the third cavity part; the refrigerant inlet is communicated with the first cavity part, the refrigerant outlet is communicated with the third cavity part, the refrigerant inlet is located on one side, away from the second cavity part, of the first cavity part, and the refrigerant outlet is located on one side, away from the second cavity part, of the third cavity part.

8. Heat exchanger based on heat superconducting heat exchange plates, according to claim 7, characterized in that: and a liquid storage strip is further arranged in the second frame, is positioned at the joint of the first cavity part and the second cavity part and is positioned on the inner wall of the first cavity part close to the third cavity part.

9. A heat exchanger based on heat superconducting heat exchange plates according to claim 1, characterized in that: in the heat superconducting heat exchange plate, the number of the second frame, the second cover plate, the second guide plate, the refrigerant inlets and the refrigerant outlets is multiple, and the number of the second frame, the second cover plate, the second guide plate, the refrigerant inlets and the refrigerant outlets is the same; the second frames are arranged on the surface, far away from the first guide plate, of the second cover plate at intervals in parallel; the third cover plates are correspondingly attached to the surfaces, far away from the second cover plates, of the second frames to form a plurality of independent second sealed chambers; the guide plates are positioned in the second sealed cavities; the refrigerant inlet and the refrigerant outlet are arranged on each second frame.

10. A heat exchanger based on heat superconducting heat exchange plates according to claim 1, characterized in that: the heat exchanger based on the heat superconducting heat exchange plate further comprises:

11. Heat exchanger based on heat superconducting heat exchange plates, according to any one of claims 1 to 10, characterized in that: the radiating fins comprise a plurality of fin convex parts which are arranged at intervals along the horizontal direction; the bottoms of the fin convex parts adjacent to each other in the horizontal direction are integrally connected.

12. Heat exchanger based on heat superconducting heat exchange plates, according to any one of claims 1 to 10, characterized in that: the radiating fins comprise a plurality of fin convex parts which are arranged at intervals along the vertical direction; the bottoms of the fin convex parts adjacent to each other in the vertical direction are integrally connected.

13. A heat exchanger based on heat superconducting heat exchange plates according to claim 12, characterized in that: the extending direction of the fin convex part is inclined to a preset included angle relative to the horizontal direction, and the preset included angle is larger than 0 degree and smaller than 90 degrees.