CN210864119U - Multichannel parallel optical module - Google Patents
Multichannel parallel optical module Download PDFInfo
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- CN210864119U CN210864119U CN201922019575.9U CN201922019575U CN210864119U CN 210864119 U CN210864119 U CN 210864119U CN 201922019575 U CN201922019575 U CN 201922019575U CN 210864119 U CN210864119 U CN 210864119U
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- 230000003287 optical effect Effects 0.000 title claims abstract description 130
- 239000013307 optical fiber Substances 0.000 claims description 45
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- 230000008878 coupling Effects 0.000 claims description 18
- 238000010168 coupling process Methods 0.000 claims description 18
- 238000005859 coupling reaction Methods 0.000 claims description 18
- 230000007704 transition Effects 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 abstract description 11
- 238000012423 maintenance Methods 0.000 abstract description 5
- 238000005538 encapsulation Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 235000011449 Rosa Nutrition 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 230000008439 repair process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The utility model relates to a multichannel parallel optical module, which comprises a transmitting optical component and a receiving optical component; the light emitting component comprises a plurality of independently packaged light emitting devices, one end of each light emitting device is connected with the printed circuit board, and the other end of each light emitting device is detachably connected with the optical connector; the receiving optical assembly comprises a plurality of receiving optical devices, one end of each receiving optical device is fixedly connected to the printed circuit board, and the other end of each receiving optical device is connected with the optical connector. This application constitutes transmission optical subassembly with a plurality of transmission optical devices with the mode of independent encapsulation to, the one end of being connected each transmission optical device and optical connector sets up to dismantle the connection, so, to the condition that certain transmission optical device takes place to damage, can directly tear this transmission optical device down alone, thereby convenient individual replacement or maintenance, and compare with whole TOSA device replacement, can also reduce replacement cost.
Description
Technical Field
The utility model relates to an optical communication technical field especially relates to a parallel optical module of multichannel.
Background
Optical interconnect technology is moving from 100G (10e9) baud to 200 Gbaud/400 Gbaud, and data centers have evolved with a variety of different paths. Two paths occur for single mode wiring in 100 gbaud data centers 500m to 2000 m: a 100 Gbaud PSM4 (Parallel Single Mode 4 lanes) and a 100 Gbaud CWDM4 optical module for parallel fiber transmission. The data center cabling evolves to single mode transmission at 200 gbaud/400 gbaud, two paths still exist: parallel fiber-optic transmitted PSM8 (Parallell Single Mode 8 lanes, parallel Single Mode eight channel) and wavelength division multiplexed FR8/LR8/ER8 optical modules. Compared with an eight-wave wavelength division multiplexing module, the PSM8 module has the following advantages: the packaging cost and the material cost of the combined wave and the split wave are reduced; the signal quality penalty caused by channel crosstalk of WDM is reduced. I.e. lower cost and higher performance for transmission between 500m and 10 km.
More and more optical module companies are now beginning to develop 200 gbaud/400 gbaud PSM8 optical modules.
The PSM8 optical module is developed with certain difficulty again, and certain problem exists in traditional packaging scheme, for example for the optical transmission scheme in traditional PSM8 optical module, it is usually that 8 passageway transmission are integrated inside a TOSA device, if 8 transmission passageways have a passageway to damage, need repair whole TOSA device is whole, can increase the maintenance degree of difficulty like this on the one hand, on the other hand still can increase maintenance or replacement cost.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is necessary to provide a multi-channel parallel optical module.
A multi-channel parallel optical module comprises an emitting optical component and a receiving optical component;
the light emitting component comprises a plurality of independently packaged light emitting devices, one end of each light emitting device is connected with the printed circuit board, and the other end of each light emitting device is detachably connected with the optical connector;
the receiving optical assembly comprises a plurality of receiving optical devices, one end of each receiving optical device is fixedly connected to the printed circuit board, and the other end of each receiving optical device is connected with the optical connector.
In one embodiment, the multi-channel parallel optical module further comprises a first optical fiber array and a second optical fiber array;
the first optical fiber array is connected between the receiving optical device and the optical connector, and the end face of an optical fiber connected with the receiving optical device is a 45-degree inclined plane;
the second optical fiber array is connected between the light emitting device and the optical connector, and a ceramic ferrule is arranged at one end, connected with the light emitting device, of the second optical fiber array.
In one embodiment, the light emitting device comprises a laser chip, a coupling lens, an isolator and an adapter;
laser with preset wavelength radiated by the laser chip is incident to the coupling lens and then converged to the isolator, and is focused into an optical fiber core of the adapter through the isolator, and the ceramic ferrule is matched with the adapter to realize the connection of the emitting optical device and the second optical fiber array.
In one embodiment, the light emitting device further comprises a backlight detector, a transition block, a flexible circuit board, a tube shell and an adjusting ring;
the backlight detector is arranged on one side of the laser chip, which is far away from the coupling lens, and the backlight detector is bonded on one end of the flexible circuit board; the other end of the flexible circuit board is welded on the printed circuit board; the laser chip, the coupling lens and the flexible circuit board are bonded on the transition block; the transition block and the isolator are bonded in the pipe shell; the adapter and the cartridge are connected by the adjustment ring.
In one embodiment, the laser chip comprises a DFB laser chip or an EML laser chip.
In one embodiment, the receiving optical device comprises a detector chip, a PD carrier and a trans-impedance amplifier;
the detector chip is arranged on the PD carrier and is opposite to the optical fiber end face of the first optical fiber array; the transimpedance amplifier is arranged close to the PD carrier, and the transimpedance amplifier and the PD carrier are fixedly bonded on the printed circuit board;
the first optical fiber array couples optical signals received by optical fibers to the detector chip through total reflection, the detector chip converts the optical signals into electrical signals, and the transimpedance amplifier is used for amplifying the electrical signals to the output standard of the parallel optical module.
In one embodiment, each of the light emitting devices is divided into at least two groups; wherein each group comprises two or four light emitting devices.
In one embodiment, the printed circuit board comprises a printed circuit main board and a printed circuit subplate; at least one group of light emitting devices are welded on the printed circuit main board and the printed circuit auxiliary board.
In one embodiment, the number of light emitting devices is the same as the number of light receiving devices.
In one embodiment, the optical connector comprises a 16-channel optical connector or a 24-channel optical connector.
According to the multi-channel parallel optical module, for the light emitting scheme, the light emitting assemblies are formed by independently packaging the plurality of light emitting devices, and one ends of the light emitting devices, which are connected with the optical connectors, are detachably connected, so that the light emitting devices can be directly and independently detached under the condition that one light emitting device is damaged, and accordingly, the light emitting devices can be conveniently and independently replaced or maintained, and replacement cost can be reduced compared with the replacement of the whole TOSA device.
Drawings
Fig. 1 is a schematic structural diagram of a multi-channel parallel optical module in an embodiment;
fig. 2 is a schematic diagram of a partial structure of the multi-channel parallel optical module in fig. 1;
FIG. 3 is a cross-sectional view of an embodiment of an emissive light device;
FIG. 4 is a cross-sectional view of a light receiving device in one embodiment;
fig. 5 is a schematic structural diagram of a multi-channel parallel optical module in another embodiment.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Fig. 1 is a schematic structural diagram of a multi-channel parallel optical module in an embodiment. The optical module may include an emitting optical subassembly (not shown in fig. 1) and a receiving optical subassembly (not shown in fig. 1), where the emitting optical subassembly is also called tosa (transmitter optical subassembly), and is mainly composed of a semiconductor laser for emitting a modulated optical signal; the receiving optical component, also called rosa (receiver optical subassembly), is mainly composed of a photodetector for receiving the modulated optical signal. The light emitting assembly of the present application includes a plurality of light emitting devices 10, one end of the light emitting devices 10 being connected to a printed circuit board 40, and the other end of the light emitting devices 10 being detachably connected to an optical connector 30; correspondingly, the receiving optical assembly also includes a plurality of receiving optical devices 20, one end of the receiving optical devices 20 is connected and fixed on the printed circuit board 40, and the other end of the receiving optical devices 20 is connected with the optical connector 30. Optionally, the number of the light emitting devices 10 in the light emitting module of the present application is the same as the number of the light receiving devices 20 in the light receiving module, and more optionally, the number of the light emitting devices 10 in the light emitting module and the number of the light receiving devices 20 in the light receiving module of the present application are both 8, so as to form an eight-channel parallel optical module.
Considering the light emitting scheme in the conventional PSM8 optical module, it is common to integrate 8-channel emission into one TOSA device, and if one channel of the 8 emission channels is damaged, the whole TOSA device needs to be repaired, which increases the maintenance difficulty on one hand and increases the maintenance or replacement cost on the other hand. In the present application, a plurality of light emitting devices 10 are individually packaged to form a light emitting assembly, and one end of each light emitting device 10 is connected to a printed circuit board 40, and the other end of the light emitting device 10 is detachably connected to an optical connector 30; therefore, when one light emitting device is damaged, the light emitting device can be directly and independently detached, so that the light emitting device is convenient to independently replace or maintain, and the replacement cost can be reduced compared with the replacement of the whole TOSA device.
Further, in order to implement the solution of the present application, reference may be made to fig. 2, which is a schematic diagram of a partial structure of the multi-channel parallel optical module in fig. 1. The multichannel parallel optical module of the present application may further include a first optical fiber array (not shown in fig. 2) and a second optical fiber array (not shown in fig. 2); the first optical fiber array can be understood as comprising a plurality of single-mode optical fibers, and when needed, the plurality of single-mode optical fibers can be coupled for convenience of management and improvement of reliability; in this embodiment, as 301 in fig. 2 is a 4-channel receiving fiber array, that is, 4 single-mode fibers are coupled into a bundle, as shown in fig. 2, the first fiber array in this embodiment is divided into two 4-channel receiving fiber arrays 301, and compared with the conventional method of directly coupling 8 channels, this embodiment can better consider the coupling efficiency of 8 channels; the first optical fiber array in this application is connected between the receiving optical device 20 and the optical connector 30, further, the optical connector 30 may be an MPO optical connector, and further, the MPO optical connector may be a 16-channel or 24-channel MPO optical connector. That is, the first optical fiber array is connected between the receiving optical device 20 and the MPO optical connector 303; in addition, the end surface of the optical fiber connected to the receiving optical device 20 of the first optical fiber array may be a 45-degree inclined surface, and the 45-degree inclined surface may be obtained by polishing the end surface of the bare fiber; the second optical fiber array is connected between the light emitting device 10 and the optical connector 30, the second optical fiber array has the same definition as the first optical fiber array, and both the second optical fiber array and the first optical fiber array comprise a plurality of single-mode optical fibers, and meanwhile, a ceramic ferrule is arranged at one end of the second optical fiber array, which is connected with the light emitting device 10; in this embodiment, since the first fiber array is an 8-channel receiving fiber array, the second fiber array is also an 8-channel transmitting fiber array, that is, the second fiber array in this embodiment is composed of eight single-mode fibers, one end of each single-mode fiber is connected to the MPO optical connector 303, and the other end is provided with a ferrule, that is, the ferrules TX1-TX8 in fig. 2.
In some embodiments, referring to FIG. 3, a cross-sectional view of a separately packaged light emitting device 10 is illustrated. In the figure, the light emitting device 10 in this embodiment may include a laser chip 101, a coupling lens 102, an isolator 103, and an adapter 105; laser with a preset wavelength radiated by the laser chip 101 is incident on the coupling lens 102 and then converged on the isolator 103, and is focused into the fiber core of the adapter 103 through the isolator 103, and the ferrules TX1-TX8 are matched with the adapter 105 to realize connection of the light emitting device 10 and the second fiber array. Specifically, the laser chip 101 may be a DFB laser chip or an EML laser chip; the optical fibers in the adapter 105 may be single mode optical fibers.
Further, with continued reference to fig. 3, the light emitting device 10 of the present application may further include a backlight detector 106, a transition block 110, a flexible circuit board 108, a tube housing 109, and an adjustment ring 104; the backlight detector 106 is disposed on a side of the laser chip 101 away from the coupling lens 102, that is, the backlight detector 106 and the coupling lens 102 are disposed on opposite sides of the laser chip 101; one end of the flexible circuit board 108 is bonded with the backlight detector 106; the other end of the flexible circuit board 108 is soldered on the printed circuit board 40; the laser chip 101, the coupling lens 102 and the flexible circuit board 108 are adhered to the transition block 110; the transition block 110 and the isolator 103 are bonded within the tube shell 109; the adapter 105 and the tube housing 109 are connected by the adjusting ring 104, and specifically, the adapter 105 and the tube housing 109 are respectively connected to the adjusting ring 104 by laser welding. It should be noted that the bonding in this embodiment is understood as bonding using glue. In addition, 107 denotes a cover, which is mainly used to house the laser chip 101, the coupling lens 102, the adapter 105, the backlight detector 106, a portion of the flexible circuit board 108, the transition block 110, and the like of the light emitting device 10; this portion is then soldered to the rest to form a non-hermetically packaged mini-TOSA device.
Further, referring to fig. 4, a cross-sectional view of the light receiving device 20 provided in the present application is shown. In the figure, 201: an optical fiber with a coating layer; 202: a glass V groove; 203: polishing a 45-degree bare fiber; 204: a detector chip; 205: a transimpedance amplifier; 206: a glass cover plate; 207: a PD carrier. The light receiving device 20 may include a detector chip 204, a PD carrier 207, and a transimpedance amplifier 205; the end of the single mode fiber is polished at a 45 degree angle to form a polished 45 degree bare fiber 203; light emitted from the single-mode fiber is polished by a bare fiber 203 with 45 degrees, reflected and vertically irradiated on a photosensitive surface of a detector chip 204 to form photocurrent; an alternating current signal component in the photocurrent is amplified to the output standard of the parallel optical module by the transimpedance amplifier 205 and then output to the optical module; the detector chip 204 is fixed on the PD carrier 207 by means of glue bonding; the polished 45-degree bare fiber 203 is fixed between the glass V groove 202 and the glass cover plate 206 in a glue bonding mode; the glass cover plate 206, the PD carrier 207 and the transimpedance amplifier 205 are fixed on a printed circuit main board 401 of the optical module in a glue bonding mode; in the above, a basic structure of a single-channel optical path of the receiving optical device 20 is provided, and 8 single-channel receiving optical paths (four in this application, two in total) are multiplexed in the optical module space of the present embodiment, so that parallel receiving of 8 optical signals can be realized. It should be understood that the coated optical fiber 201, the glass V-groove 202, the polished 45-degree bare fiber 203, the glass cover 206, etc. belong to the first optical fiber array.
In some embodiments, referring to fig. 5, the aforementioned light emitting devices 10 can be divided into at least two groups; wherein each group includes two or four light emitting devices 10, since the present embodiment employs eight light emitting devices 10, the present application divides the eight light emitting devices 10 into 2 groups, each group including four light emitting devices 10; as shown in fig. 5, two sets of the light emitting devices 10 are stacked in the vertical direction; further, according to the above description, one end of the light emitting device 10 of the present application is fixed on the printed circuit board 40, and in the case of grouping the light emitting devices 10, the printed circuit board 40 of the present application may also include a printed circuit main board 401 and a printed circuit sub-board 402; at least one group of light emitting devices 10 is soldered to the printed circuit main board 401 and the printed circuit sub-board 402. That is, the two groups of light emitting devices 10 can be respectively soldered on the printed circuit board 401 and the printed circuit sub-board 402, so that the area of the printed circuit board 401 can be reduced, and the volume of the optical module product is relatively small.
In addition, when the multichannel parallel optical module is assembled, the following steps can be referred to:
step 1: bonding a PD carrier 207 and a transimpedance amplifier 205 on the upper surface of the printed circuit main board 401; bonding a detector chip 204 on the PD carrier 207;
step 2: coupling the first optical fiber array with the detector chip-204, and adhering the glass cover plate 206 on the printed circuit main board 401;
and step 3: respectively welding 4 mini-TOSA devices 10 on the printed circuit main board 401 and the optical module auxiliary board 402;
and 4, step 4: inserting 8 ceramic ferrules Tx1-Tx8 on the second optical fiber array into the adapter 105 of the 8 mini-TOSA device 10, and curing the ceramic ferrules with glue; so far, the eight-channel parallel transceiver optical module of the present application is assembled.
In summary, according to the light emitting scheme, the light emitting assemblies are formed by independently packaging the plurality of light emitting devices, and the ends of the light emitting devices, which are connected with the optical connectors, are detachably connected, so that the light emitting devices can be directly and independently detached when a certain light emitting device is damaged, and therefore, the light emitting devices can be conveniently and independently replaced or maintained, and compared with the replacement of the whole TOSA device, the replacement cost can be reduced; aiming at the optical receiving scheme, the receiving of 8 channels is divided into two groups, each group comprises four channels, and the two groups are respectively coupled, so that the consistency of the 8-channel coupling efficiency is greatly improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The multichannel parallel optical module is characterized by comprising an emitting optical component and a receiving optical component;
the light emitting component comprises a plurality of independently packaged light emitting devices, one end of each light emitting device is connected with the printed circuit board, and the other end of each light emitting device is detachably connected with the optical connector;
the receiving optical assembly comprises a plurality of receiving optical devices, one end of each receiving optical device is fixedly connected to the printed circuit board, and the other end of each receiving optical device is connected with the optical connector.
2. The multi-channel parallel optical module of claim 1, further comprising a first fiber array and a second fiber array;
the first optical fiber array is connected between the receiving optical device and the optical connector, and the end face of an optical fiber connected with the receiving optical device is a 45-degree inclined plane;
the second optical fiber array is connected between the light emitting device and the optical connector, and a ceramic ferrule is arranged at one end, connected with the light emitting device, of the second optical fiber array.
3. The multi-channel parallel optical module of claim 2, wherein the light emitting device comprises a laser chip, a coupling lens, an isolator and an adapter;
laser with preset wavelength radiated by the laser chip is incident to the coupling lens and then converged to the isolator, and is focused into an optical fiber core of the adapter through the isolator, and the ceramic ferrule is matched with the adapter to realize the connection of the emitting optical device and the second optical fiber array.
4. The multi-channel parallel optical module of claim 3, wherein the light emitting device further comprises a backlight detector, a transition block, a flexible circuit board, a tube shell and an adjusting ring;
the backlight detector is arranged on one side of the laser chip, which is far away from the coupling lens, and the backlight detector is bonded on one end of the flexible circuit board; the other end of the flexible circuit board is welded on the printed circuit board; the laser chip, the coupling lens and the flexible circuit board are bonded on the transition block; the transition block and the isolator are bonded in the pipe shell; the adapter and the cartridge are connected by the adjustment ring.
5. The multi-channel parallel optical module of claim 3, wherein the laser chip comprises a DFB laser chip or an EML laser chip.
6. The multi-channel parallel optical module of claim 2, wherein the receiving optics comprise a detector chip, a PD carrier and a transimpedance amplifier;
the detector chip is arranged on the PD carrier and is opposite to the optical fiber end face of the first optical fiber array; the transimpedance amplifier is arranged close to the PD carrier, and the transimpedance amplifier and the PD carrier are fixedly bonded on the printed circuit board;
the first optical fiber array couples optical signals received by optical fibers to the detector chip through total reflection, the detector chip converts the optical signals into electrical signals, and the transimpedance amplifier is used for amplifying the electrical signals to the output standard of the parallel optical module.
7. The multi-channel parallel light module according to any of claims 1-6, wherein each of the light emitting devices is divided into at least two groups; wherein each group comprises two or four light emitting devices.
8. The multi-channel parallel optical module of claim 7, wherein the printed circuit board comprises a printed circuit main board and a printed circuit subplate; at least one group of light emitting devices are welded on the printed circuit main board and the printed circuit auxiliary board.
9. The multi-channel parallel light module according to any of claims 1-6, characterized in that the number of the emitting optical devices is the same as the number of the receiving optical devices.
10. The multi-channel parallel optical module of any of claims 1-6, wherein the optical connector comprises a 16-channel optical connector or a 24-channel optical connector.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201922019575.9U CN210864119U (en) | 2019-11-21 | 2019-11-21 | Multichannel parallel optical module |
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| CN201922019575.9U CN210864119U (en) | 2019-11-21 | 2019-11-21 | Multichannel parallel optical module |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112346181A (en) * | 2020-11-09 | 2021-02-09 | 长飞光纤光缆股份有限公司 | Optical module |
| CN112558242A (en) * | 2020-12-11 | 2021-03-26 | 江苏奥雷光电有限公司 | Miniaturized optical engine of available multichannel radio frequency optical module |
| CN113946021A (en) * | 2020-07-17 | 2022-01-18 | 英属维京群岛商祥茂光电科技股份有限公司 | Optical communication system |
| CN114089488A (en) * | 2021-10-22 | 2022-02-25 | 中航光电科技股份有限公司 | Free space transmission optical assembly, optical communication module and optical communication system |
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2019
- 2019-11-21 CN CN201922019575.9U patent/CN210864119U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113946021A (en) * | 2020-07-17 | 2022-01-18 | 英属维京群岛商祥茂光电科技股份有限公司 | Optical communication system |
| CN113946021B (en) * | 2020-07-17 | 2023-01-31 | 英属维京群岛商祥茂光电科技股份有限公司 | Optical communication system |
| CN112346181A (en) * | 2020-11-09 | 2021-02-09 | 长飞光纤光缆股份有限公司 | Optical module |
| CN112558242A (en) * | 2020-12-11 | 2021-03-26 | 江苏奥雷光电有限公司 | Miniaturized optical engine of available multichannel radio frequency optical module |
| CN114089488A (en) * | 2021-10-22 | 2022-02-25 | 中航光电科技股份有限公司 | Free space transmission optical assembly, optical communication module and optical communication system |
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