CN211846222U - Diamond Arrangement Arrangement Device for Diamond Arranger - Google Patents

Abstract

The utility model relates to a diamond arrangement finishing device of diamond collator, it is equipped with plural diamond storage tank including a arrangement board on the arrangement board, and the diamond storage tank can be circular diamond storage tank or oval diamond storage tank, and the opening size of each diamond storage tank, all is less than lithodomous diameter, when the diamond falls into the diamond storage tank, enables lithodomous sharp pointed end outwards. The utility model discloses utilize special diamond storage tank design, can effectively arrange in order the diamond, when making the diamond inlay and locate diamond arrangement ware, sharp pointed surface can both expose outside diamond arrangement ware, can avoid the lithodomous plane to expose in diamond arrangement ware, influences diamond arrangement ware's cut rate.

Description

Diamond Arrangement Arrangement Device for Diamond Arranger

technical field

The utility model relates to a technology for making a diamond organizer, in particular to a diamond arranging and arranging device for a diamond organizer capable of arranging the diamonds arranged on the diamond organizer.

Background technique

Chemical-Mechanical Planarization (CMP) is a technology commonly used in semiconductor manufacturing. Chemical-mechanical planarization uses mechanical force combined with chemical etching to flatten the surface of wafers or other semiconductor components during processing. processing.

In the chemical mechanical planarization process of semiconductors, a common technique is to use a polishing pad (Pad) to contact the surface of a wafer or other semiconductor components to grind the wafer or other semiconductor components with mechanical force. It is used together with chemical etching slurry (Slurry) to remove impurities or uneven structures on the surface of wafers or other semiconductor components through chemical reaction and physical mechanical force.

Among them, the cutting rate of the diamond organizer will change with the diamond arrangement angle and density. Therefore, in order to improve the cutting rate of the diamond organizer, the diamond arrangement angle and density on the diamond organizer are very important, but When making diamond organizers in the past, there was no effective way to make the exposed surface of diamonds on the diamond organizer, resulting in the risk that most of the diamond planes may face outwards in the finished diamond organizer. The setting method of diamonds not only affects the diamond arrangement. The cut rate of the diamond organizer is also reduced, and the diamonds are also prone to fall off the diamond organizer. When the quality of the diamond organizer is poor, it will also affect the quality of the subsequent grinding wafers or other semiconductors. Therefore, whether the quality of the diamond organizer is good or not has a profound impact on the qualification rate of wafers or other semiconductors. It is also a very important part of the semiconductor industry.

In view of this, the present invention proposes a diamond arranging and arranging device for a diamond arranging device to effectively overcome the above-mentioned problems.

Utility model content

The main purpose of the present utility model is to provide a diamond arrangement and arrangement device for a diamond organizer, which utilizes a special diamond accommodating groove design, which can effectively arrange the arrangement angle of the diamonds. When the diamonds are set in the diamond organizer, all diamonds are sharp The surface can be exposed to the diamond organizer to improve the cutting rate of the diamond organizer.

Another object of the present utility model is to provide a diamond arranging and arranging device for a diamond organizer, which can effectively organize the arrangement angle of the diamonds, and avoid that when the diamonds are arranged in the diamond organizer, the plane of the diamonds is exposed outside the diamond organizer, thereby reducing the The cut rate of the diamond finisher.

In order to achieve the above-mentioned purpose, the present invention provides a diamond arrangement and arrangement device for a diamond organizer, comprising an arrangement plate, and the arrangement plate is provided with a plurality of diamond accommodating grooves, and each diamond accommodating groove can respectively accommodate a diamond. , and the size of the opening of each diamond accommodating groove is smaller than the diameter of the diamond.

The plurality of diamond accommodating grooves may be round diamond accommodating grooves or oval diamond accommodating grooves.

The finishing board is a steel finishing board.

To sum up, the utility model utilizes the special design of the diamond accommodating groove, which can effectively arrange the arrangement angles of the diamonds. When the diamonds are set in the diamond organizer, the sharp surfaces of all the diamonds can be exposed on the diamond organizer, so as to avoid the diamonds from being damaged. The flat surface is exposed outside the diamond organizer to improve the cutting rate of the diamond organizer.

In order to further understand and recognize the structural features and the achieved effects of the present invention, preferred embodiment drawings and detailed descriptions are hereby accompanied, and the descriptions are as follows.

Description of drawings

Fig. 1 is a three-dimensional schematic diagram of the present invention.

2A to 2F are schematic diagrams of successive steps for making a diamond organizer according to the present invention.

3A to 3C are schematic diagrams of successive steps of making a diamond organizer according to another embodiment of the present invention.

Explanation of reference numerals: 1-diamond arrangement and arrangement device of diamond organizer; 10-arrangement plate; 12-diamond accommodating groove; 20-soft substance; 22-substrate; 24-metal substrate; 26-diamond organizer; 30 - Base; 32 - Metal Layer; 34 - Diamond Organizer; 40 - Diamond.

Detailed ways

The utility model relates to a diamond arranging and arranging device for a diamond organizer, which can arrange the installation angle of the diamonds, so that when the diamonds are set in the diamond organizer, the sharp surfaces of all the diamonds can face outward, so as to improve the diamond organizer The cutting rate is relatively helpful to improve the pass rate of subsequent wafers or other semiconductors.

Please refer to FIG. 1 to describe in detail the structure of the diamond arranging and arranging device 1 of the diamond organizer. As shown in the figure, the structure of the diamond arranging and arranging device 1 of the diamond organizer includes an arranging board 10, and the arranging board 10 can be a steel arranging board. , the finishing plate 10 is provided with a plurality of diamond accommodating grooves 12 for accommodating diamonds respectively (not shown in the figure), the opening size of each diamond accommodating groove 12 is smaller than the diameter of the diamond, and the plurality of diamond accommodating grooves 12 is a round diamond accommodating groove or an oval diamond accommodating groove, the edges of the diamond accommodating groove 12 are all arcs, and there is no right-angled diamond accommodating groove 12 .

The structure of the diamond accommodating groove 12 can make the sharp surface of the diamond face outward, not only because the size of the opening is smaller than the diameter of the diamond, the diamond can be snapped into the opening of the diamond accommodating groove 12, but also because the diamond accommodating groove 12 is Round diamond receptacles or oval diamond receptacles have rounded edges and no right-angle designs. Since the diamonds set in the diamond organizer are usually hexahedron, octahedron or tetrahedron diamonds, the diamond accommodating groove 12 is designed without corners, which can avoid hexahedron, octahedron or tetrahedron diamonds The sharp part just falls into the position of the corner of the diamond accommodating groove 12, and the flat part is exposed.

After explaining the structure of the diamond arranging device 1 of the diamond organizer of the present invention, please refer to FIGS. 2A to 2F to describe in detail the use state of the diamond arranging device 1 of the diamond organizer. First, please refer to FIG. 2A , and sprinkle a plurality of diamonds 40 on the finishing board 10. Since the opening size of the diamond accommodating groove 12 is smaller than the diameter of the diamond 40, and the diamond accommodating groove 12 is a round diamond accommodating groove or an oval diamond accommodating groove, and has no corner design, the plurality of diamonds 40 fall into the diamond The sharp surfaces of all diamonds 40 may be directed outwards when the grooves 12 are accommodated.

Next, referring to FIG. 2B , a soft material 20 , such as non-woven fabric or paper, is adhered to the finishing board 10 , so that the diamonds 40 on the diamond accommodating grooves 12 can be embedded in the soft material 20 . Next, please refer to FIG. 3C, remove the finishing board 10, and lay the soft substance 20 inlaid with diamonds 40 on a substrate 22, the substrate 22 may be a glaze substrate or a ceramic substrate. High temperature sintering is performed. After high temperature sintering, the soft substance 20 has been deformed or broken. At this time, the surface of the substrate 22 can be washed with a water column, and the soft substance 20 on the substrate 22 can be washed clean. As shown in FIG. 2D, the diamond 40 is set on the on the substrate 22 . Finally, referring to FIG. 2E and FIG. 2F , the substrate 22 inlaid with diamonds 40 is mounted on a metal base 24 to complete the diamond organizer 26 .

Next, please refer to FIG. 3A to FIG. 3C to describe the diamond arrangement and arrangement device 1 using the diamond organizer of the present invention, another embodiment of making a diamond organizer. First, please refer to FIG. 3A , which is the same as the above-mentioned embodiment. When a plurality of diamonds are scattered on the arrangement plate 10 , when all the diamonds 40 fall into the diamond accommodating grooves 12 , the sharp surfaces of the diamonds 40 may all face outward.

Next, referring to FIG. 3B , a base 30 is provided. The base 30 can be a steel base. The base 30 is coated with a metal layer 32 , and the side coated with the metal layer 32 is bonded to the diamond 40 . Next, referring to FIG. 3C , the finishing plate 10 is removed, and electroplating is performed, so that the diamonds 40 can be firmly embedded in the metal layer 32 , and the diamond organizer 34 is completed.

To sum up, the utility model utilizes the special design of the diamond accommodating groove, which can effectively arrange the arrangement angles of the diamonds. When the diamonds are set in the diamond organizer, the sharp surfaces of all the diamonds can be exposed on the diamond organizer, so as to avoid the diamonds from being damaged. The flat surface is exposed outside the diamond organizer to improve the cutting rate of the diamond organizer.

The above description is only illustrative rather than restrictive for the present invention, and those of ordinary skill in the art will understand that many modifications, changes or equivalents can be made without departing from the spirit and scope defined by the claims. But all will fall within the protection scope of the present invention.

Claims (4)

1. a diamond arrangement arrangement device of a diamond organizer, is characterized in that, comprises: An arrangement plate is provided with a plurality of diamond accommodating grooves for accommodating diamonds respectively, and the opening size of each diamond accommodating groove is smaller than the diameter of the diamond. 2 . The diamond arrangement and arrangement device of a diamond organizer as claimed in claim 1 , wherein the plurality of diamond accommodating grooves are round diamond accommodating grooves. 3 . 3. The diamond arranging device of claim 1, wherein the plurality of diamond accommodating grooves are oval diamond accommodating grooves. 4. The diamond arranging and arranging device of claim 1, wherein the arranging plate is a steel arranging plate.

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