CN212907725U - DFN1610-6 chip frame - Google Patents
DFN1610-6 chip frame Download PDFInfo
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- CN212907725U CN212907725U CN202022500171.4U CN202022500171U CN212907725U CN 212907725 U CN212907725 U CN 212907725U CN 202022500171 U CN202022500171 U CN 202022500171U CN 212907725 U CN212907725 U CN 212907725U
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- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000015572 biosynthetic process Effects 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 230000032798 delamination Effects 0.000 description 1
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Abstract
The utility model relates to a semiconductor manufacturing technology field, in particular to DFN1610-6 chip frame. The utility model comprises a frame body and vertical cutting channels, wherein the frame body is provided with a plurality of chip mounting units, each chip mounting unit comprises three functional units, each functional unit is provided with two pins, and the vertical cutting channels are respectively positioned at two sides of each row of chip mounting units; all the functional units on each chip mounting unit are arranged at intervals along the arrangement direction of the vertical cutting channels, two pins on each functional unit are arranged at intervals along the transverse direction of the frame body, and the two pins are respectively connected with the vertical cutting channels; the side surface of the pin is provided with a concave part, and the concave part is positioned at the connecting part of the pin and the vertical cutting channel. The utility model discloses after the plastic envelope is ended, can reduce the formation of overlap at the edge of product to and when cutting the product, can reduce the phenomenon that appears the layering between pin and the plastic envelope body, reduce the risk that the short circuit appears in the side of pin.
Description
Technical Field
The utility model relates to a semiconductor manufacturing technology field, in particular to DFN1610-6 chip frame.
Background
In the DFN1610-6 chip frame product existing in the market at present, the utilization rate of the frame body 1 itself is not high. As shown in fig. 1, three exhaust grooves 2 are designed on most existing DFN1610-6 chip frames, and the three exhaust grooves 2 divide the DFN1610-6 chip frame into C, D, E and F four areas, and this way has a low utilization rate for the frame body 1 itself, resulting in low production efficiency and high production cost of the whole product.
In addition, in order to facilitate the product division after plastic encapsulation, a cutting lane is generally designed between two adjacent chip mounting units in the conventional DFN1610-6 chip frame, and after the plastic encapsulation of the DFN1610-6 chip frame is finished, the product is cut along the cutting lane. However, after the plastic package of the conventional DFN1610-6 chip frame is completed, when a product is cut along the cutting path, a delamination phenomenon occurs between the leads and the plastic package body due to an excessively high heat during cutting, and a short circuit risk occurs on the side surfaces of the leads due to a short distance between two adjacent leads. In addition, the conventional DFN1610-6 chip frame is easy to generate burrs and the like on the edge of a product after the plastic package is finished.
SUMMERY OF THE UTILITY MODEL
The invention of the utility model aims to: aiming at the problems that in the prior art, when the existing DFN1610-6 chip frame is cut after plastic package is finished and a product is cut, the phenomenon of layering between a pin and a plastic package body is easy to occur, and the risk of short circuit is easy to occur on the side face of the pin, the DFN1610-6 chip frame is provided, the phenomenon of layering between the pin and the plastic package body can be reduced after the plastic package is finished and when the product is cut, the risk of short circuit occurring on the side face of the pin can be reduced, and the formation of flash can be reduced on the edge of the product after the plastic package is finished.
In order to realize the purpose, the utility model discloses a technical scheme be:
the DFN1610-6 chip frame comprises a frame body, wherein a plurality of chip mounting units are arranged on the frame body, each chip mounting unit comprises three functional units, each functional unit is provided with two pins, and all the chip mounting units are arranged on the frame body in a rectangular array; the frame body is vertically provided with vertical cutting channels, and the vertical cutting channels are respectively positioned on two sides of each row of chip mounting units; all the functional units on each chip mounting unit are arranged at intervals along the arrangement direction of the vertical cutting channels, two pins on each functional unit are arranged at intervals along the transverse direction of the frame body, and the two pins are respectively connected with the vertical cutting channels on the two sides of the chip mounting unit; and the side surface of the pin is provided with a concave part which is positioned at the joint of the pin and the vertical cutting channel.
In the utility model, the side of the pin is provided with the concave part, and the concave part is positioned at the connecting part of the pin and the vertical cutting path, so that after the plastic package is carried out, when the product is cut along the vertical cutting path, the amount of cutting is reduced, and the heat generated during cutting is reduced, thereby reducing the phenomenon that the heat is too high during cutting and the layering phenomenon occurs between the pin and the plastic package body; moreover, the concave parts are arranged on the side surfaces of the pins, so that the spacing distance of the connecting part between the pins on two adjacent functional units and the same vertical cutting channel can be increased in the arrangement direction of the vertical cutting grooves, and the risk of short circuit on the side surfaces of the pins due to the short spacing distance between the two adjacent pins when a product is cut along the vertical cutting channel can be reduced; additionally, the utility model discloses be provided with the concave part in the side of pin, thereby the utility model discloses when carrying out the plastic envelope, can increase the plastic envelope material with the utility model discloses area of contact between, and then can increase the locking die power, thereby the utility model discloses can reduce after the plastic envelope finishes and appear phenomenons such as overlap at the edge of product. Therefore, through the utility model discloses a structure the utility model discloses after the plastic envelope end and when cutting the product, can reduce the phenomenon that appears the layering between pin and the plastic envelope body, can reduce the risk that the short circuit appears in the side of pin to and after the plastic envelope is ended, can reduce the formation of overlap at the edge of product.
As the preferred scheme of the utility model, the both sides of every pin all are provided with the concave part. Through the structure, the utility model discloses after the plastic envelope, when cutting the product along vertical cutting way, can further reduce and appear layering phenomenon between pin and the plastic envelope body to and can further reduce the risk that the short circuit appears in the side of pin, and after the plastic envelope is ended, can further reduce the formation of overlap at the edge of product.
As a preferred scheme of the utility model, two sides of each row of chip mounting units are provided with transverse cutting channels, transverse connecting ribs are arranged in the transverse cutting channels, and the transverse connecting ribs are fixedly connected with two adjacent rows of chip mounting units or the chip mounting units are fixedly connected with the edge of the frame body; vertical connecting ribs are arranged in the vertical cutting channels and are fixedly connected with pins on the functional units or the pins are fixedly connected with the edge of the frame body. Through the structure, the utility model discloses a structural strength can be increased.
As the preferred scheme of the utility model, the vertical connecting rib and/or the horizontal connecting rib are of a semi-corrosion structure. By the structure, the binding force between the plastic package material and the frame body can be increased, and the product can be cut more conveniently, so that the heat generated by cutting the product can be reduced, the generated thermal stress is reduced, the layering phenomenon between the pins and the plastic package body can be further reduced, the moisture sensitivity of the product can be enhanced, and the reliability of the product can be improved; moreover, when the product is cut, the residual plastic package material on the frame body can not enter the product through the semi-corrosion structure of the vertical connecting rib and/or the horizontal connecting rib, so that the risk of adverse effect on the subsequent process can be reduced; meanwhile, the semi-corrosion structure is also beneficial to exhausting gas during plastic packaging.
As the preferred embodiment of the present invention, the width of the vertical connecting rib is 0.1 ± 0.025mm, and/or the width of the horizontal connecting rib is 0.1 ± 0.025 mm.
As a preferred scheme of the present invention, in each chip mounting unit, each functional unit is provided with a chip mounting portion for placing at least one chip, and the corresponding chip mounting portions on the three functional units are respectively named as a first chip mounting portion, a second chip mounting portion and a third chip mounting portion; the first chip mounting part is not more than 0.8 +/-0.025 mm in size along the transverse direction of the frame body, and is not more than 0.5 +/-0.025 mm in size along the vertical direction of the frame body; the size of the second chip mounting part along the transverse direction of the frame body is not more than 0.8 +/-0.025 mm, and the size of the second chip mounting part along the vertical direction of the frame body is not more than 0.38 +/-0.025 mm; the third chip mounting part is not more than 0.8 +/-0.025 mm in size along the transverse direction of the frame body, and is not more than 0.38 +/-0.025 mm in size along the vertical direction of the frame body. With the above configuration, the chip selection margin can be increased.
As the utility model discloses a preferred scheme is provided with an exhaust duct on frame body's the horizontal, and the exhaust duct is along the vertical setting of frame body, and the exhaust duct falls into A region and B region with the frame body, all is provided with a plurality of chip installation units on A region and B region. Through the structure, more chip mounting units can be arranged on each frame body, so that the utilization rate of the frame body can be improved, and the production cost is reduced.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:
1. through the utility model discloses a structure the utility model discloses after the plastic envelope and when cutting the product, can reduce the phenomenon that appears the layering between pin and the plastic envelope body, can reduce the risk that appears the short circuit in the side of pin to and after the plastic envelope is ended, can reduce the formation of overlap at the edge of product.
2. The utility model discloses simple structure, the processing of being convenient for to manufacturing cost is lower.
3. Through the utility model discloses can improve the utilization ratio to the frame body, reduce the cost of frame body to and can improve the production efficiency of product.
Drawings
Fig. 1 is a schematic structural diagram of a conventional DFN1610-6 chip frame.
Fig. 2 is a schematic structural diagram of the present invention.
Fig. 3 is a schematic structural view of the frame body.
Fig. 4 is a schematic view of connection of two adjacent chip mounting units.
Fig. 5 is a schematic structural view of the chip mounting unit.
Fig. 6 is a schematic view of a structure in which two chips are provided on each chip mounting portion.
Fig. 7 is a schematic view of a structure in which one chip is provided on each chip mounting portion.
The labels in the figure are: 1-frame body, 2-exhaust groove, 3-chip mounting unit, 31-functional unit, 311-pin, 4-vertical cutting path, 5-horizontal cutting path, 6-concave part, 7-chip mounting part and 8-chip.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings.
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
As shown in fig. 2 to 5, the present invention includes a frame body 1;
in fig. 2, the X direction is the lateral direction of the frame body 1, and the Y direction is the longitudinal direction of the frame body 1. As shown in fig. 2 and 3, the utility model discloses be provided with an exhaust duct 2 on frame body 1's the horizontal, exhaust duct 2 is along frame body 1's vertical setting to exhaust duct 2 falls into a region and B region with frame body 1, all is provided with a plurality of chip mounting unit 3 on A region and B region, and all chip mounting unit 3 are the rectangular array range on A region and B region.
Set up an exhaust duct 2 on every frame body 1 to exhaust duct 2 falls into two regional modes with frame body 1, and for prior art, falls into four regional modes with frame body 1, the utility model discloses the structural style who adopts can have more chip installation units 3 on the same area of every frame body 1 to can improve the utilization ratio to frame body 1 self, and then can improve the production efficiency and the reduction in production cost of whole product.
As shown in fig. 4, the utility model also comprises vertical cutting channels 4 vertically arranged along the frame body 1, wherein the vertical cutting channels 4 are respectively positioned at two sides of each row of chip mounting units 3;
as shown in fig. 4 and 5, each chip mounting unit 3 includes three functional units 31, and each functional unit 31 is provided with two pins 311; thus, on each chip mounting unit 3, six pins 311 are provided, and the six pins 311 are divided into two groups and located on both sides of each functional unit 31, respectively.
In the utility model, all the functional units 31 on each chip mounting unit 3 are arranged at intervals along the arrangement direction of the vertical cutting channels 4, two pins 311 on each functional unit 31 are arranged at intervals along the transverse direction of the frame body 1, and the two pins 311 are respectively connected with the vertical cutting channels 4 on both sides of the chip mounting unit 3; further, in order to increase the structural strength of the present invention, as shown in fig. 4, two sides of each row of chip mounting units 3 are provided with a transverse cutting channel 5, a transverse connecting rib is arranged in each transverse cutting channel 5, and the transverse connecting rib is fixedly connected to two adjacent rows of chip mounting units 3, or the chip mounting units 3 are fixedly connected to the edge of the frame body 1; vertical connecting ribs are arranged in the vertical cutting channels 4 and are fixedly connected with the pins 311 on the functional units 31, or the pins 311 are fixedly connected with the edge of the frame body 1.
Further, in each chip mounting unit 3, each functional unit 31 is provided with a chip mounting portion 7 for placing at least one chip 8, and the specific size and the specific structure of the chip mounting portion 7 are generally selected according to actual conditions. In order to make it possible to make the choice of chip 8 more flexible,
the chip mounting parts 7 on the three functional units 31 in each chip mounting unit 3 can be named as a first chip mounting part, a second chip mounting part and a third chip mounting part respectively, and the size of the first chip mounting part along the transverse direction of the frame body 1 is not more than 0.8 +/-0.025 mm, and the size along the vertical direction of the frame body 1 is not more than 0.5 +/-0.025 mm; the size of the second chip mounting part along the transverse direction of the frame body 1 is not more than 0.8 +/-0.025 mm, and the size of the second chip mounting part along the vertical direction of the frame body 1 is not more than 0.38 +/-0.025 mm; the third chip mounting part has a dimension along the transverse direction of the frame body 1 of no more than 0.8 +/-0.025 mm and a dimension along the vertical direction of the frame body 1 of no more than 0.38 +/-0.025 mm.
In the present invention, one chip 8, two chips 8 or a plurality of chips 8 may be mounted on the chip mounting portion 7 of each functional unit 31, specifically, as shown in fig. 6, two chips 8 may be disposed on each chip mounting portion 7, thereby forming two paths of bonding wires; one chip 8 may be provided on each chip mounting portion 7 as shown in fig. 7, thereby forming a one-way bonding wire.
As shown in fig. 4 and 5, the concave portion 6 is disposed on the side surface of the pin 311, and the concave portion 6 is located at the connection position of the pin 311 and the cutting path.
In the utility model, the side of the pin 311 is provided with the concave part 6, and the concave part 6 is located at the connecting part of the pin 311 and the cutting path, so that after the plastic package is carried out, when the product is cut along the vertical cutting path 4, the amount of cutting required can be reduced, and further the heat generated during cutting can be reduced, thereby reducing the phenomenon of layering between the pin 311 and the plastic package body due to overhigh heat during cutting; moreover, the concave parts 6 are arranged on the side surfaces of the pins 311, so that the distance between the connection parts of the pins 311 on two adjacent functional units 31 and the same vertical cutting channel 4 can be increased in the arrangement direction of the vertical cutting channels, and the risk of short circuit on the side surfaces of the pins 311 due to the short distance between two adjacent pins 311 when a product is cut along the vertical cutting channel 4 can be reduced; additionally, the utility model discloses side at pin 311 is provided with concave part 6, thereby the utility model discloses when carrying out the plastic envelope, can increase the plastic envelope material with the utility model discloses area of contact between, and then can increase the locking die power, thereby the utility model discloses can reduce after the plastic envelope finishes and appear phenomenons such as overlap at the edge of product. Therefore, through the utility model discloses a structure the utility model discloses after the plastic envelope end and when cutting the product, can reduce the phenomenon that appears the layering between pin 311 and the plastic envelope body, can reduce the risk that appears the short circuit in the side of pin 311 to and after the plastic envelope ends, can reduce the formation of overlap at the edge of product.
Further, as shown in fig. 5, the present invention is provided with a concave portion 6 on both sides of each pin 311. Thus, the utility model discloses after the plastic envelope, when cutting the product along vertical cutting way 4, can further reduce and appear layering phenomenon between pin 311 and the plastic envelope body to and can further reduce the risk that the short circuit appears in the side of pin 311, and after the plastic envelope is ended, can further reduce the formation of overlap at the edge of product.
In actual manufacturing, the way of providing the recesses 6 on both sides of the lead 311 can increase the gap between the sides of the lead 311 from 97um to 221um, and further reduce the risk of short circuit on the sides of the lead 311, compared with the way of not providing the recesses 6 on both sides of the lead 311.
Furthermore, the vertical connecting rib and/or the horizontal connecting rib of the utility model are of a semi-corrosion structure. The vertical connecting ribs and/or the horizontal connecting ribs are in a semi-corrosion structure, namely: after the vertical connecting ribs and/or the transverse connecting ribs adopt a semi-corrosion mode, the thickness of the vertical connecting ribs and/or the transverse connecting ribs is thinned.
The vertical connecting ribs and/or the transverse connecting ribs are arranged to be of a semi-corrosion structure, so that the bonding force between the plastic package material and the frame body 1 can be increased, and the product can be cut more conveniently, so that the heat generated by cutting the product can be reduced, the generated thermal stress can be reduced, the phenomenon of layering between the pins 311 and the plastic package body can be further reduced, the moisture sensitivity of the product can be enhanced, and the reliability of the product can be improved; moreover, when the product is cut, the residual plastic package material on the frame body 1 cannot enter the product through the semi-corrosion structure of the vertical connecting rib and/or the horizontal connecting rib, so that the risk of adverse effect on the subsequent process can be reduced; meanwhile, the semi-corrosion structure is also beneficial to exhausting gas during plastic packaging. In particular, the width of the vertical tie bars can be designed to be 0.1 ± 0.025mm, and/or the width of the transverse tie bars can be designed to be 0.1 ± 0.025 mm.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (7)
- The DFN1610-6 chip frame comprises a frame body (1), wherein a plurality of chip mounting units (3) are arranged on the frame body (1), each chip mounting unit (3) comprises three functional units (31), two pins (311) are arranged on each functional unit (31), and all the chip mounting units (3) are arranged on the frame body (1) in a rectangular array;the method is characterized in that: the frame is characterized by further comprising vertical cutting channels (4) which are vertically arranged along the frame body (1), wherein the vertical cutting channels (4) are respectively positioned on two sides of each row of chip mounting units (3);all the functional units (31) on each chip mounting unit (3) are arranged at intervals along the arrangement direction of the vertical cutting channels (4), two pins (311) on each functional unit (31) are arranged at intervals along the transverse direction of the frame body (1), and the two pins (311) are respectively connected with the vertical cutting channels (4) on the two sides of the chip mounting unit (3);and a concave part (6) is arranged on the side surface of the pin (311), and the concave part (6) is positioned at the connection part of the pin (311) and the vertical cutting channel (4).
- 2. The DFN1610-6 chip frame of claim 1, wherein: both sides of each pin (311) are provided with a recess (6).
- 3. The DFN1610-6 chip frame of claim 1 or 2, wherein: two sides of each row of chip mounting units (3) are provided with transverse cutting channels (5), transverse connecting ribs are arranged in the transverse cutting channels (5), and the transverse connecting ribs are fixedly connected with the two adjacent rows of chip mounting units (3) or the chip mounting units (3) are fixedly connected with the edge of the frame body (1);vertical connecting ribs are arranged in the vertical cutting channels (4), and are fixedly connected with pins (311) on the functional units (31) or the pins (311) are fixedly connected with the edge of the frame body (1).
- 4. The DFN1610-6 chip frame of claim 3, wherein: the vertical connecting ribs and/or the transverse connecting ribs are of a semi-corrosion structure.
- 5. The DFN1610-6 chip frame of claim 3, wherein: the width of the vertical connecting rib is 0.1 plus or minus 0.025mm,and/or the width of the transverse connecting rib is 0.1 +/-0.025 mm.
- 6. The DFN1610-6 chip frame of claim 1 or 2, wherein: in each chip mounting unit (3), each functional unit (31) is provided with a chip mounting part (7) for placing at least one chip (8), and the corresponding chip mounting parts (7) on the three functional units (31) are named as a first chip mounting part, a second chip mounting part and a third chip mounting part respectively;the size of the first chip mounting part along the transverse direction of the frame body (1) is not more than 0.8 +/-0.025 mm, and the size of the first chip mounting part along the vertical direction of the frame body (1) is not more than 0.5 +/-0.025 mm;the size of the second chip mounting part along the transverse direction of the frame body (1) is not more than 0.8 +/-0.025 mm, and the size of the second chip mounting part along the vertical direction of the frame body (1) is not more than 0.38 +/-0.025 mm;the third chip mounting part is not more than 0.8 +/-0.025 mm in size along the transverse direction of the frame body (1), and is not more than 0.38 +/-0.025 mm in size along the vertical direction of the frame body (1).
- 7. The DFN1610-6 chip frame of claim 1 or 2, wherein: the air exhaust groove (2) is arranged on the frame body (1) in the transverse direction, the air exhaust groove (2) is arranged along the longitudinal direction of the frame body (1), the frame body (1) is divided into an area A and an area B by the air exhaust groove (2), and a plurality of chip mounting units (3) are arranged on the area A and the area B.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022500171.4U CN212907725U (en) | 2020-11-02 | 2020-11-02 | DFN1610-6 chip frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022500171.4U CN212907725U (en) | 2020-11-02 | 2020-11-02 | DFN1610-6 chip frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212907725U true CN212907725U (en) | 2021-04-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022500171.4U Active CN212907725U (en) | 2020-11-02 | 2020-11-02 | DFN1610-6 chip frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212907725U (en) |
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2020
- 2020-11-02 CN CN202022500171.4U patent/CN212907725U/en active Active
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