CN212910484U

CN212910484U - Product with parts

Info

Publication number: CN212910484U
Application number: CN202022054594.8U
Authority: CN
Inventors: 藤村峻也
Original assignee: Riso Kagaku Corp
Current assignee: Riso Kagaku Corp
Priority date: 2019-09-30
Filing date: 2020-09-18
Publication date: 2021-04-06
Anticipated expiration: 2030-09-18
Also published as: JP2021057472A; JP7418174B2

Abstract

The utility model provides a product with parts for mounting electronic devices easily and reliably in a non-damaged manner. The product with parts (1) has a protrusion (3) as a holding mechanism, the protrusion (3) is provided on a part of the periphery of the mounting plane (R) provided on the base plate (2) of the product with parts, To hold electronic devices that are arranged on the mounting plane. The electronic device can be placed on the mounting plane while being held by the protrusion (3) by simply inserting the electronic device into the inside of the protrusion (3) surrounding the mounting plane (FIG. 3). An electronic device can be easily and reliably mounted on a product with parts without damage. In addition, the electronic device can also be detached.

Description

Product with parts

Technical Field

The present invention relates to a product with a component, on which an electronic device is mounted, and more particularly, to a product with a component, on which an electronic device is mounted easily and reliably in a non-destructive manner.

Background

Patent document 1 below discloses an invention relating to an IC tag inlay (IC tag inlay) for insert-in-mold molding which is not damaged during molding and an insert-in-mold molding method using the IC tag inlay. The IC tag inlay 1 for insert-in-mold molding has an opening 1h larger than the diameter of a mold gate at a position substantially in the center of the IC tag inlay base material 1b and not damaging the circumferential antenna coil 2 of the IC tag. By filling the IC tag-fitted article into the mold so that the opening of the IC tag-fitted article reaches a position facing the gate of the mold and injecting the resin, the IC tag-fitted article, which is a molded article in which the IC tag is embedded in the resin base material, can be manufactured without damaging the IC tag.

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 2002-355847

SUMMERY OF THE UTILITY MODEL

Problem to be solved by utility model

The IC tag inlay disclosed in patent document 1 can be used as a part of an article mounted on a device including a reading means for communicating with an IC tag. In such a case, in order to enable the IC tag and the reading member to perform normal communication according to the purpose of use of the apparatus and the article, it is necessary to accurately set the positional relationship between the IC tag and the reading member to a desired state. In order to accurately set the positional relationship between the IC tag and the reading member to a desired state, the positional relationship between the reading device and the IC tag when the article is mounted on the device, and the accuracy of the arrangement (the accuracy of the position and the orientation) of the IC tag in the IC tag fitted body are considered to be important. However, patent document 1 does not particularly describe these points, and there is a possibility that the arrangement accuracy may be problematic if the IC tag is tilted in the mold in the resin molding step of the IC tag-embedded object.

Further, in order to fix the IC tag to the IC tag-embedded object, it is necessary to inject resin into the inside of the mold in which the IC tag is arranged and to mold the IC tag. Further, since the IC tag is exposed to high temperature and high pressure in the molding process, there is a problem that a failure may occur. Further, when the IC tag is broken down for some reason and needs to be replaced, the IC tag is buried in the resin, and therefore, there is a problem that the IC tag cannot be taken out unless the surrounding resin is broken.

The present invention has been made in view of the above-described conventional technology and the problem thereof, and an object of the present invention is to provide a component-equipped product in which an electronic component is easily and reliably mounted without damage.

Means for solving the problems

The component-mounted product according to claim 1 is a component-mounted product provided with an electronic component, and is characterized by comprising a holding mechanism which is provided at a part of a periphery of a mounting plane provided in the component-mounted product and holds the electronic component arranged on the mounting plane.

The component-equipped product according to

claim

1 or 2 is characterized in that the holding mechanism has at least one pair of protruding portions that hold the side surfaces of the electronic component.

The component-equipped product according to claim 3 is characterized in that the holding mechanism includes a holding portion that is formed by joining a pair of the protruding portions and faces an upper surface of the electronic component.

The component-mounted product according to claim 2 or 4 is characterized in that the holding mechanism includes a locking portion provided on the pair of projections and contacting an upper surface of the electronic component arranged on the mounting plane.

The component-equipped product according to

claim

1 or 5 is characterized in that the holding mechanism includes a leaf spring that sandwiches and holds the electronic component arranged on the mounting plane.

Effect of the utility model

According to the component-mounted product described in claim 1, the electronic component can be arranged on the mounting surface in a state of being held by the holding mechanism by a simple operation of inserting the electronic component into the holding mechanism surrounding the mounting surface of the component-mounted product. Therefore, the electronic component can be easily and reliably mounted on the product with the component without damage, and the electronic component can be detached.

Drawings

Fig. 1 is a plan view of a product with parts of embodiment 1.

Fig. 2(a) is a side view of the component-equipped product of embodiment 1 as viewed from the direction of arrow a in fig. 1, and fig. 2(B) is a side view of the component-equipped product of embodiment 1 as viewed from the direction of arrow B in fig. 1.

Fig. 3(a) and 3(b) are process diagrams showing a mounting process of an electronic component in the component-equipped product according to embodiment 1.

Fig. 4 is a perspective view of a modification of the component-equipped product according to embodiment 1.

Fig. 5 is a plan view of the product with parts of embodiment 2.

Fig. 6(a) is a side view of the component-equipped product of embodiment 2 as viewed from the direction of arrow a in fig. 5, and fig. 6(B) is a side view of the component-equipped product of embodiment 2 as viewed from the direction of arrow B in fig. 5.

Fig. 7(a) and 7(b) are process diagrams showing a mounting process of an electronic component in the component-equipped product according to embodiment 2.

Fig. 8 is a perspective view showing a 1 st modification of the component-equipped product according to embodiment 2.

Fig. 9 is a perspective view showing a 2 nd modification of the component-equipped product of embodiment 2.

Fig. 10 is a plan view of the product with parts of embodiment 3.

Fig. 11(a) is a side view of the product with a component of embodiment 3 as viewed from the direction of arrow a in fig. 10, and fig. 11(B) is a side view of the product with a component of embodiment 3 as viewed from the direction of arrow B in fig. 10.

Fig. 12(a) and 12(b) are process diagrams showing a mounting process of an electronic component in the component-equipped product according to embodiment 3.

Fig. 13 is a perspective view showing a modification of the component-equipped product according to embodiment 3.

Fig. 14 is a top view of the product with parts of embodiment 4.

Fig. 15(a) is a side view of the component-equipped product of embodiment 4 as viewed from the direction of arrow a in fig. 14, and fig. 15(B) is a side view of the component-equipped product of embodiment 4 as viewed from the direction of arrow B in fig. 14.

Fig. 16(a), 16(b) and 16(c) are process diagrams showing a mounting step of an electronic component in the component-equipped product according to embodiment 4.

Fig. 17 is a plan view showing a modification of the component-equipped product according to embodiment 4.

Fig. 18(a) is a side view showing a modification of the component-equipped product according to embodiment 4 as viewed from the direction of arrow a in fig. 17, and fig. 18(B) is a side view showing a modification of the component-equipped product according to embodiment 4 as viewed from the direction of arrow B in fig. 17.

Fig. 19(a), 19(b), and 19(c) are process diagrams showing a mounting process of an electronic component in a modification of the component-equipped product according to embodiment 4.

Description of the reference numerals

1. 1a, 5a, 5b, 7a, 9a, product with parts; 3. 3a, 3b, 3c, 3d, 3e, 3f, a protrusion as a holding mechanism; 6. a cover serving as a holding portion of the holding mechanism; 12. a claw portion as a holding mechanism; p, electronic devices; r, mounting plane.

Detailed Description

Embodiments (1 st to 4 th embodiments) of the present invention will be described with reference to fig. 1 to 19(a), 19(b), and 19 (c).

These embodiments relate to a component, i.e., a component-equipped product, used for efficiently manufacturing a final product on which electronic devices are mounted. That is, in the case where it is difficult to directly mount an electronic component on a final product in terms of a process or in terms of handling of the electronic component, if a component-equipped product including the electronic component is manufactured in advance in a form that facilitates mounting on the final product in a different process, the component-equipped product is mounted on the final product, thereby facilitating mounting of the electronic component.

Here, the electronic device is used for communication with an external device or the like when the final product on which the electronic device is mounted on the device or the like, and the content of information such as communication, the purpose of communication, and the like are not limited, and the technical meaning of the electronic device is explained in the broadest sense. In the embodiments, although a rectangular plate-shaped electronic component having a predetermined thickness is shown, this is merely an example, and the external shape, size, and the like of the electronic component are not limited to a specific external shape and size.

It is to be noted that the end product on which the electronic device is mounted is used for various purposes and applications, and a specific example of the end product will be described later, but this is merely an example, and the structure, shape, size, and the like of the end product are not limited to a specific structure, shape, size, and the like. Further, the device on which the final product is mounted is used for various purposes and applications as in the final product, and the structure, shape, size, and the like are not limited to a specific structure, shape, size, and the like as well.

Embodiment 1 of the present invention will be described with reference to fig. 1 to 4.

Fig. 1 is a plan view of a product 1 with a component according to embodiment 1 as a component of a final product, fig. 2(a) is a side view as viewed from the direction of an arrow a in fig. 1, and fig. 2(B) is a side view as viewed from the direction of an arrow B in fig. 1. In these figures, the main body of the final product is not shown, and the component-equipped product 1 shown in fig. 1, 2(a), and 2(b) is mounted on the main body not shown to complete the final product.

In fig. 1, 2(a) and 2(b), a rectangular substrate 2 having a predetermined thickness is shown as a main body of the product 1 with a component, but the shape and size of the substrate 2 are examples of simplifying and illustrating the form thereof, and the shape and size are not intended to be limited to such shapes and sizes, and the material is not particularly limited. Further, as described below, the electronic component P is held on the substrate 2 by the holding mechanism, but when the component-mounted product 1 is mounted on the final product, the component-mounted product 1 may be mounted on the final product so that the electronic component P is visible from the outside of the final product, or the component-mounted product 1 may be mounted on the final product so that the electronic component P is not visible from the outside of the final product. The same applies to other embodiments.

A rectangular mounting plane R is specified as a range in which a substantially rectangular plate-shaped electronic component P should be provided on the upper surface of the substrate 2 of the component-equipped product 1 shown in fig. 1, 2(a) and 2 (b). Although the outer edge of the rectangular mounting plane R is not shown, the plane on the upper surface side of the substrate 2 on which the electronic component P is mounted after mounting corresponds to the outer edge of the rectangular mounting plane R. Two pairs, i.e., 4 projections 3 are provided as holding means for holding the electronic component P arranged on the mounting plane R so as to be in contact with the center of each side of the electronic component P in a part of the periphery of the mounting plane R. The 4 protrusions 3 have the same shape, and are in contact with the electronic component P with a longer side shorter than one side of the electronic component P, and the height of the protrusions 3 is slightly smaller than the height of the electronic component P.

Since the protrusion 3 is a member for holding the electronic component P, the material of the protrusion 3 is preferably resin or the like, compared to metal that may affect wireless communication as a function of the electronic component P. In addition, the intervals of the respective pairs of

projections

3, 3 are set to be the same as or slightly smaller than the size of the electronic device P interposed therebetween. When the dimensional relationship between the two is expressed by fitting terms, for example, "interference fit" can be employed.

Fig. 3(a) and 3(b) are process diagrams showing a mounting process of the electronic component P in the component-equipped product 1 according to embodiment 1. In order to hold the electronic component P between the two pairs of 4 projections 3, the electronic component P is lowered horizontally from directly above the mounting plane R as shown in fig. 3(a), and is pushed into the mounting plane R surrounded by the 4 projections 3 as shown in fig. 3 (b). Some pressing force is required when pushing in the electronic component P, but if the electronic component P is fitted in, the electronic component P is held between the protrusions 3 and is not easily detached. In addition, when it is necessary to remove the electronic component P from the component-mounted product 1, if a tool is inserted between the upper surface of the substrate 2 and the electronic component P at a portion of the outer edge portion of the mounting plane R where the protrusion 3 is not present and operated so as to widen the interval therebetween, the electronic component P can be lifted up from the substrate 2 and removed from the protrusion 3.

Fig. 4 is a perspective view of a modification of the component-equipped product 1a according to embodiment 1. In this modification, the height of the protrusion 3a is set to be the same as the height of the electronic component P, and the outer shape of the substrate 2a is circular. The other structure is substantially the same as that of the first embodiment. In this modification, since the central portion of each of the 4 side surfaces of the electronic component P is in contact with the inner surface of the projection 3a at a position ranging from the lower end edge to the upper end edge, the holding force of the projection 3a on the electronic component P is greater than that of the projection 3 of embodiment 1, and the electronic component P is reliably held and is less likely to fall off.

Embodiment 2 of the present invention will be described with reference to fig. 5 to 9.

Fig. 5 is a plan view of a component-equipped product 5 according to embodiment 2 as a component of a final product, fig. 6(a) is a side view as viewed from the direction of arrow a in fig. 5, and fig. 6(B) is a side view as viewed from the direction of arrow B in fig. 5. Fig. 5, 6(a) and 6(b) show the same substrate 2 as in embodiment 1 as the main body of the component-equipped product 5. Hereinafter, the description will be given mainly of the portions different from embodiment 1, and the description of embodiment 1 will be referred to for the other portions.

As shown in fig. 5, 6(a) and 6(b), two pairs, i.e., 4

projections

3 and 3b are provided in each central portion of the periphery of the mounting plane R of the substrate 2 of the component-mounted product 5 as holding means for holding the electronic component P arranged on the mounting plane R. Unlike embodiment 1, the pair of projections 3b on one side has a shorter lateral width and a larger height in contact with the side surface of the electronic component P than the pair of projections 3 on the other side. The upper surfaces of the pair of

projections

3b and 3b are connected to each other by a cover 6 serving as a holding portion facing the upper surface of the electronic component P. Thus, there is a gap between the upper surface of the electronic device P at the mounting plane R and the lower surface of the cover 6.

Fig. 7(a) and 7(b) are process diagrams showing a mounting step of the electronic component P in the component-equipped product 5 according to embodiment 2. In order to hold the electronic component P in the mounting plane R surrounded by two pairs, i.e., 4 projections 3, 3B and the cover 6, as shown in fig. 7(a), the electronic component P is inserted between the pair of projections 3B, 3B and the cover 6 on one side across the projection 3 from the side where the projection 3 on the other side having a lower height is located, i.e., in the direction of the arrow B in fig. 5, and as shown in fig. 7(B), the electronic component P is pushed into the mounting plane R surrounded by the 4 projections 3, 3B. According to embodiment 2, even if the electronic component P is separated from the 4

protrusions

3 and 3b, the cover 6 serves as a pressing member, and therefore, the electronic component P can be prevented from falling off the substrate 2.

Fig. 8 is a perspective view of a component-equipped product 5a as a 1 st modification of embodiment 2. In this modification 1, the substrate 2a is circular. In addition, the height of the protrusion 3c on the side where the cover 6 is fixed is set to be the same as the height of the electronic device P so that the cover 6 is in contact with the upper surface of the electronic device P in the mounting position. The other side of the lower protrusion 3d is lower than the lower protrusion 3 of embodiment 2, and has a wedge shape in which the upper surface is inclined so that the height thereof becomes lower toward the mounting plane R.

In order to mount the electronic component P on the component-mounted product 5a of the 1 st modification shown in fig. 8, the electronic component P is inserted between the pair of

projections

3c and 3c on one side and the cover 6 along the inclined upper surface of the projection 3d from one side of the pair of

projections

3d and 3d on the other side having a relatively low height, and the electronic component P is pushed into the mounting plane R surrounded by the 4

projections

3c and 3 d. According to this modification 1, since 4 side surfaces of the electronic component P are pressed by the 4

protrusions

3c and 3d and the upper surface of the electronic component P is pressed by the cover 6, the electronic component P is more reliably held than in the embodiment 2. In this way, although the electronic component P is in contact with the holding mechanism at 5 surfaces, the inclined upper surface of the other projection 3d serves as a guide surface of the electronic component P when the electronic component P is inserted, and therefore, the electronic component P can be smoothly mounted. In order to smoothly perform such mounting and to ensure the retention after mounting, it is preferable that the 4

projections

3c and 3d are made of a material that does not deform as much as possible, and the cover 6 is made of a material that can deform slightly elastically.

Fig. 9 is a perspective view of a component-equipped product 5b as a 2 nd modification of embodiment 2. The maximum thickness of the lower projection 3e of the 2 nd modification is smaller than the maximum thickness of the lower projection 3d of the 1 st modification, and is formed into a plate shape, and unlike the 1 st modification, the upper surface of the projection 3e is not inclined, and the whole is a thin flat plate-shaped member.

In order to mount the electronic component P on the component-mounted product 5b of the 2 nd modification shown in fig. 9, the electronic component P is inserted between the upper projections 3c and the cover 6 from the side of the lower pair of projections 3e along the upper surface of the projections 3e, and is pushed into the mounting plane R surrounded by the 4

projections

3c and 3 e. According to this modification 2, the contact area between the low protrusions 3e and the electronic component P is slightly larger than that in the modification 1, and therefore, the holding force equal to or greater than that in the modification 1 can be obtained. Further, since the lower projections 3e are simply plate-shaped, it is not necessary to form the upper surface in an inclined surface as in modification 1, and the cost is lower than that in modification 1.

Embodiment 3 of the present invention will be described with reference to fig. 10 to 13.

Fig. 10 is a plan view of a component-equipped product 7 according to embodiment 3 as a component of a final product, fig. 11(a) is a side view as viewed from the direction of arrow a in fig. 10, and fig. 11(B) is a side view as viewed from the direction of arrow B in fig. 10. Fig. 10, 11(a) and 11(b) show the same substrate 2 as in embodiment 1 as the main body of the component-equipped product 1. Hereinafter, the description will be given mainly of the portions different from embodiment 1, and the description of embodiment 1 will be referred to for the other portions.

As shown in fig. 10, 11(a) and 11(b), two pairs, i.e., 4

projections

3 and 3f are provided as holding means for holding the electronic component P arranged on the mounting plane R in each central portion of the periphery of the mounting plane R of the substrate 2 of the component-mounted product 7. The shape of the

projections

3 and 3f except for the height is substantially the same as that of embodiment 1, and as shown in fig. 11(a), the height of the projection 3f on the other side is larger than that of the projection 3 on the one side and substantially the same as that of the electronic component P. The arrangement interval between the pair of

projections

3f and 3f on the other side is longer than the width of the electronic component P, and as shown in fig. 11(a), a gap is formed between one projection 3f and the electronic component P. Further, on the upper surfaces of the pair of

projections

3f and 3f on the other side, locking portions 8 as holding mechanisms for holding the electronic component P are attached. The locking portion 8 is a plate spring-like member having elasticity and being thinner as it approaches the tip, and its tip protrudes inward of the protrusion 3f and contacts the upper surface of the electronic component P above the mounting plane R. The locking portion 8 may be made of the same material as the cover 6 of embodiment 2.

Fig. 12(a) and 12(b) are process diagrams showing a mounting step of the electronic component P in the component-equipped product 7 according to embodiment 3. In order to hold the electronic component P in the mounting plane R surrounded by two pairs of 4

projections

3 and 3f and the locking portions 8, the electronic component P is arranged on the pair of locking

portions

8 and 8 in accordance with the arrangement of the projections 3, and as shown in fig. 12(a), one side portion of the electronic component P corresponding to one locking portion 8 is pressed downward and pushed downward below the locking portion 8. Next, as shown in fig. 12(b), the other side portion of the electronic component P corresponding to the other locking portion 8 is pressed downward, and the other side portion is pushed below the locking portion 8. Thereby, the electronic component P moves below the two locking portions 8 and is held on the mounting plane R surrounded by the 4

protrusions

3 and 3 f. Of the 4

projections

3 and 3f, only two

projections

3 and 3 are in contact with the electronic component P, but the electronic component P is pressed by the engaging

portions

8 and 8 at two positions on the upper surface, and is thus in a state of being less likely to fall off. In addition, when it is necessary to take out the electronic component P held between the

projections

3 and 3f, the electronic component P can be taken out from the projections 3 and the substrate 2 by inserting a tool between the electronic component P and a portion of the upper surface of the substrate 2 where the

projections

3 and 3f are not present, and by enlarging the interval between the two, and performing an operation of lifting the tool so as to pass over the locking

portions

8 and 8 one by one.

Fig. 13 is a perspective view of a component-equipped product 7a as a modification of embodiment 3. In this modification, the height of the 4 protrusions 3 is set to be the same as the height of the electronic component P, and the outer shape of the substrate 2a is circular. The other structure is substantially the same as that of embodiment 3. In this modification, since the height of the projection 3a to which the locking portion 8 is not attached is the same as the height of the electronic component P, the holding force of the projection 3a to the electronic component P is larger than that of embodiment 3, and the electronic component P is reliably held and is less likely to fall off.

Embodiment 4 of the present invention will be described with reference to fig. 14 to 16(a), 16(b), and 16 (c).

Fig. 14 is a plan view of a component-equipped product 9 according to embodiment 4 as a component of a final product, fig. 15(a) is a side view as viewed from the direction of arrow a in fig. 14, and fig. 15(B) is a side view as viewed from the direction of arrow B in fig. 14. Fig. 14, 15(a) and 15(b) show the same substrate 2 as in embodiment 1 as the main body of the component-equipped product 9. Hereinafter, the holding mechanism of embodiment 4, which is different from the projection 3 and the like of embodiments 1 to 3, will be mainly described, and the description of embodiment 1 will be referred to for the other portions.

As shown in fig. 14, 15(a) and 15(b), the component-mounted product 9 according to embodiment 4 includes a plate spring 10 as a holding mechanism for holding the electronic component P by contacting portions of two adjacent sides and two other sides continuous to the two sides of the electronic component P arranged on the mounting plane R of the substrate 2. The plate spring 10 has a position corresponding to one corner of the electronic component P disposed on the mounting plane R as a fixing portion 13 fixed to the substrate 2, and the plate spring 10 is composed of two

plate members

11 and 11 connected to each other at the fixing portion 13. The two

plate members

11 and 11 are in a state of being acute-angled (about 30 degrees in the illustrated example) as shown in fig. 16 a in a state where the electronic component P is not sandwiched therebetween, and are in a state of being substantially perpendicular to each other when the electronic component P is sandwiched therebetween, and hold the electronic component P by an elastic force. Further, a claw portion 12 orthogonal to the plate member 11 is provided at the tip end of the plate member 11. When the electronic component P is held between the plate springs 10, the claw portions 12 are locked to the other two corner portions of the electronic component P, so that the electronic component P is reliably held.

Fig. 16(a), 16(b), and 16(c) are process diagrams showing a mounting step of the electronic component P in the component-equipped product 9 according to embodiment 4. In order to hold the electronic component P in the mounting plane R, as shown in fig. 16(a), the electronic component P is disposed on the upper surface of the substrate 2, and the corner of the electronic component P is brought into contact with and pushed into the two

claw portions

12 and 12 of the two

plate members

11 and 11 which are in an acute angle state. As shown in fig. 16(b), when the electronic component P is pushed in, the

claw portions

12, 12 of the plate spring 10 move along the side surface of the electronic component P, and the two

plate members

11, 11 of the plate spring 10 deform in a direction in which the angle at which they intersect increases. As shown in fig. 16(c), when the electronic component P enters the plate spring 10 beyond the claw portions 12, the

claw portions

12, 12 are locked at both corner portions of the electronic component P, and the electronic component P is reliably held. When it is necessary to remove the electronic component P held by the plate spring 10, the electronic component P can be removed from the plate spring 10 and the substrate 2 by moving the electronic component P in a direction orthogonal to the substrate 2 while applying a force to the plate spring 10 in a direction in which the

plate members

11 and 11 of the plate spring 10 are opened.

A modification of embodiment 4 of the present invention will be described with reference to fig. 17 to 19(a), 19(b), and 19 (c).

Fig. 17 is a plan view of a component-equipped product 9a as a modification of embodiment 4, fig. 18(a) is a side view as viewed from the direction of arrow a in fig. 17, and fig. 18(B) is a side view as viewed from the direction of arrow B in fig. 17. Hereinafter, a holding mechanism according to a modification of embodiment 4, which is different from embodiment 4, will be mainly described, and the description of embodiment 4 will be referred to for the other portions.

As shown in fig. 17, 18(a) and 18(b), a component-attached product 9a as a modification of embodiment 4 has the same plate spring 10 as embodiment 4, but a rectangular plate-shaped cover 16 parallel to the base plate 2 is attached to the tip end portion of the plate member 11 and the upper edge of the claw portion 12 of the plate spring 10. As shown in fig. 19 a to 19 c, the operation of mounting the electronic component P on the leaf spring 10 according to the modification of embodiment 4 is the same as that of embodiment 4 (see fig. 16 a to 16 c). However, in the modification of embodiment 4, as shown in fig. 17, 18(a) and 18(b), the electronic component P arranged on the mounting plane R is not only held by the elastic force of the plate spring 10 acting in a plane parallel to the substrate 2 and the locking of the claw portion 12, but also pressed by the cover 16 provided at the tip end of the plate spring 10 and does not move in the direction orthogonal to the substrate 2. Thus, in the modification, the electronic component P is held more reliably than in embodiment 4, and the risk of the electronic component P coming off the plate spring 10 is smaller than in embodiment 4. In addition, when it is necessary to detach the electronic component P from the plate spring 10, the electronic component P may be moved on the substrate 2 by opening the plate spring 10 in the order of fig. 19(c), 19(b), and 19(a), but this operation causes the plate spring 10 to be deflected to a greater extent than in the case of embodiment 4, and therefore a larger force is necessary.

According to the embodiments and the modifications described above, the electronic component P can be stably arranged on the mounting plane R in a state of being held by the holding mechanism only by a simple operation of inserting the electronic component P into the holding mechanism (the projection 3, the projection 3a, the projection 3b, the projection 3c, the projection 3d, the projection 3e, the projection 3f, the cover 16, the plate spring 10, the claw portion 12 of the plate spring 10, and the cover 6 of the plate spring 10) surrounding a part of the outer periphery of the mounting plane R of the component-attached

product

1, 1a, 5a, 5b, 7a, 9 a. Therefore, the electronic component P can be mounted easily and reliably without damaging the component-attached product.

Further, a specific example of the final product is a roll of plate paper mounted on a plate making apparatus. The stencil paper roll is a product formed by packing a continuous strip-shaped porous stencil paper roll in a paper tube. In the case where this plate roll or a cover to be inserted and fixed to an end of a paper tube of the plate roll is used as a final product, a component-bearing product 1 containing an electronic device P is attached to the cover. When the plate roll is mounted on or used in a plate making apparatus, communication with the plate making or stencil sheet is performed between the electronic device P and the plate making apparatus as necessary.

Another specific example is an ink cartridge mounted on an inkjet printing apparatus. When the component-equipped product 1 with the electronic component P mounted thereon is mounted on an ink cartridge as a final product, communication with printing, ink, or the like is performed between the electronic component P and the ink jet printing apparatus as needed when the ink cartridge is mounted on or used in the ink jet printing apparatus.

Further, another specific example is an ink bottle mounted on a stencil printing apparatus. When the component-equipped product 1 with the electronic component P mounted thereon is mounted on an ink bottle as a final product, communication with printing, ink, or the like is performed between the electronic component P and the stencil printing apparatus as necessary when the ink bottle is mounted on or used in the stencil printing apparatus.

Structure and Effect of component-attached product relating to each of the embodiments

The component-mounted product according to claim 1 is a component-mounted product provided with an electronic component P, and is characterized by comprising a holding mechanism provided at a part of a periphery of a mounting plane R provided in the component-mounted product, for holding the electronic component P arranged on the mounting plane R.

According to the component-mounted product of claim 1, the electronic component P can be arranged on the mounting plane R in a state of being held by the holding mechanism by a simple operation of inserting the electronic component P into the holding mechanism surrounding the mounting plane R of the component-mounted product. Therefore, the electronic component P can be easily and reliably mounted to the component-equipped product without damage, and the electronic component P can be removed.

The component-equipped product according to claim 2 is characterized in that the holding mechanism includes at least a pair of

protrusions

3, 3a, 3b, 3c, 3d, 3e, and 3f for holding the side surface of the electronic component P, based on the component-equipped product according to claim 1.

According to the component-equipped product of claim 2, the electronic component P can be easily and reliably mounted to the component-equipped product without damage by a simple operation of merely fitting the electronic component P between the protruding portions.

The component-equipped product according to claim 3 is characterized in that the holding mechanism has a holding portion (cover 6) that couples a pair of the projections and faces the upper surface of the electronic component P, based on the component-equipped product according to claim 2.

According to the component-equipped product of claim 3, the electronic component P can be easily and reliably mounted to the component-equipped product without damage by a simple operation of inserting the electronic component P between the protruding portion and the holding portion and fitting the electronic component P between the protruding portions. In addition, the electronic component P is pressed not only by the protrusion portion but also by the holding portion on the upper surface side, and therefore holding becomes more reliable.

The component-mounted product according to claim 2 or the component-mounted product according to claim 4 is characterized in that the holding mechanism includes a locking portion (locking portion 8) provided in the pair of protruding portions and contacting an upper surface of the electronic component P disposed on the mounting plane R.

According to the component-equipped product of claim 4, the electronic component P can be easily and reliably mounted to the component-equipped product without damage by a simple operation of pushing the electronic component P downward from above the engaging portion and fitting the electronic component P between the protruding portions. In addition, the electronic component P is pressed not only by the protrusion portion but also by the engagement portion on the upper surface side, and therefore the holding becomes more reliable.

The invention according to claim 1 is characterized in that the holding mechanism includes a plate spring 10, and the plate spring 10 sandwiches and holds the electronic component P arranged on the mounting plane R.

According to the component-equipped product of claim 5, the electronic component P can be easily and reliably mounted to the component-equipped product without damage by a simple operation of merely sandwiching the electronic component P between the plate springs. Since the electronic component P is sandwiched with the elastic force of the plate spring acting, it is kept reliable.

Claims

1. A component-equipped product provided with an electronic device, characterized in that,

the component-mounted product includes a holding mechanism provided at a part of a periphery of a mounting plane provided on the component-mounted product, for holding the electronic component arranged on the mounting plane.

2. The item with parts as claimed in claim 1,

the holding mechanism has at least one pair of protruding portions that hold the side surfaces of the electronic component.

3. The item with parts as claimed in claim 2,

the holding mechanism has a holding portion that couples the pair of protruding portions and faces an upper surface of the electronic component.

4. The item with parts as claimed in claim 2,

the holding mechanism includes a locking portion provided on the pair of protruding portions and contacting an upper surface of the electronic component disposed on the mounting plane.

5. The item with parts as claimed in claim 1,

the holding mechanism has a leaf spring that sandwiches and holds the electronic component arranged on the mounting plane.