CN213564437U - Laser welding device - Google Patents
Laser welding device Download PDFInfo
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- CN213564437U CN213564437U CN202022142197.6U CN202022142197U CN213564437U CN 213564437 U CN213564437 U CN 213564437U CN 202022142197 U CN202022142197 U CN 202022142197U CN 213564437 U CN213564437 U CN 213564437U
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- laser
- frame
- semiconductor laser
- pulse
- laser welding
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- 238000003466 welding Methods 0.000 title claims abstract description 31
- 239000004065 semiconductor Substances 0.000 claims abstract description 43
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000002131 composite material Substances 0.000 claims abstract description 15
- 238000003754 machining Methods 0.000 claims abstract description 8
- 239000004033 plastic Substances 0.000 abstract description 30
- 229920003023 plastic Polymers 0.000 abstract description 30
- 239000002184 metal Substances 0.000 abstract description 10
- 238000004021 metal welding Methods 0.000 abstract description 7
- 238000004023 plastic welding Methods 0.000 abstract description 7
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 239000003292 glue Substances 0.000 abstract description 3
- 230000007547 defect Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003562 lightweight material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laser Beam Processing (AREA)
Abstract
An embodiment of the utility model provides a laser welding device, include: the laser welding device comprises a pulse laser assembly, a semiconductor laser assembly, a focusing lens and a machining platform, wherein the semiconductor laser emitted by the semiconductor laser assembly and the pulse laser emitted by the pulse laser assembly form coaxial composite laser, and the focusing lens is arranged below the composite laser and used for focusing the composite laser on a material to be welded on the machining platform. The utility model discloses fix metal/plastics on processing platform, through the combination of pulse laser and semiconductor laser, realize the laser heat conduction/the laser transmission welding of metal and plastics or plastics and plastics, the welding of metal and plastics basement punches, and welding strength can promote the quintupling, and pollutes for a short time, need not use other materials such as glue.
Description
Technical Field
The utility model relates to the field of welding technique, especially, relate to a laser welding device.
Background
There is an increasing demand for lightweight materials in the automotive field, in which plastic, one of four major non-metallic substances, is combined with metal to obtain a dissimilar combined material of plastic and metal, combining the excellent properties of metal and plastic. Or the plastic and the plastic are combined together, so that a plastic product with better performance can be obtained. However, the conventional method of bonding or mechanically bonding the plastic and the metal (or plastic) has the defects of low bonding strength, high pollution, excessive additional parts and the like.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a laser welding device for solve the bonding strength who adopts bonding or mechanical bonding plastics and plastics or plastics and metal to lead to among the prior art low with pollute big defect.
An embodiment of the utility model provides a laser welding device, include: the laser welding device comprises a pulse laser assembly, a semiconductor laser assembly, a focusing lens and a machining platform, wherein the semiconductor laser emitted by the semiconductor laser assembly and the pulse laser emitted by the pulse laser assembly form coaxial composite laser, and the focusing lens is arranged below the composite laser and used for focusing the composite laser on a material to be welded on the machining platform.
The pulse laser assembly comprises a pulse laser and a mirror vibrating mechanism, and the ejection end of the pulse laser faces the mirror vibrating mechanism.
The semiconductor laser assembly comprises a semiconductor laser and a reflecting mirror, and an emitting end of the semiconductor laser faces the reflecting mirror.
The semiconductor laser component further comprises a collimating mirror, and the collimating mirror is arranged between the emitting end of the semiconductor laser and the reflecting mirror.
The pulse laser assembly further comprises a beam expander, and the beam expander is arranged between the ejection end of the pulse laser and the mirror vibrating mechanism.
The processing platform comprises a first frame and a second frame which are arranged in parallel and opposite to each other and used for pressing and fixing materials to be welded.
The first frame and the second frame are provided with through holes, and the tensioning rope penetrates through the through holes to enable the first frame and the second frame to be pressed tightly.
The frame comprises a first frame and a second frame, and is characterized by further comprising a rotating handle, wherein the rotating handle is arranged on the edge of the first frame or the second frame and used for driving the first frame or the second frame to rotate.
The lifting device further comprises a lifter and a pressure sensor, wherein the pressure sensor is arranged between the first frame and the second frame, and the lifter is arranged below the first frame and the second frame.
The embodiment of the utility model provides a pair of laser welding device fixes metal/plastics on processing platform, through the combination of pulse laser and semiconductor laser, realizes the laser heat conduction/the laser transmission welding of metal and plastics or plastics and plastics, borrows by the characteristic of pulse laser and semiconductor laser, realizes punching the welding of metal and plastic substrate, and welding strength can promote five times, and pollutes for a short time, need not use other materials such as glue.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a laser welding apparatus according to an embodiment of the present invention.
Reference numerals:
1: a beam expander; 2: an optical fiber; 3: pulse laser; 4: a first galvanometer; 5: a focusing lens; 6: a pulsed laser; 7: a semiconductor laser; 8: compounding laser; 9: a pressure sensor; 10: a computer; 11: an elevator; 12: a first frame; 13: tensioning the rope; 14: rotating the handle; 15: a mirror plate; 16: a semiconductor laser; 17: a collimating mirror; 18: a second galvanometer; 19: a second frame.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; the connection can be mechanical connection or point connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
A laser welding apparatus according to an embodiment of the present invention is described below with reference to fig. 1, including: the laser welding device comprises a pulse laser assembly, a semiconductor laser assembly, a focusing lens and a machining platform, wherein a semiconductor laser 16 emitted by the semiconductor laser assembly and a pulse laser 3 emitted by the pulse laser assembly form coaxial composite laser 8, and the focusing lens 5 is arranged below the composite laser 8 and used for focusing the composite laser 8 on a material to be welded on the machining platform.
Specifically, the pulse laser assembly comprises a pulse laser 6 and a galvanometer mechanism, the emitting end of the pulse laser 6 faces the galvanometer mechanism, the semiconductor laser assembly comprises a semiconductor laser 7 and a reflecting mirror 15, and the emitting end of the semiconductor laser 7 faces the reflecting mirror 15, so that the semiconductor laser 16 emitted by the semiconductor laser 7 passes through the reflecting mirror 15 and forms coaxial composite laser 8 with the pulse laser 3 emitted by the pulse laser 6 through the galvanometer mechanism.
Further, the pulse laser 6 and the semiconductor laser 7 are both connected to a transmitter (i.e. the emitting end of the laser) through the optical fiber 2, the pulse laser 3 emitted from the pulse laser 6 forms a coaxial composite laser 8 through the first vibrating mirror 4 and the second vibrating mirror 18 (i.e. the vibrating mirror mechanism) and the semiconductor laser 16 emitted from the semiconductor laser 7 through the two reflecting mirrors 15, and the composite laser 8 is focused and irradiated on the material to be welded of the processing platform through the focusing mirror 5. If the material is the welding of metal and plastic, the metal is firstly punched by the pulse laser 3, and then the metal and the plastic are welded by the semiconductor laser 16. If the material is plastic and the plastic is welded, the pulsed laser 6 can be switched off and the semiconductor laser 16 can be used directly for processing. The mirror plate 15 can control its reflection angle by a motor. The focusing lens 5 is a full-wave band focusing lens.
The embodiment of the utility model provides a pair of laser welding device fixes metal/plastics on processing platform, through the combination of pulse laser 3 and semiconductor laser 16, realizes the laser heat conduction/laser transmission welding of metal and plastics or plastics and plastics, borrows by the characteristic of pulse laser 3 and semiconductor laser 16, realizes punching the welding of metal and plastic substrate, and welding strength can promote five times, and pollutes for a short time, need not use other materials such as glue.
In one embodiment, the semiconductor laser module further includes a collimator 17, and the collimator 17 is disposed between the output end of the semiconductor laser 7 and the mirror 15. The pulse laser component also comprises a beam expanding lens 1, and the beam expanding lens 1 is arranged between the ejection end of the pulse laser 6 and the galvanometer mechanism. In this embodiment, the semiconductor laser 16 is changed from a divergent optical path to a parallel optical path by the collimator lens 17, and the divergent angle of the pulse laser 3 and the diameter of the laser beam are changed by the beam expander 1, so that the emitted semiconductor laser 16 can be irradiated onto the reflective mirror 15 in parallel, and the emitted pulse laser 3 can be irradiated onto the first galvanometer 4 and the second galvanometer 18.
In one embodiment, the processing platform comprises a first frame 12 and a second frame 19 arranged in parallel and opposite to each other for holding the material to be welded in compression. In use, a material to be welded is placed between the first frame 12 and the second frame 19, and the first frame 12 and the second frame 19 are pressed so that the material to be welded is fixed between the first frame 12 and the second frame 19.
In one embodiment, the laser welding apparatus further includes a tension rope 13, through holes are formed in the first frame 12 and the second frame 19, and the tension rope 13 passes through the through holes to press the first frame 12 and the second frame 19. Specifically, the tension rope 13 is arranged along the contour of the first frame 12 and the second frame 19 and passes through the through holes of the first frame 12 and the second frame 19, and after the material to be welded is placed between the first frame 12 and the second frame 19, the first frame 12 and the second frame 19 are pressed tightly by tightening the tension rope 13, so that the material to be welded is fixed and is prevented from falling off between the first frame 12 and the second frame 19.
In one embodiment, the laser welding device further comprises a rotating handle 14, and the rotating handle 14 is mounted on an edge of the first frame 12 or the second frame 19 and used for driving the first frame 12 or the second frame 19 to rotate so as to process the reverse side of the material to be welded.
In one embodiment, the laser welding apparatus further includes a lifter 11 and a pressure sensor 9, the pressure sensor 9 being disposed between the first frame 12 and the second frame 19, the lifter 11 being disposed below the first frame 12 and the second frame 19. When the lifter 11 ascends, the extrusion force between the first frame 12 and the second frame 19 can be increased, the extrusion force between the first frame and the second frame is monitored by the pressure sensor 9, the ascending position of the lifter 11 is controlled by the computer 10 or other control systems according to the pressure data collected by the pressure sensor 9, and the lifter 11 and the pressure sensor 9 are matched for use to accurately control the pressure, so that the welding repeatability is improved.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (9)
1. A laser welding apparatus, comprising: the laser welding device comprises a pulse laser assembly, a semiconductor laser assembly, a focusing lens and a machining platform, wherein the semiconductor laser emitted by the semiconductor laser assembly and the pulse laser emitted by the pulse laser assembly form coaxial composite laser, and the focusing lens is arranged below the composite laser and used for focusing the composite laser on a material to be welded on the machining platform.
2. The laser welding apparatus according to claim 1, wherein the pulse laser assembly includes a pulse laser and a galvanometer mechanism, and an output end of the pulse laser faces the galvanometer mechanism.
3. The laser welding apparatus according to claim 1, wherein the semiconductor laser module includes a semiconductor laser and a mirror plate, an emission end of the semiconductor laser being directed toward the mirror plate.
4. The laser welding apparatus according to claim 3, wherein the semiconductor laser module further comprises a collimator lens disposed between the exit end of the semiconductor laser and the mirror plate.
5. The laser welding apparatus according to claim 2, wherein the pulsed laser assembly further comprises a beam expander disposed between the output end of the pulsed laser and the galvanometer mechanism.
6. The laser welding apparatus according to claim 1, wherein the processing platform includes a first frame and a second frame arranged in parallel and opposite to each other for press-fixing the material to be welded.
7. The laser welding apparatus according to claim 6, further comprising a tension rope, wherein through holes are provided in the first frame and the second frame, and the tension rope passes through the through holes to press the first frame and the second frame.
8. The laser welding device according to claim 6, further comprising a rotating handle, wherein the rotating handle is mounted on an edge of the first frame or the second frame and is used for driving the first frame or the second frame to rotate.
9. The laser welding apparatus according to claim 6, further comprising a lifter and a pressure sensor, the pressure sensor being disposed between the first frame and the second frame, the lifter being disposed below the first frame and the second frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022142197.6U CN213564437U (en) | 2020-09-25 | 2020-09-25 | Laser welding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022142197.6U CN213564437U (en) | 2020-09-25 | 2020-09-25 | Laser welding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213564437U true CN213564437U (en) | 2021-06-29 |
Family
ID=76578409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022142197.6U Active CN213564437U (en) | 2020-09-25 | 2020-09-25 | Laser welding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213564437U (en) |
-
2020
- 2020-09-25 CN CN202022142197.6U patent/CN213564437U/en active Active
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