CN213602170U - a cooling device - Google Patents
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- CN213602170U CN213602170U CN202022375899.9U CN202022375899U CN213602170U CN 213602170 U CN213602170 U CN 213602170U CN 202022375899 U CN202022375899 U CN 202022375899U CN 213602170 U CN213602170 U CN 213602170U
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Abstract
本实用新型公开了一种冷却装置，包括热泵装置和沸腾器；所述热泵装置，用于将热负载的热量传输至所述沸腾器；所述沸腾器，用于接收所述热泵装置传输的热量，并通过工作介质将所述冷却装置的温度维持在设定范围；所述工作介质的沸点高于环境温度且低于所述热泵装置的工作排热温度。本实用新型通过热泵装置将热负载的热量传输至沸腾器，再利用沸腾器接收所述热泵装置传输的热量，并通过工作介质将热泵装置的排热温度维持在设定范围，改善了现有技术的大功率热管理系统体积占用，适合于瞬时/短时热源的工作需求。
The utility model discloses a cooling device, comprising a heat pump device and a boiler; the heat pump device is used for transferring the heat of a heat load to the boiler; the boiler is used for receiving the heat transmitted by the heat pump device. heat, and the temperature of the cooling device is maintained within a set range by the working medium; the boiling point of the working medium is higher than the ambient temperature and lower than the working heat rejection temperature of the heat pump device. The utility model transmits the heat of the heat load to the boiler through the heat pump device, and then utilizes the boiler to receive the heat transmitted by the heat pump device, and maintains the exhaust heat temperature of the heat pump device within the set range through the working medium, thereby improving the existing The high-power thermal management system of the technology occupies the volume and is suitable for the working requirements of instantaneous/short-term heat sources.
Description
Technical Field
The utility model relates to a laser instrument technical field especially relates to a cooling device.
Background
In the laser industry and other industries, various problems caused by heat are extremely prominent, the development of a high-power laser technology is always restricted, the concepts such as heat dissipation, thermal design and the like researched in the field of general electronic devices are far exceeded, and a thermal management technology becomes one of the most key core problems needed to be broken through for realizing a high-power laser.
One of the important goals of laser thermal management technology is to minimize the volume, weight, and power consumption of the thermal management system, making the laser as a whole most compact and efficient. Previously, when the power level of the laser is below kilowatt, the requirement in this respect is not very urgent, and with the rapid development of high power lasers towards higher power, the thermal management technology is faced with the problem of the greatest difficulty and needs to be solved urgently.
The heat generation in the high-power laser has the remarkable characteristic of large total heat flow, and the high-power laser has high output power and is inevitably accompanied with a large amount of useless heat generation. The electro-optic efficiency of current high performance semiconductor lasers can reach 50% or more, while the light-to-light conversion efficiency of solid state lasers can reach about 25%, with the remainder of the energy being substantially converted into heat energy. In addition, the processes of converting the initial electric power into the high-power constant-current direct current required by the laser, controlling and shaping the light beam in the laser and the like also cause partial energy loss and conversion into heat energy, so that the laser with certain energy obtained by adopting the solid laser necessarily generates at least about 8-10 times of heat energy, and in order to remove the heat energy from the laser system, the electric energy which is several times of the energy of the output laser is generally required to be input for self consumption of a cooling system.
From a temporal perspective, the heat generation and transfer modes of general electronic devices are continuously stable or do not vary significantly, and cooling systems are currently designed based on this premise, but for high power laser or other similar systems, this concept must be changed, and a high power laser system often generates much more heat during operation than a conventional electronic device, and the heat source is almost zero during non-operation, which presents a great challenge to the design and manufacture of cooling systems, and conventional cooling systems are suitable for conditions where the heat source varies slowly and are oblivious to frequent rapid changes in cooling amount, which is likely to cause failure. If the refrigeration system designed for the high-power laser system is designed in the same way as the conventional way, the maximum refrigeration capacity must be not less than the peak heat load of the laser system, so that the volume and the weight of the refrigeration system are larger, and when the high-power laser system works intermittently, the working capacity of the refrigeration system can only be idle and cannot stop working, and the refrigeration system also needs to consume a great deal of energy to prepare for the next laser system work.
In systems such as high-power laser, the size and weight of the corresponding high-power thermal management system are high, huge thermal management equipment is necessary to be a limitation on the development of the high-power laser, for engineering application, various measures are necessary to transfer the maximum amount of useless heat from a heat source (gain medium, pumping source and the like) to the ambient environment at the minimum cost (energy consumption, size, weight and the like), and the temperature control precision of a cooled part is ensured, but no better solution is available at present.
SUMMERY OF THE UTILITY MODEL
An embodiment of the utility model provides a cooling device for improve the high-power heat management system volume of prior art and occupy, be suitable for the work demand of instantaneous/short-time heat source.
An embodiment of the utility model provides a cooling device, include: a heat pump device and a boiler;
the heat pump device is used for transmitting heat of a heat load to the boiler in an operation period;
the boiler is used for receiving the heat transmitted by the heat pump device and maintaining the heat discharge temperature of the heat pump device in a set range through a working medium;
the working medium has a boiling point higher than ambient temperature and lower than a working heat rejection temperature of the heat pump device.
Optionally, the cooling device further includes: a heat absorption end and a heat extraction end;
the heat pump device is connected between the heat absorption end and the heat exhaust end;
the heat pump device receives heat of the heat load through the heat absorption end and transmits the heat to the boiler through the heat exhaust end.
Optionally, the cooling device further includes: a media container in communication with the boiler for delivering the working media to the boiler during operation.
Optionally, the working medium is a pure substance or a mixture, and the working medium is in a liquid state at a preset storage temperature and/or a preset storage pressure.
Optionally, the heat pump device includes a semiconductor refrigeration device, a vapor compression refrigeration device, an absorption refrigeration device, or an air compression refrigeration device.
Optionally, when the boiler operates, the working medium is heated and vaporized inside the boiler under normal pressure or reduced pressure, and the vaporized working medium can be directly discharged into the surrounding environment.
Optionally, a heat absorption space is arranged inside the boiler, and is used for providing a working environment for the working medium when working, and the heat absorption space is provided with a micro-channel array, a micro-jet impact array or metal foam.
The embodiment of the utility model provides a through heat pump device with heat load's heat transmission to boiling device, recycle the boiling device and receive the heat of heat pump device transmission to maintain cooling device's temperature at the settlement scope through working medium, improved prior art's high-power thermal management system volume and occupy, be suitable for the work demand of instantaneous/short-term heat source.
The above description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the present invention is given.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
FIG. 1 is a prior art schematic;
fig. 2 is a schematic diagram of a first embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
Example one
In the conventional scheme, a vapor compression refrigeration device is taken as an example, and as shown in fig. 1, heat generated by a heat source is transferred to a cooler, and the cooler transfers the heat to an evaporator and a condenser in sequence, and finally transfers the heat to the atmosphere. In the device-level heat transfer portion, heat generated in the heat source is directly transferred to the cooler through the thermal connection layer, and in the system-level heat transfer portion, three fluids, such as secondary refrigerant, refrigerant and air in the atmospheric environment, are generally adopted as heat transfer media, so that the heat is gradually removed from the cooler and sent to the environment. However, in systems such as high-power laser, the size and weight of the corresponding high-power thermal management system are high, and huge thermal management equipment is necessary to be beneficial to restricting the development of high-power laser.
Based on this, the first embodiment of the present invention provides a cooling device, as shown in fig. 2, including: a heat pump device and a boiler;
the heat pump device is used for transmitting heat of a heat load to the boiler in an operation period;
the boiler is used for receiving the heat transmitted by the heat pump device and maintaining the heat discharge temperature of the heat pump device in a set range through a working medium;
the working medium has a boiling point higher than ambient temperature and lower than a working heat rejection temperature of the heat pump device.
The heat pump device of the utility model can be a semiconductor refrigeration device, a vapor compression refrigeration device, an absorption refrigeration device or an air compression refrigeration device, etc. The heat pump device mainly has the advantages that the heat of a heat load is transmitted to the boiler by using electric energy, the boiler receives the heat transmitted by the heat pump device, the heat discharge temperature of the heat pump device is maintained in a set range through working media, the occupied volume of a high-power heat management system in the prior art is improved, and the heat pump device is suitable for the working requirement of an instant/short-time heat source.
Optionally, the cooling device further includes: a heat absorption end and a heat extraction end;
the heat pump device is connected between the heat absorption end and the heat exhaust end;
the heat pump device receives heat of the heat load through the heat absorption end and transmits the heat to the boiler through the heat exhaust end.
Specifically, as shown in fig. 2, the cooling device in this embodiment further includes: the heat pump device receives heat of the heat load through the heat absorption end and transmits the heat to the boiler through the heat exhaust end. The heat absorbed by the heat absorption end is transmitted to the heat discharge end by using energy such as electric energy, and the temperature of the heat discharge end is maintained in a set range by the boiler through the working medium, so that the boiler can bear a higher working temperature level. Compared with the prior art, the utility model discloses can utilize relatively less volume, weight and power consumption to come the equilibrium instantaneous/short-time heat source that is much bigger relatively, be applicable to the laser instrument and other super high power electronic equipment of super high power intermittent type short-time work to solve the affiliated cooling device volume of super high power laser instrument and other high-power electronic equipment, weight, electric energy consumption scheduling problem excessively.
Optionally, the cooling device further includes: a media container in communication with the boiler for delivering the working media to the boiler during operation.
Specifically, as shown in fig. 2, the cooling device further includes: the medium container is communicated with the boiler, the medium container is arranged, the working medium is stored in the working medium container at normal temperature, and after a certain working period, the working medium is consumed completely, and the supplementary working medium can be continuously added to meet the working requirement of the next working period.
Optionally, the working medium is a pure substance or a mixture, and the working medium is in a liquid state at a preset storage temperature and/or a preset storage pressure.
In particular, for the storage of the working medium in the medium container, the working medium can be controlled to be in a liquid state in a storage state by using temperature and/or pressure, so that the working medium flows to the boiler when the working is convenient.
Optionally, when the boiler operates, the working medium is heated and vaporized inside the boiler under normal pressure or reduced pressure, and the vaporized working medium can be directly discharged into the surrounding environment.
In particular, in the present embodiment, corresponding to the storage of the working medium in the medium container, the way of controlling the vaporization of the working medium during the operation of the boiler may be, for example, controlling the pressure in the medium container to decrease during the operation, thereby vaporizing the working medium. Or under the condition of normal pressure, the temperature of the working medium is increased by the boiler so that the working medium is vaporized. The heat generated by the heat discharging end is taken away along with the vaporization of the working medium, the stable working temperature of the heat discharging end is maintained, the cooling purpose is realized, and meanwhile, the vaporized working medium can be directly discharged into the surrounding environment without recovery, so that the space occupation of the cooling device is further reduced.
Optionally, a heat absorption space is arranged inside the boiler, and is used for providing a working environment for the working medium when working, and the heat absorption space is provided with a micro-channel array, a micro-jet impact array or metal foam.
Specifically, the heat absorption space in which the working medium is vaporized in the boiler is used for providing a working environment for the working medium when the boiler works, and the specific heat absorption space can be realized by arranging a micro-channel array, a micro-jet impact array or a metal foam and other reinforced heat transfer structures.
To sum up, the utility model discloses a scheme of taking is for utilizing heat pump device to carry the heat of heat absorption end to heat extraction end controllably in the during operation time, promotes to higher suitable operating temperature, adopts the liquid working medium of boiling vaporization again, utilizes the huge latent heat of gas-liquid phase transition, and the vaporization cools off heat extraction end of heat pump device in the boiling ware, and then guarantees the operating temperature of required refrigerated heat source, and does not retrieve after liquid working medium uses.
The cooling device of the utility model is different from the conventional heat management device, and does not need the heat discharging end air cooling condenser and the fan with huge volume and weight, thereby greatly reducing the volume and weight of the equipment; can utilize less volume, weight to come the equilibrium instantaneous/short-time heat source that the ratio is far greater relatively, be applicable to super high power laser instrument and other high-power electronic equipment, super high power heat source peak value is higher, and the duty cycle is big more, can embody the utility model's advantage more.
The heat absorption in the liquid-gas phase change process is relatively easy and quick to complete, the response to the temperature is quick, and the method is suitable for ultrahigh-power lasers and other high-power electronic equipment to instantaneously generate an ultrahigh-power heat source with instantaneous reduction.
Example two
The second embodiment of the present invention provides an embodiment of a cooling device, which comprises a vapor compression refrigeration device, a heat absorption end, a heat discharge end, a boiling device, a working medium, and a medium container.
The heat pump device is composed of a vapor compression refrigeration device, an evaporator of a conventional vapor compression refrigeration device is arranged at a heat absorption end, a boiling device is connected with a heat discharge end, a liquid working medium selected in the embodiment is ethanol, vapor compression refrigeration circulation is driven by using external electric energy, short-time ultra-large heat generated by a high-power heat source is conveyed to the heat discharge end, the temperature of the heat absorption end is controlled at a required device working temperature, for example, 20 ℃, the temperature of the heat discharge end is controlled above the normal boiling point of the liquid working medium (for ethanol, over 78 ℃), because the heat discharge end is connected with the boiling device, the liquid working medium capable of being boiled and vaporized in a medium container is violently vaporized in the boiling device, the heat discharge end of the heat pump device is cooled by using huge latent heat of gas-liquid phase change, stable work of the heat pump device is maintained, the working temperature of the heat source required to be cooled at the heat absorption, and after vaporization, the liquid working medium enters the atmospheric environment until the liquid working medium is completely consumed.
EXAMPLE III
The third embodiment of the present invention provides an embodiment of a cooling device, which comprises a semiconductor cooling device, a heat absorbing end, a heat discharging end, a boiling device, a working medium, and a medium container.
The heat pump device is composed of a semiconductor refrigerating device, a heat absorption end and a heat extraction end are respectively a cold end and a hot end of the semiconductor refrigerating device, a selected working medium is water at normal temperature and normal pressure, short-time large heat generated by a high-power heat source is conveyed to the heat extraction end by using external direct current electric energy, the temperature of the heat extraction end is controlled to be above the normal boiling point of the liquid working medium (above 100 ℃ for water), the heat extraction end is connected with a boiling device, the boiling and vaporizing liquid working medium in a medium container is vigorously vaporized in the boiling device, the heat extraction end of the heat pump device is cooled by using huge latent heat of gas-liquid phase change, stable work of the heat pump device is further maintained, the working temperature of the heat source needing to be cooled is ensured, the liquid water of the working medium is not recycled after being used, and the vaporized liquid water enters the atmosphere environment.
The above embodiment numbers of the present invention are only for description, and do not represent the advantages and disadvantages of the embodiments.
While the embodiments of the present invention have been described with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many modifications may be made by one skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.
Claims (7)
1. A cooling apparatus, comprising: a heat pump device and a boiler;
the heat pump device is used for transmitting heat of a heat load to the boiler in an operation period;
the boiler is used for receiving the heat transmitted by the heat pump device and maintaining the heat discharge temperature of the heat pump device in a set range through a working medium;
the working medium has a boiling point higher than ambient temperature and lower than a working heat rejection temperature of the heat pump device.
2. The cooling apparatus of claim 1, wherein the cooling apparatus further comprises: a heat absorption end and a heat extraction end;
the heat pump device is connected between the heat absorption end and the heat exhaust end;
the heat pump device receives heat of the heat load through the heat absorption end and transmits the heat to the boiler through the heat exhaust end.
3. The cooling apparatus of claim 1, wherein the cooling apparatus further comprises: a media container in communication with the boiler for delivering the working media to the boiler during operation.
4. A cooling device according to claim 3, wherein the working medium is pure or a mixture, and the working medium is in a liquid state at a predetermined storage temperature and/or a predetermined storage pressure.
5. A cooling device according to any one of claims 1 to 4, wherein said heat pump device comprises a semiconductor refrigeration device, a vapor compression refrigeration device, an absorption refrigeration device or an air compression refrigeration device.
6. A cooling device as claimed in claim 3 or 4, characterized in that the boiler is operated in particular in such a way that the working medium is heated and vaporized in the boiler by means of atmospheric pressure or a pressure reduction, the vaporized working medium being directly dischargeable into the surroundings.
7. A cooling device according to any one of claims 1-4, characterized in that the boiler is internally provided with a heat absorbing space for providing a working environment for the working medium during operation, the heat absorbing space being provided with an array of micro channels, an array of micro-jet impingement arrays or a metal foam.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022375899.9U CN213602170U (en) | 2020-10-23 | 2020-10-23 | a cooling device |
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| CN202022375899.9U CN213602170U (en) | 2020-10-23 | 2020-10-23 | a cooling device |
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| CN213602170U true CN213602170U (en) | 2021-07-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112271535A (en) * | 2020-10-23 | 2021-01-26 | 中国电子科技集团公司第十一研究所 | Cooling device and thermal management method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112271535A (en) * | 2020-10-23 | 2021-01-26 | 中国电子科技集团公司第十一研究所 | Cooling device and thermal management method |
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