CN213633546U - Probe card with flatness adjusting function - Google Patents

Abstract

The utility model discloses a probe card that possesses roughness adjustment function, including the printed circuit board body, printed circuit board body outer wall is equipped with the probe body, printed circuit board body outer wall is kept away from probe body one side and is equipped with the space converter body, the inside interior picture peg body that is equipped with of space converter body, space converter body outer wall sets up deflection device, space converter body outer wall is kept away from deflection device one side and is set up compensation arrangement, the space converter body is by first contact probe, first probe base plate and first space converter. The utility model discloses in, first flatness adjusting device and second flatness adjusting device do not have interconnect, but link to each other with the probe base plate separately, because do not have the interference between first flatness adjusting device and the second flatness adjusting device, so the roughness is unrestricted to can ensure the roughness degree of freedom.

Description

Probe card with flatness adjusting function

Technical Field

The utility model relates to a technical field is adjusted to the roughness of probe card, concretely relates to probe card that possesses roughness adjustment function.

Background

In order to test semiconductor devices (e.g., semiconductor memories, displays) for defects during or after manufacturing, a probe card is generally used to electrically connect a wafer and a semiconductor device testing apparatus, to transmit an electrical signal of the testing apparatus to a semiconductor bare chip formed on the wafer, and to transmit a signal returned from the semiconductor bare chip to the semiconductor device testing apparatus. At present, the probe card on the market does not have the flatness adjusting function.

Therefore, it is necessary to provide a probe card with a flatness adjustment function to solve the above problems.

The above information disclosed in this background section is only for enhancement of understanding of the background of the disclosure and therefore it may contain information that does not constitute prior art that is already known to a person of ordinary skill in the art.

Disclosure of Invention

The utility model aims at providing a probe card that possesses roughness adjustment function through to solve the above-mentioned weak point in the technique.

In order to achieve the above object, the present invention provides the following technical solutions: a probe card with a flatness adjusting function comprises a printed circuit board body, wherein a probe body is arranged on the outer wall of the printed circuit board body, a space converter body is arranged on one side, away from the probe body, of the outer wall of the printed circuit board body, an inner insertion plate body is arranged inside the space converter body, a deflection device is arranged on the outer wall of the space converter body, a compensation device is arranged on one side, away from the deflection device, of the outer wall of the space converter body, and the space converter body is composed of a first contact probe, a first probe substrate, a first space converter, an inner insertion plate, a first support, a clamping spring, a first lower reinforcing plate, a first upper reinforcing plate, a first printed circuit board, a first leveling bolt, a first leveling joint, a first leveling screw, a first floating substrate, a floating substrate column, a second leveling bolt, a second floating substrate, a third leveling bolt, The second upper reinforcing plate, the probe body is composed of a second probe substrate, a second printed circuit board, a first flatness adjusting device, a floating installation device and a second flatness adjusting device.

Preferably, the printed circuit board body is composed of a second contact probe, a first MEMS probe substrate, a second space transformer, a second support, a third contact probe, a second MEMS probe substrate, a third space transformer, a fourth contact probe, and a fourth space transformer.

Preferably, the inner interposer body is composed of a third flat screw, a second flat rotary joint, a fourth flat bolt, a fourth flat screw, and a fifth flat bolt.

Preferably, the compensation device is composed of a second floating substrate and a floating substrate column.

Preferably, the deflection device is composed of a third printed circuit board, an intermediate adapter, a third upper reinforcing plate, a second lower reinforcing plate, a fourth printed circuit board, a fourth upper reinforcing plate, and a third lower reinforcing plate.

In the technical scheme, the utility model provides a technological effect and advantage:

the utility model discloses a do not have interconnect with first flatness adjusting device and second flatness adjusting device, but link to each other with the probe base plate separately for do not have the interference between first flatness adjusting device and the second flatness adjusting device, so the roughness is unrestricted, thereby can ensure the roughness degree of freedom, even in large tracts of land probe card, a plurality of flatness adjusting device are independent each other, have the effect of light regulation roughness.

Drawings

For a clearer explanation of the embodiments of the present application or technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and it is obvious for those skilled in the art to obtain other drawings according to these drawings.

Fig. 1 is a sectional view of a conventional probe card including an apparatus for adjusting flatness of probes.

Fig. 2 is a cross-sectional view of a probe card provided according to an embodiment of the present invention.

Fig. 3 is a plan view of a probe card provided according to another embodiment of the present invention.

Fig. 4 is a cross-sectional view of a probe card provided according to another embodiment of the present invention.

Fig. 5 is a cross-sectional view of a probe substrate unit of a probe card provided in accordance with another embodiment of the present invention.

Fig. 6 is a cross-sectional view of a probe substrate unit of a probe card provided in accordance with another embodiment of the present invention.

Fig. 7 is a cross-sectional view of a probe substrate unit of a probe card provided in accordance with another embodiment of the present invention.

Fig. 8 is a cross-sectional view of a first flatness adjustment apparatus of a probe card according to an embodiment of the present invention.

Fig. 9 is a cross-sectional view of a first flatness adjustment apparatus of a probe card according to an embodiment of the present invention.

Fig. 10 is a cross-sectional view of a floating mount device of a probe card according to another embodiment of the present invention.

FIG. 11 is a cross-sectional view of a printed circuit board unit of a probe card provided according to another embodiment of the present invention.

Fig. 12 is a cross-sectional view of a printed circuit board unit of a probe card provided according to another embodiment of the present invention.

Description of reference numerals:

10 space transformer body, 20 probe body, 30 printed circuit board body, 40 interposer body, 50 deformation compensation device, 60 deflection device, 101 first contact probe, 102 first probe substrate, 103 first space transformer, 104 interposer, 105 first bracket, 106 clamp spring, 107 first lower stiffener, 108 first upper stiffener, 109 first printed circuit board, 110 first leveling bolt, 111 first leveling joint, 112 first leveling screw, 113 first floating substrate, 114 floating substrate column, 115 second leveling bolt, 121 second leveling screw, 122 second floating substrate, 123 third leveling bolt, 124 second upper stiffener, 211 second probe substrate, 212 second printed circuit board, 213 first leveling adjustment device, 214 floating mounting device, 215 second leveling adjustment device, 311 second contact probe, 312 first MEMS probe substrate, 313 second space transformer, 314 second support, 321 third contact probe, 322 second MEMS probe substrate, 323 third space transformer, 331 fourth contact probe, 332 fourth space transformer, 411 third leveling screw, 412 second leveling joint, 413 fourth leveling screw, 421 fourth leveling screw, 422 fifth leveling screw, 511 second floating substrate, 512 floating substrate column, 611 third printed circuit board, 612 intermediate adapter, 613 third upper stiffener, 614 second lower stiffener, 621 fourth printed circuit board, 622 fourth upper stiffener, 623 third lower stiffener.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted.

Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more example embodiments. In the following description, numerous specific details are provided to give a thorough understanding of example embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the subject matter of the present disclosure can be practiced without one or more of the specific details, or with other methods, components, steps, and so forth. In other instances, well-known structures, methods, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the disclosure.

The utility model provides a probe card that possesses roughness adjustment function as shown in fig. 1-7, including printed circuit board body 30, printed circuit board body 30 outer wall is equipped with probe body 20, printed circuit board body 30 outer wall is kept away from probe body 20 one side and is equipped with space converter body 10, the inside interior interposer body 40 that is equipped with of space converter body 10, space converter body 10 outer wall sets up deflection device 60, deflection device 60 one side is kept away from to space converter body 10 outer wall sets up compensation arrangement 50, space converter body 10 is by first contact probe 101, first probe base plate 102 and first space converter 103, interior interposer 104, first support 105, clamping spring 106, first reinforcing plate 107 down, first upper reinforcing plate 108, first printed circuit board 109, first leveling bolt 110, first leveling adapter 111, The probe body 20 includes a first leveling screw 112, a first floating substrate 113, a floating substrate column 114, a second leveling bolt 115, a second floating substrate 121, a third leveling bolt 122, and a second upper reinforcing plate 123, and the probe body includes a second probe substrate 211, a second printed circuit board 212, a first leveling adjustment device 213, a floating mounting device 214, and a second leveling adjustment device 215.

Further, in the above technical solution, the printed circuit board body 30 is composed of a second contact probe 311, a first MEMS probe substrate 312, a second space transformer 313, a second support 314, a third contact probe 321, a second MEMS probe substrate 322, a third space transformer 323, a fourth contact probe 331, and a fourth space transformer 332.

Further, in the above technical solution, the interposer body 40 is composed of a third leveling screw 411, a second leveling swivel joint 412, a fourth leveling bolt 413, a fourth leveling screw 421 and a fifth leveling bolt 422.

Further, in the above technical solution, the compensation device 50 is composed of a second floating substrate 511 and a floating substrate column 512.

Further, in the above-mentioned solution, the deflecting device 60 is composed of a third printed circuit board 611, an intermediate adapter 612, a third upper reinforcing plate 613, a second lower reinforcing plate 614, a fourth printed circuit board 621, a fourth upper reinforcing plate 622, and a third lower reinforcing plate 623.

The implementation mode is specifically as follows: when using the probe card, first contact probes 101 are mounted on the wafer contact surface of a first MEMS probe substrate 102 at spaced intervals. The first contact probe 101 receives an electrical signal of an external test device from the first MEMS probe substrate 102 and transmits it to the wafer, and receives a signal returned from the wafer and transmits it to the first MEMS probe substrate 102. The first contact probe 101 directly contacts a pad on the wafer to test the wafer. Preferably, the first contact probe 101 is an elastic body to prevent damage to the wafer when contacting the pad on the wafer. The first MEMS probe substrate 102 is coupled to the first contact probe 101 and the first space transformer 103. The first MEMS probe substrate 102 receives an electrical signal of an external test device from the first space transformer 103 and transmits it to the first contact probe 101. The first contact probe 101 then receives the signal returned by the wafer and transmits it to the first space transformer 103. The first space transformer 103 is coupled to the first MEMS probe substrate 102 and the interposer 104. The first space transformer 103 receives an electrical signal of an external test device from the interposer 104 and transmits it to the first MEMS probe substrate 102. The wafer return signal is then received from the first contact probe 101 and transmitted to the interposer 104. The interposer 104 is coupled to the first printed circuit board 109 and the first space transformer 103. The interposer 104 receives an electrical signal of an external test apparatus from the first printed circuit board 109 and transmits it to the first space transformer 103. The wafer return signal is then received from the first space transformer 103 and transmitted to the first printed circuit board 109. Preferably, the portion of the interposer 104 in contact with the first printed circuit board 109 and the first space transformer 103 is an elastic body. In this way, with the first printed circuit board 109 fixed, the interposer 104 can easily adjust the flatness of the first MEMS probe substrate 102 and the first space transformer 103 by the first leveling bolt 110 or the second leveling bolt 115. The interposer 104 includes at least one passage for a first leveling bolt 110, a first leveling swivel 111, or a first leveling screw 112 to pass through. The first support 105 is coupled to the first MEMS probe substrate 102 and the first space transformer 103. The first bracket 105 is used to fix the first MEMS probe substrate 102 and the first space transformer 103, and is coupled with the floating substrate column 114, the second leveling bolt 115, and the clamping spring 106. The spring 106 is coupled to the first bracket 105 and the first lower reinforcing plate 107. The spring 106 provides elasticity between the first bracket 105 and the first lower reinforcing plate 107, and the first bracket 105 is pressed or pulled by the first leveling bolt 110 or the second leveling screw 115, so that the effect of the first lower reinforcing plate 107 can be reduced when the first bracket 105 moves. The first lower reinforcing plate 107 is coupled with the spring 106 and the first printed circuit board 109. The first lower stiffener 107 is used to fix the first printed circuit board 109 and connect the first printed circuit board 109 and the first bracket 105 through the spring 106. Therefore, when the flatness is adjusted by the second flattening screws 115, the first lower reinforcing plate 107 functions to prevent a force from being directly applied to the printed circuit board 414. The first upper reinforcing plate 108 is attached to the first printed circuit board 109. The first upper stiffener 108 is used to fix the first printed circuit board 109 and prevent the first printed circuit board 109 from being damaged due to bending or breaking. In addition, the first upper reinforcing plate 108 includes a plurality of passages through which the first leveling bolt 110, the first leveling swivel 111, the first leveling screw 112, the floating base plate column 114, and the second leveling bolt 115 pass. The first printed circuit board 109 is attached to the interposer 104, the first lower reinforcing plate 107, and the first upper reinforcing plate 108. The first printed circuit board 109 is fixed by the first lower reinforcing plate 107 and the first upper reinforcing plate 108. The first printed circuit board 109 receives an electrical signal from an external test apparatus and transmits it to the interposer 104. The signal returned from the wafer is then received from the interposer 104 and transmitted to external test equipment. The printed circuit board 104 includes a plurality of passages for the first leveling bolt 110, the first leveling swivel 111, the first leveling screw 112, the floating substrate post 114, and the second leveling screw 115 to pass through. The first leveling bolt 110 is fastened to the first space transformer 103 and the first leveling swivel 111. The first leveling bolt 110 is fastened to the first space transformer 103 by a fastening structure on the first space transformer 103, and if there is no such fastening structure, is fastened to the first space transformer 103 in an engaging manner. The first leveling swivel 111 is fastened to the first leveling bolt 110 and the first leveling screw 112. The first leveling swivel 111 transmits a compressive force or a tensile force applied by the first leveling screw 112 to the first leveling bolt 110. The first leveling screw 112 is fastened to the first leveling swivel 111 and the first floating base plate 113. The first leveling screw 112 is preferably in the form of a screw. This makes it possible to apply a compressive force or a tensile force to the first space transformer 103 by rotating the first leveling screw 112 left and right. The first leveling bolt 110, the first leveling swivel 111, and the first leveling screw 112 are disposed at a central region of each substrate. For this case, a plurality of first leveling bolts 110, first leveling swivel joints 111, and first leveling screws 112 may be provided. The central region refers to a region other than the outer peripheral portion of each substrate. Floating substrate 113 is attached to leveling screws 112 and floating substrate posts 114. A first floating base plate 113 is disposed at a distance from the first upper stiffener plate 108 and is coupled to a floating base plate post 114 to couple the first leveling screw 112 to the first bracket 105. The floating substrate column 114 is coupled with the first floating substrate 113 and the first support 105. The floating substrate column 114 is not connected to any portion except the first floating substrate 113 and the first support 105. As described above, the first floating base plate 113 and the floating base plate column 114 are attached only to the first bracket 105 and the first leveling screw 112, thereby separating the first leveling bolt 110, the first leveling swivel 111, and the first leveling screw 112 from the second leveling bolt 115. The second leveling bolt 115 applies a tensile force or a compressive force to the first support 105 to adjust the flatness of the first MEMS probe substrate 102 and the first space transformer 103. The second leveling bolt 115 penetrates the first upper reinforcing plate 108 and the first printed circuit board 109 to be attached to the first bracket 105 without being connected to other members. Accordingly, the second leveling bolt 115 is separated from the first leveling bolt 110, the first leveling swivel 111, and the first leveling screw 112. In order to adjust the flatness more accurately, a plurality of second leveling bolts may be used.

As described above, according to an embodiment of the present invention, the first leveling bolt 110, the first leveling swivel 111, and the first leveling screw 112 are fastened only to the first space transformer 103 through the first floating substrate 113 and the floating substrate column 114, and the second leveling bolt 115 is directly fastened only to the first bracket 105. Since the first leveling bolt 110, the first leveling swivel 111, and the first leveling screw 112 are separated from the second leveling bolt 115, the flatness adjustment of the first MEMS probe substrate 102 and the first space transformer 103 by the first leveling bolt 110, the first leveling swivel 111, and the first leveling screw 112 and the flatness adjustment of the first MEMS probe substrate 102 and the first space transformer 103 by the second leveling bolt 115 do not affect each other. That is, the degree of freedom of the flatness adjustment by the second leveling bolt 115 is not affected by the first leveling bolt 110, the first leveling swivel 111, and the first leveling screw 112. The second leveling screw 121 is disposed at a central region of the second floating base plate 122 and the second upper reinforcing plate 124. In order to adjust the flatness more precisely, it is preferable that a plurality of flat screws are provided. The second floating base plate 122 is supported by the floating base plate posts and spaced apart from the second upper stiffener plate 124. In addition, the central region includes channels for the flat screws 114 to pass through, the number of channels corresponding to the number of flat screws. The third leveling bolt 123 is disposed at the outer peripheral portion of the second upper reinforcing plate 124. The second upper stiffener plate 124 is attached to the printed circuit board and spaced apart from the second floating substrate 122. In addition, the outer peripheral portion includes passages for the flat bolts 123 to pass through, and the number of the passages is the same as the number of the flat bolts. The second probe substrate 211 contacts a pad of the wafer to transmit an electrical signal of an external test device to the wafer, and then transmits a signal received from the wafer to the second printed circuit board 212. The second probe substrate 211 is coupled with the first flatness adjustment unit 213, the floating mount 214, and the second printed circuit board 212. The first flatness adjustment device 213 adjusts the flatness of the second probe substrate 211 by applying a tensile force or a compressive force to the central region of the second probe substrate 211. The first flatness adjustment device 213 is connected to the second probe substrate 211 through the floating mount 214, and is not connected to other members. Therefore, the first flatness adjustment device 213 is separated from the second flatness adjustment device 215. In order to adjust the flatness more accurately, a plurality of first flatness adjustment devices may be used. The floating mount device 214 connects the second probe substrate 211 and the first flatness adjustment device 213. The floating mount device 214 is fastened only to the second probe substrate 211 and the first flatness adjustment device 213, and is not connected to other components. The second printed circuit board 212 receives an electrical signal from an external test apparatus and transmits it to the second probe substrate 211, and receives a wafer signal from the second probe substrate 211 and transmits it to the external test apparatus. The second printed circuit board 212 includes a passage to insert the first flatness adjustment device 213, the floating mount device 214, and the second flatness adjustment device 215. The second flatness adjustment device 215 adjusts the flatness of the second probe substrate 211 by applying pressure or tension to the outer circumferential portion of the second probe substrate 211. The second flatness adjustment device 215 is connected to the second probe substrate 211 through the second printed circuit board 212, and is otherwise not connected to other members. Therefore, the second flatness adjustment device 215 is separated from the first flatness adjustment device 213. In order to adjust the flatness more accurately, a plurality of second flatness adjustment devices may be used. As described above, according to another embodiment of the present invention, the first flatness adjustment unit 213 is fastened only to the second probe substrate 211 by the floating mount unit 214, and the second flatness adjustment unit 215 is also fastened only to the second probe substrate 211. Since the first flatness adjustment device 213 and the second flatness adjustment device 215 are separated from each other, the flatness adjustment of the second probe substrate 211 by the first flatness adjustment device 213 and the second flatness 215 does not affect each other. That is, the degree of freedom of flatness adjustment performed by the second flatness adjustment device 215 is not limited by the first flatness adjustment device 213.

According to another embodiment of the present invention, the probe substrate includes a second contact probe 311, a first MEMS probe substrate 312, a second space transformer 313 and a second support 314. A plurality of second contact probes 311 are mounted on the wafer contact surface of the second space transformer 313 at intervals. The second contact probe 311 directly contacts the wafer to test the wafer. Preferably, the contact probes 311 are elastomeric to prevent damage to the wafer when contacted. The first MEMS probe substrate 312 is connected with the second contact probe 311, the second space transformer 313 and the second support 314. The first MEMS probe substrate 312 receives an electrical signal of an external test device from the second space transformer 313 and transmits it to the second contact probe 311. The wafer signal is then received from the second contact probe 311 and transmitted to the second space transformer 313. The second space transformer 313 is connected to the first MEMS probe substrate 312 and the second support 314. The second space transformer 313 receives an electrical signal of an external test device from the printed circuit board and transmits it to the first MEMS probe substrate 312. The wafer signal is then received from the first MEMS probe substrate 312 and transmitted to the printed circuit board. The second support 314 is connected to the first MEMS probe substrate 312 and the second space transformer 313. The second holder 314 fixes the first MEMS probe substrate 312 and the second space transformer 313, and is connected with the floating mount device and the second flatness adjustment device. According to another embodiment of the present invention, the probe substrate includes a third contact probe 321, a second MEMS probe substrate 322, and a third space transformer 323. A plurality of third contact probes 321 are mounted on the wafer contact surface of the second space transformer 313 at intervals. The third contact probe 321 directly contacts the wafer to test the wafer. Preferably, the contact probes 321 are elastomeric to prevent damage to the wafer when contacted. The second MEMS probe substrate 322 is connected with the third contact probe 321 and the third space transformer 323. The second MEMS probe substrate 322 receives an electrical signal of an external test device from the third space transformer 323 and transmits it to the third contact probe 321. The wafer signal is then received from the third contact probe 321 and transmitted to the third space transformer 323. The third space transformer 323 is coupled with the second MEMS probe substrate 322 and the printed circuit board. The third space transformer 323 receives an electrical signal of an external test device from the printed circuit board and transmits it to the second MEMS probe substrate 322. The wafer signal is then received from the second MEMS probe substrate 322 and transmitted to the printed circuit board.

According to another embodiment of the present invention, the probe substrate of the probe card includes fourth contact probes 331 and a fourth space transformer 332. A plurality of fourth contact probes 331 are mounted on the wafer contact surface of the space transformer 332 at regular intervals. The fourth contact probe 331 directly contacts the wafer to test the wafer. Preferably, the fourth contact probe 331 is an elastomer to prevent damage to the wafer when contacted. The fourth space transformer 332 is coupled with the fourth contact probe 331 and the printed circuit board. The fourth space transformer 332 receives an electrical signal of an external test device from the printed circuit board and transmits it to the fourth contact probe 331. The wafer signal is then received from the fourth contact probe 331 and transmitted to the printed circuit board. The space transformer 332 functions to transform the pitch, and the pitch between the plurality of contact terminals on the upper surface thereof is different from the interval between the plurality of contact terminals on the lower surface thereof. For example, the pitch of the lower surface is smaller than the pitch of the upper surface. Therefore, a probe card conforming to a narrow pitch of wafer pads can be manufactured. According to another embodiment of the present invention, the first flatness adjustment device includes a fourth leveling bolt 413, a second leveling swivel 412, and a third leveling screw 411. A third leveling screw 411 is coupled to the second leveling swivel 412 and the floating mount. The third leveling screw 411 is preferably in the form of a screw. Thus, by rotating the leveling screw 411 left and right, tension or pressure can be applied to the probe substrate. The second leveling swivel 412 is fastened to the fourth leveling bolt 413 and the third leveling screw 411. The second leveling swivel 412 transmits a compressive force or a tensile force applied by the third leveling screw 411 to the fourth leveling bolt 413. A fourth leveling bolt 413 is fastened to the probe base plate and the second leveling swivel 412. The fourth leveling bolt 413 is fastened to the probe substrate by a fastening structure on the probe substrate, and is fastened to the probe substrate by a bonding method if such a fastening structure is not provided. According to another embodiment of the present invention, the first flatness adjustment device includes a fifth leveling bolt 422 and a fourth leveling screw 421. The fourth leveling screw 421 is coupled to the fifth leveling bolt 422 and the floating mount. The fourth leveling screw 421 is preferably in the form of a screw. Thus, by rotating the third leveling screw 411 in the left-right direction, a tensile force or a compressive force can be applied to the probe substrate. The fifth leveling screw 422 is coupled to the probe substrate and the fourth leveling screw 421. The fifth leveling bolt 422 is fastened to the probe substrate by a fastening structure on the probe substrate, and if there is no such fastening structure, the remaining probe substrate is fastened by bonding.

According to another embodiment of the present invention, the floating mount device includes a second floating substrate 511 and a floating substrate column 512. A second floating substrate 511 is coupled to the leveling control device and the floating substrate posts 512. The floating substrate column 512 is coupled with the second floating substrate 511 and the probe substrate. When the floating mounting means is composed of the second floating substrate 511 and the floating substrate columns 512, probe card manufacturing and component replacement are facilitated. According to another embodiment of the present invention, the printed circuit board unit includes a third printed circuit board 611, a third upper reinforcing plate 613, and a second lower reinforcing plate 614. The third printed circuit board 611 is coupled with the third upper reinforcing plate 613, the second lower reinforcing plate 614, and the interposer 612. The third printed circuit board 611 is fixed by the third upper reinforcing plate 613 and the second lower reinforcing plate 614. The third printed circuit board 611 receives an electrical signal from an external test device and transmits it to the interposer adapter 612. The wafer signal is then received from the interposer 612 and transmitted to external test equipment. The third printed circuit board 611 includes a plurality of passages through which the first flatness adjustment unit, the floating mount unit, and the second flatness adjustment unit pass. The third upper reinforcing plate 613 is coupled to the third printed circuit board 611. The third upper reinforcing plate 613 fixes the third printed circuit board 611 to prevent damage due to bending or breaking of the third printed circuit board 611. The third upper reinforcing plate 613 includes a plurality of passages, not shown, through which the first flatness adjustment means, the floating mount means, and the second flatness adjustment means pass. The second lower stiffener plate 614 is coupled to the third printed circuit board 611. The second lower stiffener 614 fixes the third printed circuit board 611 and connects the third printed circuit board 611 and the probe substrate. Therefore, the second lower reinforcing plate 614 functions to prevent a force from being directly applied to the printed circuit board 611 when the flatness is adjusted by the second flatness adjustment unit. The interposer 612 is coupled with the third printed circuit board 611 and the probe substrate. The interposer 612 receives an electrical signal from the third printed circuit board 611 and transmits it to the probe substrate. The wafer signal is then received from the probe substrate and transmitted to the third printed circuit board 611. The portion of the interposer 612 in contact with the third printed circuit board 611 and the probe substrate is preferably an elastomer. This facilitates the adjustment of the flatness of the probe substrate by the first flatness adjustment means or the second flatness adjustment means in a state where the third printed circuit board 611 is fixed. The interposer 612 includes at least one passage through which the first flatness adjustment mechanism passes. According to another embodiment of the present invention, the printed circuit board unit includes a fourth printed circuit board 621, a fourth upper reinforcing plate 622, and a lower reinforcing plate 623. The fourth printed circuit board 621 is attached to the fourth upper reinforcing plate 622, the lower reinforcing plate 623 and the probe substrate. The fourth printed circuit board 621 is fixed by the fourth upper reinforcing plate 622 and the lower reinforcing plate 623. The fourth printed circuit board 621 receives an electrical signal from an external test device and transmits it to the probe substrate. The wafer signal is then received from the probe substrate and transmitted to external test equipment. The fourth printed circuit board 621 includes a plurality of passages through which the first flatness adjustment device, the floating mount device, and the second flatness adjustment device pass. The fourth upper reinforcement plate 622 is coupled to the fourth printed circuit board 621. The fourth upper reinforcement plate 622 fixes the fourth printed circuit board 621 to prevent damage due to bending or breaking of the fourth printed circuit board 621. Fourth upper reinforcing plate 622 includes a plurality of channels for the first flatness adjustment device, the floating mount, and the second flatness adjustment device to pass therethrough. The lower reinforcement plate 623 is coupled to the fourth printed circuit board 621. The lower reinforcement plate 623 fixes the fourth printed circuit board 621 and connects the fourth printed circuit board 621 and the probe substrate. Therefore, the third lower reinforcing plate 623 functions to prevent a force from being directly applied to the printed circuit board 621 when the flatness is adjusted by the second flatness adjusting apparatus, and this embodiment particularly solves the problem that the probe card in the market does not have a flatness adjusting function.

While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the present invention. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the invention.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (5)

1. A probe card with flatness adjustment function, comprising a printed circuit board body (30), characterized in that: the outer wall of the printed circuit board body (30) is provided with a probe body (20), one side, far away from the probe body (20), of the outer wall of the printed circuit board body (30) is provided with a space converter body (10), an inner plug-in board body (40) is arranged inside the space converter body (10), the outer wall of the space converter body (10) is provided with a deflection device (60), one side, far away from the deflection device (60), of the outer wall of the space converter body (10) is provided with a compensation device (50), and the space converter body (10) is composed of a first contact probe (101), a first probe substrate (102), a first space converter (103), an inner plug-in board (104), a first support (105), a clamping spring (106), a first lower reinforcing plate (107), a first upper reinforcing plate (108), a first printed circuit board (109), a first leveling bolt (110), and a first leveling joint (111), The probe body (20) comprises a second probe substrate (211), a second printed circuit board (212), a first flatness adjusting device (213), a floating mounting device (214) and a second flatness adjusting device (215).

2. The probe card with flatness adjustment function according to claim 1, wherein: the printed circuit board body (30) is composed of a second contact probe (311), a first MEMS probe substrate (312), a second space converter (313), a second support (314), a third contact probe (321), a second MEMS probe substrate (322), a third space converter (323), a fourth contact probe (331) and a fourth space converter (332).

3. The probe card with flatness adjustment function according to claim 1, wherein: the inner insert body (40) is composed of a third flat screw (411), a second flat swivel joint (412), a fourth flat bolt (413), a fourth flat screw (421) and a fifth flat bolt (422).

4. The probe card with flatness adjustment function according to claim 1, wherein: the compensation device (50) is composed of a second floating substrate (511) and a floating substrate column (512).

5. The probe card with flatness adjustment function according to claim 1, wherein: the deflection unit (60) is composed of a third printed circuit board (611), an intermediate adapter (612), a third upper reinforcing plate (613), a second lower reinforcing plate (614), a fourth printed circuit board (621), a fourth upper reinforcing plate (622), and a third lower reinforcing plate (623).

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