CN221176875U - Chip module - Google Patents

Abstract

The application discloses a chip module, which comprises a shell, a chip assembly and an adapter; the shell is provided with a first inner cavity and a first opening communicated with the first inner cavity, and the chip assembly is positioned in the first inner cavity; the adapter is arranged at the first opening and is electrically connected with the chip assembly, and at least part of the adapter is positioned outside the shell and is used for being electrically connected with external equipment. According to the application, the adapter is arranged on the shell, then the adapter is connected with external equipment, and the data transmission is realized through the electric connection of the adapter and the chip module, so that the chip module is convenient to detach and replace.

Description

Chip module

Technical Field

The present application relates to the field of chip technology, and in particular to a chip module.

Background technique

Chips are important components for information data transmission, but current chips are generally directly soldered on circuit boards, making it inconvenient to replace the chips.

Utility Model Content

The purpose of this application is to provide a technical solution for a chip module to solve the above-mentioned problem, thereby facilitating the replacement of the chip by adding an adapter.

The chip module provided in the present application includes a shell, a chip assembly and an adapter; the shell has a first inner cavity and a first opening connected to the first inner cavity, and the chip assembly is located in the first inner cavity; the adapter is installed at the first opening and is electrically connected to the chip assembly, and the adapter is at least partially located outside the shell, and the adapter is used to be electrically connected to an external device.

In one embodiment, the chip assembly includes a chip body, a carrier and a substrate which are fixedly connected in sequence, and the chip body, the carrier and the substrate are electrically connected in sequence, the substrate is fixed to the wall of the first inner cavity, and the substrate is electrically connected to the adapter.

In one embodiment, the chip module further includes a heat conducting component, and the heat conducting component is disposed on a side of the chip body facing away from the carrier board.

In one embodiment, the heat conducting component comprises a heat conducting plate, and the heat conducting plate is disposed on a side of the chip body facing away from the carrier.

In one embodiment, the heat-conducting component further includes a heat-conducting pad, which is located between the chip body and the heat-conducting plate, and the chip body, the heat-conducting pad and the heat-conducting plate are sequentially attached.

In one embodiment, the heat conduction component further includes a heat dissipation fin, and the heat dissipation fin is fixed to a side of the heat conduction plate away from the chip body.

In one embodiment, the heat conduction assembly further includes a heat dissipation fan, and the heat dissipation fan is disposed on a side of the heat dissipation fins away from the heat conduction plate.

In one embodiment, the chip module also includes a first baffle, a second baffle, a first spring and a second spring; a first support plate and a second support plate are fixed at both ends of the heat conducting plate respectively; the first baffle and the second baffle are located on the side of the heat conducting plate away from the chip body, and are both fixed to the cavity wall of the first inner cavity; the two ends of the first spring respectively abut the first baffle and the first support plate, the two ends of the second spring respectively abut the second baffle and the second support plate, and the first spring and the second spring are both in a compressed state.

In one embodiment, the chip module also includes an annular shell and a dustproof net; the outer shell also has a second opening connected to the first inner cavity; the annular shell has a second inner cavity and a third opening and a fourth opening connected to the second inner cavity; the annular shell is fixed to the outer shell, and the third opening is connected to the second opening, and the cooling fan is at least partially located in the second inner cavity; the dustproof net covers the fourth opening.

In one embodiment, the housing further has a plurality of ventilation holes.

The chip module provided in the present application includes a housing, a chip assembly and an adapter; the housing has a first inner cavity and a first opening connected to the first inner cavity, and the chip assembly is located in the first inner cavity; the adapter is installed at the first opening and is electrically connected to the chip assembly, and the adapter is at least partially located outside the housing, and the adapter is used to electrically connect to an external device. In the present application, an adapter is provided on the housing, and then the adapter is used to connect to an external device, and data transmission is realized by electrically connecting the adapter to the chip module, so that the chip module in the present application is easy to disassemble and replace.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the implementation scheme are briefly introduced below.

FIG1 is a schematic diagram of the overall structure of a chip module provided in an embodiment of the present application.

FIG. 2 is a schematic diagram of the cross-sectional structure of a chip module provided in an embodiment of the present application.

FIG3 is a schematic diagram of a cross-sectional structure of a chip module provided in an embodiment of the present application from another viewing angle.

FIG. 4 is a schematic diagram of fixing heat sink fins in a chip module provided in an embodiment of the present application.

Explanation of the reference numerals: 100-housing; 101-first inner cavity; 102-ventilation hole; 110-first side panel; 111-mounting seat; 120-second side panel; 121-first opening; 130-third side panel; 140-fourth side panel; 200-chip assembly; 210-substrate; 220-carrier; 230-chip body; 300-heat dissipation assembly; 310-heat conductive plate; 311-first support plate; 312-second support plate; 320-thermal conductive pad; 330-heat dissipation fin; 340-heat dissipation fan; 341-mounting frame; 400-first baffle; 410-second baffle; 500-first spring; 510-second spring; 600-annular shell; 610-second inner cavity; 700-dustproof net; 800-adapter.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

As shown in Figures 1, 2, 3 and 4, the chip module provided in the embodiment of the present application includes a housing 100, a chip assembly 200 and an adapter 800; the housing 100 has a first inner cavity 101 and a first opening 121 connected to the first inner cavity 101, and the chip assembly 200 is located in the first inner cavity 101; the adapter 800 is installed at the first opening 121 and is electrically connected to the chip assembly 200, and the adapter 800 is at least partially located outside the housing 100, and the adapter 800 is used to be electrically connected to an external device. In the embodiment of the present application, the adapter 800 is arranged on the housing 100, and then the adapter 800 is used to connect with the external device. It can be understood by those skilled in the art that the adapter 800 can be a USB (Universal Serial Bus) port, etc., and can be connected to the external device for communication by plugging and other methods. In the embodiment of the present application, the data transmission between the chip module and the external device is realized by electrically connecting the adapter 800 to the chip module, so that the chip module in the present application is easy to disassemble and replace.

Specifically, referring to FIG. 2 and FIG. 3, the housing 100 includes a first side plate 110, a second side plate 120, a third side plate 130 and a fourth side plate 140 which are fixedly connected end to end, and a first panel and a second panel which are arranged opposite to each other, wherein the first panel is fixedly connected to one end of the first side plate 110, the second side plate 120, the third side plate 130 and the fourth side plate 140, and the second panel is fixedly connected to the other end of the first side plate 110, the second side plate 120, the third side plate 130 and the fourth side plate 140. The first side plate 110, the second side plate 120, the third side plate 130, the fourth side plate 140, the first panel and the second panel are surrounded to form a first inner cavity 101. The first opening 121 is opened on the second side plate 120, and the adapter 800 is installed at the first opening 121 of the second side plate 120. Specifically, the adapter 800 can be clamped in the first opening 121. Of course, those skilled in the art can understand that the adapter 800 can also be disposed on any of the first side plate 110 , the third side plate 130 , the fourth side plate 140 , the first panel or the second panel, and this application does not impose any specific limitation. The chip assembly 200 is fixed on the first side plate 110 .

In one embodiment, the chip assembly 200 includes a chip body 230, a carrier board 220 and a substrate 210 which are fixedly connected in sequence. Specifically, the chip body 230 is welded on the carrier board 220, the carrier board 220 is welded on the substrate 210, and the chip body 230, the carrier board 220 and the substrate 210 are electrically connected in sequence, the substrate 210 is fixed to the wall of the first inner cavity 101, and the substrate 210 is electrically connected to the adapter 800. It can be understood by those skilled in the art that the substrate 210 can be a PCB (printed circuit board). In the embodiment of the present application, the substrate 210 is fixed to the wall of the first inner cavity 101, and the substrate 210 is easy to process and can be convenient for flexible setting of the fixed position. For example, through holes can be opened at the four corners of the substrate 210, a fixing seat can be set on the avoidance of the first inner cavity 101, and the substrate 210 can be fixed to the wall of the first inner cavity 101 by bolts or the like. Furthermore, a mounting base 111 may be provided on the first side plate 110 , and the substrate 210 may be fixed to the mounting base 111 of the first side plate 110 by bolts or the like, so that a gap may be provided between the substrate 210 and the first side plate 110 , thereby facilitating heat dissipation of the substrate 210 .

In one embodiment, the chip module further includes a heat-conducting component, which is disposed on a side of the chip body 230 away from the carrier 220. It can be understood by those skilled in the art that the chip body 230 generates a large amount of heat during operation, thereby causing the temperature of the chip body 230 to rise, and the temperature rise of the chip body 230 will affect the performance of the chip body 230. Therefore, by arranging the heat dissipation component 300 on the side of the chip body 230 away from the carrier 220, the chip body 230 can be timely cooled and cooled, so that the chip body 230 is in a suitable working environment, and the performance of the chip body 230 is guaranteed.

In one embodiment, the heat conducting assembly includes a heat conducting plate 310, and the heat conducting plate 310 is disposed on a side of the chip body 230 away from the carrier 220. The heat conducting plate 310 has a large heat dissipation area and is convenient for heat dissipation.

In one embodiment, the heat conductive component further includes a heat conductive pad 320, and the heat conductive pad 320 is located between the chip body 230 and the heat conductive plate 310, and the chip body 230, the heat conductive pad 320 and the heat conductive plate 310 are sequentially attached. It can be understood by those skilled in the art that the heat conductive pad 320 can be a heat conductive silicone rubber, etc., and the heat conductive pad 320 can be provided. On the one hand, the heat conductive plate 310 can be bonded to the chip body 230, so that the heat conductive plate 310 and the chip body 230 are more closely attached; on the other hand, due to the soft characteristics of the heat conductive track, the heat conductive silicone rubber can cover the surface of the chip body 230 with the maximum area, thereby increasing the heat dissipation area of the chip body 230.

In one embodiment, the heat conducting assembly further includes a heat dissipation fin 330, and the heat dissipation fin 330 is fixed to a side of the heat conducting plate 310 away from the chip body 230. The heat dissipation fin 330 can further increase the heat dissipation area and improve the heat dissipation efficiency.

In one embodiment, referring to FIG. 2 and FIG. 3 , the chip module further includes a first baffle 400, a second baffle 410, a first spring 500 and a second spring 510; the first support plate 311 and the second support plate 312 are fixedly disposed at both ends of the heat conducting plate 310; the first baffle 400 and the second baffle 410 are located on the side of the heat conducting plate 310 away from the chip body 230, and are both fixed to the cavity wall of the first inner cavity 101. The two ends of the first spring 500 abut against the first baffle 400 and the first support plate 311, respectively, and the two ends of the second spring 510 abut against the second baffle 410 and the second support plate 312, respectively, and the first spring 500 and the second spring 510 are both in a compressed state. Specifically, the first baffle 400 is fixed to the side of the second side plate 120 close to the first inner cavity 101, and the second baffle 410 is fixed to the side of the fourth side plate 140 close to the first accommodating cavity.

In the embodiment of the present application, since the first spring 500 and the second spring 510 are in a compressed state, that is, the first spring 500 and the second spring 510 always apply a force toward the chip body 230 to the heat conducting plate 310, thereby ensuring that the heat conducting plate 310 can be tightly attached to the chip body 230, and avoiding the formation of a gap between the heat conducting plate 310 and the chip body 230 due to long-term use, resulting in a decrease in heat dissipation performance. By providing the first spring 500 and the second spring 510, it is possible to always ensure that the heat conducting plate 310 is tightly attached to the heat dissipation body, thereby ensuring heat dissipation efficiency.

In one embodiment, the heat conduction assembly further includes a heat dissipation fan 340, and the heat dissipation fan 340 is disposed on a side of the heat dissipation fin 330 away from the heat conduction plate 310. Specifically, a mounting frame 341 is disposed on a side of the third side plate 130 close to the first inner cavity 101, and the heat dissipation fan 340 is fixed on the mounting frame 341. The heat dissipation fan 340 can further improve the heat dissipation capacity, thereby ensuring that the chip body 230 is always at a suitable working temperature.

In one embodiment, the chip module further includes an annular shell 600 and a dustproof net 700; the outer shell 100 also has a second opening connected to the first inner cavity 101; the annular shell 600 has a second inner cavity 610 and a third opening and a fourth opening connected to the second inner cavity 610; the annular shell 600 is fixed to the outer shell 100, and the third opening is connected to the second opening, and the cooling fan 340 is at least partially located in the second inner cavity 610; the dustproof net 700 covers the fourth opening. In the embodiment of the present application, by setting the annular shell 600, the cooling fan 340 can be at least partially located in the second inner cavity 610, and because the area of the vertical projection of the cooling fan 340 on the heat sink is smaller than the heat sink, the space can be reduced by setting the annular shell 600 to place the cooling fan 340. It can be understood by those skilled in the art that the annular shell 600 and the outer shell 100 can be integrally formed.

Those skilled in the art can also understand that the dustproof net 700 has a plurality of small holes, and the aperture of the small holes is small, which can prevent dust from entering the first inner cavity 101 and the second inner cavity 610, thereby preventing dust from contaminating the chip body 230. On the other hand, the small holes can be provided to discharge the air in the first inner cavity 101 and the second inner cavity 610, increase the air convection between the first inner cavity 101 and the second inner cavity 610 and the outside, and facilitate cooling.

In one embodiment, the housing 100 further has a plurality of ventilation holes 102. Specifically, the ventilation holes can be provided on the second side panel 120 and the fourth side panel 140. Of course, those skilled in the art can also set them on the first side panel 110, the third side panel 130, the first panel or the second panel according to the specific situation, and this application does not make specific restrictions. Those skilled in the art can understand that the ventilation holes 102 can further increase the circulation of air in the first inner cavity 101 and the second inner cavity 610 with the outside world, thereby increasing the cooling efficiency.

The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea.

Claims (10)

1. A chip module, characterized in that it comprises a housing, a chip assembly and an adapter; The housing has a first inner cavity and a first opening communicating with the first inner cavity, and the chip assembly is installed in the first inner cavity; The adapter is installed at the first opening and is electrically connected to the chip assembly. The adapter is at least partially located outside the housing and is used to be electrically connected to an external device. 2. The chip module according to claim 1 is characterized in that the chip assembly includes a chip body, a carrier and a substrate which are fixedly connected in sequence, and the chip body, the carrier and the substrate are electrically connected in sequence, the substrate is fixed to the wall of the first inner cavity, and the substrate is electrically connected to the adapter. 3 . The chip module according to claim 2 , further comprising a heat-conducting component, wherein the heat-conducting component is disposed on a side of the chip body facing away from the carrier board. 4 . The chip module according to claim 3 , wherein the heat conducting component comprises a heat conducting plate, and the heat conducting plate is arranged on a side of the chip body facing away from the carrier board. 5. The chip module according to claim 4, characterized in that the heat-conducting component further comprises a heat-conducting pad, the heat-conducting pad is located between the chip body and the heat-conducting plate, and the chip body, the heat-conducting pad and the heat-conducting plate are sequentially attached. 6 . The chip module according to claim 4 , wherein the heat conducting component further comprises a heat dissipation fin, and the heat dissipation fin is fixed to a side of the heat conducting plate away from the chip body. 7 . The chip module according to claim 6 , wherein the heat conduction component further comprises a heat dissipation fan, and the heat dissipation fan is arranged on a side of the heat dissipation fin away from the heat conduction plate. 8. The chip module according to claim 4, characterized in that the chip module further comprises a first baffle, a second baffle, a first spring and a second spring; a first support plate and a second support plate are respectively provided at both ends of the heat conducting plate; the first baffle and the second baffle are both located on a side of the heat conducting plate away from the chip body, and are both fixed to the cavity wall surface of the first inner cavity; Two ends of the first spring abut against the first baffle plate and the first support plate respectively, and two ends of the second spring abut against the second baffle plate and the second support plate respectively, and the first spring and the second spring are both in a compressed state. 9. The chip module according to claim 7, characterized in that the chip module further comprises an annular shell and a dustproof net; the shell further comprises a second opening communicating with the first inner cavity; the annular shell comprises a second inner cavity and a third opening and a fourth opening communicating with the second inner cavity; The annular shell is fixed to the outer shell, and the third opening is communicated with the second opening. The heat dissipation fan is at least partially located in the second inner cavity. The dustproof net covers the fourth opening. 10 . The chip module according to claim 1 , wherein the housing is provided with a plurality of ventilation holes.