[go: up one dir, main page]

CN221536186U - Overflow reaction vessel and waste gas treatment equipment - Google Patents

Overflow reaction vessel and waste gas treatment equipment Download PDF

Info

Publication number
CN221536186U
CN221536186U CN202323595604.9U CN202323595604U CN221536186U CN 221536186 U CN221536186 U CN 221536186U CN 202323595604 U CN202323595604 U CN 202323595604U CN 221536186 U CN221536186 U CN 221536186U
Authority
CN
China
Prior art keywords
overflow
flange
reaction chamber
flow equalizing
reaction vessel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202323595604.9U
Other languages
Chinese (zh)
Inventor
章文军
闫潇
许信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Jingyi Automation Equipment Co Ltd
Original Assignee
Beijing Jingyi Automation Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Jingyi Automation Equipment Co Ltd filed Critical Beijing Jingyi Automation Equipment Co Ltd
Priority to CN202323595604.9U priority Critical patent/CN221536186U/en
Application granted granted Critical
Publication of CN221536186U publication Critical patent/CN221536186U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The application provides an overflow type reaction container and waste gas treatment equipment, and belongs to the technical field of waste gas treatment. The overflow-type reaction vessel includes: the container body is provided with a reaction chamber; the overflow flange is arranged on the container body, is provided with an overflow groove arranged along the circumferential direction of the reaction chamber, is provided with an overflow port and is communicated with the reaction chamber through the overflow port; the conveying pipeline is arranged on the overflow flange and communicated with the overflow groove and is used for conveying the protection medium into the overflow groove. According to the overflow type reaction container provided by the application, the flowing protection layer can be formed on the inner wall of the reaction chamber body through the protection medium, so that dust is not easy to adhere to the inner wall of the reaction chamber, heat in the reaction chamber can be absorbed through the flowing protection medium, the inner wall of the reaction chamber is not easy to be corroded by high temperature and chemical corrosion, and the service life is long.

Description

Overflow reaction vessel and waste gas treatment equipment
Technical Field
The application relates to the technical field of waste gas treatment, in particular to an overflow type reaction container and waste gas treatment equipment.
Background
In the process of producing semiconductor devices, waste gases such as silicon tetrahydride, hydrogen fluoride and the like are generated, and the waste gases are required to be discharged after being subjected to innocent treatment, so that the waste gases are prevented from polluting the atmosphere.
Currently, an exhaust gas treatment apparatus includes a reaction vessel, and in use, exhaust gas is fed into the reaction vessel, and oxidation treatment or the like is performed on the exhaust gas in the reaction vessel to reduce harmful substances in the exhaust gas.
However, there are many dust and particles which enter the reaction vessel along with the exhaust gas and adhere to the inner wall of the reaction vessel, and the problem of blockage inside the reaction vessel easily occurs after a long period of use. In addition, in the oxidation treatment process of the waste gas in the reaction vessel, chemical corrosion and high-temperature corrosion can be generated on the inner wall of the reaction vessel, so that the service life of the reaction vessel is shorter.
Disclosure of utility model
The application provides an overflow type reaction container and waste gas treatment equipment, which can form a flowing protection layer in a reaction chamber, are not easy to cause blockage, are not easy to corrode the inner wall of the reaction chamber, and have long service life.
In one aspect, the present application provides an overflow-type reaction vessel comprising: the container body is provided with a reaction chamber;
The overflow flange is arranged on the container body, is provided with an overflow groove arranged along the circumferential direction of the reaction chamber, and is provided with an overflow port of the overflow groove and communicated with the reaction chamber through the overflow port;
and the conveying pipeline is arranged on the overflow flange, is communicated with the overflow groove and is used for conveying the protective medium into the overflow groove.
In some embodiments, the overflow flange is provided with a flow equalizing part arranged along the circumferential direction of the overflow flange;
The flow equalizing part and the overflow flange are arranged at intervals, and a flow equalizing gap which communicates the overflow port with the reaction chamber is formed.
In some embodiments, the flow equalizing void includes a first void portion in communication with the overflow port and a second void portion in communication with the reaction chamber, the first void portion having a width greater than a width of the second void portion.
In some embodiments, the flow equalizing flange further comprises a protective liner arranged on the flow equalizing flange;
The protection inner container is arranged with the inner wall of the overflow flange at intervals, and the flow equalizing gap is arranged between the protection inner container and the overflow flange.
In some embodiments, the delivery line is oriented tangentially to the isopipe.
In some embodiments, the number of the conveying pipelines is a plurality, and the conveying pipelines are uniformly arranged along the circumferential direction of the overflow trough.
In some embodiments, the container body comprises:
An outer housing;
The inner shell is sleeved on the inner side of the outer shell, and a cooling cavity is formed between the inner shell and the outer shell;
The outer shell and the inner shell are positioned at the end part of the same side and are connected with the fixing flange together;
The input pipeline is arranged on the outer shell and is communicated with the cooling cavity;
the output pipeline is arranged on the outer shell and is communicated with the cooling cavity;
The inner side of the inner shell is the reaction chamber, and the overflow flange is arranged on one of the fixing flanges.
In some embodiments, the inlet line is oriented tangentially to the cooling chamber.
In some embodiments, the outer housing is provided with a connector for securing a temperature sensing device.
In another aspect, the present application provides an exhaust gas treatment apparatus comprising:
An exhaust gas delivery pipe;
the overflow reactor vessel of any of the first aspect and its alternative embodiments, wherein the off-gas delivery conduit communicates with the reaction chamber.
In the overflow type reaction container and the waste gas treatment equipment provided by the application, when the overflow type reaction container is in use, the flowing protection layer can be formed on the inner wall of the reaction chamber body through the protection medium, so that dust is not easy to adhere to the inner wall of the reaction chamber, heat in the reaction chamber can be absorbed through the flowing protection medium, the inner wall of the reaction chamber is not easy to be corroded by high temperature and chemical corrosion, and the service life is long.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
FIG. 1 is a schematic diagram of an overflow-type reaction vessel according to an embodiment of the present application;
FIG. 2 is a cross-sectional view of an overflow reaction vessel in an embodiment of the application;
FIG. 3 is an enlarged view of FIG. 2 at A;
FIG. 4 is a partial exploded view of an overflow type reaction vessel according to an embodiment of the present application.
Reference numerals illustrate:
100. A container body; 101. a reaction chamber; 102. a cooling chamber; 110. an outer housing; 111. a connecting column; 120. an inner housing; 130. a fixed flange; 140. an input pipeline; 150. an output line;
200. an overflow flange; 201. an overflow trough; 202. an overflow port;
300. A delivery line;
400. a flow equalizing flange; 410. a flow equalizing part; 401. flow equalizing gaps; 401a, a first flow equalizing gap; 401b, a second flow equalizing gap;
500. A protective liner;
600. a caliper;
700. and (3) sealing rings.
Specific embodiments of the present application have been shown by way of the above drawings and will be described in more detail below. The drawings and the written description are not intended to limit the scope of the inventive concepts in any way, but rather to illustrate the inventive concepts to those skilled in the art by reference to the specific embodiments.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the application. Rather, they are merely examples of apparatus and methods consistent with aspects of the application as detailed in the accompanying claims.
FIG. 1 is a schematic diagram of an overflow-type reaction vessel according to an embodiment of the present application; FIG. 2 is a cross-sectional view of an overflow reaction vessel in an embodiment of the application; fig. 3 is an enlarged view at a in fig. 2.
Referring to fig. 1 to 3, an embodiment of the present application provides an overflow type reaction vessel including a vessel body 100, an overflow flange 200, and a transfer line 300. The vessel body 100 is provided with a reaction chamber 101. The overflow flange 200 is provided on the vessel body 100, and is provided with an overflow groove 201, and the overflow groove 201 is provided with an overflow port 202 provided along the circumferential direction of the reaction chamber 101, and is communicated with the reaction chamber 101 through the overflow port 202. The delivery line 300 is disposed on the overflow flange 200 and communicates with the overflow trough 201 for delivering a protective medium into the overflow trough 201.
Wherein, the container body 100 may have a cylindrical structure, and the container body 100 is vertically placed in actual use. The top end of the container body 100 serves as an air inlet for introducing exhaust gas into the reaction chamber 101, and the bottom end of the container body 100 serves as an air outlet for discharging the exhaust gas treated in the reaction chamber 101.
The overflow flange 200 may be disposed at the top end of the container body 100, and may be an annular structure adapted to the container body 100, the overflow trough 201 may also be correspondingly disposed in an annular shape, and the overflow port 202 of the overflow trough 201 may be disposed upwards.
In use, one end of the delivery line 300 is connected to a delivery pump for the protective medium, which delivers the protective medium through the delivery line 300 into the isopipe 201. When the protection medium fills the overflow trough 201, it flows out through the overflow port 202 and down the inner wall of the overflow flange 200 and the inner wall of the reaction chamber 101, thereby forming a flow protection layer on the inner wall of the reaction chamber 101. Optionally, the protective medium is circulating water.
In some embodiments, when isopipe 201 is annular, delivery line 300 may be oriented tangentially to isopipe 201. When the protective medium enters the overflow groove 201, the protective medium can flow around the annular direction of the overflow groove 201, and is not easy to flow out through the overflow port 202, so that the protective medium overflows from the overflow port 202 more uniformly, and the thickness uniformity of the flowing protective layer is improved.
In some embodiments, the number of transfer lines 300 may be multiple and evenly arranged along the perimeter side of the overflow flange 200. Referring to fig. 1, the number of the conveying pipelines 300 is four, and each conveying pipeline 300 is arranged along the tangential direction of the overflow trough 201, so that the protective medium can be conveyed into the overflow trough 201 through the four conveying pipelines 300 at the same time, and the uniformity of the flowing protective layer is further improved.
By forming the flowing protection layer on the inner wall of the reaction chamber 101, on one hand, the problem of blockage caused by the adhesion of dust and particles carried by the waste gas to the inner wall of the reaction chamber 101 can be reduced, on the other hand, the waste gas can be prevented from directly contacting with the reaction chamber 101, and meanwhile, the temperature of the inner wall of the reaction chamber 101 can be reduced by flowing protection medium, so that the chemical corrosion and the high-temperature corrosion to the inner wall of the reaction chamber 101 are reduced, and the service life is prolonged.
FIG. 4 is a partial exploded view of an overflow type reaction vessel according to an embodiment of the present application.
Referring to fig. 1 to 4, in some embodiments, the overflow type reaction vessel may further include a flow equalizing flange 400 disposed at the overflow flange 200, and provided with a flow equalizing portion 410 disposed along a circumferential direction of the overflow flange 200. Wherein, the flow equalizing portion 410 is spaced apart from the overflow flange 200, and forms a flow equalizing gap 401 for communicating the overflow port 202 with the reaction chamber 101.
The flow equalizing flange 400 can also have an annular structure, the flow equalizing flange 400 can be embedded at the top of the overflow flange 200, and a sealing ring 700 is arranged between the flow equalizing flange 400 and the overflow flange 200, so that the tightness of the joint of the flow equalizing flange 400 and the overflow flange 200 is ensured.
Referring to fig. 3, the flow equalizing flange 400 has a groove opposite to the overflow groove 201, and the flow equalizing portion 410 may be formed by extending a portion of the flow equalizing flange 400 downward to the inner side of the overflow flange 200, so that a flow equalizing gap 401 is formed between the flow equalizing portion 410 and the overflow flange 200, and the flow equalizing gap 401 can communicate the overflow port 202 with the reaction chamber 101. After the protective medium flows out from the overflow port 202, the protective medium firstly enters the flow equalizing gap 401 and then flows downwards into the reaction chamber 101, so that the direction of the protective medium flowing out from the overflow port 202 can be limited, the protective medium can be guided, and the protective medium is ensured to be adhered to the inner wall of the reaction chamber 101 to flow so as to form a flowing protective layer.
In some embodiments, the flow equalizing void 401 may include a first void portion 401a in communication with the overflow port 202 and a second void portion 401b in communication with the reaction chamber, the first void portion 401a having a width greater than the second void portion 401 b.
Optionally, the flow equalizing portion 410 may be provided with a flow equalizing groove disposed in a direction away from the inner wall of the overflow flange 200, a first void portion 401a is formed between the flow equalizing groove and the inner wall of the overflow flange 200, and a second void portion 401b is formed between a portion of the flow equalizing portion 410 below the flow equalizing groove and the inner wall of the overflow flange 200, so that the width of the first void portion 401a is greater than the width of the second void portion 401 b. When the protection medium passes through the flow equalizing gap 401, the protection medium firstly enters the first gap portion 401a for convergence, and then flows out through the second gap portion 401b, so that the protection medium can be more uniform in flowing out.
In some embodiments, the flow equalizing flange 400 further includes a protective liner 500. Wherein, the protection liner 500 is disposed at an interval with the inner wall of the overflow flange 200, and the flow equalizing gap 401 is disposed between the protection liner 500 and the overflow flange 200.
The protective liner 500 has a ring structure, and the protective liner 500 can be made of corrosion-resistant materials such as stainless steel or high-quality steel. The bottom end of the protective liner 500 is lower than the bottom end of the flow guiding part of the flow equalizing flange 400, so that the flow equalizing gap 401 is located between the protective liner 500 and the overflow flange 200. The actual length of the protective liner 500 may be adjusted according to the composition of the exhaust gas, the temperature requirement in the reaction chamber 101, the heat source, etc.
In practical application, the exhaust gas carries high temperature when entering the reaction chamber 101, so that the protective liner 500 can avoid the high temperature from affecting the formation of the flowing protective layer, and can also avoid the protective medium from sputtering outside the reaction chamber 101 when flowing out of the flow equalizing gap 401.
In some embodiments, the container body 100 may include: an outer housing 110, an inner housing 120, a fixed flange 130, an input pipe 140, and an output pipe 150. The inner housing 120 is sleeved on the inner side of the outer housing 110, and forms a cooling chamber 102 with the outer housing 110. The number of the fixing flanges 130 is at least two, and the end portions of the outer case 110 on the same side as the inner case 120 are commonly connected to the fixing flanges 130. An inlet line 140 is provided to the outer housing 110 and communicates with the cooling chamber 102. An output line 150 is provided to the outer housing 110 and communicates with the cooling chamber 102. The inner side of the inner housing 120 is a reaction chamber 101, and the overflow flange 200 is disposed on one of the fixing flanges 130.
Alternatively, the outer casing 110 and the inner casing 120 are both cylindrical, the outer diameter of the inner casing 120 is smaller than the inner diameter of the outer casing 110, and the inner casing 120 is sleeved on the inner side of the outer casing 110, so that a cooling chamber 102 is formed between the inner casing 120 and the outer casing 110. The two fixing flanges 130 are respectively disposed on the upper and lower sides of the outer housing 110 and the inner housing 120, and the outer housing 110, the inner housing 120 and the fixing flanges 130 can be connected by welding. In practical use, the fixing flange 130 may be provided with a positioning groove for positioning the relative positions of the outer housing 110 and the inner housing 120, which is not described in detail in this embodiment.
The overflow flange 200 may be provided to the upper fixing flange 130, alternatively, the overflow flange 200 and the fixing flange 130 are connected and fixed by the caliper 600. A sealing ring 700 may be provided between the overflow flange 200 and the fixing flange 130 to ensure tightness between the overflow flange 200 and the fixing flange 130.
In use, one end of the input pipeline 140 is used for being connected with a delivery pump of the cooling medium, so that the cooling medium can be delivered into the cooling chamber 102 through the input pipeline 140, and after passing through the cooling chamber 102, the cooling medium flows out through the output pipeline 150, so that the heat in the reaction chamber 101 can be absorbed by the cooling medium, and the high-temperature corrosion on the inner wall of the reaction chamber 101 is further reduced. Optionally, the cooling medium is circulating water.
Optionally, the input pipe 140 is disposed at the bottom of the outer casing 110, and the output pipe 150 is disposed at the top of the outer casing 110, so that the flow direction of the cooling medium is opposite to the direction of the exhaust gas passing through the reaction chamber 101, and the heat absorption efficiency is improved. In some embodiments, the input line 140 may be oriented tangentially to the cooling chamber 102. The cooling medium is caused to rotate about the axis of the outer housing 110 as it enters the cooling chamber 102, enabling the cooling medium to sufficiently flow within the cooling chamber 102.
In some embodiments, the outer housing 110 may be provided with a connector for securing the temperature sensing device. So that the temperature of the vessel body 100 can be detected in real time to ensure stable operation of the overflow type reaction vessel. Alternatively, the connecting member is a connecting post 111, and a threaded hole may be provided on the connecting post 111 to fix the temperature detecting device through the threaded hole.
The embodiment of the application also provides an exhaust gas treatment device, which comprises an exhaust gas conveying pipeline (not shown in the figure) and the overflow type reaction container in the embodiment.
Wherein the exhaust gas delivery pipe communicates with the reaction chamber 101 to deliver exhaust gas generated in the production of semiconductor devices into the reaction chamber 101. During the exhaust gas treatment, the protecting medium flows out through the overflow port 202 and the flow equalizing gap 401, and forms a flowing protecting layer on the inner wall of the reaction chamber 101, so that the adhesion of dust or particles can be avoided, and the temperature of the inner wall of the reaction chamber 101 can be reduced. Meanwhile, the cooling medium which circularly flows is arranged in the cooling chamber 102 between the outer shell 110 and the inner shell 120, so that heat in the reaction chamber 101 is further absorbed, chemical corrosion and high-temperature corrosion on the inner wall of the reaction chamber 101 can be reduced, and the service life is prolonged.
The foregoing has outlined rather broadly the more detailed description of embodiments of the application in order that the detailed description of the principles and embodiments of the application may be implemented in conjunction with the detailed description of embodiments of the application that follows. Meanwhile, based on the idea of the present application, those skilled in the art can make changes or modifications on the specific embodiments and application scope of the present application, which belong to the protection scope of the present application. In view of the foregoing, this description should not be construed as limiting the application.

Claims (10)

1. An overflow-type reaction vessel, comprising:
The container body is provided with a reaction chamber;
The overflow flange is arranged on the container body and is provided with an overflow groove arranged along the circumferential direction of the reaction chamber, and the overflow groove is provided with an overflow port and is communicated with the reaction chamber through the overflow port;
and the conveying pipeline is arranged on the overflow flange, is communicated with the overflow groove and is used for conveying the protective medium into the overflow groove.
2. The overflow type reaction vessel according to claim 1, further comprising a flow equalizing flange provided to the overflow flange, and provided with a flow equalizing portion provided along a circumferential direction of the overflow flange;
The flow equalizing part and the overflow flange are arranged at intervals, and a flow equalizing gap which communicates the overflow port with the reaction chamber is formed.
3. The overflow type reaction vessel of claim 2, wherein the flow equalizing void includes a first void portion and a second void portion, the first void portion being in communication with the overflow port, the second void portion being in communication with the reaction chamber, the first void portion having a width greater than a width of the second void portion.
4. The overflow type reaction vessel of claim 2, further comprising a protective liner disposed on the flow equalizing flange;
The protection inner container is arranged with the inner wall of the overflow flange at intervals, and the flow equalizing gap is arranged between the protection inner container and the overflow flange.
5. The overflow reactor vessel of any of claims 1-4, wherein the transfer line is oriented tangentially to the overflow trough.
6. The overflow type reaction vessel as claimed in claim 5, wherein the number of the transfer lines is plural and is uniformly arranged in a circumferential direction of the overflow tank.
7. The overflow reaction vessel of any of claims 1-4, wherein the vessel body comprises:
An outer housing;
The inner shell is sleeved on the inner side of the outer shell, and a cooling cavity is formed between the inner shell and the outer shell;
The outer shell and the inner shell are positioned at the end part of the same side and are connected with the fixing flange together;
The input pipeline is arranged on the outer shell and is communicated with the cooling cavity;
the output pipeline is arranged on the outer shell and is communicated with the cooling cavity;
The inner side of the inner shell is the reaction chamber, and the overflow flange is arranged on one of the fixing flanges.
8. The overflow reaction vessel of claim 7 wherein the inlet line is oriented tangentially to the cooling chamber.
9. The overflow type reaction vessel as claimed in claim 7, wherein the outer case is provided with a connection member for fixing the temperature detecting means.
10. An exhaust gas treatment device, comprising:
An exhaust gas delivery pipe;
The overflow reactor vessel of any of claims 1-9, wherein the waste gas transfer conduit communicates with the reaction chamber.
CN202323595604.9U 2023-12-27 2023-12-27 Overflow reaction vessel and waste gas treatment equipment Active CN221536186U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202323595604.9U CN221536186U (en) 2023-12-27 2023-12-27 Overflow reaction vessel and waste gas treatment equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202323595604.9U CN221536186U (en) 2023-12-27 2023-12-27 Overflow reaction vessel and waste gas treatment equipment

Publications (1)

Publication Number Publication Date
CN221536186U true CN221536186U (en) 2024-08-16

Family

ID=92221468

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202323595604.9U Active CN221536186U (en) 2023-12-27 2023-12-27 Overflow reaction vessel and waste gas treatment equipment

Country Status (1)

Country Link
CN (1) CN221536186U (en)

Similar Documents

Publication Publication Date Title
JP4592746B2 (en) Semiconductor manufacturing apparatus, semiconductor device manufacturing method, and exhaust trap apparatus
CN101338983A (en) Heat exchanger
CN114420604A (en) Process chamber assembly, semiconductor processing equipment and method thereof
CN221536186U (en) Overflow reaction vessel and waste gas treatment equipment
CN101655312A (en) Water cooling device and method of rotary kiln shell
JPH11264676A (en) Fluid cooler and cooling method
CN110756119A (en) Continuous hydrogenation reaction device with hydrogen distributor and process
CN106277184A (en) High flow rate is pressed ion-exchange unit
CN221536185U (en) Gas reaction vessel and exhaust gas treatment device
CN218689258U (en) Inorganic membrane reactor of chloroethylene
CN214598207U (en) Falling film absorber
CN116651329A (en) Gas distributor and bubble column of double-ring distribution pipe of anti-backflow
CN112391611A (en) Plasma enhanced atomic layer deposition coating device
EP4023989A1 (en) High-temperature fluid transporting pipeline with heat exchange apparatus installed therein, suitable heat exchange apparatus and heat exchange method
CN213051802U (en) Silicon wafer cleaning water supply system
CN112030229B (en) Tail gas purification device and semiconductor process system
CN214936050U (en) A hydrogen production device
CN209138287U (en) Falling liquid film reacts header structure
CN207347524U (en) A kind of biomass gasifying furnace water cooling equipment
CN205392369U (en) Organosilicon heat pipe fluidized bed reactor
CN111947450A (en) Semiconductor chamber and annealing device
CN214810707U (en) Large Polymerization Loop Reactor
CN219913093U (en) Air inlet end cover, air inlet assembly and tail gas treatment device
CN223016959U (en) Furnace tube
KR102860223B1 (en) Heating Pipe

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant