CN221573915U - Radiating plate, packaging structure of power module and radiating module - Google Patents

Abstract

The application discloses a heat radiation plate, a packaging structure of a power module and a heat radiation module, wherein the heat radiation plate comprises a bottom plate, the bottom plate is provided with a first surface and a second surface which are opposite, and a heat radiation object is arranged on the second surface; the heat dissipation column protrudes from the first surface of the bottom plate; the enclosure is positioned on the first surface of the bottom plate and surrounds the edge of the bottom plate to form a containing cavity, and the heat dissipation column is positioned in the containing cavity; the enclosure is further provided with an inlet and an outlet, and a turbulence structure is arranged in a local or whole area of at least one side of the accommodating cavity. The heat radiation design has larger heat radiation area and better heat radiation capacity, and can be suitable for power devices with higher heat productivity, so that the corresponding power module can realize higher current output capacity.

Description

Radiating plate, packaging structure of power module and radiating module

Technical Field

The present utility model relates to the field of heat dissipation technologies, and in particular, to a heat dissipation plate, a packaging structure of a power module, and a heat dissipation module.

Background

The power module radiator is a key component for effectively reducing the temperature of the power module and ensuring the normal operation of the power module. With the increasing power density of electronic devices, the heat generated by the power module is also increasing. The traditional heat dissipation mode mainly depends on the combination of the heat dissipation fins and the fans, but due to the small size and high density of the power module, the traditional heat dissipation device cannot meet the heat dissipation requirement. Therefore, improving the heat dissipation performance of the power module becomes a key technical problem.

In recent years, some novel power module radiator technologies have been widely used. For example, the heat radiator is manufactured by adopting a multilayer board technology and a high heat conduction material, so that the heat conduction performance of the power module can be effectively improved. In addition, by using methods such as liquid cooling technology, efficient heat dissipation can be realized in a small space, so that the heat dissipation requirement of the power module is met, and space can be saved. However, the existing liquid cooling heat dissipation plate has the defects of complex flow channel structure, high processing difficulty and high cost, and has higher requirements on an external pressure pump and pipelines, and relatively insufficient heat dissipation capacity, so that the requirement of high-power long-time operation of products is difficult to meet. The existing multi-module liquid cooling heat dissipation usually adopts a serial connection mode, the temperature difference between the power modules at the inlet and the outlet is larger, and when the power modules are used in parallel, the temperature of the power modules at the outlet is higher, so that the current output capacity of the product is greatly limited.

Therefore, how to enhance the heat dissipation capability of the heat dissipation plate and reduce the requirement on the peripheral water pump structure is a problem to be solved in the present stage.

Disclosure of utility model

Therefore, the present utility model is directed to a heat dissipating plate, a package structure of a power module, and a heat dissipating module, so as to improve heat dissipating capability and performance of the corresponding power module.

According to an aspect of the present invention, there is provided a heat dissipating plate including: a base plate having opposite first and second surfaces, the second surface being provided with a heat dissipating object; the heat dissipation column protrudes out of the first surface of the bottom plate; the enclosure is positioned on the first surface of the bottom plate and surrounds the edge of the bottom plate to form a containing cavity, and the heat dissipation column is positioned in the containing cavity; the enclosure is further provided with an inlet and an outlet, and a turbulence structure is arranged in a local or whole area of at least one side of the accommodating cavity.

Optionally, the enclosure includes a first side and a second side opposite to each other, the inlet is located on the first side, the outlet is located on the second side, and positions of the inlet and the outlet are interchangeable; the enclosure further comprises a third side edge and a fourth side edge which are oppositely arranged, and the third side edge and the fourth side edge are perpendicular to the first side edge and the second side edge.

Optionally, the spoiler structure includes a first spoiler structure and a second spoiler structure, the first spoiler structure is located on the first side and/or the second side, and the second spoiler structure is located on the third side and/or the fourth side.

Optionally, a minimum distance between the first side edge or the second side edge and the center of the heat dissipation post is 0.5mm-10mm.

Optionally, the turbulence structure is zigzag.

Optionally, the turbulence structure comprises a plurality of tooth structures, and a cross section of each tooth structure comprises at least one of ellipse, semicircle and polygon.

Optionally, the flow-disturbing structure is arranged adjacent to the inlet and/or the outlet.

Optionally, the cross-sectional shape of the heat dissipation post includes one of diamond, circle, ellipse, polygon.

Optionally, the heat dissipation columns include a plurality of, a plurality of the heat dissipation columns are evenly arranged in an array or unevenly arranged, and the center-to-center distance between adjacent heat dissipation columns is 0.1mm-5mm.

When the section of the heat dissipation column is diamond, two ends of a diagonal line of the diamond point to the inlet side and the outlet side respectively; when the cross section of the heat dissipation column is elliptical, two ends of the major axis of the ellipse point to the inlet side and the outlet side respectively.

The heat dissipation plate comprises a plurality of heat dissipation columns, wherein the plurality of heat dissipation columns are arranged in an array mode, gaps among the plurality of heat dissipation columns form a flow channel from the inlet to the outlet, and the shape of the flow channel comprises at least one of a straight line shape, an arc shape, a folded line shape and a snake shape.

Optionally, the flow channels include a plurality of flow channels, and the plurality of flow channels are parallel to each other.

Optionally, the liquid enters the accommodating cavity from the inlet of the enclosure and flows out from the outlet of the enclosure.

According to another aspect of the present invention, there is provided a package structure of a power module, including: a substrate comprising opposing first and second surfaces; a power device electrically connected to the second surface of the substrate; the heat dissipation plate comprises a bottom plate, a heat dissipation column and a surrounding baffle, wherein the bottom plate is provided with a first surface and a second surface which are opposite, and the second surface of the bottom plate is connected with the first surface of the substrate; the heat dissipation column protrudes out of the first surface of the bottom plate; the enclosure is positioned on the first surface of the bottom plate and surrounds the edge of the bottom plate to form a containing cavity, and the heat dissipation column is positioned in the containing cavity; the enclosure is also provided with an inlet and an outlet, and a turbulence structure is arranged in a partial or whole area of at least one side of the accommodating cavity; a power terminal and a signal terminal electrically connected to the second surface of the substrate; and a housing covering the substrate and the power device and exposing a first surface of the heat dissipation plate, portions of the power terminals and the signal terminals being exposed from the housing.

Optionally, the enclosure includes a first side and a second side opposite to each other, the inlet is located on the first side, the outlet is located on the second side, and positions of the inlet and the outlet are interchangeable; the enclosure further comprises a third side edge and a fourth side edge which are oppositely arranged, and the third side edge and the fourth side edge are perpendicular to the first side edge and the second side edge.

Optionally, the spoiler structure includes a first spoiler structure and a second spoiler structure, the first spoiler structure is located on the first side and/or the second side, and the second spoiler structure is located on the third side and/or the fourth side.

Optionally, a minimum distance between the first side edge or the second side edge and the center of the heat dissipation post is 0.5mm-10mm.

Optionally, the turbulence structure is zigzag.

Optionally, the turbulence structure comprises a plurality of tooth structures, and a cross section of each tooth structure comprises at least one of ellipse, semicircle and polygon.

Optionally, the flow-disturbing structure is arranged adjacent to the inlet and/or the outlet.

Optionally, the cross-sectional shape of the heat dissipation post includes one of diamond, circle, ellipse, polygon.

Optionally, the heat dissipation columns include a plurality of, a plurality of the heat dissipation columns are evenly arranged in an array or unevenly arranged, and the center-to-center distance between adjacent heat dissipation columns is 0.1mm-5mm.

Optionally, when the cross section of the heat dissipation column is diamond, two ends of a diagonal line of the diamond point to the inlet side and the outlet side respectively; when the cross section of the heat dissipation column is elliptical, two ends of the major axis of the ellipse point to the inlet side and the outlet side respectively.

Optionally, the heat dissipation posts include a plurality of, a plurality of the heat dissipation post array is arranged, a plurality of gaps between the heat dissipation posts form a runner from the inlet to the outlet, and the runner includes at least one of a straight line shape, an arc shape, a folded line shape and a serpentine shape.

Optionally, the flow channels include a plurality of flow channels, and the plurality of flow channels are parallel to each other.

Optionally, the liquid enters the accommodating cavity from the inlet of the enclosure and flows out from the outlet of the enclosure.

According to still another aspect of the present invention, there is provided a heat dissipating module including: at least two of the above-described power module packages, each having separate inlets and outlets; the first pipeline is connected with the inlets of all the packaging structures, and the second pipeline is connected with the outlets of all the packaging structures so that a plurality of the packaging structures are connected in parallel.

Optionally, the enclosure includes a first side and a second side opposite to each other, the inlet is located on the first side, the outlet is located on the second side, and positions of the inlet and the outlet are interchangeable; the first side and the second side are parallel to the first conduit and the second conduit.

The utility model has the beneficial effects that:

According to the radiating plate, the packaging structure of the power module and the radiating module, the radiating column is arranged on the bottom plate of the radiating plate and is surrounded by the surrounding baffle, so that the radiating column is positioned in the accommodating cavity; the liquid flows into the accommodating cavity from the inlet, flows out from the outlet after passing through the heat dissipation column, and the heat dissipation design has larger heat dissipation area and better heat dissipation capacity, and is applicable to power devices with higher heating value, so that the corresponding power module can realize higher current output capacity.

For the packaging structure of a single power module, the heat dissipation column layout comprises uniformly distributed and non-uniformly distributed schemes, wherein the tightly uniformly distributed scheme increases the convection heat dissipation capacity by increasing the heat dissipation surface; the non-uniform distribution scheme can realize uniform temperature design among heat dissipation objects by increasing heat dissipation area of the heat concentration area. Further, the turbulence design of the inlet and the outlet further optimizes the liquid distribution of the heat dissipation surface, thereby optimizing the uniformity of heat dissipation inside the package structure of the single power module.

The heat dissipation column has lower flow resistance, can reduce the configuration requirement on the peripheral pressure pump, and simplifies and reduces the peripheral water pump structure. The heat radiation module adopts the parallel design, so that the temperature difference between liquid outlet and liquid inlet can be effectively reduced, the temperature uniformity among all power modules in the heat radiation module is improved, and the overall current output capacity of the heat radiation module is improved.

For the heat radiation modules with the plurality of power modules connected in parallel, the heat radiation difference placed side by side is reduced through the parallel layout, and the heat radiation effect of the single power module is improved, so that the more excellent heat radiation effect is obtained.

Drawings

The above and other objects, features and advantages of the present utility model will become more apparent from the following description of embodiments of the present utility model with reference to the accompanying drawings.

Fig. 1 shows a perspective view of a package structure of a first embodiment of the present utility model;

fig. 2 shows a front view of a package structure of a first embodiment of the present utility model;

FIG. 3 shows an enlarged partial schematic view of a package structure according to a first embodiment of the present utility model;

fig. 4 shows a front view of a package structure of a second embodiment of the present utility model;

fig. 5 shows a front view of a package structure of a third embodiment of the present utility model;

FIG. 6 is a schematic diagram showing the flow of liquid inside a conventional heat dissipation module;

fig. 7 shows a schematic diagram of the flow direction of the liquid inside the heat dissipation module of the present utility model.

Detailed Description

Various embodiments of the present utility model will be described in more detail below with reference to the accompanying drawings. The same reference numbers will be used throughout the drawings to refer to the same or like parts. For clarity, the various features of the drawings are not drawn to scale.

The utility model will be further described with reference to the drawings and examples.

Fig. 1 shows a perspective view of a package structure of a first embodiment of the present utility model; the package structure includes a heat dissipation plate 100, a case 200, a substrate, a power device, a power terminal 301, and a signal terminal 302, wherein the power device is shielded by the heat dissipation plate 100 and is not visible by the case 200, and the power device includes MOS, IGBT, FRD, and the like, for example. Specifically, the substrate includes opposing first and second surfaces; the power device is electrically connected with the second surface of the substrate, and the heat dissipation plate 100 is connected with the first surface of the substrate; the power terminal 301 and the signal terminal 302 are electrically connected to the second surface of the substrate, respectively; the housing covers the substrate and the power device and exposes the first surface of the heat dissipation plate 100; portions of the power terminals 301 and the signal terminals 302 are exposed from the housing 200.

Compared with the existing way of connecting the heat dissipation plate with the power module through bolts and sealant, the package structure of the first embodiment is formed by wrapping each part with the housing 200, and the integrated package structure has more excellent performances of high humidity resistance, high voltage resistance, high corrosion resistance, high stress impact resistance and the like.

Further, the heat dissipating plate 100 includes a base plate 110, the base plate 110 having opposite first and second surfaces, the second surface of the base plate 110 being connected to the first surface of the substrate, for example, to conduct heat of the power device to the base plate 110. The substrate is, for example, an AMB (ACTIVE METAL Brazing ) substrate or a DBC (Direct Bond Copper, direct copper-clad) substrate.

The first surface of the bottom plate 110 is provided with a plurality of heat dissipation columns 120, the heat dissipation columns 120 protrude from the first surface of the bottom plate 110, the heat dissipation columns 120 include a plurality of heat dissipation columns 120 arranged in an array to increase a heat dissipation area, and further, the heat dissipation columns 120 also play a role in guiding flow. The first surface of the base plate 110 is further provided with a fence 130, the fence 130 surrounds the edge of the base plate 110 to form a containing cavity in the fence 130, and the height of the fence 130 is not smaller than that of the heat dissipation post 120, for example, and the heat dissipation post 120 is located in the containing cavity. Specifically, the bottom plate 110 is, for example, rectangular, the enclosure 130 is, for example, a rectangular frame, the enclosure 130 includes a first side and a second side opposite to each other, and a third side and a fourth side perpendicular to the first side and the second side, the first side of the enclosure 130 is provided with an inlet 131, the second side of the enclosure 130 is provided with an outlet 132, positions of the inlet 131 and the outlet 132 are interchangeable, and sizes and positions of the inlet 131 and the outlet 132 are adjustable as required, so that liquid flows into the accommodating chamber from the inlet 131 and flows out from the outlet 132 after passing through the heat dissipation column 120. Further, the side wall of the enclosure 130 facing the accommodating cavity is further provided with a turbulence structure 140, and the turbulence structure 140 is matched with the heat dissipation column 120, so that the flow and the flow velocity of the liquid in the accommodating cavity are distributed more uniformly, the flow equalizing effect is realized, the flow difference of different areas is reduced, and the overall heat dissipation capacity and heat dissipation uniformity are enhanced.

Fig. 2 shows a front view of a package structure of a first embodiment of the present utility model; as can be seen from fig. 2, the plurality of heat dissipation columns 120 are arranged in an array, a certain distance is provided between the heat dissipation columns and the first side edge and the second side edge of the enclosure 130, a turbulence structure 140 is arranged on the side wall of the enclosure 130 facing the accommodating cavity, and the distance and the size of the turbulence structure 140 correspond to those of the heat dissipation columns 120; the turbulence structure 140 includes a first turbulence structure 141 disposed on the first side and the second side, and a second turbulence structure 142 disposed on the third side and the fourth side, wherein the first turbulence structure 141 is, for example, a triangular rib, and the first turbulence structure 141 is mainly used for turbulence of the inlet 131 and the outlet 132, so as to enhance the uniform velocity and the uniform flow effect of the liquid, and in particular, the first turbulence structure 141 is not disposed on the inlet 131 and the outlet 132, and may be disposed near the inlet 131 and the outlet 132, i.e., the first turbulence structure 141 is disposed adjacent to the inlet 131 and the outlet 132, so as to improve the flow and the flow uniformity of the inlet 131 and the outlet 132. The second turbulence structures 142 are, for example, comb-teeth-shaped, and the second turbulence structures 142 are configured to cooperate with the heat dissipation columns 120 at the edges of the array to increase the heat dissipation area and the flow resistance of the liquid at the edges of the enclosure 130, so that the liquid flows through the middle area corresponding to the heat source as much as possible. Further, the turbulence structure 140 may include a plurality of tooth structures, and the cross-sectional shape of each tooth structure includes at least one of a zigzag shape, such as an ellipse, a semicircle, and a polygon, where the turbulence structure 140 is used to increase the flow resistance of the edge of the enclosure 130, and ensure that the liquid flows uniformly from the middle area of the heat dissipation post as much as possible, so as to ensure the uniformity of heat dissipation of the power device. In other embodiments, the first spoiler structure 141 may be disposed only on the first side or the second side, the second spoiler structure 142 may be disposed only on the third side or the fourth side, and the spoiler structure on each side may be disposed only in a partial area or a whole area of the side.

FIG. 3 shows an enlarged partial schematic view of the dashed box area in FIG. 2; as can be seen from fig. 3, the heat dissipation post 120 has a diamond-shaped cross section, and two diagonal ends of the diamond-shaped cross section are directed to the inlet 131 side and the outlet 132 side, respectively. Compared with a cylindrical structure, the diamond-shaped heat dissipation column 120 has larger heat resistance, so that phase-to-phase (one power module is in one phase, the inside of a single power module is in the phase, and the phase-to-phase flow difference can be controlled within 10 percent); the diamond-shaped heat dissipation columns 120 have larger heat dissipation areas in the phase and more turbulence ratios than triangular heat dissipation columns, and can achieve better heat dissipation effects in the phase. The plurality of heat dissipation columns 120 are uniformly arranged in an array, for example, a center-to-center distance d1 between adjacent heat dissipation columns 120 is 0.1mm to 5mm, and similarly, a minimum distance between the center of the heat dissipation column 120 and the third side or the fourth side (the side where the second turbulence structures 142 are located) of the enclosure 130 is also 0.1mm to 5mm, for example; the minimum distance d2 between the center of the heat dissipation post 120 and the first side (side of the inlet 131) of the enclosure 130 is, for example, 0.5mm to 10mm, and similarly, the minimum distance d2 between the heat dissipation post 120 and the second side (side of the outlet 132) of the enclosure 130 is, for example, also 0.5mm to 10mm. In other embodiments, the cross-sectional shape of the heat-dissipating stud 120 may be elliptical, with the major axis of the ellipse pointing toward the inlet 131 side and the outlet 132 side, respectively.

Fig. 4 shows a front view of a package structure of a second embodiment of the present utility model; the heat dissipation plate in the package structure of the second embodiment is different from the first embodiment, the cross section of the heat dissipation post 120 in the heat dissipation plate of the second embodiment is circular, and the heat dissipation posts 120 in the second embodiment are arranged in an array according to a specific pattern, specifically, the heat dissipation posts 120 are arranged in an overlapping manner, for example, according to an "F" shape, so as to form a runner 121 as shown by a dashed arrow in the figure, and the runner 121 is, for example, serpentine, so that the heat dissipation post 120 also has a partial flow guiding effect, a flow equalizing effect of liquid in the heat dissipation plate is improved, and heat dissipation consistency is ensured. Of course, the heat dissipation post 120 may form a plurality of flow channels 121 parallel to each other between the inlet 131 and the outlet 132, and the width of each flow channel 121 may be partially adjusted according to the distance between the flow channel and the inlet 131/outlet 132; further, the arrangement of the heat dissipation columns 120 and the gaps between the heat dissipation columns 120 may be controlled, so that the flow channels 121 arranged therein may have other shapes such as straight line, arc, and folded line, which will not be described herein. Of course, in this second embodiment, the side edge (the first side edge and/or the second side edge) where the inlet 131 and/or the outlet 132 are/is located may also be provided with the first turbulence structure 141.

Fig. 5 shows a front view of a package structure of a third embodiment of the present utility model; this third embodiment is similar to the first embodiment except that the heat dissipation post 120 of the heat dissipation plate has an elliptical cross-sectional shape, and further, both ends of the major axis of the ellipse are directed to the inlet 131 side and the outlet 132 side, respectively. Similarly, the cross-sectional shape of the heat dissipation post 120 may be circular, polygonal, or the like. The heat dissipation columns 120 in this embodiment are unevenly distributed, and the center-to-center spacing between adjacent heat dissipation columns 120 is, for example, 0.1mm-5mm, and more heat dissipation columns 120 are correspondingly disposed in the high temperature region of the power device. Of course, in this third embodiment, the side edge where the inlet 131 is located may also be provided with a turbulence structure.

FIG. 6 is a schematic diagram showing the flow of liquid inside a conventional heat dissipation module; the heat dissipation module comprises a packaging structure of a plurality of power modules, for example, the heat dissipation module comprises three power modules which are arranged in parallel along a straight line, the heat dissipation plates 101 in the power modules are also arranged in parallel along the straight line, the liquid inlets and outlets of the three heat dissipation plates 101 are connected in series along the direction of arranging in parallel (from left to right in fig. 6), the temperature of the liquid is gradually increased along with the increase of the distance from the inlets, the temperature difference between the liquid outlet and the liquid inlet is even more than 10 ℃, good heat dissipation cannot be realized, a large temperature difference exists between the power modules, and the current output capacity of the power modules at one side of the outlets is limited.

Fig. 7 shows a schematic diagram of the flow direction of the liquid inside the heat dissipation module of the present utility model. The heat dissipation module includes a plurality of power modules, for example, three power modules arranged in parallel along a straight line are also included in the heat dissipation module, the heat dissipation plates 100 in the power modules are also arranged in parallel along a straight line, each package structure has an independent inlet and an outlet, the heat dissipation module includes a first pipeline 410 and a second pipeline 420, wherein the first pipeline 410 includes a plurality of openings connected with the inlet of each heat dissipation plate 100, the second pipeline 420 also includes a plurality of openings connected with the outlet of each heat dissipation plate 100, and the first side and the second side of the heat dissipation plate 100 are parallel to the first pipeline 410 and the second pipeline 420, thereby realizing a parallel design. The parallel design can effectively reduce the temperature difference between liquid inlet and liquid outlet, reduce the temperature difference of each power module in the heat radiation module, realize uniform flow and flow velocity distribution inside the power modules and among the power modules, ensure that the temperature of each power module is more uniform, and obviously improve the overall current output capacity of the heat radiation module.

According to the radiating plate, the packaging structure of the power module and the radiating module, the radiating column is arranged on the bottom plate of the radiating plate and is surrounded by the surrounding baffle, so that the radiating column is positioned in the accommodating cavity; the liquid flows into the accommodating cavity from the inlet, flows out from the outlet after passing through the heat dissipation column, and the heat dissipation design has larger heat dissipation area and better heat dissipation capacity, and is applicable to power devices with higher heating value, so that the corresponding power module can realize higher current output capacity.

For the packaging structure of a single power module, the heat dissipation column layout comprises uniformly distributed and non-uniformly distributed schemes, wherein the tightly uniformly distributed scheme increases the convection heat dissipation capacity by increasing the heat dissipation surface; the non-uniform distribution scheme can realize uniform temperature design among heat dissipation objects by increasing heat dissipation area of the heat concentration area. Further, the turbulence design of the inlet and the outlet further optimizes the liquid distribution of the heat dissipation surface, thereby optimizing the uniformity of heat dissipation inside the package structure of the single power module.

The heat dissipation column has lower flow resistance, can reduce the configuration requirement on the peripheral pressure pump, and simplifies and reduces the peripheral water pump structure. The heat radiation module adopts the parallel design, so that the temperature difference between liquid outlet and liquid inlet can be effectively reduced, the temperature uniformity among all power modules in the heat radiation module is improved, and the overall current output capacity of the heat radiation module is improved.

For the heat radiation modules with the plurality of power modules connected in parallel, the heat radiation difference placed side by side is reduced through the parallel layout, and the heat radiation effect of the single power module is improved, so that the more excellent heat radiation effect is obtained.

It should be noted that in this document relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

Embodiments in accordance with the present utility model, as described above, are not intended to be exhaustive or to limit the utility model to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best utilize the utility model and various modifications as are suited to the particular use contemplated. The utility model is limited only by the claims and the full scope and equivalents thereof.

Claims (28)

1. A heat dissipation plate, characterized by comprising:

A base plate having opposite first and second surfaces, the second surface being provided with a heat dissipating object;

the heat dissipation column protrudes out of the first surface of the bottom plate;

The enclosure is positioned on the first surface of the bottom plate and surrounds the edge of the bottom plate to form a containing cavity, and the heat dissipation column is positioned in the containing cavity;

The enclosure is further provided with an inlet and an outlet, and a turbulence structure is arranged in a local or whole area of at least one side of the accommodating cavity.

2. The heat dissipating plate according to claim 1, wherein said enclosure includes opposite first and second sides, said inlet being located on said first side, said outlet being located on said second side, positions of said inlet and said outlet being interchangeable; the enclosure further comprises a third side edge and a fourth side edge which are oppositely arranged, and the third side edge and the fourth side edge are perpendicular to the first side edge and the second side edge.

3. The heat dissipating plate according to claim 2, wherein the spoiler structure includes a first spoiler structure and a second spoiler structure, the first spoiler structure being located at the first side and/or the second side, the second spoiler structure being located at the third side and/or the fourth side.

4. The heat dissipating plate according to claim 2, wherein a minimum distance between the first side or the second side and a center of the heat dissipating stud is 0.5mm to 10mm.

5. The heat dissipating plate according to claim 1, wherein the turbulence structures are zigzag-shaped.

6. The heat dissipating plate according to claim 5, wherein the turbulence structure includes a plurality of tooth structures, and a cross section of each tooth structure includes at least one of an ellipse, a semicircle, and a polygon.

7. The heat dissipating plate according to claim 1, wherein the turbulence structures are disposed adjacent to the inlet and/or the outlet.

8. The heat dissipating plate according to claim 2, wherein a cross-sectional shape of the heat dissipating stud includes one of a circle, an ellipse, and a polygon.

9. The heat dissipating plate according to claim 8, wherein the heat dissipating studs comprise a plurality of heat dissipating studs uniformly arranged in an array or non-uniformly arranged, and a center-to-center spacing between adjacent heat dissipating studs is 0.1mm to 5mm.

10. The heat dissipating plate according to claim 8, wherein when the cross-sectional shape of the heat dissipating stud is a diamond, both ends of a diagonal line of the diamond are directed to the inlet side and the outlet side, respectively; when the cross section of the heat dissipation column is elliptical, two ends of the major axis of the ellipse point to the inlet side and the outlet side respectively.

11. The heat dissipating plate according to claim 8, wherein said heat dissipating studs include a plurality of said heat dissipating studs arranged in an array, gaps between said plurality of heat dissipating studs forming flow paths from said inlet to said outlet, and wherein said flow paths have a shape including at least one of a straight line shape, an arcuate line shape, and a folded line shape.

12. The heat dissipating plate according to claim 11, wherein said flow path includes a plurality of said flow paths, and a plurality of said flow paths are parallel to each other.

13. The heat dissipating plate according to claim 1, wherein liquid enters the accommodating chamber from an inlet of the enclosure and flows out from an outlet of the enclosure.

14. A package structure of a power module, comprising:

A substrate comprising opposing first and second surfaces;

A power device electrically connected to the second surface of the substrate;

the heat dissipation plate comprises a bottom plate, a heat dissipation column and a surrounding baffle, wherein the bottom plate is provided with a first surface and a second surface which are opposite, and the second surface of the bottom plate is connected with the first surface of the substrate; the heat dissipation column protrudes out of the first surface of the bottom plate; the enclosure is positioned on the first surface of the bottom plate and surrounds the edge of the bottom plate to form a containing cavity, and the heat dissipation column is positioned in the containing cavity; the enclosure is also provided with an inlet and an outlet, and a turbulence structure is arranged in a partial or whole area of at least one side of the accommodating cavity;

A power terminal and a signal terminal electrically connected to the second surface of the substrate;

And a housing covering the substrate and the power device and exposing a first surface of the heat dissipation plate, portions of the power terminals and the signal terminals being exposed from the housing.

15. The package of claim 14, wherein the enclosure includes opposing first and second sides, the inlet being on the first side and the outlet being on the second side, the inlet and outlet being interchangeable in location; the enclosure further comprises a third side edge and a fourth side edge which are oppositely arranged, and the third side edge and the fourth side edge are perpendicular to the first side edge and the second side edge.

16. The package of claim 15, wherein the spoiler structure comprises a first spoiler structure and a second spoiler structure, the first spoiler structure being located at the first side and/or the second side, the second spoiler structure being located at the third side and/or the fourth side.

17. The package of claim 15, wherein a minimum spacing between the first side or the second side and the center of the heat spreader pillar is 0.5mm-10mm.

18. The package of claim 14, wherein the turbulence structures are zigzag-shaped.

19. The package of claim 18, wherein the turbulence structure comprises a plurality of teeth, each of the teeth having a cross-section comprising at least one of an ellipse, a semicircle, and a polygon.

20. The packaging structure of claim 14, wherein the flow disturbing structure is arranged adjacent to the inlet and/or the outlet.

21. The package structure of claim 15, wherein the cross-sectional shape of the heat spreader post comprises one of a circle, an oval, and a polygon.

22. The package structure of claim 21, wherein the heat dissipation posts comprise a plurality of heat dissipation posts, the plurality of heat dissipation posts are uniformly arranged in an array or non-uniformly arranged, and a center-to-center spacing between adjacent heat dissipation posts is 0.1mm-5mm.

23. The package structure according to claim 21, wherein when the cross-sectional shape of the heat dissipation post is a diamond, both ends of a diagonal line of the diamond point to the inlet side and the outlet side, respectively; when the cross section of the heat dissipation column is elliptical, two ends of the major axis of the ellipse point to the inlet side and the outlet side respectively.

24. The package structure of claim 21, wherein the heat dissipation posts comprise a plurality of the heat dissipation posts arranged in an array, and gaps between the plurality of the heat dissipation posts form a flow path from the inlet to the outlet, and the flow path has a shape including at least one of a straight line shape, a curved line shape, and a folded line shape.

25. The package of claim 24, wherein the flow channels comprise a plurality of flow channels, the plurality of flow channels being parallel to one another.

26. The package of claim 14, wherein liquid enters the containment chamber from an inlet of the enclosure and exits from an outlet of the enclosure.

27. A heat dissipation module, comprising:

At least two packaging structures of the power module according to any one of claims 14 to 26, a plurality of the packaging structures being arranged in an array, each of the packaging structures having a separate inlet and outlet;

The first pipeline is connected with the inlets of all the packaging structures, and the second pipeline is connected with the outlets of all the packaging structures so that a plurality of the packaging structures are connected in parallel.

28. The heat dissipating module of claim 27, wherein said enclosure includes first and second opposing sides, said inlet being on said first side and said outlet being on said second side, said inlet and said outlet being interchangeable in location; the first side and the second side are parallel to the first conduit and the second conduit.