CN221670101U - Small-size high-precision multilayer circuit board - Google Patents

Abstract

The utility model relates to the technical field of multilayer circuit boards, and discloses a small-volume high-precision multilayer circuit board which comprises a multilayer circuit board body and a heat dissipation seat, wherein the multilayer circuit board body comprises a substrate layer, three copper foil circuit layers and two insulating layers are respectively and alternately laminated on the upper surface and the lower surface of the substrate layer, and a conductive through hole, a conductive blind hole and a conductive buried hole are arranged on the multilayer circuit board body to interconnect the copper foil circuit layers; the mounting groove has been seted up at the top of heat dissipation seat, and the multilayer circuit board body can install in the mounting groove, is located the fixed subassembly that is equipped with around the mounting groove on the heat dissipation seat, and the inside heat dissipation chamber that is equipped with of heat dissipation seat, the lateral part in heat dissipation chamber are equipped with radiator fan, and the bottom in heat dissipation chamber is equipped with a plurality of rows of louvres, and the bottom surface and the side of heat dissipation seat are equipped with first fin and second fin all around respectively. The utility model has six interconnected circuit layers, has small volume, is convenient for wiring, greatly shortens the wiring length, and improves the integral heat dissipation effect by arranging the heat dissipation structure.

Description

A small volume and high precision multilayer circuit board

Technical Field

The utility model relates to the technical field of multilayer circuit boards, in particular to a small-volume and high-precision multilayer circuit board.

Background Art

Due to the need for high-speed circuits in the computer and aerospace industries, the packaging density is required to be further improved. In addition, the size of discrete components is reduced and microelectronics is developing rapidly. Electronic equipment is developing in the direction of reducing volume and reducing weight. Single-sided and double-sided printed boards are limited by available space and it is impossible to further increase the assembly density. Therefore, it is necessary to consider using multi-layer printed circuits with more layers and more precision than double-sided boards. In order to reduce the volume, multi-layer circuit boards require multi-layer wiring. Small-volume, high-precision multi-layer circuit boards have smaller volume and higher assembly density. They will generate a lot of heat when working. The heat accumulation will cause high temperature and damage the device, thereby reducing the service life. Therefore, a small-volume, high-precision multi-layer circuit board with good heat dissipation is needed.

Utility Model Content

The utility model aims to solve the above problems and provide a small-volume, high-precision multi-layer circuit board with small volume, convenient wiring and good heat dissipation.

In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is as follows: a small-volume, high-precision multi-layer circuit board, comprising a multi-layer circuit board body and a heat sink;

The multilayer circuit board body comprises a substrate layer, the upper surface of the substrate layer is sequentially connected with a first copper foil circuit layer, a first insulating layer, a second copper foil circuit layer, a second insulating layer, and a third copper foil circuit layer, the lower surface of the substrate layer is sequentially connected with a fourth copper foil circuit layer, a third insulating layer, a fifth copper foil circuit layer, a fourth insulating layer, and a sixth copper foil circuit layer, a conductive through hole is provided between the third copper foil circuit layer and the sixth copper foil circuit layer, a conductive blind hole is provided between the second copper foil circuit layer and the third copper foil circuit layer and between the fourth copper foil circuit layer and the fifth copper foil circuit layer, and a conductive buried hole is provided between the second copper foil circuit layer and the fifth copper foil circuit layer;

A mounting groove is provided on the top of the heat sink, and the multilayer circuit board body can be installed in the mounting groove. A fixing component for fixing the multilayer circuit board body is provided around the mounting groove on the heat sink. A heat dissipation cavity is provided inside the heat sink, and a heat dissipation fan is provided on the side of the heat dissipation cavity. A plurality of rows of heat dissipation holes are provided at the bottom of the heat dissipation cavity. A first heat dissipation fin and a second heat dissipation fin are respectively provided around the bottom and side surfaces of the heat sink.

Furthermore, the cooling fan is arranged in the middle position of the side, a cooling pipe connected to the cooling fan is arranged in the cooling cavity, a plurality of cooling partitions perpendicular to the cooling pipe are arranged in the cooling cavity to form a plurality of cooling partition cavities, a plurality of rows of cooling holes are correspondingly arranged at the bottom of the cooling partition cavities, a plurality of air outlet holes are arranged on both sides of the cooling pipe, and the plurality of air outlet holes correspond one-to-one with the plurality of cooling partition cavities.

Furthermore, the fixing assembly includes a frame-shaped fixing plate and a fastener for fastening the frame-shaped fixing plate. The top of the heat sink is provided with a stepped fixing groove for fixing the frame-shaped fixing plate. The width of the frame-shaped fixing plate is greater than the width of the fixing groove so that the frame-shaped fixing plate can press the four sides of the multi-layer circuit board body.

Furthermore, the fastener is a fastening nut, and a plurality of positioning columns are fixed on the fixing groove, including a frame-shaped fixing plate corresponding to a positioning hole for the positioning column to pass through, and the upper end of the positioning column is provided with an external thread that matches the fastening nut and is threadedly connected.

Furthermore, the number of the positioning posts is eight, two of which are arranged on each surface, and the positioning posts on corresponding surfaces are symmetrically distributed.

Furthermore, the heat sink is made of aluminum.

Due to the adoption of the above technical solution, the utility model has the following beneficial effects:

The utility model sets six circuit layers, and directly interconnects each layer through conductive through holes, conductive blind holes, and conductive buried holes. It has a small volume, is convenient for wiring, greatly shortens the wiring length, shortens the connection between components, and improves the speed of signal transmission.

The utility model provides a first heat sink and a second heat sink respectively around the bottom surface and the side surface of the heat sink, and utilizes the first heat sink and the second heat sink to increase the heat dissipation contact area, which is beneficial to heat dissipation; and a heat dissipation cavity is provided in the heat sink, the side of the heat dissipation cavity is connected to a heat dissipation fan, and heat dissipation holes are provided on the bottom, and cold air is blown into the heat dissipation cavity by the heat dissipation fan, and heat is dissipated from the heat dissipation holes, so as to increase air convection heat dissipation and improve the heat dissipation effect. The heat sink and the heat dissipation cavity are used to cooperate to improve the overall heat dissipation effect.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic structural diagram of a small-volume, high-precision multi-layer circuit board of the present invention;

FIG2 is a schematic cross-sectional view of a multilayer circuit board body of the present invention;

FIG3 is a schematic diagram of the main structure of a small-volume, high-precision multi-layer circuit board of the present invention;

FIG4 is a schematic cross-sectional view of the A-A plane of FIG3 of the present invention;

FIG5 is a bottom view of a small-volume, high-precision multi-layer circuit board according to the present invention;

In the figure: 1-multilayer circuit board body, 101-substrate layer, 102-first copper foil circuit layer, 103-first insulating layer, 104-second copper foil circuit layer, 105-second insulating layer, 106-third copper foil circuit layer, 107-fourth copper foil circuit layer, 108-third insulating layer, 109-fifth copper foil circuit layer, 110-fourth insulating layer, 111-sixth copper foil circuit layer, 112-conductive through hole, 113-conductive blind hole, 114-conductive buried hole, 2-heat sink, 21-mounting groove, 22-first heat sink, 23-second heat sink, 24-fixing groove, 3-frame type fixing plate, 31-positioning hole, 4-heat dissipation fan, 5-heat dissipation hole, 6-positioning column, 61-external thread, 7-heat dissipation pipe, 71-air outlet, 8-heat dissipation baffle.

DETAILED DESCRIPTION

In order to make the technical personnel of the technical field better understand the scheme of the utility model, the technical scheme in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by the technical personnel in the technical field of the utility model. The terms used in the specification of the utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the utility model. The terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

As shown in FIG. 1 , a small-volume and high-precision multi-layer circuit board includes a multi-layer circuit board body 1 and a heat sink 2 .

As shown in FIG2 , the multilayer circuit board body 1 comprises a substrate layer 101, the upper surface of which is sequentially connected with a first copper foil circuit layer 102, a first insulating layer 103, a second copper foil circuit layer 104, a second insulating layer 105, and a third copper foil circuit layer 106, the substrate layer 101 is a glass fiber board, and each insulating layer is a PP material, the upper surface of the substrate layer 101 is sequentially connected with a fourth copper foil circuit layer 107, a third insulating layer 108, a fifth copper foil circuit layer 109, a fourth insulating layer 110, and a sixth copper foil circuit layer 111, the third copper foil circuit layer 106 and the sixth copper foil circuit layer 111 are provided with conductive through holes 112, conductive blind holes 113 are provided between the second copper foil circuit layer 104 and the third copper foil circuit layer 106 and between the fourth copper foil circuit layer 107 and the fifth copper foil circuit layer 109, and conductive buried holes 114 are provided between the second copper foil circuit layer 104 and the fifth copper foil circuit layer 109. The circuits of each layer are arranged in a staggered manner. The upper surface of the third copper foil circuit layer 106 of the top layer is covered with a finishing layer and the circuit pads are exposed, which are used to solder components. The lower surface of the sixth copper foil circuit layer 111 of the bottom layer is covered with a finishing layer. The multilayer circuit board body is provided with six circuit layers, and each layer is directly interconnected through conductive through holes 112, conductive blind vias 113, and conductive buried vias 114. It is small in size, convenient for wiring, greatly shortens the wiring length, shortens the connection between components, and improves the speed of signal transmission.

As shown in FIG1 , a mounting groove 21 is provided on the top of the heat sink 2, and the multilayer circuit board body 1 can be installed in the mounting groove 21. A fixing assembly for fixing the multilayer circuit board body 1 is provided around the mounting groove 21 on the heat sink 2. A heat sink cavity is provided inside the heat sink 2, and a heat sink fan 4 is provided on the side of the heat sink cavity. A plurality of rows of heat dissipation holes 5 are provided at the bottom of the heat sink cavity. A first heat sink 22 and a second heat sink 23 are provided around the bottom and side of the heat sink 2. Preferably, the spacing between the first heat sink 22 and the second heat sink 23 is 5-10 mm, and the height of the first heat sink 22 and the second heat sink 23 is 3-6 mm. The heat sink 2 is made of aluminum, which is light in weight, has high thermal conductivity, and good heat dissipation.

As shown in Figures 4 and 5, the cooling fan 4 is arranged in the middle of the side, a cooling pipe 7 connected to the cooling fan 4 is arranged in the cooling cavity, a plurality of cooling partitions 8 distributed perpendicular to the cooling pipe 7 are arranged in the cooling cavity to form a plurality of cooling partition cavities, a plurality of rows of cooling holes 5 are correspondingly arranged at the bottom of the cooling partition cavities, a plurality of air outlet holes 71 are arranged on both sides of the cooling pipe 7, and the plurality of air outlet holes 71 correspond one-to-one to the plurality of cooling partition cavities.

As shown in FIG1 , the fixing assembly includes a frame-shaped fixing sheet 3 and a fastener for fastening the frame-shaped fixing sheet 3. The top of the heat sink 2 is provided with a stepped fixing groove 24 for fixing the frame-shaped fixing sheet 3. The width of the frame-shaped fixing sheet 3 is greater than the width of the fixing groove 24, so that the frame-shaped fixing sheet 3 can press the periphery of the multi-layer circuit board body 1. This structure uses the frame-shaped fixing sheet 3 to press the multi-layer circuit board body 1, and uses the fastener to fasten it, so as to fix the multi-layer circuit board body 1 on the heat sink 2.

As shown in FIG. 1 , the fastener is a fastening nut, and a plurality of positioning columns 6 are fixed on the fixing groove 24, including a positioning hole 31 corresponding to the frame-type fixing plate 3 for the positioning column 6 to pass through, and an external thread 61 is provided at the upper end of the positioning column 6 to be threadedly connected with the fastening nut. Preferably, eight positioning columns 6 are provided, two on each surface, and the positioning columns 6 on the corresponding surfaces are symmetrically distributed. The positioning columns 6 cooperate with the positioning holes 31 on the frame-type fixing plate 3 to position the frame-type fixing plate 3, and the frame-type fixing plate 3 is pressed and fixed by tightening the fastening nut.

When in use, the multilayer circuit board body 1 is placed in the installation groove 21, the positioning column 6 is passed through the positioning hole 31 of the frame-type fixing plate 3, and then the fastening nut is tightened to press the multilayer circuit board body 1 onto the heat sink 2. During operation, the first heat sink 22 and the second heat sink 23 at the bottom and around the heat sink 2 are used to increase the heat dissipation contact area and improve the heat dissipation of the multilayer circuit board body 1; and by setting a heat dissipation cavity, the heat dissipation fan 4 is used to blow cold air into the heat dissipation cavity, the cold air enters the heat dissipation air duct, and is discharged from the air outlet 71, correspondingly entering each separated heat dissipation cavity, and the heat is discharged from the heat dissipation hole 5 at the bottom of the heat dissipation cavity, increasing air convection heat dissipation, and the two cooperate to improve the overall heat dissipation effect.

The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not depart from the spirit of the present invention are within the scope of protection of the present invention.

Claims (6)

1. A small-volume, high-precision multi-layer circuit board, characterized in that it includes a multi-layer circuit board body and a heat sink; The multilayer circuit board body comprises a substrate layer, the upper surface of the substrate layer is sequentially connected with a first copper foil circuit layer, a first insulating layer, a second copper foil circuit layer, a second insulating layer, and a third copper foil circuit layer, the lower surface of the substrate layer is sequentially connected with a fourth copper foil circuit layer, a third insulating layer, a fifth copper foil circuit layer, a fourth insulating layer, and a sixth copper foil circuit layer, a conductive through hole is provided between the third copper foil circuit layer and the sixth copper foil circuit layer, a conductive blind hole is provided between the second copper foil circuit layer and the third copper foil circuit layer and between the fourth copper foil circuit layer and the fifth copper foil circuit layer, and a conductive buried hole is provided between the second copper foil circuit layer and the fifth copper foil circuit layer; A mounting groove is provided on the top of the heat sink, and the multilayer circuit board body can be installed in the mounting groove. A fixing component for fixing the multilayer circuit board body is provided around the mounting groove on the heat sink. A heat dissipation cavity is provided inside the heat sink, and a heat dissipation fan is provided on the side of the heat dissipation cavity. A plurality of rows of heat dissipation holes are provided at the bottom of the heat dissipation cavity. A first heat dissipation fin and a second heat dissipation fin are respectively provided around the bottom and side surfaces of the heat sink. 2. A small-volume, high-precision multi-layer circuit board according to claim 1, characterized in that the heat dissipation fan is arranged in the middle position of the side, a heat dissipation pipe connected to the heat dissipation fan is arranged in the heat dissipation cavity, a plurality of heat dissipation partitions are arranged in the heat dissipation cavity perpendicular to the heat dissipation pipe to form a plurality of heat dissipation partition cavities, a plurality of rows of heat dissipation holes are correspondingly arranged at the bottom of the heat dissipation partition cavities, a plurality of air outlet holes are arranged on both sides of the heat dissipation pipe, and the plurality of air outlet holes correspond one-to-one with the plurality of heat dissipation partition cavities. 3. A small-volume, high-precision multi-layer circuit board according to claim 1, characterized in that the fixing component includes a frame-type fixing plate and a fastener for fastening the frame-type fixing plate, and the top of the heat sink is provided with a stepped fixing groove for fixing the frame-type fixing plate, and the width of the frame-type fixing plate is greater than the width of the fixing groove, so that the frame-type fixing plate can press the four sides of the multi-layer circuit board body. 4. A small-volume, high-precision multi-layer circuit board according to claim 3, characterized in that the fastener is a fastening nut, a plurality of positioning columns are fixed on the fixing groove, including a frame-shaped fixing plate corresponding to a positioning hole for the positioning column to pass through, and the upper end of the positioning column is provided with an external thread that is threadedly connected to the fastening nut. 5. A small-volume, high-precision multi-layer circuit board according to claim 4, characterized in that the positioning posts are provided in eight numbers, two on each surface, and the positioning posts on corresponding surfaces are symmetrically distributed. 6 . The small-volume, high-precision multi-layer circuit board according to claim 1 , wherein the heat sink is made of aluminum.