CN222124578U - Temperature and pressure integrated detection device - Google Patents
Temperature and pressure integrated detection device Download PDFInfo
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- CN222124578U CN222124578U CN202420947277.4U CN202420947277U CN222124578U CN 222124578 U CN222124578 U CN 222124578U CN 202420947277 U CN202420947277 U CN 202420947277U CN 222124578 U CN222124578 U CN 222124578U
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- 238000001514 detection method Methods 0.000 title claims abstract description 67
- 238000009434 installation Methods 0.000 claims abstract description 16
- 238000007789 sealing Methods 0.000 claims abstract description 14
- 239000011521 glass Substances 0.000 claims description 27
- 239000000523 sample Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 10
- 239000011324 bead Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000003750 conditioning effect Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
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Abstract
The utility model provides a temperature and pressure integrated detection device which comprises a mounting body, a temperature detection assembly, a pressure detection assembly, a circuit board and a connector. Wherein, one side interval of installation body is equipped with first mounting groove and second mounting groove, and the opposite side of installation body is equipped with the air vent that all communicates with first mounting groove and second mounting groove. The temperature detection assembly is arranged in the first mounting groove and is in sealing fit with the inner side wall of the first mounting groove. The pressure detection assembly is arranged in the second mounting groove and is in sealing fit with the inner side wall of the second mounting groove. The circuit board is electrically connected with the temperature detection assembly, the pressure detection assembly and the connector. The temperature and pressure integrated detection device can detect the temperature and the pressure of a medium at the same time, solves the problem of complex and bulky structure in the installation of multiple sensors, optimizes the structure, has small volume, high mass production efficiency and greatly increases the reliability and the stability.
Description
Technical Field
The utility model relates to the technical field of detection, in particular to a temperature and pressure integrated detection device.
Background
The pressure transmitter is an electronic device capable of detecting different medium pressures, and can convert the sensed medium pressures into electric signals to be transmitted to an external display control device. In the advanced technology era, some measurement media need to detect the pressure of the medium and also need to detect the temperature of the medium. Whereas most pressure transmitters in the prior art only measure the pressure of the medium, the temperature of the measured medium is a separate temperature sensor. Therefore, the pressure sensor and the temperature sensor are separated, the measurement is performed by the separated sensor, the reserved mounting positions are more, and the structure is complex.
Disclosure of utility model
Based on the problems, such as multiple reserved installation positions and complex structure, of pressure sensor and temperature sensor split type sensor measurement in the prior art are needed, and a temperature and pressure integrated detection device is provided.
The technical scheme is as follows:
In one aspect, a temperature and pressure integrated detection device is provided, including:
The mounting body is provided with a first mounting groove and a second mounting groove at intervals on one side of the mounting body, and a vent hole communicated with the first mounting groove and the second mounting groove is formed on the other side of the mounting body;
The temperature detection component is arranged in the first mounting groove and is in sealing fit with the inner side wall of the first mounting groove;
A pressure detection assembly mounted in the second mounting groove and in sealing engagement with the inner side wall of the second mounting groove, and
The circuit board is electrically connected with the temperature detection assembly, the pressure detection assembly and the connector, the circuit board is used for converting the temperature detected by the temperature detection assembly and the pressure detected by the pressure detection assembly into an electric signal, and the connector is used for outputting the electric signal.
The temperature and pressure integrated detection device in the above embodiment is used, when the temperature and pressure integrated detection device is used, the connector is electrically connected with the external display control device, the installation body is installed at the measuring medium end of the medium container, so that a medium in the medium container can enter the first installation groove and the second installation groove through the vent holes, the temperature detection component can detect the temperature of the medium and convey the corresponding temperature value to the circuit board, the pressure detection component can detect the pressure of the medium and convey the corresponding pressure value to the circuit board, and the circuit board converts the received temperature value and the pressure value into corresponding electrical signals and conveys the corresponding electrical signals to the external display control device through the connector for display. The temperature and pressure integrated detection device can detect the temperature and the pressure of a medium at the same time, solves the problem of complex and bulky structure in the installation of multiple sensors, optimizes the structure, has small volume, high mass production efficiency and greatly increases the reliability and the stability. In addition, temperature detection subassembly and pressure detection subassembly are installed respectively in first mounting groove and second mounting groove, avoid taking place to interfere between the two, improve temperature and pressure integrated detection device's reliability.
The technical scheme is further described as follows:
In one embodiment, the first mounting groove and the vent hole are coaxially arranged, the temperature detection assembly comprises a sleeve and a temperature sensor, one end of the sleeve is arranged to be a closed end, the other end of the sleeve is arranged to be an open end, the open end is mounted in the first mounting groove and is in sealing fit with the inner side wall of the first mounting groove, the closed end extends out of the mounting body from the vent hole, the temperature sensor is electrically connected with the circuit board, the temperature sensor is provided with a temperature probe, and the temperature probe is positioned in the sleeve.
In one embodiment, the temperature probe is located within the closed end.
In one embodiment, the sleeve has an outer diameter that matches the inner diameter of the first mounting groove and is smaller than the inner diameter of the vent hole.
In one embodiment, the mounting body is provided with a connecting portion, the vent hole is located at a side of the connecting portion away from the mounting body, and the connecting portion is used for being connected with the medium container so as to communicate the vent hole with the inner cavity of the medium container.
In one embodiment, the pressure detecting component comprises a glass base and an MEMS pressure chip, the glass base is mounted in the second mounting groove and is in sealing fit with the inner side wall of the second mounting groove, one end of the glass base is electrically connected with the circuit board, and the MEMS pressure chip is mounted on one side of the glass base, which is close to the bottom wall of the second mounting groove, and is electrically connected with the other end of the glass base.
In one embodiment, a side of the mounting body provided with the first mounting groove is a mounting surface, the circuit board is mounted on the mounting surface, and the connector is mounted on a side of the circuit board away from the mounting surface and is matched with the mounting surface to clamp and fix the circuit board.
In one embodiment, a flange is provided on an outer side wall of the connector near one end of the circuit board, and a curled edge is provided on the mounting surface, and the curled edge is in limit fit with the flange so as to limit the flange to a side of the circuit board far away from the mounting surface.
In one embodiment, the bead extends about an axis of the first mounting groove to form a closed loop structure, the second mounting groove and the circuit board being both located inside the bead.
In one embodiment, the circuit board includes a first plate electrically connected to the temperature sensing assembly and the pressure sensing assembly, a second plate electrically connected to the connector, and a metal gasket between the first plate and the second plate and electrically connected to both the first plate and the second plate.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application.
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a temperature and pressure integrated detection device according to an embodiment.
Fig. 2 is a cross-sectional view of the temperature and pressure integrated type detecting device of fig. 1 along A-A direction.
Fig. 3 is an exploded view of the temperature and pressure integrated type detecting device of fig. 1.
Reference numerals illustrate:
10. The temperature and pressure integrated detection device comprises 100 parts, a mounting body, 110 parts, a first mounting groove, 120 parts, a second mounting groove, 130 parts, a vent hole, 140 parts, a connecting part, 150 parts, a mounting surface, 160 parts, curled edges, 200 parts, a temperature detection component, 210 parts, a sleeve, 211 parts, an open end, 212 parts, a closed end, 220 parts, a temperature sensor, 221 parts, a temperature probe, 300 parts, a pressure detection component, 310 parts, a glass base, 320 parts, a MEMS pressure chip, 400 parts, a circuit board, 410 parts, a first board, 420 parts, a second board, 430 parts, a metal gasket, 500 parts, a connector, 510 parts and a flange.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
As shown in fig. 1 and 2, in one embodiment, a temperature and pressure integrated detection device 10 is provided, which includes a mounting body 100, a temperature detection assembly 200, a pressure detection assembly 300, a circuit board 400, and a connector 500. Wherein, a first mounting groove 110 and a second mounting groove 120 are arranged at intervals on one side of the mounting body 100, and a vent 130 which is communicated with both the first mounting groove 110 and the second mounting groove 120 is arranged on the other side of the mounting body 100. The temperature detecting assembly 200 is mounted to the first mounting groove 110 and is in sealing engagement with an inner sidewall of the first mounting groove 110. The pressure detecting assembly 300 is mounted to the second mounting groove 120 and is in sealing engagement with the inner sidewall of the second mounting groove 120. The circuit board 400 is electrically connected to the temperature detecting assembly 200, the pressure detecting assembly 300 and the connector 500, the circuit board 400 is used for converting the temperature detected by the temperature detecting assembly 200 and the pressure detected by the pressure detecting assembly 300 into electrical signals, and the connector 500 is used for outputting the electrical signals.
When the temperature and pressure integrated detection device 10 in the above embodiment is used, the connector 500 is electrically connected with an external display control device, the mounting body 100 is mounted on the measuring medium end of the medium container, so that the medium in the medium container can enter the first mounting groove 110 and the second mounting groove 120 through the vent hole 130, the temperature detection assembly 200 can detect the temperature of the medium, and the corresponding temperature value is conveyed to the circuit board 400, the pressure detection assembly 300 can detect the pressure of the medium, and the corresponding pressure value is conveyed to the circuit board 400, and the circuit board 400 converts the received temperature value and pressure value into corresponding electrical signals and conveys the corresponding electrical signals to the external display control device through the connector 500 for displaying. The temperature and pressure integrated detection device 10 can detect the temperature and the pressure of a medium at the same time, solves the problem of complex and bulky structure in multi-sensor installation, optimizes the structure, has small volume, high mass production efficiency and greatly increases the reliability and the stability. In addition, the temperature detecting assembly 200 and the pressure detecting assembly 300 are respectively installed in the first installation groove 110 and the second installation groove 120, so that interference between the two is avoided, and the reliability of the temperature and pressure integrated detecting device 10 is improved.
The medium container may be configured as a holding tank, holding line or other structure capable of holding a medium. The temperature sensing assembly 200 may be any temperature sensor known in the art. The pressure sensing assembly 300 may be any pressure sensor known in the art. Specifically, in the present embodiment, the mounting body 100 may be provided as a housing. The circuit board 400 may be provided as a flexible PCB (Printed Circuit Board ). The flexible PCB is provided with an amplifying conditioning circuit. A PIN for electrically connecting the amplifying conditioning circuit is provided in the connector 500.
As shown in fig. 2 and 3, further, the first mounting groove 110 is coaxially disposed with the vent hole 130, the temperature detecting assembly 200 includes a sleeve 210 and a temperature sensor 220, one end of the sleeve 210 is disposed as a closed end 212, the other end is disposed as an open end 211, the open end 211 is mounted on the first mounting groove 110 and is in sealing fit with the inner sidewall of the first mounting groove 110, the closed end 212 extends out of the mounting body 100 from the vent hole 130, the temperature sensor 220 is electrically connected with the circuit board 400, the temperature sensor 220 is provided with a temperature probe 221, and the temperature probe 221 is located in the sleeve 210. In this way, the sleeve 210 can separate the temperature sensor 220 from the medium, so as to avoid the medium from contacting with the temperature sensor 220 to damage the temperature sensor 220, and improve the reliability of the temperature and pressure integrated detection device 10.
In particular, in the present embodiment, the temperature sensor 220 may be provided as an NTC temperature sensor (Negative Temperature Coefficient Sensor). The temperature sensor 220 is soldered to the circuit board 400 for communication. The open end 211 is sealed with the inner wall of the first mounting groove 110 by laser welding. The temperature and pressure integrated detection device 10 is used for bearing pressure on the back.
As shown in fig. 3, optionally, a temperature probe 221 is located within closed end 212. Thus, when the installation body 100 is installed at the measuring medium end, the temperature probe 221 and the closed end 212 are both located in the medium container, so that the medium temperature detected by the temperature probe 221 is more accurate, and the reliability of the temperature and pressure integrated detection device 10 is improved.
As shown in fig. 2 and 3, the outer diameter of the sleeve 210 is optionally adapted to the inner diameter of the first mounting groove 110 and smaller than the inner diameter of the vent hole 130. In this way, the sleeve 210 can seal the first mounting groove 110 and also can be spaced from the inner side wall of the vent hole 130, so that the medium can enter the second mounting groove 120 through the gap between the inner side wall of the vent hole 130 and the outer side wall of the sleeve 210, and the reliability of the temperature and pressure integrated detection device 10 is improved.
As shown in fig. 2 and 3, in one embodiment, the mounting body 100 is provided with a connection portion 140, the vent hole 130 is located on a side of the connection portion 140 away from the mounting body 100, and the connection portion 140 is used for connecting with the medium container so as to communicate the vent hole 130 with the inner cavity of the medium container. In this way, the convenience of assembling the temperature and pressure integrated detection device 10 is improved.
The connection portion 140 may be mounted on the measurement medium end of the medium container by plugging, clamping, screwing or other detachable connection methods. In this embodiment, the outer side wall of the connecting portion 140 is provided with an external thread screwed with the measuring medium end.
As shown in fig. 2 and 3, in one embodiment, the pressure detecting assembly 300 includes a glass base 310 and a MEMS (Micro-Electro-MECHANICAL SYSTEM, micro Electro mechanical system) pressure chip 320, the glass base 310 is mounted on the second mounting groove 120 and is in sealing engagement with an inner sidewall of the second mounting groove 120, one end of the glass base 310 is electrically connected to the circuit board 400, and the MEMS pressure chip 320 is mounted on a side of the glass base 310 near a bottom wall of the second mounting groove 120 and is electrically connected to the other end of the glass base 310. In this way, the MEMS pressure chip 320 can detect the pressure of the medium, and the detected pressure value is transmitted to the circuit board 400 through the glass base 310, so that the convenience of the temperature and pressure integrated detection device 10 is improved.
In particular, in the present embodiment, the MEMS pressure Chip 320 may be provided as an FC (Flip Chip) MEMS Chip. The MEMS pressure die 320 is flip-chip bonded to one end of the glass substrate 310, and the other end of the glass substrate 310 is bonded to the circuit board 400 for communication. The glass base 310 and the inner side wall of the second mounting groove 120 are sealed by laser welding. One side of the second mounting groove 120 communicates with the vent hole 130.
As shown in fig. 2 and 3, in one embodiment, a side of the mounting body 100 provided with the first mounting groove 110 is provided as the mounting surface 150, the circuit board 400 is mounted on the mounting surface 150, and the connector 500 is mounted on a side of the circuit board 400 away from the mounting surface 150 and is engaged with the mounting surface 150 to clamp and fix the circuit board 400. In this way, the temperature detecting assembly 200 and the pressure detecting assembly 300 are installed in the installation body 100, and the installation body 100, the circuit board 400 and the connector 500 are integrally arranged, so that the structural optimization of the temperature and pressure integrated detecting device 10 is realized, and the volume is small.
Optionally, the circuit on the circuit board 400, which is designed corresponding to the temperature detecting assembly 200, and the circuit on the circuit board 400, which is designed corresponding to the pressure detecting assembly 300, are arranged at intervals. Specifically, in this embodiment, the middle part of the circuit board 400 is connected with the temperature sensor 220, the upper part of the circuit board 400 is connected with the PIN on the glass base 310, and is electrically connected with the MEMS pressure chip 320 on the back, and signals of the temperature sensor 203 and the MEMS pressure chip 320 are collected at the same time, and signals are output after conditioning and integration.
As shown in fig. 2 and 3, optionally, a flange 510 is disposed on an outer side wall of the connector 500 near one end of the circuit board 400, a curled edge 160 is disposed on the mounting surface 150, and the curled edge 160 is in a limit fit with the flange 510, so as to limit the flange 510 to a side of the circuit board 400 far from the mounting surface 150. In this way, the mounting body 100, the circuit board 400 and the connector 500 can be assembled integrally, and the reliability of the temperature and pressure integrated detection device 10 can be improved.
As shown in fig. 2 and 3, in the embodiment, the curled edge 160 extends around the axis of the first mounting groove 110 to form a closed loop structure, and the second mounting groove 120 and the circuit board 400 are located inside the curled edge 160. The flange 510 extends about the axis of the connector 500 to form a closed loop structure. In this way, the limiting area between the flange 510 and the bead 160 increases, and the reliability of the temperature and pressure integrated detection device 10 is improved.
As shown in fig. 2 and 3, in one embodiment, the circuit board 400 includes a first plate 410, a second plate 420, and a metal gasket 430, wherein the first plate 410 is electrically connected to both the temperature detecting element 200 and the pressure detecting element 300, the second plate 420 is electrically connected to the connector 500, and the metal gasket 430 is located between the first plate 410 and the second plate 420 and is electrically connected to both the first plate 410 and the second plate 420. In this way, the metal washer 430 is installed between the first plate 410 and the second plate 420, and is riveted to perform the supporting and fixing function, so as to improve the reliability of the temperature and pressure integrated detection device 10.
In order to further understand the structure and principle of the temperature and pressure integrated detection device 10, a detailed description will be given below of one of the assembly modes of the temperature and pressure integrated detection device 10.
1. Combining the metal PIN and the metal ring into a glass base 310 by a glass sintering technology;
2. The MEMS pressure chip 320 is flip-chip bonded to the PIN of the glass base 310;
3. The glass base 310 welded with the MEMS pressure chip 320 is laser welded in the second mounting groove 120 inside the mounting body 100, and the sleeve 210 is laser welded in the second mounting groove 120 inside the mounting body 100;
4. The signal end of the temperature sensor 220 is welded on the first plate 410, and the temperature probe 221 in the temperature sensor 220 is installed in the sleeve 210;
5. the first plate 410 is welded to the glass base 310 to be fixed;
6. The first board 410 is provided with an amplifying and conditioning circuit, one end of the amplifying and conditioning circuit is electrically connected with the metal PIN needle on the glass base 310 and the temperature sensor 220, and the other end of the amplifying and conditioning circuit is electrically connected with the connector 500;
7. Placing a metal gasket 430 between the first plate 410 and the second plate 420;
8. The connector 500 is welded to the second plate 420 and then placed on the mounting body 100 for crimping the bead 160, completing the assembly of the temperature and pressure integrated inspection device 10.
In the description of the present application, it should be understood that, if any, these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., are used herein with respect to the orientation or positional relationship shown in the drawings, these terms refer to the orientation or positional relationship for convenience of description and simplicity of description only, and do not indicate or imply that the apparatus or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application.
Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.
In the present application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, they may be fixedly connected, detachably connected or integrally formed, mechanically connected, electrically connected, directly connected or indirectly connected through an intermediate medium, and communicated between two elements or the interaction relationship between two elements unless clearly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.
It will be further understood that when interpreting the connection or positional relationship of elements, although not explicitly described, the connection and positional relationship are to be interpreted as including the range of errors that should be within an acceptable range of deviations from the particular values as determined by those skilled in the art. For example, "about," "approximately," or "substantially" may mean within one or more standard deviations, and is not limited herein.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (10)
1. Temperature and pressure integrated detection device, characterized by comprising:
The mounting body is provided with a first mounting groove and a second mounting groove at intervals on one side of the mounting body, and a vent hole communicated with the first mounting groove and the second mounting groove is formed on the other side of the mounting body;
The temperature detection component is arranged in the first mounting groove and is in sealing fit with the inner side wall of the first mounting groove;
A pressure detection assembly mounted in the second mounting groove and in sealing engagement with the inner side wall of the second mounting groove, and
The circuit board is electrically connected with the temperature detection assembly, the pressure detection assembly and the connector, the circuit board is used for converting the temperature detected by the temperature detection assembly and the pressure detected by the pressure detection assembly into an electric signal, and the connector is used for outputting the electric signal.
2. The temperature and pressure integrated detection device according to claim 1, wherein the first mounting groove and the vent hole are coaxially arranged, the temperature detection assembly comprises a sleeve and a temperature sensor, one end of the sleeve is provided with a closed end, the other end of the sleeve is provided with an open end, the open end is mounted in the first mounting groove and is in sealing fit with the inner side wall of the first mounting groove, the closed end extends out of the mounting body from the vent hole, the temperature sensor is electrically connected with the circuit board, and the temperature sensor is provided with a temperature probe which is positioned in the sleeve.
3. The temperature and pressure integrated sensing device of claim 2, wherein the temperature probe is located within the closed end.
4. The temperature and pressure integrated detection device according to claim 2, wherein an outer diameter of the sleeve is adapted to an inner diameter of the first mounting groove and is smaller than an inner diameter of the vent hole.
5. The temperature and pressure integrated detection device according to claim 1, wherein the installation body is provided with a connection portion, the vent hole is located at a side of the connection portion away from the installation body, and the connection portion is used for being connected with a medium container so as to communicate the vent hole with an inner cavity of the medium container.
6. The temperature and pressure integrated detection device according to any one of claims 1 to 5, wherein the pressure detection assembly comprises a glass base and a MEMS pressure chip, the glass base is mounted in the second mounting groove and is in sealing fit with an inner side wall of the second mounting groove, one end of the glass base is electrically connected with the circuit board, and the MEMS pressure chip is mounted on one side of the glass base close to a bottom wall of the second mounting groove and is electrically connected with the other end of the glass base.
7. The temperature and pressure integrated detection device according to any one of claims 1 to 5, wherein a side of the mounting body provided with the first mounting groove is provided as a mounting surface, the circuit board is mounted on the mounting surface, and the connector is mounted on a side of the circuit board away from the mounting surface and is matched with the mounting surface to clamp and fix the circuit board.
8. The temperature and pressure integrated detection device according to claim 7, wherein a flange is arranged on an outer side wall of one end of the connector, which is close to the circuit board, and a curled edge is arranged on the mounting surface and is in limit fit with the flange so as to limit the flange to one side of the circuit board, which is far away from the mounting surface.
9. The temperature and pressure integrated detection device of claim 8, wherein the bead extends around an axis of the first mounting groove to form a closed loop structure, the second mounting groove and the circuit board being both located inside the bead.
10. The integrated temperature and pressure sensing device of any one of claims 1 to 5, wherein the circuit board comprises a first plate electrically connected to both the temperature sensing assembly and the pressure sensing assembly, a second plate electrically connected to the connector, and a metal gasket positioned between and electrically connected to both the first plate and the second plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420947277.4U CN222124578U (en) | 2024-05-06 | 2024-05-06 | Temperature and pressure integrated detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420947277.4U CN222124578U (en) | 2024-05-06 | 2024-05-06 | Temperature and pressure integrated detection device |
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| Publication Number | Publication Date |
|---|---|
| CN222124578U true CN222124578U (en) | 2024-12-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202420947277.4U Active CN222124578U (en) | 2024-05-06 | 2024-05-06 | Temperature and pressure integrated detection device |
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| CN (1) | CN222124578U (en) |
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