CN222321862U

CN222321862U - Probe card processing device and probe card

Info

Publication number: CN222321862U
Application number: CN202323620371.3U
Authority: CN
Inventors: 杨杰; 鲁艳春
Original assignee: Beihai Huike Semiconductor Technology Co Ltd
Current assignee: Beihai Huike Semiconductor Technology Co Ltd
Priority date: 2023-12-28
Filing date: 2023-12-28
Publication date: 2025-01-07
Anticipated expiration: 2033-12-28

Abstract

The application belongs to the technical field of probe card processing, and particularly relates to a probe card processing device and a probe card, wherein the probe card processing device comprises a processing platform, the probe card processing device further comprises an adjusting mechanism, the adjusting mechanism comprises an adjusting component and a fixing platform, the adjusting component is arranged on the processing platform, the fixing platform is arranged on one side of the adjusting component far away from the processing platform, the fixing platform can move under the adjustment of the adjusting component, and a wafer can be placed on one side of the fixing platform far away from the adjusting component; the fixing mechanism comprises a supporting seat and a fixing component, wherein the supporting seat is arranged on the processing platform and surrounds the adjusting mechanism, a through hole is formed in one side, away from the processing platform, of the supporting seat, the fixing component is arranged on one side, away from the processing platform, of the supporting seat, when the circuit board is arranged on the fixing component, the circuit board covers at least part of the through hole, and the adjusting component is adjusted so that the fixing platform corresponds to the alignment hole on the circuit board. The scheme of the application utilizes the probe card processing device to improve the precision of the probe card.

Description

Probe card processing device and probe card

Technical Field

The application belongs to the technical field of probe card processing, and particularly relates to a probe card processing device and a probe card.

Background

In recent years, the semiconductor process technology has been advanced rapidly, and the current stage has been advanced to below 32 nm. At present, products are required to be light, thin, short, small, smaller and stronger in functions and more pins, and in order to reduce the occupied area of chip packaging and improve the IC efficiency, flip-chip packaging is commonly applied to drawing chips, chip sets, memories, CPUs and the like. The high-order packaging mode has high unit price, if the chip test can be performed before packaging, the defective products are found to exist in the wafer, namely, marking is performed until the marked defective products are discarded before the back-end packaging process, and unnecessary packaging cost can be saved.

In the process of probe card production, the PCB substrate needs to be fixed, and then a plurality of probes are fixed on the PCB substrate, so that the probe card is manufactured. However, the precision of the probe card manufactured by the existing probe card processing device is not enough.

Disclosure of utility model

The application aims to provide a probe card processing device and a probe card, and the probe card processing device is used for improving the precision of the probe card.

The first aspect of the present application provides a probe card processing apparatus, the probe card processing apparatus including a processing platform, the probe card processing apparatus further including:

The adjusting mechanism comprises an adjusting component and a fixed platform, the adjusting component is arranged on the processing platform, the fixed platform is arranged on one side, far away from the processing platform, of the adjusting component, the fixed platform can move under the adjustment of the adjusting component, and a wafer can be placed on one side, far away from the adjusting component, of the fixed platform;

The fixing mechanism comprises a supporting seat and a fixing component, wherein the supporting seat is arranged on the processing platform and surrounds the adjusting mechanism, a through hole is formed in one side, away from the processing platform, of the supporting seat, the fixing component is arranged on one side, away from the processing platform, of the supporting seat, when the circuit board is arranged on the fixing component, the circuit board covers at least part of the through hole, and the adjusting component is adjusted, so that the fixing platform corresponds to an alignment hole on the circuit board.

In an exemplary embodiment of the present application, the adjustment assembly is capable of adjusting a positional relationship of the fixed platform in a first direction, a second direction, and a third direction;

the first direction, the second direction and the third direction are perpendicular to each other.

In an exemplary embodiment of the present application, the support base includes a support platform and a plurality of support columns disposed around the adjustment mechanism, the support platform is disposed on a side of the support columns away from the processing platform, and the support platform is provided with the through hole for exposing the fixing platform;

The fixing component comprises a fixing piece, the fixing piece comprises a body, a supporting part and a clamping part, the body is arranged on the supporting platform and is far away from the processing platform, the supporting part and the clamping part are all arranged on the body, the supporting part is provided with a fixing position, and when the circuit board is placed in the fixing position, the clamping part clamps and fixes the circuit board at the clamping part and the supporting part.

In an exemplary embodiment of the present application, the fixing assembly includes a first fixing member and a second fixing member disposed opposite to each other, the circuit board is overlapped on the fixing position of the first fixing member and the fixing position of the second fixing member, and the circuit board is clamped by the clamping portion of the first fixing member and/or the clamping portion of the second fixing member.

In an exemplary embodiment of the present application, a receiving groove is formed between the supporting part and the body, the receiving groove being capable of providing a buffer space when the circuit board is placed in the fixed position.

In an exemplary embodiment of the present application, the probe card processing apparatus further includes:

The clamping mechanism is arranged at intervals with the adjusting mechanism and the fixing mechanism, the clamping mechanism comprises an adjusting part and a clamping part, the clamping part is used for clamping the blade probe, and the clamping part can move under the adjusting action of the adjusting part.

In an exemplary embodiment of the present application, the probe card processing device further includes a first locking mechanism, where the first locking mechanism is disposed on the processing platform, the first locking mechanism includes a locking platform and a locking assembly, the adjusting mechanism and the fixing mechanism are both disposed on the locking platform, the locking assembly is connected to the locking platform, and the locking platform can be locked and fixed under the action of the locking assembly.

In an exemplary embodiment of the present application, the probe card processing apparatus further includes a second locking mechanism including a locking platform and a locking knob, the clamping mechanism being connected to the locking platform, the locking knob being capable of locking a position of the clamping mechanism on the locking platform.

In an exemplary embodiment of the present application, the probe card processing apparatus further includes a processing seat and a rotating handle for fixing the observation mechanism, the rotating handle is disposed on the processing seat and is spaced from the fixing mechanism and the adjusting mechanism, and the processing platform is disposed on the processing seat.

The second aspect of the application provides a probe card prepared by the probe card processing device, wherein the probe card comprises a blade probe and a circuit board, and the blade probe is arranged on the circuit board.

The scheme of the application has the following beneficial effects:

The application relates to a probe card processing device and a probe card, wherein the probe card processing device comprises an adjusting mechanism and a fixing mechanism, the adjusting mechanism comprises an adjusting component and a fixing platform, the adjusting component can adjust the relative position of the fixing platform, one side of the fixing platform far away from the processing platform can be used for placing a wafer, the fixing mechanism comprises a supporting seat and a fixing component, the supporting seat is arranged on the processing platform and surrounds the outer side of the adjusting mechanism, namely, the adjusting component and the fixing platform are arranged in the supporting seat, the supporting seat is provided with the supporting platform, a through hole for exposing the fixing platform is formed in the supporting seat, namely, the adjusting component can adjust the fixing platform to move in the through hole, the fixing component is provided with a fixing position, when a circuit board is placed in the fixing position, the position of the fixing platform is adjusted through the adjusting component, so that the wafer on the fixing platform corresponds to an alignment hole of the circuit board, namely, the wafer position of the fixing platform can be adjusted according to the alignment hole on the circuit board, the wafer is corresponding to the alignment hole, the alignment precision of the wafer and the alignment hole is improved, the subsequent probe card manufacturing precision is ensured, and the probe card precision is further improved.

Other features and advantages of the application will be apparent from the following detailed description, or may be learned by the practice of the application.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application as claimed.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application. It is evident that the drawings in the following description are only some embodiments of the present application and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.

Fig. 1 is a schematic front view of a probe card processing apparatus according to a first embodiment of the present application;

FIG. 2 is an enlarged schematic view showing the structure of the clamping portion and the supporting portion at A in FIG. 1;

Fig. 3 is a schematic perspective view of a probe card processing apparatus according to a first embodiment of the present application;

Fig. 4 is a schematic diagram showing a structure of a circuit board separated from a fixing assembly according to an embodiment of the application.

Reference numerals illustrate:

10. The probe card processing device comprises 110, a processing platform, 120, an adjusting mechanism, 121, an adjusting assembly, 122, a fixing platform, 130, a fixing mechanism, 131, a supporting seat, 1311, a supporting platform, 1312, a supporting column, 132, a fixing assembly, 1320, a fixing piece, 1320a, a first fixing piece, 1320b, a second fixing piece, 1321, a body, 1322, a supporting part, 1323, a clamping part, 133, a through hole, 134, a containing groove, 140, a clamping mechanism, 141, an adjusting part, 142, a clamping part, 143, an adjusting arm, 150, a first locking mechanism, 151, a locking platform, 152, a locking assembly, 160, a second locking mechanism, 161, a locking platform, 162, a locking knob, 170, a processing seat, 180, a rotating handle, 20, a circuit board, 210 and an alignment hole.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many different forms and should not be construed as limited to the examples set forth herein, but rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art.

In the present disclosure, the terms "first," "second," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying a number of technical features being indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected via an intermediate medium, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the application. One skilled in the relevant art will recognize, however, that the application may be practiced without one or more of the specific details, or with other methods, components, devices, steps, etc. In other instances, well-known methods, devices, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the application.

Example 1

The first embodiment of the application provides a probe card processing device 10, which is mainly used for processing a probe card, and the probe card processing device 10 can effectively improve the precision of the probe card. The probe card comprises a blade probe and a circuit board 20, wherein the blade probe is welded on a welding spot of the circuit board 20 in a welding mode, and the blade probe is also required to be corresponding to a wafer in the process, so that the manufacturing of the probe card is completed.

Accordingly, in order to improve the processing accuracy of the probe card, referring to fig. 1, the probe card processing apparatus 10 includes:

A processing platform 110, wherein the processing platform 110 is a horizontal plane.

The adjusting mechanism 120, the adjusting mechanism 120 includes an adjusting component 121 and a fixing platform 122, the adjusting component 121 and the fixing platform 122 are both arranged on the processing platform 110, the fixing platform 122 is arranged on one side of the adjusting component 121 far away from the processing platform 110, the fixing platform 122 can move under the adjustment of the adjusting component 121, a wafer can be placed on one side of the fixing platform 122 far away from the adjusting component 121, and the wafer can correspond to the blade probe and the circuit board 20 when the subsequent circuit board 20 is welded with the subsequent blade probe.

The fixing mechanism 130, the fixing mechanism 130 includes a supporting seat 131 and a fixing component 132, the supporting seat 131 is arranged on the processing platform 110 and surrounds the outer side of the adjusting mechanism 120, a supporting platform 1311 is arranged on one side of the supporting seat 131 far away from the processing platform 110, a through hole 133 for exposing the fixing platform 122 is arranged on the supporting platform 1311, and the open area of the through hole 133 is larger than or equal to the area of the fixing platform 122. The fixing component 132 is disposed on one side of the supporting platform 1311 away from the processing platform 110, the fixing component 132 has a fixing position, when the circuit board 20 is placed on the fixing position, the fixing platform 122 can be controlled to be located at the position of the through hole 133 by adjusting the adjusting component 121, and the alignment relationship between the wafer and the circuit board 20 can be changed by changing the position of the fixing platform 122, so that the alignment hole 210 of the wafer and the circuit board 20 corresponds to facilitate the alignment precision between the wafer and the alignment hole 210 of the circuit board 20, and the alignment precision between the wafer and the alignment hole 210 of the circuit board 20 is improved by adjusting the adjusting component 121, so that the precision of the probe card is improved.

It can be understood that the position of the fixing platform 122 can be adjusted at will by the adjusting component 121, so that the wafer can be aligned with the alignment hole 210 of the circuit board 20 when the circuit board 20 is at any fixed position, and the alignment accuracy is improved, so that the accuracy of the probe card is improved.

With continued reference to fig. 1, the support base 131 may further include a support column 1312 extending in the thickness direction of the processing platform 110, where a support platform 1311 is disposed on a side of the support column 1312 away from the processing platform 110, i.e. the support platform 1311 is supported on the processing platform 110 by the support column 1312. In addition, a plurality of support columns 1312 are disposed around the adjusting mechanism 120, that is, a plurality of support columns 1312 form a receiving space around, and the adjusting mechanism 120 is disposed in the receiving space.

For example, the support base 131 includes four support columns 1312 extending in the thickness direction of the processing platform 110, and the heights of the four support columns 1312 in the thickness direction of the processing platform 110 are the same, so that the support platform 1311 is a horizontal plane. In addition, the support columns 1312 are disposed around the adjusting mechanism 120, and there is an adjusting gap between adjacent support columns 1312, through which the adjusting component 121 can be adjusted, thereby adjusting the position of the fixed platform 122.

The adjusting component 121 can adjust the positional relationship of the fixed platform 122 in the first direction, the second direction and the third direction, and the first direction, the second direction and the third direction are perpendicular to each other, that is, the adjusting component 121 can adjust the fixed platform 122 in different directions, so as to improve the alignment accuracy of the wafer and the alignment hole 210.

For example, the adjustment assembly 121 can adjust the position of the fixed platform 122 in front-to-back, up-to-down, left-to-right.

For example, the first direction and the second direction are adjustments in a horizontal plane, and the third direction may be adjustments in a thickness direction of the processing platform 110, i.e., the first direction, the second direction, and the third direction may correspond to an X-axis, a Y-axis, and a Z-axis. The position of the fixing platform 122 in the first direction, the second direction and the third direction can be adjusted through the adjusting assembly 121, so that the alignment precision of the alignment holes 210 of the wafer and the circuit board 20 is improved, the alignment precision of the connection of the subsequent blade probes and the circuit board 20 is improved, and the precision of the probe card is further improved.

The fixing assembly 132 includes a fixing member 1320, as shown in fig. 2, the fixing member 1320 includes a body 1321, a supporting portion 1322 and a clamping portion 1323, wherein the body 1321 is disposed on a side of the supporting platform 1311 away from the processing platform 110, that is, the body 1321 is disposed on the supporting platform 1311. The supporting part 1322 and the clamping part 1323 are arranged on the body 1321, the supporting part 1322 and the clamping part 1323 are arranged at intervals, the supporting part 1322 is provided with a fixing position, when the circuit board 20 is placed in the fixing position, the clamping part 1323 is used for clamping and fixing the circuit board 20 at the clamping part 1323 and the supporting part 1322, so that the stability of the circuit board 20 on the fixing component 132 is ensured, the circuit board 20 is prevented from moving randomly on the fixing component 132, the alignment precision of the alignment holes 210 on the wafer and the circuit board 20 is ensured, the butt joint precision of the blade probe and the circuit board 20 is further ensured, and the precision of the probe card is improved.

Referring to fig. 3 and 4, in order to ensure the stability of the circuit board 20 on the fixing assembly 132, the fixing assembly 132 includes a first fixing member 1320a and a second fixing member 1320b, the first fixing member 1320a and the second fixing member 1320b are respectively disposed on opposite sides of the supporting platform 1311, opposite ends of the circuit board 20 are respectively disposed on fixing positions of the first fixing member 1320a and the second fixing member 1320b, so as to carry the circuit board 20, and the fixing positions of the first fixing member 1320a and the second fixing member 1320b are located on the same horizontal plane, so as to ensure that the circuit board 20 is on a horizontal plane, thereby ensuring subsequent welding precision.

It is understood that when the circuit board 20 is placed in the fixing position of the first fixing member 1320a and the fixing position of the second fixing member 1320b, the clamping portions 1323 of the first fixing member 1320a and/or the clamping portions 1323 of the second fixing member 1320b may clamp and fix opposite ends of the circuit board 20 to clamp and fix the circuit board 20 at the two fixing members 1320, i.e., the circuit board 20 may be fixed by one of the first fixing member 1320a and the second fixing member 1320b or the circuit board 20 may be fixed by both the first fixing member 1320a and the second fixing member 1320 b.

In the embodiment of the present application, as shown in fig. 4, two ends of the circuit board 20 are respectively fixed to the circuit board 20 by the clamping portion 1323 of the first fixing member 1320a and the clamping portion 1323 of the second fixing member 1320b, so as to ensure the stability of the circuit board 20, avoid the circuit board 20 from sliding randomly, and ensure the manufacturing precision of the probe card.

In addition, referring to fig. 2, a receiving groove 134 is formed between the supporting portion 1322 and the body 1321, and the receiving groove 134 can provide a buffer space when the circuit board 20 is placed in a fixed position, that is, the circuit board 20 has a certain distance from the body 1321, so as to avoid damage caused by collision between the circuit board 20 and the body 1321 during the processing process, and ensure the integrity of the circuit board 20.

In the embodiment of the present application, the probe card processing device 10 further includes a clamping mechanism 140, where the clamping mechanism 140, the adjusting mechanism 120 and the fixing mechanism 130 are all disposed at intervals, the clamping mechanism includes an adjusting portion 141 and a clamping portion 142, the clamping portion 142 is used for clamping the blade probe, and the clamping portion 142 can move under the adjusting action of the adjusting portion 141 to adjust the alignment precision of the blade probe and the wafer and the alignment hole 210, so as to improve the alignment precision of the blade probe and the circuit board 20, i.e. improve the precision of the probe card.

It will be appreciated that referring to fig. 3, the clamping mechanism 140 further includes an adjusting arm 143, where the adjusting arm 143 connects the adjusting portion 141 and the clamping portion 1323, and the position of the clamping portion 1323 can be changed by adjusting the arm 143. The adjusting portion 141 can still adjust the position of the clamping portion 1323 in the first direction, the second direction, and the third direction, that is, adjust the position of the clamping portion 1323 in the X-axis, the Y-axis, and the Z-axis.

Illustratively, the adjusting portion 141 adjusts the positional relationship of the clamping portion 1323 in front-rear, left-right, and up-down.

In addition, referring to fig. 3, the probe card processing apparatus 10 further includes a first locking mechanism 150, where the first locking mechanism 150 may be used to lock the positional relationship of the adjusting mechanism 120 and the positional relationship of the locking and fixing mechanism 130, and the first locking mechanism 150 is disposed on the processing platform 110. The first locking mechanism 150 comprises a locking platform 151 and a locking assembly 152, the adjusting mechanism 120 and the fixing mechanism 130 are arranged on the locking platform 151, the locking assembly 152 is connected with the locking platform 151, the locking platform 151 can be locked and fixed under the action of the locking assembly 152 to fix the positions of the adjusting mechanism 120 and the fixing mechanism 130 on the processing platform 110, relative displacement between the adjusting mechanism 120 and the fixing mechanism 130 is avoided, and alignment accuracy of the wafer and the alignment holes 210 on the circuit board 20 is guaranteed.

It will be appreciated that the locking knob 162 in the locking assembly 152 may be used to unscrew or tighten clockwise or counter-clockwise to control movement of the locking platform 151 or to prevent movement of the locking platform 151.

Accordingly, referring to fig. 3 or 4, the probe card processing apparatus 10 further includes a second locking mechanism 160, where the second locking mechanism 160 includes a locking platform 161 and a locking knob 162, the clamping mechanism 140 is connected to the locking platform 161, and the locking knob 162 can lock the position of the clamping mechanism 140 on the locking platform 161 to ensure the relative position of the clamping mechanism 140 and the processing platform 110.

In addition, the probe card processing device 10 further includes a processing seat 170 and a rotating handle 180 for fixing the observation mechanism, the rotating handle 180 is disposed on the processing seat 170, the processing seat 170 is provided with the processing platform 110, and the rotating handle 180, the fixing mechanism 130 and the adjusting mechanism 120 are disposed at intervals to avoid mutual interference.

It will be appreciated that by adjusting the alignment between the wafer and the alignment hole 210 of the circuit board 20 and the alignment between the blade probe and the alignment hole 210 of the circuit board 20 by the observation mechanism, the positional relationship between the fixing platform 122 and the clamping mechanism 140 can be adjusted according to the requirement, so that the wafer corresponds to the alignment hole 210 on the circuit board 20 and the blade probe on the clamping mechanism 140 corresponds to the alignment hole 210 and the wafer.

It should be noted that the processing seat 170 may be formed by splicing a plurality of sections, and one end of the section close to the ground may be provided with a roller or a supporting member, so that the position of the probe card processing device 10 can be moved at will by the roller, the carrying is more convenient, and the processing seat 170 can be well fixed on the ground by the supporting member.

In addition, in the process of manufacturing the probe card, the wafer needs to be placed under the alignment hole 210 of the circuit board 20, that is, the fixing platform 122 and the supporting platform 1311 are not located on the same horizontal plane. Then, the blade probe on the clamping mechanism 140 is corresponding to the soldering point of the circuit board 20, and after confirming that the position of the soldering point of the blade probe and the circuit board 20 is correct, soldering is performed, and the blade probe is soldered on the circuit board 20.

The preparation process of the probe card comprises the following steps:

1. The wafer is placed on a fixed platen 122;

2. The blade probe is fixed on the clamping portion 1323;

3. The alignment hole 210 and the wafer position of the blade probe and the circuit board 20 are adjusted, that is, the relationship between the wafer on the fixing platform 122 and the alignment hole 210 of the circuit board 20 is adjusted by adjusting the adjusting component 121, and the alignment relationship between the clamping part 1323 and the alignment hole 210 in the circuit board 20 is adjusted by the adjusting part 141, so that the alignment of the wafer and the blade probe is accurate, and the alignment of the wafer and the alignment hole 210 of the circuit board 20 is precisely assembled, thereby improving the manufacturing precision of the probe card.

4. The blade probe is soldered to the soldering point on the circuit board 20, and the blade probe is fixed to the circuit board 20 by soldering when the positions of the alignment hole 210 and the wafer of the blade probe and the circuit board 20 are fixed.

5. After the soldering points of the blade probe and the circuit board 20 are soldered, the soldering quality of the blade probe and the circuit board 20 is confirmed.

If the welding quality is good, the needle grinding machine is used for grinding needles, so that the flatness of the needles is reduced from 15 mu m to 5 mu m.

And if the welding quality is poor, the blade probe and the welding point are welded again.

The probe card processing device 10 can realize the adjustment of the precision of the alignment holes 210 on the wafer and the circuit board 20 before the blade probe is welded, and can utilize the adjusting part 141 to adjust the positions of the blade probe, the alignment holes 210 and the wafer when the blade probe is welded, so that the whole probe card processing device is flexible to use, the positions of the blade probe and the circuit board 20 are accurate, the precision is greatly improved, and the welding precision can be controlled to be below 5 mu m to 15 mu m.

Example two

The second embodiment of the present application provides a probe card, and the probe card processing apparatus 10 in the first embodiment is used to manufacture the probe card in the second embodiment.

The probe card is an interface between an electronic test system and a semiconductor wafer. Typically, the probe card mechanically interfaces with the probes and is electrically connected to the tester. The purpose of this is to provide an electrical path between the test system and the circuits on the wafer, allowing the circuits to be tested and verified at the wafer level, typically before they are diced and packaged. It is typically composed of a printed circuit board 20 (PCB) and some form of contact element, typically metallic, but may also be made of other materials.

For example, in a second embodiment of the present application, a probe card is provided, which includes a circuit board 20 and a blade probe soldered on a soldering point of the circuit board 20. The probe card processing apparatus 10 of the first embodiment can improve the alignment accuracy of the blade probe and the circuit board 20, and the alignment accuracy of the alignment hole 210 of the circuit board 20 and the wafer, and further can improve the accuracy of the manufactured probe card.

In the description of the present specification, reference to the terms "some embodiments," "exemplary," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

While embodiments of the present application have been shown and described, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives and variations may be made in the above embodiments by those skilled in the art within the scope of the application, which is therefore intended to be covered by the appended claims and their equivalents.

Claims

1. A probe card processing apparatus comprising a processing platform, characterized in that the probe card processing apparatus further comprises:

2. The probe card processing apparatus of claim 1, wherein the adjustment assembly is capable of adjusting the positional relationship of the fixed platform in a first direction, a second direction, and a third direction;

3. The probe card processing device according to claim 1, wherein the supporting base comprises a supporting platform and a plurality of supporting columns arranged around the adjusting mechanism, the supporting platform is arranged on one side of the supporting columns away from the processing platform, and the supporting platform is provided with the through holes for exposing the fixing platform;

4. The probe card processing apparatus according to claim 3, wherein the fixing assembly comprises a first fixing member and a second fixing member, the first fixing member and the second fixing member are disposed opposite to each other, the circuit board is overlapped on the fixing position of the first fixing member and the fixing position of the second fixing member, and the circuit board is clamped by the clamping portion of the first fixing member and/or the clamping portion of the second fixing member.

5. The probe card processing apparatus of claim 3, wherein a receiving groove is formed between the supporting portion and the body, the receiving groove being capable of providing a buffer space when the circuit board is placed in the fixed position.

6. The probe card processing apparatus of any one of claims 1-5, further comprising:

7. The probe card processing apparatus of any one of claims 1-5, further comprising a first locking mechanism disposed on the processing platform, the first locking mechanism comprising a locking platform and a locking assembly, the adjustment mechanism and the fixing mechanism both disposed on the locking platform, the locking assembly being connected to the locking platform, the locking platform being capable of locking under the action of the locking assembly.

8. The probe card processing apparatus of claim 6, further comprising a second locking mechanism comprising a locking platform and a locking knob, the clamping mechanism being coupled to the locking platform, the locking knob being capable of locking the position of the clamping mechanism on the locking platform.

9. The probe card processing apparatus of claim 1, further comprising a processing base and a rotating handle for fixing the observation mechanism, wherein the rotating handle is disposed on the processing base and is spaced apart from the fixing mechanism and the adjusting mechanism, and the processing platform is disposed on the processing base.

10. A probe card prepared by the probe card processing apparatus of any one of claims 1 to 9, wherein the probe card comprises a blade probe and a circuit board, the blade probe being disposed on the circuit board.