CN222395029U

CN222395029U - LDS antenna assembly and communication equipment

Info

Publication number: CN222395029U
Application number: CN202420246912.6U
Authority: CN
Inventors: 刘序俊; 冯鑫
Original assignee: Shenzhen Sunway Communication Co Ltd
Current assignee: Shenzhen Sunway Communication Co Ltd
Priority date: 2024-01-31
Filing date: 2024-01-31
Publication date: 2025-01-24
Anticipated expiration: 2034-01-31

Abstract

The embodiment of the utility model relates to the field of antenna technology, and in particular to an LDS antenna assembly and communication equipment, including an injection molded part, an LDS circuit, components and a circuit board assembly, wherein the LDS circuit is arranged on one side of the injection molded part, the components are arranged on the other side of the injection molded part, the circuit board assembly is embedded in the injection molded part, one side of the circuit board assembly is electrically connected to the LDS circuit, and the other side of the circuit board assembly is electrically connected to the components. Through the above manner, the embodiment of the utility model can reduce the possibility of external impurities such as water and dust entering the interior of the LDS antenna assembly on the basis of satisfying the electrical connectivity between the LDS circuit and the components.

Description

LDS antenna assembly and communication equipment

Technical Field

The embodiment of the utility model relates to the technical field of antennas, in particular to an LDS antenna assembly and communication equipment.

Background

With the development of communication technology, antennas gradually tend to be miniaturized and diversified, wherein as the technology of LDS (Laser-Direct-structuring) is mature, LDS antennas are gradually produced, the LDS antennas are formed on a formed plastic support by utilizing a Laser technology to directly plate (electroless plating) the support to form metal antennas, and the LDS antennas are favored by industry in small size and flexible design.

However, in the process of implementing the present utility model, the inventor finds that, referring to fig. 1-2, the LDS antenna assembly 1 currently on the market mainly includes an injection molding member 2, an LDS line 3 and a component 4, where the LDS line 3 and the component 4 are respectively disposed on two opposite sides of the injection molding member 2, referring to fig. 3-4, the conventional LDS antenna assembly 1 mainly includes a guide hole 5 disposed on the injection molding member 2, and an LDS coating 6 is laser engraved (laser engraved) on a sidewall of the guide hole 5 to implement electrical communication between the LDS line 3 and the component 4, but in this scheme, impurities such as external water, dust and the like easily enter the inside of the LDS antenna assembly 1 through the guide hole 5, thereby affecting the performance of the LDS antenna assembly 1.

Disclosure of utility model

In view of the foregoing, embodiments of the present utility model provide an LDS antenna assembly and a communication device that overcome or at least partially solve the foregoing problems.

According to one aspect of the embodiment of the utility model, an LDS antenna assembly is provided, which comprises an injection molding piece, an LDS circuit, a component and a circuit board assembly, wherein the LDS circuit is arranged on one side of the injection molding piece, the component is arranged on the other side of the injection molding piece, the circuit board assembly is embedded in the injection molding piece, one side of the circuit board assembly is electrically connected with the LDS circuit, and the other side of the circuit board assembly is electrically connected with the component. In this way, the LDS lines and components are in electrical communication.

In some embodiments, the circuit board assembly and the injection molding member are in an integral structure, so that the circuit board assembly and the injection molding member are connected more firmly.

In some embodiments, the circuit board assembly includes a plurality of circuit boards, the circuit boards are stacked in sequence, the circuit boards are electrically connected, one side of the circuit boards is electrically connected with the LDS circuit, and the other side of the circuit boards is electrically connected with the component.

In some embodiments, the circuit board includes a plurality of conductor layers and a plurality of substrate layers, one substrate layer is disposed between any two adjacent conductor layers, the plurality of conductor layers and the plurality of substrate layers are electrically connected, the conductor layer on one side of the plurality of circuit boards is electrically connected to the LDS circuit, and the conductor layer on the other side of the plurality of circuit boards is electrically connected to the component. Thus, the conductor layer can electromagnetically shield the substrate layer.

In some embodiments, the circuit board assembly is provided with a through hole, the circuit board assembly includes a conductive member, the conductive member is disposed in the through hole, and the plurality of conductor layers and the plurality of substrate layers are electrically connected with the conductive member, respectively.

In some embodiments, a groove is formed in one side of the injection molding piece, the bottom of the groove is communicated with the conductor layers on one sides of the circuit boards, and at least part of the LDS circuit extends into the groove to be electrically connected with the conductor layers on one sides of the circuit boards.

In some embodiments, the LDS antenna assembly further comprises a plating layer disposed in the recess, the plating layer electrically connecting the LDS line and the conductor layer on one side of the plurality of circuit boards, respectively. Thus, the conductivity between the LDS circuit and the conductor layer on one side of the circuit boards is improved.

In some embodiments, the plating layer covers a conductor layer of one side of the plurality of circuit boards at the bottom of the groove. Thus, the conductivity between the LDS line and the conductor layer on one side of the circuit boards is improved, and the possibility of corrosion of the conductor layer is reduced.

In some embodiments, the LDS antenna assembly further includes a connecting piece, the connecting piece is disposed on the other side of the injection molding piece, one end of the connecting piece is electrically connected with the component, and the other end of the connecting piece is electrically connected with the conductor layer on the other side of the plurality of circuit boards.

According to an aspect of an embodiment of the present utility model, there is provided a communication device including the LDS antenna assembly described above.

The LDS antenna assembly provided by the embodiment of the utility model comprises an injection molding piece, an LDS circuit, components and a circuit board assembly, wherein the LDS circuit is arranged on one side of the injection molding piece, the components are arranged on the other side of the injection molding piece, the circuit board assembly is embedded in the injection molding piece, one side of the circuit board assembly is electrically connected with the LDS circuit, the other side of the circuit board assembly is electrically connected with the components, and the possibility that external impurities such as water and dust enter the LDS antenna assembly is reduced on the basis of meeting the electrical communication between the LDS circuit and the components.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for a person skilled in the art.

Fig. 1 is a perspective view of a prior art LDS antenna assembly;

fig. 2 is a perspective view of another view of a prior art LDS antenna assembly;

Fig. 3 is a cross-sectional view of the LDS antenna assembly of fig. 1;

FIG. 4 is a schematic view of the via of FIG. 3;

Fig. 5 is a cross-sectional view of an LDS antenna assembly provided by an embodiment of the utility model;

FIG. 6 is a schematic diagram of antenna signal transfer for the LDS antenna assembly of FIG. 5;

fig. 7 is a cross-sectional view of another LDS antenna assembly provided by an embodiment of the utility model;

fig. 8 is a cross-sectional view of yet another LDS antenna assembly provided by an embodiment of the utility model.

Reference numerals in the specific embodiments are as follows:

1. LDS antenna component, 2, injection molding piece, 21, groove, 3, LDS circuit, 4, component, 5, guide hole, 6, LDS coating;

30. 31, 311, conductor layer, 312, base material layer, 32, through hole, 33, conductive element, 40, plating layer, 50, connecting element, 60, insulating element, 70, insulating layer.

Detailed Description

In order that the utility model may be readily understood, a more particular description thereof will be rendered by reference to specific embodiments that are illustrated in the appended drawings. It will be understood that when an element is referred to as being "fixed" to another element, it can be directly on the other element or one or more intervening elements may be present therebetween. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or one or more intervening elements may be present therebetween. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used in this specification includes any and all combinations of one or more of the associated listed items.

The LDS antenna is formed by directly plating (chemical plating) a metal antenna on a formed plastic support by utilizing a laser technology. Chemical plating, i.e., electroless plating, or autocatalytic plating, is a plating process in which metal ions in a plating solution are reduced to metal by means of a suitable reducing agent without an applied current and deposited onto the surface of a part.

Referring to fig. 1-2, a conventional LDS antenna assembly 1 mainly includes an injection molding member 2, an LDS line 3 and a component 4, where the LDS line 3 and the component 4 are respectively disposed on two opposite sides of the injection molding member 2. Referring to fig. 3-4 together, in order to achieve that the LDS lines 3 and the components 4 on two sides of the injection molding member 2 can be electrically connected, the conventional LDS antenna assembly 1 is mainly configured with a guide hole 5 on the injection molding member 2, and an LDS coating 6 is laser engraved (laser engraved) on a side wall of the guide hole 5 to achieve that the LDS lines 3 and the components 4 are conducted, but under this scheme, impurities such as external water and dust easily enter the inside of the LDS antenna assembly 1 through the guide hole 5, so as to affect the performance of the LDS antenna assembly 1. The LDS circuit 3 is formed by directly engraving a three-dimensional circuit pattern on an injection molded plastic support by utilizing a laser technology, and then electroplating to form a three-dimensional metal circuit by the pattern, so that the plastic support has certain electrical performance.

According to the LDS antenna assembly provided by the embodiment of the application, the circuit board assembly is embedded in the injection molding piece, LDS circuits and components on two sides of the injection molding piece are electrically communicated through the circuit board assembly, and on the basis of meeting the electrical communication between the LDS circuits and the components, the possibility that impurities such as outside water and dust enter the LDS antenna assembly is reduced.

In order to facilitate the reader to understand the inventive concept of the present application, the following describes a specific structure of an LDS antenna assembly provided by the embodiment of the present application:

Referring to fig. 5, the LDS antenna assembly 1 provided in the embodiment of the application includes an injection molding member 2, an LDS line 3, a component 4 and a circuit board assembly 30, wherein the LDS line 3 is disposed on one side of the injection molding member 2, the component 4 is disposed on the other side of the injection molding member 2, the circuit board assembly 30 is embedded in the injection molding member 2, one side of the circuit board assembly 30 is electrically connected with the LDS line 3, and the other side of the circuit board assembly 30 is electrically connected with the component 4, so that the LDS line 3 and the component 4 on both sides of the injection molding member 2 can be electrically connected through the circuit board assembly 30, and the possibility that external impurities such as water, dust and the like enter the inside of the LDS antenna assembly 1 is reduced. It is understood that the component 4 may be an LDS line, and the positions of the LDS line 3 and the component 4 may be interchanged. The component 4 is typically an electronic component (for example, a filter) at the front end of the antenna, and the component 4 may also be a connector for transmitting the antenna signal to the motherboard chip.

In some embodiments, the circuit board assembly 30 and the injection molding member 2 are formed into an integral structure by an injection molding process, so that the circuit board assembly 30 is connected with the injection molding member 2 more firmly, and no additional design space is added, which is beneficial to reducing the design space of the LDS antenna assembly 1, so that the LDS antenna assembly 1 is light-weighted.

For the circuit board assembly 30, the circuit board assembly 30 includes a plurality of circuit boards 31, the circuit boards 31 are sequentially stacked, any two adjacent circuit boards 31 may be connected together by welding or gluing, the circuit boards 31 are electrically connected, one side of the circuit boards 31 is electrically connected with the LDS circuit 3, and the other side of the circuit boards 31 is electrically connected with the component 4. Before the circuit board assembly 30 is embedded in the injection molding 2, the circuit board 31 is soldered with electronic components (not shown) according to a conventional process SMT (Surface Mounted Technology, surface mount technology) to form a finished circuit board 31, so that the problem that the injection molding 2 is selected to be high-temperature resistant plastic due to high temperature required by soldering in a later stage process is avoided, thereby increasing the cost, and the SMT mainly refers to a process technology of mounting some microminiature parts on a PCB board by using a mounter. The circuit board 31 includes a plurality of conductor layers 311 and a plurality of substrate layers 312, wherein one substrate layer 312 is disposed between any two adjacent conductor layers 311, the plurality of conductor layers 311 and the plurality of substrate layers 312 are electrically connected, the conductor layers 311 on one side of the plurality of circuit boards 31 are electrically connected to the LDS circuit 3, and the conductor layers 311 on the other side of the plurality of circuit boards 31 are electrically connected to the component 4, so that the conductor layers 311 can be used as electromagnetic shielding layers to reduce the possibility of electromagnetic interference received by the circuit (not shown) of the substrate layers 312, and the conductor layers 311 are preferably copper layers to provide good electrical conductivity to the conductor layers 311.

In some embodiments, the circuit board assembly 30 is provided with a through hole 32, the through hole 32 penetrates through the circuit boards 31, the circuit board assembly 30 further includes a conductive member 33, the conductive member 33 is disposed on the through hole 32, the conductor layers 311 and the substrate layers 312 are respectively electrically connected with the conductive member 33, so that the conductor layers 311 and the substrate layers 312 can be electrically connected, it is understood that the number of the through holes 32 may be multiple, and the conductive member 33 may be a metal plating layer attached on a sidewall of the through hole 32 or a metal post inserted into the through hole 32.

The injection molding 2 is provided with a groove 21 on one side, the bottoms of the grooves 21 are communicated with the conductor layers 311 on one side of the circuit boards 31, and at least part of the LDS circuit 3 extends into the groove 21 to be electrically connected with the conductor layers 311 on one side of the circuit boards 31. In some embodiments, the LDS antenna assembly 1 further includes a plating layer 40, where the plating layer 40 is disposed in the groove 21, and the plating layer 40 is electrically connected to the LDS line 3 and the conductor layer 311 on one side of the plurality of circuit boards 31, so as to improve conductivity between the LDS line 3 and the conductor layer 311 on one side of the plurality of circuit boards 31, and the plating layer 40 may be a metal plating layer such as an LDS plating layer or solder, and the plating layer 40 may be formed during chemical plating of the LDS line 3 and the conductor layer 311 on one side of the plurality of circuit boards 31. In a preferred embodiment, the plating 40 covers the conductor layer 311 on one side of the circuit boards 31 at the bottom of the recess 21, so as to improve conductivity between the LDS circuit 3 and the conductor layer 311 on one side of the circuit boards 31 and reduce the possibility of corrosion of the conductor layer 311.

In a preferred embodiment, referring to fig. 6, in the portion of the circuit board assembly 30 near the groove 21, the ends of any two adjacent conductor layers 311 penetrate through the substrate layer 312 between the two conductor layers, so that the conductor layers 311 in the portion of the circuit board assembly 30 are in contact with each other, and the component 4 is directly contacted with the conductor layer 311 on the other side of the portion of the circuit board assembly 30, so that the antenna signal of the LDS line 3 in the groove 21 can be sequentially transmitted to the component 4 through the conductor layers 311 (as shown by the arrow in fig. 6), and of course, the signal of the component 4 can also be similarly sequentially transmitted to the LDS line 3 through the conductor layers 311.

In some embodiments, referring to fig. 7, the LDS antenna assembly 1 further includes a connecting piece 50, the connecting piece 50 is disposed on the other side of the injection molding piece 2, one end of the connecting piece 50 is electrically connected with the component 4, and the other end of the connecting piece 50 is electrically connected with the conductor layer 311 on the other side of the plurality of circuit boards 31, so as to realize that when the component 4 is disposed on the other side of the injection molding piece 2 and the component 4 cannot be electrically connected with the conductor layer 311 on the other side of the plurality of circuit boards 31, the component 4 can be electrically connected with the conductor layer 311 on the other side of the plurality of circuit boards 31 through the connecting piece 50, so as to assist the component 4 to electrically connect with the LDS circuit 3.

In some embodiments, referring to fig. 8, the LDS antenna assembly 1 further includes an insulating member 60 and an insulating layer 70. The insulating member 60 is disposed on the through hole 32 to generate an insulating effect on the conductor layer 311, the base material layer 312 and the conductive member 33, so as to prevent an external conductor from directly touching the conductor layer 311, the base material layer 312 or the conductive member 33 through the through hole 32 to interfere with the normal operation of the circuit board 31, the insulating member 60 may be insulating resin and fill the through hole 32, and the insulating member 60 may also be an insulating paint layer and be attached to the surface of the through hole 32 or the conductive member 33. The insulating layer 70 is attached to the surfaces of the conductor layers 311 on the other sides of the circuit boards 31 to generate an insulating effect on the conductor layers 311 on the other sides of the circuit boards 31, so as to prevent external conductors from directly touching the conductor layers 311 on the other sides of the circuit boards 31 to interfere with the normal operation of the circuit boards 31, and of course, the insulating layer 70 does not obstruct the electrical connection between the connector 50 or the component 40 and the conductor layers 311 on the other sides of the circuit boards 31, and the insulating layer 70 may be an insulating paint layer or an insulating resin.

For the convenience of the reader to understand the inventive concept of the present application, the following describes the process flow of the LDS antenna assembly 1:

Firstly, manufacturing a circuit board 31 into a finished circuit board 31 through SMT welding electronic components, detecting the finished circuit board 31, sequentially superposing a plurality of circuit boards 31 into a circuit board assembly 30 after detection, embedding the circuit board assembly 30 into an injection molding piece 2, detecting the circuit board assembly 30 after embedding, respectively arranging LDS circuits 3 and components 4 on two sides of the injection molding piece 2 after detection to form a preliminary LDS antenna assembly 1, carrying out chemical plating on the LDS antenna assembly 1 to form a plating layer 40, and finally carrying out integral function detection on the LDS antenna assembly 1.

In the embodiment of the utility model, the LDS antenna assembly 1 comprises an injection molding piece 2, an LDS circuit 3, a component 4 and a circuit board assembly 30, wherein the LDS circuit 3 is arranged on one side of the injection molding piece 2, the component 4 is arranged on the other side of the injection molding piece 2, the circuit board assembly 30 is embedded in the injection molding piece 2, one side of the circuit board assembly 30 is electrically connected with the LDS circuit 3, the other side of the circuit board assembly 30 is electrically connected with the component 4, and the possibility that external impurities such as water, dust and the like enter the LDS antenna assembly 1 is reduced on the basis of meeting the electric communication between the LDS circuit 3 and the component 4. In addition, compared with the scheme of laser carving and chemical plating of the LDS plating layer 6 on the side wall of the guide hole 5 in the prior art, the embodiment of the utility model does not increase the process cost of forming the guide hole 5 and the cost of the LDS process, electromagnetic shielding can be carried out on the circuit of the substrate layer 312 through the conductor layer 311 of the circuit board assembly 30, the circuit board assembly 30 is embedded in the injection molding piece 2 in an injection molding mode and the like, no additional design space is increased, the design space of the LDS antenna assembly 1 is reduced, and the LDS antenna assembly 1 is light.

The present utility model also provides an embodiment of a communication device, where the communication device includes the LDS antenna assembly 1, and the function and structure of the LDS antenna assembly 1 may refer to the above embodiment, and are not described herein in detail.

It should be noted that while the present utility model has been illustrated in the drawings and described in connection with the preferred embodiments thereof, it is to be understood that the utility model may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but are to be construed as providing a full breadth of the disclosure. The above technical features are further combined with each other to form various embodiments which are not listed above and are all considered as the scope of the present utility model described in the specification, further, the improvement or transformation can be carried out by the person skilled in the art according to the above description, and all the improvements and transformation shall fall within the protection scope of the appended claims.

Claims

1. An LDS antenna assembly comprising:

an injection molding;

The LDS line is arranged on one side of the injection molding piece;

The component is arranged on the other side of the injection molding piece;

The circuit board assembly is embedded in the injection molding piece, one side of the circuit board assembly is electrically connected with the LDS circuit, and the other side of the circuit board assembly is electrically connected with the component.

2. The LDS antenna assembly of claim 1, wherein,

The circuit board assembly and the injection molding piece are of an integrated structure.

3. The LDS antenna assembly of claim 1, wherein,

The circuit board assembly comprises a plurality of circuit boards, wherein the circuit boards are sequentially overlapped and are electrically connected;

One side of the circuit boards is electrically connected with the LDS circuit, and the other side of the circuit boards is electrically connected with the components.

4. The LDS antenna assembly of claim 3,

The circuit board comprises a plurality of conductor layers and a plurality of substrate layers, wherein one substrate layer is arranged between any two adjacent conductor layers, and the conductor layers are electrically connected with the substrate layers;

The conductor layers on one sides of the circuit boards are electrically connected with the LDS circuit, and the conductor layers on the other sides of the circuit boards are electrically connected with the components.

5. The LDS antenna assembly of claim 4,

The circuit board assembly is provided with a through hole, the circuit board assembly comprises a conductive piece, the conductive piece is arranged in the through hole, and the conductor layers and the substrate layers are respectively and electrically connected with the conductive piece.

6. The LDS antenna assembly of claim 4,

The injection molding device is characterized in that a groove is formed in one side of the injection molding piece, the bottoms of the grooves are communicated with the conductor layers on one sides of the circuit boards, and at least part of the LDS circuit extends into the groove to be electrically connected with the conductor layers on one sides of the circuit boards.

7. The LDS antenna assembly of claim 6, wherein,

The LDS antenna assembly further comprises a plating layer, wherein the plating layer is arranged in the groove, and the plating layer is respectively and electrically connected with the LDS circuit and the conductor layers on one sides of the circuit boards.

8. The LDS antenna assembly of claim 7, wherein,

The plating layer covers the conductor layers on one sides of the circuit boards at the bottoms of the grooves.

9. The LDS antenna assembly of claim 4,

The LDS antenna assembly further comprises a connecting piece, the connecting piece is arranged on the other side of the injection molding piece, one end of the connecting piece is electrically connected with the components, and the other end of the connecting piece is electrically connected with the conductor layers on the other sides of the circuit boards.

10. A communication device comprising the LDS antenna assembly of any of claims 1-9.