CN222720360U - Wafer edge cleaning device and wafer cleaning equipment - Google Patents
Wafer edge cleaning device and wafer cleaning equipment Download PDFInfo
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- CN222720360U CN222720360U CN202421473110.5U CN202421473110U CN222720360U CN 222720360 U CN222720360 U CN 222720360U CN 202421473110 U CN202421473110 U CN 202421473110U CN 222720360 U CN222720360 U CN 222720360U
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Abstract
The utility model discloses a wafer edge cleaning device and wafer cleaning equipment. The wafer edge cleaning device comprises a cleaning brush assembly, a mounting seat, an underframe and a driving mechanism. The brush assembly includes a brush having an inclined brush face in contact engagement with the edge of the wafer. The mounting seat is used for connecting the driving mechanism and the cleaning brush assembly, the driving mechanism is used for driving the mounting seat to rotate around the driving mechanism, so that the cleaning brush assembly is close to a wafer, and the driving mechanism is arranged on the underframe. The wafer edge cleaning device and the wafer cleaning equipment can ensure good cleaning effect on the edge of the wafer and avoid wafer fragmentation.
Description
Technical Field
The utility model belongs to the field of semiconductor integrated circuit manufacturing equipment, and relates to a wafer edge cleaning device and wafer cleaning equipment.
Background
With the development of integrated circuit technology, the crystal lattice is gradually developed to a large size, 12 inches is gradually becoming the mainstream of integrated circuit manufacture, and even 18 inches and more are developed in the future. The expansion of the wafer size correspondingly causes the expansion of the wafer edge area, and the control of the wafer edge defect is more important. By wafer edge defects, it is meant that after the film (particularly some films with poor adhesion) accumulates at the wafer edge (typically requiring several film depositions) to some extent, it peels off under internal stress or external force, and if it falls to the device area on the wafer surface, it becomes a defect that affects the yield of the product, and serious defects may even lead to product rejection. After a period of time of the film deposition process, a film having a thicker thickness is deposited due to a larger contact angle of the edge reaction, and the film thickness of other regions is thinner than that of the edge positions. The wafer edge defect control method removes possible flaking sources by cleaning the wafer edge, and a special Bevel cleaning (Bevel cleaning) process is required.
In the prior art, a tilt angle brush (bearing brush) is typically used for the tilt angle cleaning process. The bevel brush is capable of cleaning larger particles at the edge and near-edge regions of the wafer. However, using a single bevel angle brush tends to result in an unclean edge clean, edge ring defects, and unnecessary yield impact on the wafer.
Disclosure of utility model
The utility model aims to provide a wafer edge cleaning device and wafer cleaning equipment, which can ensure a better cleaning effect on the edge of a wafer and avoid wafer fragmentation.
The technical scheme adopted by the utility model is as follows:
The wafer edge cleaning device comprises a cleaning brush assembly, a mounting seat, an underframe and a driving mechanism;
The cleaning brush assembly comprises a cleaning brush, wherein the cleaning brush is provided with an inclined brush surface in contact fit with the edge of the wafer;
the mounting seat is used for connecting the driving mechanism and the cleaning brush assembly;
The driving mechanism is used for driving the mounting seat to rotate around the driving mechanism so that the cleaning brush assembly is close to the wafer;
the driving mechanism is arranged on the underframe.
In a preferred embodiment, the mounting base is rotatably connected to the driving mechanism through an angle adjusting mechanism, so that the wafer edge cleaning device has a plurality of working states, and the contact angles between the brush surface of the cleaning brush and the wafer in the plurality of working states are different. In the embodiment, the contact angle between the cleaning brush and the wafer can be adjusted, so that different cleaning requirements are met.
In a more preferred embodiment, the drive mechanism comprises:
a rotating motor;
An arm shaft driven to rotate by the rotating motor, the mounting seat being connected to the arm shaft;
And a sensor for detecting a torque acting on the arm shaft to monitor a force of the brush of the cleaning brush against a wafer.
In a preferred embodiment, the wafer edge cleaning apparatus further comprises an upper nozzle and a lower nozzle disposed up and down, and the cleaning brush assembly is disposed between the upper nozzle and the lower nozzle. The upper and lower nozzles can spray liquid on the upper and lower surfaces of the wafer at the same time, so that the cleaning effect is improved.
In a more preferred embodiment, the upper nozzle and/or the lower nozzle are adjustably arranged to adjust the spray angle. Different spraying angles are set for different cleaning processes, so that the side wall of the wafer can be cleaned better, the cleaning efficiency is improved, and the requirement on the acting force of the cleaning brush on the surface of the wafer can be reduced to a certain extent by the proper spraying angle, so that the risk of wafer breakage is reduced.
In a more preferred embodiment, the upper nozzle and/or the lower nozzle are configured to spray cleaning fluid toward the wafer.
In a preferred embodiment, the cleaning brush has two conical portions with two conical surfaces that are symmetrical up and down, the brush surface being the conical surface or a part of the conical surface.
In a preferred embodiment, the brush assembly further comprises a sensor for detecting the force of the brush against the wafer. The sensor detects the output torque, so that the acting force of the cleaning brush on the wafer is controlled, and the cleaning effect is improved. Meanwhile, the cleaning force of the cleaning brush acting on the edge surface of the wafer can be monitored and controlled in real time through the sensor, so that the wafer is prevented from being crushed by the cleaning brush during cleaning.
In a preferred embodiment, the angle adjustment mechanism comprises a spindle.
The utility model also adopts the following technical scheme:
a wafer cleaning device comprises the wafer edge cleaning device.
Compared with the prior art, the utility model has the following advantages:
According to the wafer edge cleaning device, the mounting seat is enabled to rotate around the driving mechanism through the driving mechanism, so that the cleaning brush assembly is close to a wafer, the distance between the brush face and the edge of the wafer and the compression degree are adjusted, the acting force of the cleaning brush on the edge of the wafer can be adjusted, a good cleaning effect is obtained, and meanwhile, wafer breakage is avoided.
Drawings
In order to more clearly illustrate the technical solutions of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a block diagram of a wafer cleaning apparatus according to an embodiment of the present utility model.
Fig. 2 is a partial enlarged view at a in fig. 1.
Fig. 3 is a perspective view of a wafer edge cleaning apparatus according to an embodiment of the present utility model.
Fig. 4 is a perspective view of another wafer edge cleaning apparatus according to an embodiment of the present utility model.
Fig. 5 is a partial structural view of a wafer edge cleaning apparatus according to an embodiment of the present utility model.
Wherein,
1. The wafer cleaning device comprises a clamping device, a wafer edge cleaning device, a wafer cleaning device and a wafer cleaning device;
21. A cleaning brush assembly 210, a cleaning brush 211, a brush face 212, a conical part;
22. a mounting base;
23. a chassis;
24. driving mechanism 240, rotating motor 241, arm shaft 242, bearing;
25. 250, a rotating shaft;
261. Upper nozzle 262, lower nozzle 263, liquid supply pipeline.
Detailed Description
Preferred embodiments of the present utility model will be described in detail below with reference to the attached drawings so that the advantages and features of the present utility model can be more easily understood by those skilled in the art. The description of these embodiments is provided to assist understanding of the present utility model, but is not intended to limit the present utility model.
The embodiment provides a wafer edge cleaning device which is used for cleaning the edge of a wafer. Referring to fig. 1, the wafer edge cleaning apparatus 2 may be used as one of the components of a wafer cleaning device to automatically clean a wafer 3. Wherein the wafer 3 is clamped by the clamping device 1 of the wafer cleaning equipment and is kept at a specific working position, and the edge of the wafer 3 passes through the wafer edge cleaning device 2 to clean the edge.
Referring to fig. 2 to 5, the wafer edge cleaning apparatus 2 includes a cleaning brush assembly 21, a mount 22, a bottom frame 23, and a driving mechanism 24. The brush assembly 21 includes a brush 210, the brush 210 having an inclined brush face 211 that is in contact engagement with the edge of the wafer 3. The mounting base 22 is used for connecting the driving mechanism 24 and the cleaning brush assembly 21, and the driving mechanism 24 is used for driving the mounting base 22 to rotate around the driving mechanism 24 so that the cleaning brush assembly 21 is close to the wafer 3. The driving mechanism 24 is provided on the chassis 23. As the drive mechanism 24 rotates, the mount 22 rotates about the drive mechanism 24 so that the brush assembly 21 eventually rotates about the drive mechanism 24 so that it can approach the edge of the wafer 3, changing the gap between it and the edge of the wafer 3 until the brush face 211 contacts the edge of the wafer 3 with proper pressure to achieve the desired cleaning effect while avoiding crushing the wafer 3.
Further, the mounting base 22 is rotatably connected to the driving mechanism 24 through the angle adjusting mechanism 25, so that the wafer edge cleaning apparatus 2 has a plurality of operating states in which the contact angles of the brush face 211 of the cleaning brush 210 and the wafer 3 are different. The inclination angle of the cleaning brush 210 can be adjusted through the angle adjusting mechanism 25, so that the cleaning brush 210 can adapt to wafers 3 with different thicknesses, and the contact area (the range in which the cleaning brush 210 can clean the wafers 3) between the wafers 3 and the cleaning brush 210 is changed by changing the contact angle between the cleaning brush 210 and the wafers 3, so that different cleaning requirements are met. Specifically, the mount 22 is rotatable integrally with respect to the drive mechanism 24, so that the orientation of the brush 210 is changed, and the contact angle between the brush surface 211 and the wafer 3 is adjusted.
In the specific example shown in the drawings, the angle adjustment mechanism 25 includes a rotation shaft 250. The axis of the rotation shaft 250 preferably extends in a horizontal direction. The included angle between the mounting seat 22 and the driving mechanism 24 is adjusted by adjusting the rotating angle of the rotating shaft 250, so that the included angle between the wafer 3 and the brush face 211 is changed to meet different cleaning requirements of the wafer 3.
In an alternative embodiment, the angle adjustment mechanism 25 comprises a rotary motor, and the adjustment of the angle between the mounting block 22 and the drive mechanism 24 is accomplished by the action of the rotary motor.
The drive mechanism 24 includes another rotary motor 240, an arm shaft 241, and a first sensor. The rotating motor 240 is mounted on the chassis 23, the arm shaft 241 is rotated by the rotating motor 240, the mount 22 is connected to the arm shaft 241, and the brush assembly 21 is horizontally offset from the arm shaft 241 by a distance. Specifically, the mount 22 is rotatably connected to the arm shaft 241 by the above-described rotation shaft 250. Further, the middle portion of the arm shaft 241 is mounted on the chassis 23 via a bearing, and is rotatable about its own center line toward the chassis 23. Specifically, in the example shown in the drawings, the center line of the arm shaft 241 extends in the vertical direction. The upper end of the arm shaft 241 is connected to the mount 22 via a rotation shaft 250, and the lower end of the arm shaft 241 is connected to the rotation motor 240. The first sensor is for detecting torque acting on the arm shaft 241 to monitor the urging force of the brush surface 211 of the brush 210 against the wafer 3. Specifically, a first sensor may be provided on the rotary motor 240 to learn the torque acting on the arm shaft 241 by detecting the output torque of the rotary motor 240. The cleaning force of the brush 210 on the surface of the wafer 3 can be known from the real-time output torque of the rotating motor 240 and the data of the first sensor. The cleaning force of the cleaning brush 210 acting on the surface of the wafer 3 is monitored in real time through the first sensor, and the cleaning force of the cleaning brush 210 acting on the surface of the wafer 3 is adjusted through adjusting the parameters of the rotating motor 240, so that the acting force of the cleaning brush 210 acting on the surface of the wafer 3 is within a process-limited range, and the cleaning effect is ensured, and meanwhile, the phenomenon that the wafer is broken due to overlarge acting force is avoided. .
The wafer edge cleaning apparatus 2 further includes an upper nozzle 261 and a lower nozzle 262, the upper nozzle 261 and the lower nozzle 262 being disposed in a vertically opposite direction, and the cleaning brush assembly 21 being located between the upper nozzle 261 and the lower nozzle 262. The upper nozzle 261 and the lower nozzle 262 can wash the surface of the cleaning brush 210 while washing the edge of the wafer 3, thereby improving the cleaning effect. In the example shown in the drawings, the upper and lower nozzles 261 and 262 are adjustably provided to adjust the spray angle, and the upper and lower nozzles 261 and 262 are configured to spray the cleaning liquid toward the wafer 3, and the upper and lower nozzles 261 and 262 are respectively connected with the liquid supply line 263 to supply the cleaning liquid to the upper and lower nozzles 261 and 262, respectively. At the time of cleaning, the upper nozzle 261 sprays cleaning liquid to the upper surface of the wafer 3, and the lower nozzle 262 sprays cleaning liquid to the upper surface of the wafer 3. In other examples, only the upper nozzle 261 or the lower nozzle 262 may be adjusted in spray angle and configured to spray cleaning liquid toward the wafer 3, depending on the specific process requirements. Specifically, the upper nozzle 261 and/or the lower nozzle 262 are fixed by the nozzle support, and the spray height and angle can be adjusted to facilitate wetting and cleaning the upper and lower surfaces of the edge of the wafer 3, and to facilitate wetting and cleaning the edge of the wafer 3. The direction of the liquid sprayed by the upper nozzle 261 and the lower nozzle 262 can be freely adjusted according to the process requirements, different spraying angles are set for different cleaning processes, so that the edge of the wafer 3 can be better cleaned, the cleaning efficiency is improved, and the requirement on the acting force of the cleaning brush 210 on the surface of the wafer 3 can be reduced to a certain extent by the proper spraying angle, so that the risk of crushing the wafer 3 is reduced.
The brush assembly 21 has two inclined brush surfaces 211, one inclined brush surface 211 being configured to be in contact engagement with the lower surface edge of the wafer 3 and the other inclined brush surface 211 being configured to be in contact engagement with the upper surface edge of the wafer 3. As shown in fig. 2 and 5, the brush 210 has two tapered portions having two tapered surfaces which are vertically symmetrical, and the two brush surfaces 211 are respectively constituted by the two tapered surfaces or a part of the tapered surfaces. The two conical surfaces are opposite up and down.
In this embodiment, during the process of cleaning the wafer 3, the cleaning brush 210 is in an inclined state, and the inclination angle of the cleaning brush 210 is between 60 and 85 degrees, at this time, the upper/lower surfaces of the wafer 3 are respectively contacted with the brush surface 211 of the upper/lower tapered portion 212 of the cleaning brush 210, and compared with the scheme that the cleaning brush 210 is vertically arranged, the contact area between the wafer 3 and the cleaning brush 210 is larger, so that the cleaning effect of the wafer is improved.
The brush assembly 21 further includes a motor for driving the brush 210 to rotate and a second sensor, such as a pressure sensor, for detecting the force of the brush face 211 against the wafer 3, and the second sensor is disposed in the motor or at the connection between the motor and the brush 211.
The acting force between the cleaning brush 210 and the motor is detected in real time through the second sensor, and the acting force between the cleaning brush 210 and the motor is the cleaning force of the cleaning brush 210 acting on the surface of the wafer 3, so that the real-time control of the acting force on the surface of the wafer 3 is realized.
The working process of the wafer edge cleaning device 2 of this embodiment is that, according to the process requirement, the mounting seat 22 rotates around the rotation shaft 250, the inclination angle of the cleaning brush 210, that is, the inclination angle of the brush surface 211 relative to the surface (horizontal plane) of the wafer 3 is adjusted, so that the contact area between the brush surface 211 and the edge of the wafer 3 meets the requirement, the mounting seat 22 rotates horizontally around the driving mechanism 24, so that the cleaning brush 210 is close to the edge of the wafer 3 until the brush surface 211 contacts the edge of the wafer 3 with a proper pressure to clean the edge of the wafer 3, and the upper nozzle 261 and the lower nozzle 262 spray cleaning liquid to the edge of the wafer 3 and the brush surface 211 with a proper angle during cleaning, so as to ensure a good cleaning effect. In the above process, the sensor detects the acting force of the brush surface 211 on the edge of the wafer 3 and monitors the output torque of the motor, so as to correspondingly adjust the angle and the position of the cleaning brush 210, thereby ensuring better cleaning effect and avoiding the wafer 3 from being broken.
The wafer edge cleaning device 2 of the embodiment has the advantages that the contact angle of the cleaning brush 210 and the wafer 3 can be adjusted to meet different cleaning requirements, the acting force of the cleaning brush 210 on the wafer 3 can be controlled in real time, the wafer 3 is prevented from being broken, liquid is sprayed on the upper surface and the lower surface of the wafer 3 at the same time, and the cleaning effect is improved.
As used in this specification and in the claims, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus.
It is further understood that the term "plurality" in this disclosure means two or more, and other adjectives are similar thereto.
It is further understood that the terms "first," "second," and the like are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish one type of information from another and do not denote a particular order or importance. Indeed, the expressions "first", "second", etc. may be used entirely interchangeably. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure.
The above-described embodiments are provided for illustrating the technical concept and features of the present utility model, and are intended to be preferred embodiments for those skilled in the art to understand the present utility model and implement the same according to the present utility model, not to limit the scope of the present utility model.
Claims (10)
1. The wafer edge cleaning device is characterized by comprising a cleaning brush assembly, a mounting seat, a bottom frame and a driving mechanism;
The cleaning brush assembly comprises a cleaning brush, wherein the cleaning brush is provided with an inclined brush surface in contact fit with the edge of the wafer;
the mounting seat is used for connecting the driving mechanism and the cleaning brush assembly;
The driving mechanism is used for driving the mounting seat to rotate around the driving mechanism so that the cleaning brush assembly is close to the wafer;
the driving mechanism is arranged on the underframe.
2. The wafer edge cleaning apparatus of claim 1, wherein the mounting base is rotatably connected to the driving mechanism by an angle adjusting mechanism, such that the wafer edge cleaning apparatus has a plurality of operating states in which contact angles of the brush face of the brush with the wafer are different.
3. The wafer edge cleaning apparatus of claim 2, wherein the angle adjustment mechanism comprises a spindle.
4. The wafer edge cleaning apparatus of claim 1, wherein the drive mechanism comprises:
a rotating motor;
An arm shaft driven to rotate by the rotating motor, the mounting seat being connected to the arm shaft;
And a sensor for detecting a torque acting on the arm shaft to monitor a force of the brush of the cleaning brush against a wafer.
5. The wafer edge cleaning apparatus of claim 1, further comprising upper and lower nozzles disposed above and below, the cleaning brush assembly being located between the upper and lower nozzles.
6. The wafer edge cleaning apparatus of claim 5, wherein the upper nozzle and/or the lower nozzle are adjustably positioned to adjust the spray angle.
7. The wafer edge cleaning apparatus of claim 5, wherein the upper nozzle and/or the lower nozzle are configured to spray cleaning fluid toward a wafer.
8. The wafer edge cleaning apparatus according to claim 1, wherein the cleaning brush has two tapered portions having two tapered surfaces that are vertically symmetrical, the brush surface being the tapered surface or a part of the tapered surface.
9. The wafer edge cleaning apparatus of claim 1, wherein the cleaning brush assembly further comprises a sensor for detecting a force of the brush against the wafer.
10. A wafer cleaning apparatus comprising the wafer edge cleaning device according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421473110.5U CN222720360U (en) | 2024-06-26 | 2024-06-26 | Wafer edge cleaning device and wafer cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421473110.5U CN222720360U (en) | 2024-06-26 | 2024-06-26 | Wafer edge cleaning device and wafer cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222720360U true CN222720360U (en) | 2025-04-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421473110.5U Active CN222720360U (en) | 2024-06-26 | 2024-06-26 | Wafer edge cleaning device and wafer cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222720360U (en) |
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2024
- 2024-06-26 CN CN202421473110.5U patent/CN222720360U/en active Active
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