CN222952561U - LED lamp panel and backlight module - Google Patents
LED lamp panel and backlight module Download PDFInfo
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- CN222952561U CN222952561U CN202422039353.4U CN202422039353U CN222952561U CN 222952561 U CN222952561 U CN 222952561U CN 202422039353 U CN202422039353 U CN 202422039353U CN 222952561 U CN222952561 U CN 222952561U
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Abstract
本实用新型涉及显示设备技术领域，特别涉及一种LED灯板及背光模组，包括基板，基板上电连接有发光芯片，LED灯板还包括与发光芯片同侧设置在基板上的胶膜层，胶膜层表面设置有图形结构。本实用新型提供的一种胶膜层，在发光芯片封装完成前覆盖在基板上，胶膜层具有图形结构，光线在经过图形结构与空气接触的界面时会发生一次或多次反射及折射，使得LED灯板出光均匀。
The utility model relates to the technical field of display devices, and in particular to an LED light board and a backlight module, comprising a substrate, a light-emitting chip being electrically connected to the substrate, and the LED light board further comprising an adhesive film layer arranged on the same side of the substrate as the light-emitting chip, and a graphic structure being arranged on the surface of the adhesive film layer. The utility model provides an adhesive film layer, which is covered on the substrate before the light-emitting chip is packaged, and the adhesive film layer has a graphic structure, and when light passes through the interface where the graphic structure contacts the air, one or more reflections and refractions occur, so that the light of the LED light board is uniform.
Description
[ Field of technology ]
The utility model relates to the technical field of display equipment, in particular to an LED lamp panel and a backlight module.
[ Background Art ]
Aiming at the Mini LED backlight lamp panel applied to ultra-thin medium-small size display, the packaging mode of whole-surface glue coating is mainly adopted at present, and is generally realized through a glue dispensing or mould pressing process, and once the whole-surface glue coating is finished, the surface of the backlight lamp panel is difficult to carry out further optical processing. In general, in order to ensure uniformity and optical performance of light, a simple process treatment, such as adding a reflective layer or other optical modification, can be performed on the surface of the coated substrate. However, the optical treatment after the glue coating can only perform limited optical adjustment, and although the reflection or transmission performance can be enhanced, the problem of the uniformity of the light inside the backlight panel cannot be solved, and the complexity and cost of the manufacturing process are increased.
[ utility model ]
The utility model provides an LED lamp panel and a backlight module, which are used for solving the problem that optical treatment is limited after glue coating is performed at present.
The technical problem is solved by providing the LED lamp panel, which comprises a substrate, wherein the substrate is electrically connected with a light-emitting chip, the LED lamp panel further comprises a glue film layer which is arranged on the substrate at the same side as the light-emitting chip, and the surface of the glue film layer is provided with a pattern structure.
Preferably, the pattern structures are arranged on the surface of the adhesive film layer in an array manner, openings are formed in the adhesive film layer corresponding to the light-emitting chips, and packaging structures for covering the light-emitting chips are arranged in the openings.
Preferably, the pattern structure has a protruding portion far from one side of the substrate, and an inclination angle is formed between a side wall of the protruding portion and a plane where the substrate is located.
Preferably, the shape of the protruding portion includes at least one of a cylindrical shape, a prismatic shape, and a conical shape.
Preferably, the length of the protrusions ranges from 1 to 50 μm.
Preferably, the glue film layer is embedded with a bubble structure.
Preferably, the thickness of the adhesive film layer is 50-500 μm.
Preferably, the packaging structure comprises at least 2 refraction layers and a reflection layer, wherein the at least 2 refraction layers are stacked, the reflection layer is arranged on one side, far away from the light-emitting chip, of the refraction layer, and the refractive index of the at least 2 refraction layers is gradually decreased from one layer close to the light-emitting chip to one layer far away from the light-emitting chip.
Preferably, the packaging structure at least comprises a transparent layer provided with fluorescent powder, and the fluorescent powder converts blue light emitted by the light emitting chip into white light.
The utility model also provides a backlight module, which comprises a bracket and the LED lamp panel arranged on the bracket.
Compared with the prior art, the LED lamp panel and the backlight module provided by the utility model have the following advantages:
1. The LED lamp panel provided by the embodiment of the utility model has the advantages that the adhesive film layer consists of the graph structures with various properties or different characteristics, before the light-emitting chip is packaged, the adhesive film layer with the graph structures is combined and covered on the surface of the substrate in advance in a composite mode to form an integral adhesive film layer structure, and on the microcosmic aspect, as the refractive index of the adhesive film layer is different from that of air, light rays can be reflected and refracted once or multiple times when passing through the interface of the graph structure and the air, so that the effect of uniform light rays is achieved.
2. According to the LED lamp panel provided by the embodiment of the utility model, the pattern structure is arranged in an array manner, the light utilization rate and the transmission efficiency are optimized, the position and the shape of each pattern structure unit are precisely designed, so that as much light as possible can be effectively output from the surface of the LED lamp panel, the light-emitting chip is exposed through the opening, the light-emitting chip exposed through the opening is protected from the external environment by the packaging structure, the opening corresponding to the light-emitting chip is precisely formed in the adhesive film layer, the precise positioning and alignment of the packaging structure in the subsequent process are ensured, and the light emergent efficiency is improved by the packaging structure.
3. According to the LED lamp panel provided by the embodiment of the utility model, the incidence angle and the reflection path of light can be changed, the number of times of optical treatment of the light on the outer surface of the adhesive film layer is increased, more light is refracted out of the adhesive film layer, the optical effect on the adhesive film layer is enhanced, and the proper inclination angle effectively controls reflection and refraction, so that the light emitted from the light-emitting chip to the backlight side is uniformly distributed.
4. According to the LED lamp panel provided by the embodiment of the utility model, the bulge with the length dimension in the range of 1-50 mu m is arranged on the adhesive film layer of the LED lamp panel and is used as a micro structure, the dimension is far smaller than that of the light emitting chip, more reflection angles and refraction angles can be manufactured, the incidence angle and reflection path of light are better regulated, the light homogenizing effect is accurately controlled through the micro structure, and the original dark spot of the LED lamp panel is eliminated.
5. In the LED lamp panel provided by the embodiment of the utility model, in order to avoid light emission influence in the packaging structure of a general conventional LED lamp panel, bubbles in each packaging layer are discharged as completely as possible, and the adhesive film layer of the LED lamp panel provided by the embodiment is internally provided with a bubble structure which is used for manufacturing interfaces with different refractive indexes in the adhesive film layer, so that light rays are reflected or refracted more in the adhesive film layer, and the light emission is uniform.
6. According to the LED lamp panel provided by the embodiment of the utility model, the glue film layer is used as a layer of covering, the substrate is completely covered, the light-emitting chip is protected in the opening, the packaging structure protects the light-emitting chip exposed through the opening, the service life of the light-emitting chip is prolonged, the stability and reliability of the light-emitting chip under severe conditions are improved, the multi-layer packaging structure made of different materials effectively controls the reflection, transmission and refraction of light rays, the loss of the light inside the packaging structure is reduced to the greatest extent, the refractive index of the packaging structure is reduced from the side close to the light-emitting chip to the side far from the light-emitting chip, the light propagation path and the scattering property are improved, the color deviation caused by internal reflection and refraction is reduced, the scattered light rays can be redirected to the front side by the reflecting layer of the top layer, the light scattering and wasting are avoided, the utilization rate and the efficiency of the light are improved, and the bright spots above the chip are eliminated, so that the LED lamp panel is uniform in light emission.
7. According to the LED lamp panel provided by the embodiment of the utility model, the fluorescent powder can convert blue light with a single wavelength into white light within a wider wavelength range, and the color temperature and the color index of the white light emitted by the LED lamp panel can be adjusted by accurately selecting the type and the concentration of the fluorescent powder, so that the LED lamp panel is more suitable for different application requirements, the fluorescent powder can also improve the output efficiency of light, realize more consistent white light color output, reduce color non-uniformity and improve user experience.
8. The backlight module provided in the embodiment of the utility model has the same beneficial effects as the LED lamp panel, and is not described herein.
[ Description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic cross-sectional view of an LED lamp panel according to a first embodiment of the present utility model.
Fig. 2 is a top view of an LED lamp panel according to a first embodiment of the present utility model.
Fig. 3 is a schematic cross-sectional view of an LED lamp panel according to a second embodiment of the present utility model.
Fig. 4 is a schematic diagram illustrating a light path change of an LED lamp panel according to a second embodiment of the present utility model.
Fig. 5 is a top view of an LED lamp panel according to a second embodiment of the present utility model.
Fig. 6 is a block diagram of a backlight module according to a third embodiment of the present utility model.
The attached drawings are used for identifying and describing:
100. The LED lamp panel comprises an LED lamp panel, a 200-degree LED lamp panel, a 300-degree backlight module;
1. a substrate; 2, a light-emitting chip, 3, a glue film layer, 4, a packaging structure;
31. Pattern structure, 32, open pore, 33, protruding part, 34, bubble structure, 41, refraction layer, 42, reflection layer, 43, transparent layer;
301. And (3) a bracket.
[ Detailed description ] of the invention
The present utility model will be described in further detail with reference to the accompanying drawings and examples of implementation in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
In the present utility model, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are only used to better describe the present utility model and its embodiments and are not intended to limit the scope of the indicated devices, elements or components to the particular orientations or to configure and operate in the particular orientations.
Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the present utility model will be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, the terms "mounted," "configured," "provided," "connected," and "connected" are to be construed broadly. For example, they may be fixedly connected, detachably connected, or of unitary construction, they may be mechanically or electrically connected, they may be directly connected, or they may be indirectly connected through intermediaries, or they may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Referring to fig. 1, the present utility model provides an LED lamp panel 100, which includes a substrate 1, a light emitting chip 2 is electrically connected to the substrate 1, the LED lamp panel 100 further includes a film layer 3 disposed on the substrate 1 at the same side as the light emitting chip 2, and a pattern structure 31 is disposed on the surface of the film layer 3.
It will be appreciated that, on a microscopic scale, the refractive index of the adhesive film layer 3 is different from that of air, and that the light rays are reflected and refracted one or more times when passing through the interface of the graphic structure 31 in contact with air, and the adhesive film layer 3 plays a role of uniform light rays.
Specifically, in the prior art, most of optical processing is performed after the whole surface is coated with glue, namely after the packaging of the light emitting chip 2 is completed, and the main process is dispensing or die pressing, however, in actual production, the dispensing efficiency is low, the uniformity is difficult to control, and the die pressing also needs to be provided with a special high-precision die, so that the cost is high.
Further, an opening 32 is formed on the adhesive film layer 3 corresponding to the light emitting chip 2, and a packaging structure 4 covering the light emitting chip 2 is disposed in the opening 32.
It can be understood that the light emitting chip 2 is exposed through the opening 32, the package structure 4 protects the light emitting chip 2 exposed through the opening 32 from the external environment, and optimizes the light emitted by the light emitting chip 2, so as to improve the light utilization rate.
According to the LED lamp panel 100 provided by the utility model, before the packaging of the light-emitting chip 2 is completed, the adhesive film layer 3 with the pattern structure 31 is attached to the substrate 1, the light-homogenizing effect is realized by the rugged characteristic of the pattern structure 31, the substrate 1 is provided with the conductive circuit, the conductive circuit is paved on the surface of the substrate 1, the adhesive film layer 3 realizes the light-homogenizing effect and simultaneously protects the conductive circuit arranged on the substrate 1, the position, corresponding to the light-emitting chip 2, of the adhesive film layer 3 is provided with the opening 32, the light-emitting chip 2 is exposed out of the opening 32, the pin connected with the conductive circuit is arranged in the opening 32, and the pin is electrically connected with the light-emitting chip 2 to realize the light emission of the light-emitting chip 2.
Further, the pattern structures 31 are arranged on the surface of the adhesive film layer 3 in an array arrangement manner.
Specifically, the pattern structures 31 may be arranged in a matrix array, that is, regular rows and columns form a regular matrix grid, and uniformly and widely cover the surface of the adhesive film layer 3, so as to help collect and guide light, and optimize the divergence angle and directivity of the light.
Preferably, the pattern structures 31 can also be arranged in a honeycomb array or a staggered trapezoid, or can be uniformly and symmetrically distributed around the light emitting chip 2 as a center point according to an angle, so as to realize a more targeted focusing design, and the specific arrangement mode of the pattern structures is not limited in the embodiment, so long as the light guiding and optimizing light divergence angle can be realized.
It can be appreciated that the pattern structure 31 can change the propagation direction, the scattering angle and the beam shape of the light, so as to optimize the light distribution, improve the uniformity of the light or adjust the irradiation angle of the light, and the pattern structure 31 can be lenticular, concave-convex or prismatic, concentrate the light to the backlight side, reduce the loss of the light emitted to the outside of the substrate 1, improve the overall uniformity of the light, and improve the visual effect.
Further, referring to fig. 2, the bubble structure 34 is embedded in the adhesive film layer 3.
In the package layer structure of the general conventional LED lamp panel 100, in order to avoid light-emitting effect, bubbles in each package layer are discharged as completely as possible, and the adhesive film layer 3 of the LED lamp panel 100 provided in this embodiment is embedded with the bubble structure 34, and the bubble structure 34 can manufacture interfaces with different refractive index materials, so that light can be effectively scattered, the concentration effect of light can be reduced, the optical performance can be enhanced, and the visual experience can be improved.
Specifically, during the encapsulation of the glue film layer 3, a foaming process is used to create the bubble structure 34.
Further, the package structure 4 includes at least 2 refractive layers 41 and a reflective layer 42 provided on a side of the refractive layers 41 away from the light emitting chip 2, which are stacked, and the refractive index of the at least 2 refractive layers 41 decreases sequentially from a layer close to the light emitting chip 2 to a layer far from the light emitting chip 2.
As can be appreciated, the refractive index of the refractive layer 41 of different levels from the light emitting chip 2 end to the air end gradually becomes lower, and the light extraction rate is improved, thereby improving the brightness of the lamp panel.
Illustratively, if the first layer of refractive layer 41 is n 1, the second layer of refractive layer is n 2, and n1> n2, the light rays experience a decrease in refractive index as they enter the second layer from the first layer, and according to snell's law n1×sinΦ1=n2×sinΦ2, the propagation direction of the light rays deviates from normal as they enter the second layer of refractive layer 41 from the first layer of refractive layer 41, the refractive angle Φ2 increases, so that more light rays can be refracted out of the first layer of refractive layer 41 into the second layer of refractive layer 41, resulting in a more uniform distribution of light rays.
Specifically, the refractive index of each refractive layer 41 in the package structure 4 is larger than that of air.
Furthermore, the purpose of the reflective layer 42 disposed on the side of the refractive layer 41 away from the light emitting chip 2 is to disperse the light which is not yet effectively utilized after passing through the refractive layer 41, and the light can pass through the refractive layer 41 again through reflection, so as to be effectively guided to the outside, thereby significantly improving the overall light utilization efficiency, increasing the brightness of the LED lamp panel 100, and improving the light distribution.
Further, the thickness of the adhesive film layer 3 is in the range of 50-500 μm.
Specifically, the package structure 4 encapsulates the light emitting chip 2 disposed in the opening 32, the thickness of the light emitting chip 2 in the Mini LED lamp panel 100 is typically between 20 and 50 μm, and the thickness of the package structure 4 encapsulated on the light emitting chip 2 is typically between 30 and 1000 μm according to the thicknesses of the different refraction layers 41 and the reflection layers 42, the adhesive film layer 3 is pre-disposed on the substrate 1, and the thickness of the adhesive film layer 3 cannot exceed the sum of the thicknesses of the light emitting chip 2 and the package structure 4.
Preferably, the adhesive film layer 3 can be provided with diffusion powder, the diffusion powder can uniformly emit light, light spots and shadows generated by direct light are eliminated, and the light diffusivity is improved.
Further, referring to fig. 1 and 4, the package structure 4 includes at least one transparent layer 43 with a phosphor, and the phosphor converts blue light emitted from the light emitting chip 2 into white light.
It can be understood that the light emitted by the blue light LED chip is single blue light, and the blue light can be converted into white light by the conversion of fluorescent powder, so that the color temperature and the color rendering property are improved, and the requirements of backlight or illumination are met.
Preferably, the transparent layer 43 may be one of at least 2 refraction layers 41, or may be separately provided as a conversion layer in the package structure 4.
Further, the adhesive film layer 3 is made of one or more of silica gel, epoxy resin, thermoplastic plastic or thermoplastic resin.
It can be appreciated that these materials have good light transmittance, which helps to ensure that the light of the light emitting chip 2 can effectively penetrate through the adhesive film layer 3, improve the overall light efficiency, provide good physical protection for the light emitting chip 2, and prevent damage to the chip caused by external physical impact and humidity.
Still further, referring to fig. 3-5, a second embodiment of the present utility model provides an LED lamp panel 200, and the LED lamp panel 200 is different from the LED lamp panel 100 provided in the first embodiment only in that no openings 32 are provided on the LED lamp panel 200 corresponding to the light emitting chips 2.
Specifically, the whole surface of the adhesive film layer 3 is directly covered on the substrate 1, and the light emitting chip 2 is packaged.
Further, the pattern structure 31 has a protrusion 33 away from the substrate 1, and a sidewall of the protrusion 33 forms an inclination angle with a plane of the substrate 1.
As can be appreciated, the protrusion 33 reduces the loss of light to the outside of the substrate 1, and the inclined side wall of the protrusion 33 relative to the plane of the substrate 1 can make the light reflect and refract multiple times, so as to control the incident angle and scattering property of the light, thereby enhancing the light scattering effect, scattering and uniformly distributing the light more effectively, and reducing glare and visual discomfort.
Specifically, the protrusion 33 reduces the exit angle of the outgoing light by providing a sidewall inclined to the substrate 1, compared to the light exit surface provided parallel to the substrate 1, so that the light is fully utilized to improve the optical utilization, and the sidewall is inclined to the plane of the substrate 1 by an angle ranging from 30 ° to 80 °, preferably 45 °, without specific limitation of the angle of inclination in the present utility model, so long as the effect of reducing the exit angle is achieved.
Further, the shape of the boss 33 includes at least one of a cylinder, a prism, and a cone, which are effective to control and optimize the reflection and refraction of light to focus the light to a specific area.
Further, the shape of the protruding portion 33 may be a hemispherical shape, a parabolic shape, a zigzag shape, etc., and the shape of the protruding portion 33 is not particularly limited in the present utility model, as long as the protruding portion 33 having a corresponding shape has a sidewall inclined from the plane of the substrate 1, so as to provide more exit angles for the outgoing light.
Further, the length of the convex portion 33 is in the range of 1 to 50 μm.
Specifically, in the Mini LED lamp panel 100 for ultra-thin medium and small-sized display applications, the length of the light emitting chip 2 is typically between 0.2mm and 1mm, and the projection length of the protruding portion 33 on the plane of the substrate 1 ranges from 1 μm to 50 μm, and the size of the protruding portion 33 as a micro structure is far smaller than the size of the light emitting chip 2, so that more reflection angles and refraction angles are manufactured for outgoing light rays.
Referring to fig. 6, the third embodiment of the present utility model further provides a backlight module 300, which includes a bracket 301 and the LED lamp panel 100 according to the first embodiment disposed on the bracket 301, and has the same beneficial effects as the LED lamp panel 100, and will not be described herein.
Compared with the prior art, the LED lamp panel and the backlight module provided by the utility model have the following advantages:
1. The LED lamp panel provided by the embodiment of the utility model has the advantages that the adhesive film layer consists of the graph structures with various properties or different characteristics, before the light-emitting chip is packaged, the adhesive film layer with the graph structures is combined and covered on the surface of the substrate in advance in a composite mode to form an integral adhesive film layer structure, and on the microcosmic aspect, as the refractive index of the adhesive film layer is different from that of air, light rays can be reflected and refracted once or multiple times when passing through the interface of the graph structure and the air, so that the effect of uniform light rays is achieved.
2. According to the LED lamp panel provided by the embodiment of the utility model, the pattern structure is arranged in an array manner, the light utilization rate and the transmission efficiency are optimized, the position and the shape of each pattern structure unit are precisely designed, so that as much light as possible can be effectively output from the surface of the LED lamp panel, the light-emitting chip is exposed through the opening, the light-emitting chip exposed through the opening is protected from the external environment by the packaging structure, the opening corresponding to the light-emitting chip is precisely formed in the adhesive film layer, the precise positioning and alignment of the packaging structure in the subsequent process are ensured, and the light emergent efficiency is improved by the packaging structure.
3. According to the LED lamp panel provided by the embodiment of the utility model, the incidence angle and the reflection path of light can be changed, the number of times of optical treatment of the light on the outer surface of the adhesive film layer is increased, more light is refracted out of the adhesive film layer, the optical effect on the adhesive film layer is enhanced, and the proper inclination angle effectively controls reflection and refraction, so that the light emitted from the light-emitting chip to the backlight side is uniformly distributed.
4. According to the LED lamp panel provided by the embodiment of the utility model, the bulge with the length dimension in the range of 1-50 mu m is arranged on the adhesive film layer of the LED lamp panel and is used as a micro structure, the dimension is far smaller than that of the light emitting chip, more reflection angles and refraction angles can be manufactured, the incidence angle and reflection path of light are better regulated, the light homogenizing effect is accurately controlled through the micro structure, and the original dark spot of the LED lamp panel is eliminated.
5. In the LED lamp panel provided by the embodiment of the utility model, in order to avoid light emission influence in the packaging structure of a general conventional LED lamp panel, bubbles in each packaging layer are discharged as completely as possible, and the adhesive film layer of the LED lamp panel provided by the embodiment is internally provided with a bubble structure which is used for manufacturing interfaces with different refractive indexes in the adhesive film layer, so that light rays are reflected or refracted more in the adhesive film layer, and the light emission is uniform.
6. According to the LED lamp panel provided by the embodiment of the utility model, the glue film layer is used as a layer of covering, the substrate is completely covered, the light-emitting chip is protected in the opening, the packaging structure protects the light-emitting chip exposed through the opening, the service life of the light-emitting chip is prolonged, the stability and reliability of the light-emitting chip under severe conditions are improved, the multi-layer packaging structure made of different materials effectively controls the reflection, transmission and refraction of light rays, the loss of the light inside the packaging structure is reduced to the greatest extent, the refractive index of the packaging structure is reduced from the side close to the light-emitting chip to the side far from the light-emitting chip, the light propagation path and the scattering property are improved, the color deviation caused by internal reflection and refraction is reduced, the scattered light rays can be redirected to the front side by the reflecting layer of the top layer, the light scattering and wasting are avoided, the utilization rate and the efficiency of the light are improved, and the bright spots above the chip are eliminated, so that the LED lamp panel is uniform in light emission.
7. According to the LED lamp panel provided by the embodiment of the utility model, the fluorescent powder can convert blue light with a single wavelength into white light within a wider wavelength range, and the color temperature and the color index of the white light emitted by the LED lamp panel can be adjusted by accurately selecting the type and the concentration of the fluorescent powder, so that the LED lamp panel is more suitable for different application requirements, the fluorescent powder can also improve the output efficiency of light, realize more consistent white light color output, reduce color non-uniformity and improve user experience.
8. The backlight module provided in the embodiment of the utility model has the same beneficial effects as the LED lamp panel, and is not described herein.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the utility model, but any modifications, equivalents, improvements, etc. within the principles of the present utility model should be included in the scope of the present utility model.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202422039353.4U CN222952561U (en) | 2024-08-21 | 2024-08-21 | LED lamp panel and backlight module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422039353.4U CN222952561U (en) | 2024-08-21 | 2024-08-21 | LED lamp panel and backlight module |
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| CN222952561U true CN222952561U (en) | 2025-06-06 |
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| CN202422039353.4U Active CN222952561U (en) | 2024-08-21 | 2024-08-21 | LED lamp panel and backlight module |
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