CN223065397U - High-frequency impedance detection device - Google Patents
High-frequency impedance detection device Download PDFInfo
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- CN223065397U CN223065397U CN202422236118.6U CN202422236118U CN223065397U CN 223065397 U CN223065397 U CN 223065397U CN 202422236118 U CN202422236118 U CN 202422236118U CN 223065397 U CN223065397 U CN 223065397U
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Abstract
本实用新型公开了一种高频阻抗检测装置，包括电路板、导电组件、绝缘基板和矢量网络分析仪；所述绝缘基板开设有容纳槽和通孔，所述电路板位于所述容纳槽内，所述通孔与所述容纳槽相连通，所述通孔填充有导电金属膏，所述导电金属膏与所述电路板相连接，所述导电组件连接所述导电金属膏于所述矢量网络分析仪。电路板和导电金属膏相连接，通过导线组件连接导线金属膏和矢量网络分析仪。然后启动矢量网络分析仪，矢量网络分析仪向电路板发送复杂且精确的信号，这些信号覆盖了从低频到高频的广泛范围，能够充分激发导电金属膏在不同频段下的响应特性，解决了传统大尺寸填孔绝缘基板无法检测高频阻抗的问题。
The utility model discloses a high-frequency impedance detection device, including a circuit board, a conductive component, an insulating substrate and a vector network analyzer; the insulating substrate is provided with a receiving groove and a through hole, the circuit board is located in the receiving groove, the through hole is connected to the receiving groove, the through hole is filled with a conductive metal paste, the conductive metal paste is connected to the circuit board, and the conductive component connects the conductive metal paste to the vector network analyzer. The circuit board and the conductive metal paste are connected, and the conductive metal paste and the vector network analyzer are connected by a wire component. Then the vector network analyzer is started, and the vector network analyzer sends complex and precise signals to the circuit board. These signals cover a wide range from low frequency to high frequency, and can fully stimulate the response characteristics of the conductive metal paste in different frequency bands, solving the problem that the traditional large-size hole-filled insulating substrate cannot detect high-frequency impedance.
Description
Technical Field
The utility model relates to the technical field of insulating substrates, in particular to a high-frequency impedance detection device.
Background
In the fields of electronics and semiconductor manufacturing, high frequency impedance testing is one of the key links in evaluating the performance of materials, circuit boards and components, particularly in high speed signal transmission and Radio Frequency (RF) applications.
Because the physical size of the large-size hole filling insulating substrate exceeds the application range of the traditional testing device, the traditional clamp can not stably clamp, so that the contact in the testing process is unstable, and the accuracy and the reliability of the testing result are affected. In addition, complex metal paste layouts inside large-size substrates may not be fully and uniformly tested due to the limitations of fixture design, thereby omitting potential impedance anomaly areas.
Disclosure of utility model
In view of the above-mentioned drawbacks, the present utility model provides a high-frequency impedance detection device, in which a circuit board is connected to a conductive metal paste, and the conductive metal paste is connected to a vector network analyzer through a conductive wire assembly. And then starting the vector network analyzer, and sending complex and accurate signals to the circuit board by the vector network analyzer, wherein the signals cover a wide range from low frequency to high frequency, can fully excite the response characteristics of the conductive metal paste under different frequency bands, and solve the problem that the conventional large-size hole filling insulating substrate cannot detect high-frequency impedance.
To achieve the purpose, the utility model adopts the following technical scheme:
A high-frequency impedance detection device comprises a circuit board, a conductive component, an insulating substrate and a vector network analyzer;
The insulating substrate is provided with a containing groove and a through hole, the circuit board is positioned in the containing groove, the through hole is communicated with the containing groove, the through hole is filled with conductive metal paste, the conductive metal paste is connected with the circuit board, and the conductive component is connected with the conductive metal paste in the vector network analyzer.
The top of the insulating substrate is provided with a first sub-through hole, the bottom of the insulating substrate is provided with a second sub-through hole, the accommodating groove is respectively communicated with the first sub-through hole and the second sub-through hole, and the first sub-through hole and the second sub-through hole are filled with the conductive metal paste;
The first end of the first conductive line penetrates through the first sub-through hole to be connected with the conductive metal paste, the tail end of the first conductive line is connected with the vector network analyzer, the first end of the second conductive line penetrates through the second sub-through hole to be connected with the conductive metal paste, and the tail end of the second conductive line is connected with the vector network analyzer;
the first conductive line, the second conductive line, the circuit board and the vector network analyzer form a closed circuit.
The vector network analyzer further comprises a first SMA connecting line and a second SMA connecting line, wherein the first SMA connecting line is connected with one port of the first conductive line and one port of the vector network analyzer, and the second SMA connecting line is connected with the second conductive line and the other port of the vector network analyzer.
The two first conductive circuits are arranged, the head ends of the two first conductive circuits are connected with the conductive metal paste at the top, the tail ends of the two first conductive circuits are respectively positioned at the two opposite side edges of the insulating substrate, and the first SMA connection circuit is connected with the tail end of one of the first conductive circuits;
The first ends of the second conductive lines are connected with the conductive metal paste at the bottom, the tail ends of the second conductive lines are positioned at the edge of the insulating substrate, and the second SMA connecting lines are connected with the tail ends of one of the second conductive lines.
The top and the bottom of insulating substrate all are provided with the adhesion layer, first conductive line with the second conductive line is all through adhesion layer fixed mounting in insulating substrate.
The adhesion layer is a lead-free solder comprising tin, copper, silver, bismuth, indium and zinc.
The insulating substrate is one of a flexible substrate, a polyimide substrate, an FR-4 substrate, a glass substrate and a ceramic substrate.
The technical scheme of the utility model can have the following beneficial effects:
1. The circuit board is connected with the conductive metal paste, and the conductive metal paste is connected with the vector network analyzer through the wire assembly. And then starting the vector network analyzer, and sending complex and accurate signals to the circuit board by the vector network analyzer, wherein the signals cover a wide range from low frequency to high frequency, can fully excite the response characteristics of the conductive metal paste under different frequency bands, and solve the problem that the conventional large-size hole filling insulating substrate cannot detect high-frequency impedance.
2. In the high-frequency impedance detection device, the SMA connector can ensure that the high-frequency signal keeps lower return loss and higher transmission efficiency in the transmission process, thereby meeting the requirement of high-frequency impedance measurement.
Drawings
FIG. 1 is a schematic diagram of a high frequency impedance detecting apparatus according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of an insulating substrate according to an embodiment of the present utility model;
FIG. 3 is a cross-sectional view of an insulating substrate according to one embodiment of the present utility model;
the circuit board comprises a circuit board body, a circuit board, a conductive component, a first conductive circuit, a second conductive circuit, a first SMA connecting circuit, a second SMA connecting circuit, an insulating substrate, a receiving groove, a vector network analyzer and conductive metal paste, wherein the circuit board body comprises a circuit board 1, a conductive component, a first conductive circuit, a second conductive circuit, a first SMA connecting circuit, a second SMA connecting circuit, a conductive substrate, a receiving groove, a vector network analyzer and a conductive metal paste.
Detailed Description
The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.
In the description of the present utility model, it should be understood that the terms "length," "middle," "upper," "lower," "left," "right," "top," "bottom," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "plurality" is two or more.
In the description of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "joined," and "connected" are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, or may be directly connected, or may be indirectly connected through an intermediate medium, or may be in communication with each other. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
A high-frequency impedance detecting apparatus according to an embodiment of the present utility model is described below with reference to fig. 1 to 3.
A high-frequency impedance detection device comprises a circuit board 1, a conductive component 2, an insulating substrate 3 and a vector network analyzer 4;
The insulating substrate 3 is provided with a containing groove 31 and a through hole, the circuit board 1 is located in the containing groove 31, the through hole is communicated with the containing groove 31, the through hole is filled with conductive metal paste 5, the conductive metal paste 5 is connected with the circuit board 1, and the conductive component 2 is connected with the conductive metal paste 5 in the vector network analyzer 4.
The operation process is as follows, a through hole is formed on the insulating substrate 3, the through hole is filled with conductive metal paste 5, and the insulating substrate 3 after hole filling is completed forms a test sample for detecting high-frequency impedance.
The insulating substrate 3 after hole filling is provided with a receiving groove 31, and the receiving groove 31 is communicated with the through hole. Before detection, the circuit board 1 is pushed so that the circuit board 1 movably stretches into the accommodating groove 31 of the insulating substrate 3 until the side wall of the circuit board 1 abuts against the side wall of the accommodating groove 31, and the pushing of the circuit board 1 is stopped. The circuit board 1 is now connected to the conductive paste 5, which is connected to the vector network analyzer 4 via a wire assembly. The vector network analyzer 4 is then activated, and the vector network analyzer 4 sends complex and accurate signals to the circuit board 1, which cover a wide range from low frequency to high frequency, and can sufficiently excite the response characteristics of the conductive metal paste 5 in different frequency bands.
In the measurement process, the vector network analyzer 4 not only can capture the part of the signal directly transmitted back from the circuit board 1, but also can accurately identify and record the complex phenomena of reflection, scattering, mode conversion and the like of the signal on the pattern or the circuit of the conductive metal paste 5. The fine signal changes directly reflect the key parameters of impedance, phase, attenuation and the like of the conductive metal paste 5 under high frequency, and provide abundant data support for evaluating the high frequency performance of the conductive metal paste.
A first sub-through hole is formed in the top of the insulating substrate 3, a second sub-through hole is formed in the bottom of the insulating substrate 3, the accommodating groove 31 is respectively communicated with the first sub-through hole and the second sub-through hole, and the first sub-through hole and the second sub-through hole are filled with the conductive metal paste 5;
The conductive component 2 comprises a first conductive line 21 and a second conductive line 22, wherein the head end of the first conductive line 21 passes through the first sub-through hole to be connected with the conductive metal paste 5, the tail end of the first conductive line 21 is connected with the vector network analyzer 4, the head end of the second conductive line 22 passes through the second sub-through hole to be connected with the conductive metal paste 5, and the tail end of the second conductive line 22 is connected with the vector network analyzer 4;
The first conductive trace 21, the second conductive trace 22, the circuit board 1 and the vector network analyzer 4 form a closed circuit.
Since the conventional insulating substrate 3 is generally limited in size and electromagnetic interference, it is difficult to cooperate with the vector network analyzer 4 for testing. Accordingly, the first and second sub-through holes are provided on the insulating substrate 3 of this embodiment, and the accommodation groove 31 communicates with the first and second sub-through holes, respectively. The through hole mode can be used for most insulating substrate 3 test samples which have large surface areas and need to be high-frequency impedance and contain metal paste on the market. The first end of the first conductive line 21 passes through the first sub-through hole to be connected with the conductive metal paste 5, the tail end of the first conductive line 22 passes through the second sub-through hole to be connected with the conductive metal paste 5, and the tail end of the second conductive line 22 also is connected with the vector network analyzer 4, wherein the conductive metal paste 5 is connected with the circuit board 1, so that a closed loop can be formed inside the insulating substrate 3 through the conductive component 2, and meanwhile, the current can be connected with the vector network analyzer 4 outside, thereby realizing the detection of high-frequency impedance. This closed circuit is a core part of high-frequency impedance detection, which allows a current to flow in the conductive metal paste 5, and its impedance characteristics to be measured and analyzed by the vector network analyzer 4.
The first sub-through hole, the second sub-through hole and the accommodating groove 31 on the insulating substrate 3 are mutually communicated, so that the stable connection of the conductive component 2 is ensured, and the installation and the debugging are convenient. Meanwhile, the filling of the conductive metal paste 5 improves contact conductivity and reduces contact resistance.
The system further comprises a first SMA connecting line 23 and a second SMA connecting line 24, wherein the first SMA connecting line 23 is connected with one port of the vector network analyzer 4, and the second SMA connecting line 24 is connected with the other port of the vector network analyzer 4.
It should be noted that the first SMA connection wire 23 and the second SMA connection wire 24 are preferably SMA connectors. In the high-frequency impedance detection device, the SMA connector can ensure that the high-frequency signal keeps lower return loss and higher transmission efficiency in the transmission process, thereby meeting the requirement of high-frequency impedance measurement.
The two first conductive lines 21 are provided, the head ends of the two first conductive lines 21 are connected with the conductive metal paste 5 at the top, the tail ends of the two first conductive lines 21 are respectively positioned at two opposite side edges of the insulating substrate 3, and the first SMA connecting line 23 is connected with the tail end of one of the first conductive lines 21;
The two second conductive wires 22 are provided, the head ends of the two second conductive wires 22 are connected with the conductive metal paste 5 at the bottom, the tail ends of the second conductive wires 22 are positioned at the edge of the insulating substrate 3, and the second SMA connecting wire 24 is connected with the tail end of one of the second conductive wires 22.
The first ends of the first conductive line 21 and the second conductive line 22 are connected with the conductive metal paste 5, and the ends are respectively located at two opposite side edges of the insulating substrate 3, so that the layout is beneficial to optimizing a transmission path of a high-frequency signal, reducing attenuation and distortion of the signal in a transmission process, and improving efficiency and accuracy of signal transmission.
Because the ends of the first conductive line 21 and the second conductive line 22 are respectively positioned at two sides of the insulating substrate 3, the device can be flexibly configured according to different testing requirements during testing, for example, different testing environments and testing conditions can be adapted by selecting different ends to access testing equipment, and the universality and the flexibility of the device are enhanced.
The first SMA connecting wire 23 and the second SMA connecting wire 24 can select the connection positions according to the test environment of the test device, so that the limited space of the insulating substrate 3 is fully utilized, the smoothness of signal transmission is ensured, and the occurrence of the condition of space waste is avoided.
The top and the bottom of the insulating substrate 3 are respectively provided with an adhesion layer, and the first conductive circuit 21 and the second conductive circuit 22 are respectively fixedly installed on the insulating substrate 3 through the adhesion layers.
The adhesion layer can firmly fix the conductive circuit on the insulating substrate 3, prevent the circuit from shifting or falling off due to vibration or external force in the high-frequency test process, thereby ensuring the stability and reliability of the test, reducing signal interference and error and improving the test precision.
In addition, the adhesion layer is used for tightly attaching the conductive circuit on the insulating substrate 3, so that the air gap between the circuit and the substrate can be reduced, the capacitance effect and the inductance effect caused by the air gap are reduced, the loss and the distortion in the high-frequency signal transmission process are reduced, and the electrical performance of the test is improved.
The adhesion layer is a lead-free solder comprising tin, copper, silver, bismuth, indium and zinc.
The combination of various metal elements in the lead-free solder can form a welding joint with higher strength and good toughness, so that the first conductive circuit 21 and the second conductive circuit 22 can be firmly fixed on the insulating substrate 3, vibration and external force impact are resisted, and the stability and reliability of the testing device in a complex environment are ensured.
And the use of the lead-free solder meets the modern environmental protection requirement, and avoids the potential harm of the traditional lead-containing solder to the environment and human health.
The insulating substrate 3 is one of a flexible substrate, a polyimide substrate, an FR-4 substrate, a glass substrate, and a ceramic substrate.
These substrate materials generally have low dielectric constants and dielectric losses, which help reduce losses and distortions in the transmission of high frequency signals, thereby improving the accuracy and precision of the test.
The technical principle of the present utility model is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the utility model and should not be taken in any way as limiting the scope of the utility model. Other embodiments of the utility model will be apparent to those skilled in the art from consideration of this specification without undue burden.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422236118.6U CN223065397U (en) | 2024-09-11 | 2024-09-11 | High-frequency impedance detection device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422236118.6U CN223065397U (en) | 2024-09-11 | 2024-09-11 | High-frequency impedance detection device |
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| Publication Number | Publication Date |
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| CN223065397U true CN223065397U (en) | 2025-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202422236118.6U Active CN223065397U (en) | 2024-09-11 | 2024-09-11 | High-frequency impedance detection device |
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| CN (1) | CN223065397U (en) |
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