CN223167482U - Electromagnetic shielding module and electronic equipment - Google Patents

Abstract

The present invention provides an electromagnetic shielding module and electronic device. The electromagnetic shielding module includes a substrate, a chip assembly disposed on one side of the substrate, and a package shell. The substrate includes at least one grounding region. The package shell is connected to the substrate and covers the chip assembly. An electromagnetic shielding layer is disposed on a side of the package shell that is close to the chip assembly and/or a side of the package shell that is away from the chip assembly. The grounding region is electrically connected to the electromagnetic shielding layer.

Description

Electromagnetic shielding module and electronic equipment

Technical Field

The embodiment of the application relates to the technical field of electromagnetic shielding, in particular to an electromagnetic shielding module and electronic equipment.

Background

Electronic components such as sensors are susceptible to external electromagnetic fields, and it is often desirable to encase a metal shell over such electronic components as an electromagnetic interference (Electromagnetic Interference, EMI) shield to reduce external electromagnetic interference. However, a metal shell is directly sleeved outside an electronic element, so that a series of problems such as overlarge volume, poor electromagnetic shielding effect, light crosstalk and the like exist.

How to reduce the volume of the metal shell and improve the electromagnetic shielding capability of the electronic component is a current urgent problem to be solved.

Disclosure of utility model

In view of the above, the embodiment of the application provides an electromagnetic shielding module and an electronic device.

In order to achieve the above object, the technical solution of the embodiment of the present application is as follows:

The embodiment of the application provides an electromagnetic shielding module, which comprises a substrate, a chip assembly and a packaging shell, wherein the chip assembly and the packaging shell are arranged on one side of the substrate;

The substrate comprises at least one grounding region;

The packaging shell is connected with the substrate and covers the chip assembly;

an electromagnetic shielding layer is arranged on one side of the packaging shell, which is close to the chip assembly, and/or one side of the packaging shell, which is far away from the chip assembly;

Wherein the grounding region is electrically connected with the electromagnetic shielding layer.

In some embodiments, the package is adhered to the substrate by an insulating adhesive;

The electromagnetic shielding module further comprises at least one grounding wire, and the grounding wire is electrically connected with the grounding area and the electromagnetic shielding layer positioned on one side, close to the chip assembly, of the packaging shell.

In some embodiments, two ends of the ground wire are electrically connected to the same ground region, or two ends of the ground wire are respectively electrically connected to different ground regions;

The portion between the two ends of the grounding wire contacts the electromagnetic shielding layer so that the grounding wire is electrically connected with the electromagnetic shielding layer and the grounding area.

In some embodiments, the electromagnetic shield layer on a side of the package adjacent to the chip assembly includes one or more contacts to the ground line;

The contact portion is located on a top wall or a side wall of the electromagnetic shielding layer.

In some embodiments, the ground wire and the contact are connected by conductive adhesive.

In some embodiments, the chip assembly comprises a first chip and a second chip distributed along a first direction, wherein the first chip comprises a light emitting area for outputting emitted light, the second chip comprises a light receiving area for receiving reflected light of the emitted light, and the projection of the grounding wire on the substrate is out of the light emitting area and the projection area of the light receiving area on the substrate.

In some embodiments, the two grounding regions are respectively positioned at two sides of the chip assembly in a second direction, wherein the second direction intersects the first direction;

The packaging shell further comprises a transmitting hole, a receiving hole and a protruding structure;

The receiving hole is positioned at the light receiving position of the second chip;

the convex structure is positioned between the emitting hole and the receiving hole and extends along the second direction, and is used for optically isolating the emitted light and the reflected light;

At least part of the grounding wire is fixed between the protruding structure and the second chip.

In some embodiments, the encapsulation is bonded to the substrate by an insulating glue, the grounding region being at least partially located on the substrate surface outside the encapsulation;

The electromagnetic shielding layer on a side of the package away from the chip assembly is electrically connected to the ground region.

In some embodiments, the encapsulation is bonded to the substrate by an insulating glue and a conductive glue; the grounding area is at least partially positioned on the surface of the substrate inside the packaging shell;

The electromagnetic shielding layer positioned on one side of the packaging shell close to the chip assembly is electrically connected with the grounding area through the conductive adhesive.

The embodiment of the application also provides electronic equipment, which comprises the electromagnetic shielding module.

Compared with the electromagnetic shielding module provided by the embodiment of the application, the electromagnetic shielding module is characterized in that the metal shell is directly sleeved outside the light sensing assembly to serve as the metal shielding cover, and the electromagnetic shielding layer can be directly formed on the inner side and/or the outer side of the packaging shell in the modes of electromagnetic sputtering and the like, so that the space requirement of the electromagnetic shielding layer can be reduced, and the volume of the electromagnetic shielding module is reduced.

Drawings

Fig. 1 is a schematic structural diagram of an electromagnetic shielding module according to an embodiment of the present application;

Fig. 2A-2C are schematic structural diagrams of an electromagnetic shielding module according to an embodiment of the present application;

Fig. 3A is a schematic structural diagram of an electromagnetic shielding module according to an embodiment of the present application;

FIG. 3B is a top view of a substrate panel according to an embodiment of the present application;

fig. 3C is a schematic structural diagram of an electromagnetic shielding module according to an embodiment of the present application;

Fig. 4 is a schematic structural diagram of an electromagnetic shielding module according to an embodiment of the present application;

fig. 5A-5B are schematic views of connection between ground lines in an electromagnetic shielding module according to an embodiment of the present application;

Fig. 6 is a third schematic connection diagram of a ground wire in an electromagnetic shielding module according to an embodiment of the present application;

fig. 7 is a schematic diagram showing connection of a ground wire in an electromagnetic shielding module according to an embodiment of the present application;

fig. 8 is a schematic diagram showing connection of a ground wire in an electromagnetic shielding module according to an embodiment of the present application;

Fig. 9A-9C are schematic views of a grounding area in an electromagnetic shielding module according to an embodiment of the application;

fig. 10A is a schematic diagram of comparison between an electromagnetic shielding module and a substrate according to an embodiment of the present application;

FIGS. 10B-10C are cross-sectional views of an electromagnetic shielding module according to an embodiment of the present application along the AA' section;

Fig. 11 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

Fig. 12 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some, but not all embodiments of the application. All other embodiments, based on the embodiments of the application, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the application.

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the application may be practiced without one or more of these details. In other instances, well-known functions and constructions are not described in detail since they would obscure the application in some of the features that are well known in the art, i.e., not all features of an actual embodiment are described herein.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.

In order to provide a thorough understanding of the present application, detailed steps and detailed structures will be presented in the following description in order to explain the technical solution of the present application. Preferred embodiments of the present application are described in detail below, however, the present application may have other embodiments in addition to these detailed descriptions.

The sensor, microprocessor, radio frequency module and other sensitive electronic components often need to be provided with a grounded metal shell outside as an electromagnetic interference shielding cover, so that the interference of an external electromagnetic field on the internal electronic components is reduced, the electromagnetic radiation generated inside is prevented from leaking, the normal work of the internal electronic components is ensured, and the stability of the device is improved.

In the related art, as shown in fig. 1, an EMI shield is generally formed by covering an electronic component 100 with a metal case 101. However, the manner of directly covering a metal case on the outside of an electronic component has a problem in that firstly, the thickness of the metal case 101 is generally large, which increases the size of the packaged device, and is disadvantageous in downsizing the device. Secondly, the metal casing 101 of the outer casing may not be able to perfectly seal the electronic component 100, especially at the bottom of the electronic component and near the bottom of the metal casing, where gaps or discontinuities often exist between the electronic component 100 and the metal casing 101, thereby reducing the electromagnetic shielding effect of the metal casing. And thirdly, the metal shell generally has higher reflectivity, and if the metal shell is arranged on the upper side of the transmitting hole and/or the receiving hole, the metal shell reflects and scatters light rays emitted by the transmitting end, so that the probability that non-target light rays enter the receiving end is increased, and further, the occurrence of optical crosstalk is caused.

In view of the above, an embodiment of the application provides an electromagnetic shielding module, as shown in fig. 2A to 2C, the electromagnetic shielding module 200 includes a substrate 201, a chip assembly 202 disposed on one side of the substrate 201, and a package 203;

The substrate 201 includes at least one ground region 204;

the package 203 is connected to the substrate 201, and the package 203 covers the chip assembly 202;

An electromagnetic shielding layer 205 is arranged on one side of the packaging shell 203 close to the chip assembly 202 and/or one side of the packaging shell 203 far away from the chip assembly 202;

wherein the ground region 204 is electrically connected to the electromagnetic shielding layer 205.

In some embodiments, the package 203 may be used as a carrier for the electromagnetic shielding layer 205, and the electromagnetic shielding layer 205 may be formed on the inner surface and/or the outer surface of the package 203 by electromagnetic sputtering. Compared with the outer metal shell serving as an electromagnetic shielding cover, the electromagnetic shielding layer formed by electromagnetic sputtering can reduce subsequent assembly work and simplify the installation process. In addition, the electromagnetic shielding layer formed by electromagnetic sputtering requires very little space, no extra assembly space is reserved, and the size of the device can be further reduced. The material of the electromagnetic shielding layer 205 may be selected from metals having good electrical conductivity. For example, gold, silver, copper, aluminum, nickel, and the like.

The substrate 201 provided with the chip assembly 202 is bonded to the package case 203 by at least a part of an insulating adhesive. Specifically, the adhesive can be bonded completely through the insulating adhesive, or bonded together with the insulating adhesive through the conductive adhesive. In the vicinity of the sensitive area of the substrate 201 (for example, the wire bonding area of the chip assembly 202), if the package shell 203 and the substrate 201 are directly glued by the conductive adhesive, the conductive adhesive has a certain fluidity before curing, and the problem of glue overflow is easy to occur due to excessive use or uneven gluing, which may cause the conductive adhesive to overflow into the sensitive area to form an unexpected conductive path, thereby further causing the function failure of the electromagnetic shielding module. Compared with the electromagnetic shielding module which is completely adhered by the conductive adhesive, the electromagnetic shielding module provided by the embodiment of the application has the advantages that the package shell 203 and the substrate 201 are adhered by the insulating adhesive in the sensitive area (non-grounding area) of the substrate 201, and the short circuit caused by glue overflow is avoided in the grounding area 204 by the insulating adhesive or the conductive adhesive, so that the yield and the stability of the electromagnetic shielding module are improved.

In one embodiment, with continued reference to fig. 2A, electromagnetic shield 205 is disposed inside enclosure 203 (including the bottom of enclosure 203). The inner electromagnetic shielding layer 205 and the upper surface of the grounding region 204 may be bonded by conductive adhesive to achieve grounding connection of the electromagnetic shielding layer 205.

In another embodiment, with continued reference to fig. 2B, electromagnetic shield 205 is disposed outside of enclosure 203. The outer electromagnetic shielding layer 205 may be in direct contact connection with the side surface of the ground region 204 to achieve a ground connection of the electromagnetic shielding layer 205.

In yet another embodiment, with continued reference to fig. 2C, electromagnetic shielding layer 205 is disposed on both the inside and outside of enclosure 203. The outer electromagnetic shielding layer 205 and the side surface of the ground region 204, the inner electromagnetic shielding layer 205 may be in direct contact connection to achieve a ground connection of the electromagnetic shielding layer 205. Thus, the inner electromagnetic shielding layer and the outer electromagnetic shielding layer can provide more reliable electromagnetic shielding protection for the chip assembly 202, further improve the electromagnetic shielding capacity of the electromagnetic shielding module and enhance the working stability of the chip assembly 202.

In some embodiments, as shown in FIG. 3A, the package 203 is bonded to the substrate 201 by an insulating glue, and the grounding region 204 is at least partially located on the surface of the substrate 201 outside the package 203;

the electromagnetic shield 205 on the side of the package 203 remote from the chip assembly 202 is electrically connected to the ground region 204.

The ground region 204 is at least partially located on the surface of the substrate 201 outside the package case 203, that is, the ground region 204 is at least partially located on the side surfaces (for example, the left, right, front, and rear 4 side surfaces) of the substrate 201. After the package 203 and the substrate 201 are completely adhered by the insulating adhesive, metal may be sputtered on the outer surface of the package 203 to form an electromagnetic shielding layer 205. The electromagnetic shielding layer 205 is directly connected to the ground region 204 at the edge of the substrate 201 to enable ground connection of the electromagnetic shielding layer 205. Specifically, as shown in fig. 3B, the ground region 204 on the substrate tile may be extended onto the scribe line 301. After dicing the substrate tile, the side surfaces of the ground region 204 are exposed. After the substrate 201 and the package case 203 are adhered by an insulating adhesive, an electromagnetic shielding layer 205 is formed on the outer surface of the package case 203, and the electromagnetic shielding layer 205 and the ground region 204 exposed from the side surface of the substrate 201 are directly connected to ground. Since the package 203 and the substrate 201 are completely adhered by the insulating adhesive, the function failure of the electromagnetic shielding module is not caused even if the problem of glue overflow occurs. The accuracy requirement of the glue consumption is reduced, and the yield and stability of the electromagnetic shielding module are improved.

In some embodiments, as shown in fig. 3C, the package 203 is completely adhered to the substrate 201 by an insulating adhesive. Electromagnetic shielding layers 205 are provided on both inner and outer side surfaces of the package 203. Specifically, before the package 203 is bonded to the substrate 201, an electromagnetic shielding layer 205 is formed on the inner side (including the bottom surface) of the package 203. The ground region 204 on the substrate tile extends to the scribe line. After dicing the substrate tile, the side surfaces of the ground region 204 are exposed. After the substrate 201 and the package case 203 are adhered by an insulating adhesive, the electromagnetic shielding layer 205 is formed only on the outer side wall surface of the package case 203, and the electromagnetic shielding layer 205 formed on the inner side is connected to the ground region 204 exposed on the side surface of the substrate 201 to achieve the ground connection of the electromagnetic shielding layer 205.

In some embodiments, the package 203 is bonded to the substrate 201 by an insulating glue and a conductive glue;

the grounding area 204 is at least partially located on the surface of the substrate 201 inside the package 203;

The electromagnetic shielding layer 205 located at a side of the package 203 near the chip assembly 202 is electrically connected to the ground area 204 through the conductive paste.

The ground region 204 is at least partially located on the surface of the substrate 201 inside the package 203, i.e. the ground region 204 is at least partially located on the upper surface of the substrate 201. The bottom of the package case 203 and the ground region 204 of the substrate 201 are bonded by a conductive paste, and the other regions are bonded by an insulating paste. The electromagnetic shielding layer 205 at the bottom of the package 203 is grounded through conductive adhesive. Since the grounding region 204 is not closely adjacent to the sensitive region of the substrate 201, the conductive adhesive on the grounding region 204 will not overflow into the sensitive region, which results in failure of the electromagnetic shielding module.

In some embodiments, as shown in fig. 4, the package 203 is adhered to the substrate 201 by an insulating adhesive, and the electromagnetic shielding module 200 further includes at least one grounding wire 214, where the grounding wire 214 is electrically connected to the grounding region 204 and the electromagnetic shielding layer 205 on a side of the package 203 near the chip assembly 202.

The electromagnetic shield 205 is electrically connected to the ground region 204 on the substrate 201 by a ground line 214 such that the grounded electromagnetic shield provides a low impedance path such that any electromagnetic field attempting to penetrate the electromagnetic shield can be directed to ground, thereby protecting the chip assembly 202 inside the package 203 from external electromagnetic interference, and protecting external components from electromagnetic interference of the chip assembly 202 inside the package.

The bottom of the package case 203 and the upper surface of the substrate 201 are glued by the insulating adhesive, so that the bottom sealing performance of the electromagnetic shielding module is good, and electromagnetic waves can be effectively prevented from entering/entering the space for accommodating the chip assembly through the bottom gap or hole. In addition, the conductive adhesive has certain fluidity before solidification, and if excessive use or uneven sizing is carried out, the problem of adhesive overflow easily occurs, which can lead the conductive adhesive to overflow into a sensitive area to form an unexpected conductive path, thereby causing the functional failure of the electromagnetic shielding module. Compared with the method that the conductive adhesive is used, the insulating adhesive is used, so that short circuit caused by glue overflow can not occur, the requirement on adhesive precision is reduced, and the yield and stability of the electromagnetic shielding module are improved.

In some embodiments, the ground line may be formed in the ground region through a wire bonding process. Specifically, the suspended ground line 214 may be formed over the ground region 204 by using a metal wire (e.g., gold wire, copper wire, aluminum wire, etc.), using a thermal compression, ultrasonic, etc. After the substrate 201 and the package 203 are bonded, the suspended ground line 214 may be in contact with the electromagnetic shielding layer 205 to achieve a ground connection of the electromagnetic shielding layer 205.

Specifically, after removing the solder resist ink layer on the front-side land area of the substrate 201, the ground area 204 of the substrate 201 may be exposed. A ground line 214 for electrical connection with the electromagnetic shield layer 205 is formed on the ground region 204 through a wire bonding process. Compared with the electromagnetic shielding layer 205 and the grounding area 204 which are connected through conductive adhesive, the electromagnetic shielding layer 205 and the grounding area 204 are connected through the grounding wire 214, and the insulating adhesive is used for sealing the shell 203 and the substrate 201, so that the occurrence of unexpected conductive path formation caused by overflow of the conductive adhesive to the sensitive area is further avoided, the accuracy requirement of the adhesive consumption is reduced, and the yield and the stability of the electromagnetic shielding module are improved.

In some embodiments, the vertical height of ground line 214 is greater than the vertical height of chip assembly 202 before package 203 is bonded to substrate 201. Specifically, since the height of the ground line 214 is greater than the height of the chip assembly 202, when the package 203 is bonded to the substrate 201, the electromagnetic shielding layer 205 formed by sputtering on the inner surface of the package 203 contacts and depresses the suspended ground line 214, and the electromagnetic shielding layer 205 is grounded through the ground line 214.

In some embodiments, two ends of the ground line 214 are electrically connected to the same ground region 204, or two ends of the ground line 214 are respectively electrically connected to different ground regions 204;

The portion between the two ends of the ground line 214 contacts the electromagnetic shielding layer 205 so that the ground line 214 electrically connects the electromagnetic shielding layer 205 and the ground region 204.

In some embodiments, as shown in fig. 5A, one end of the ground line 214 is connected to the ground region 204 and the other end is connected to the same ground region 204. The middle partial ground line 214 is electrically connected to the electromagnetic shield 205 to achieve a ground connection of the electromagnetic shield 205. In other embodiments, as shown in FIG. 5B, a ground line 214 is provided on each of the plurality of ground regions 204. Both ends of each ground line 214 are connected to the same ground region 204. It will be appreciated that a plurality of ground lines 214 may be routed over the same ground region 204 to electrically connect to the electromagnetic shield 205.

In some embodiments, as shown in fig. 6, one end of the ground line 214 is connected to one ground region 204 on the left side, and the other end of the ground line 214 is connected to the other ground region 204 on the right side. The ground line 214 is suspended before the package 203 is bonded to the substrate 201. After the package case 203 is bonded to the substrate 201, the middle part of the ground line 214 is connected to the electromagnetic shielding layer 205 to achieve the ground connection of the electromagnetic shielding layer 205. It should be noted that the rectangular grounding regions shown in fig. 5A to 6 are for illustration, and the embodiment of the present application does not limit the specific shape of the grounding region 204.

In some embodiments, the electromagnetic shield 205 includes one or more contacts to the ground line 214, the contacts being located on a top wall or a side wall of the electromagnetic shield 205.

In some embodiments, there is one contact at the top wall of electromagnetic shield 205. The ground line 214 may be formed in a suspended state by a wire bonding process, and the ground line 214 may be set to a height higher than a space for accommodating the chip assembly 202, i.e., the ground line 214 may be formed to a height greater than a distance from the upper surface of the substrate 201 to the inner top wall of the package case 203. When the package 203 is bonded to the substrate 201, the suspended ground line 214 is pressed down by the package 203, and the ground line 214 is in contact connection with the electromagnetic shielding layer 205 inside the top wall of the package 203.

In other embodiments, electromagnetic shield 205 includes a plurality of contacts that contact ground line 214. The contact portion is located on the top wall of the electromagnetic shielding layer 205 (electromagnetic shielding layer including the lower surface of the bump structure), or the contact portion is located on the side wall of the electromagnetic shielding layer 205 (electromagnetic shielding layers including the left and right sides of the bump structure). Illustratively, as shown in fig. 7, the top wall and both sidewalls of the electromagnetic shielding layer 205 are in contact with the ground line 214. By connecting the plurality of contact portions with the ground line 214, the risk of disconnection of the ground line 214 from the electromagnetic shield 205 can be reduced, thereby increasing the ground stability.

In some embodiments, the ground line 214 is connected to the contact by conductive adhesive.

When the electromagnetic shielding module collides, falls or vibrates, the grounding wire and the electromagnetic shielding layer which are connected through contact may have the phenomenon that the contact point falls off or separates, so that the grounding failure of the electromagnetic shielding layer is caused.

Before the package case 203 and the substrate 201 are bonded, conductive paste may be dispensed at corresponding positions (contact portions) on the electromagnetic shielding layer 205 according to the specific arrangement positions of the ground region 204. After the package case 203 and the substrate 201 are bonded, the ground line 214 is connected to the electromagnetic shielding layer 205 through conductive paste. The conductive paste may then be cured by a baking process. The conductive glue may fix the ground line 214, reducing the risk of the ground line 214 being disconnected from the electromagnetic shielding layer 205.

Illustratively, as shown in fig. 8, by fixing the grounding wire 214 and the electromagnetic shielding layer 205 of the top wall through the conductive adhesive 801, the risk of falling off of the contact point can be effectively reduced, and the connection stability between the grounding wire 214 and the electromagnetic shielding layer 205 can be increased. The conductive adhesive 801 is only applied on the top of the inner side of the electromagnetic shielding layer 205, and even if the adhesive overflows, the risk of short circuit is not caused to the wire bonding on the substrate 201. It will be appreciated that in some other embodiments, the conductive paste 801 may also be dispensed onto the interior sidewalls of the package 203. In some embodiments, the chip assembly 202 includes one or more functional chips, the vertical projection of any functional chip on the substrate 201 does not overlap with the ground region 204 on the substrate 201.

In some embodiments, as shown in FIGS. 9A-9B, the chip assembly 202 includes a first chip 901 and a second chip 902 distributed along a first direction, the first chip 901 for outputting an emitted light, the second chip 902 for receiving a reflected light of the emitted light;

The projections of the first chip 901 and the second chip 902 on the substrate 201 do not overlap with the ground region 204.

The arrangement region of the first chip 901 and the second chip 902 on the substrate 201 is arranged offset from the ground region 204. In an embodiment, with continued reference to fig. 9A, the ground region 204 may be located between the first chip 901 and the second chip 902. In some embodiments, with continued reference to fig. 9B and 9C, the ground region 204 may be located on a side of the chip assembly 202 near an edge of the substrate 201.

The chip assembly 202 may be used to generate and receive optical signals to implement light sensing functions. Wherein the first chip 901 may generate an optical signal by or voltage driving. For example, the first chip 901 is a vertical cavity Surface emitting laser (VERTICAL CAVITY Surface-EMITTING LASER, VCSEL) chip or an edge emitting laser (EDGEEMITTING LASER, EEL) chip. The light emitting unit of the VCSEL chip comprises a laser diode which emits light perpendicular to the chip surface. Compared with EEL chips, VCSEL chips are more beneficial to realizing large-scale array and integration. The second chip 902 may receive the optical signal and convert it into an electrical signal for subsequent processing. For example, the second chip 902 is an Application-specific integrated Circuit (ASIC) chip. The first chip 901 can output the emitted light, the reflected light reflected by the object to be detected is received by the second chip 902, and the electromagnetic shielding module can sense the related information of the object to be detected through the emitted light and the reflected light.

Along the first direction (the lateral direction shown in fig. 9A), the substrate 201 is provided with a first chip 901, a ground region 204, and a second chip 902 in this order from left to right. The width of the ground region 204 in the first direction is smaller than the distance between the first chip 901 and the second chip 902. Embodiments of the present application do not limit the length of the ground region 204 in a direction perpendicular to the first direction.

With continued reference to fig. 9A, the suspended ground line 214 may be formed by a wire bonding process, and the ground line 214 may be set to a height higher than a space for accommodating the chip assembly 202. When the package is bonded to the substrate 201 and forms a space for accommodating the chip assembly 202, the package 203 may depress the suspended ground line 214. And the electromagnetic shielding layer 205 inside the package 203 may be in contact with the ground line 214 to achieve a ground connection of the electromagnetic shielding layer 205. Fig. 10A is a schematic diagram illustrating comparison between an electromagnetic shielding module and a substrate in an embodiment of the application. In some embodiments, as shown in FIG. 10A, two of the ground regions 204 are located on opposite sides of the chip assembly 202 in a second direction that intersects the first direction.

The package 203 further includes an emitting hole 1001, a receiving hole 1002, and a bump structure 1003;

the emitting hole 1001 is located at the light emitting position of the first chip 901, and the receiving hole 1002 is located at the light receiving position of the second chip 902;

The protruding structure 1003 is positioned between the emitting hole 1001 and the receiving hole 1002 and extends along the second direction, and the protruding structure 1003 is used for optically isolating the emitted light and the reflected light;

Both ends of the grounding wire 214 are respectively connected to the grounding regions 204 on both sides in the second direction;

at least part of the ground line 214 is fixed between the bump structure 1003 and the second chip 902.

The suspended ground line 214 may be formed by a wire bonding process, and the ground line 214 may be set to a height higher than that of the second chip 902. Fig. 10B is a cross-sectional view along the AA' section of the embodiment shown in fig. 10A, wherein, as shown in fig. 10B, the ground line 214 spans the second chip 902 along the second direction (the lateral direction shown in fig. 10B), one end of the ground line 214 is connected to the ground region 204 on the left side of the second chip 902, and the other end of the ground line 214 is connected to the ground region 204 on the right side of the second chip 902. After the package shell 203 is adhered to the substrate 201, the bump structure 1003 presses a portion of the ground line 214 against the upper surface of the second chip 902. The bump structure 1003 is abutted against the second chip 902, and the electromagnetic shielding layer 205 on the lower surface of the bump structure 1003 is connected with a part of the ground line 214 to realize ground connection of the electromagnetic shielding layer 205. In another embodiment, as shown in fig. 10C, the ground line 214 is in contact with not only the small surface of the bump structure 1003, but also the inner sidewall of the package 203.

It should be noted that, the passivation layer is disposed on the upper surface of the second chip 902, and pressing the ground line 214 onto the second chip 902 does not cause the second chip 902 to have a short risk. In some embodiments, the electromagnetic shielding layer on the surface of the bump structure 1003 is in direct contact with the ground region 204 of the substrate 201.

With continued reference to fig. 10A, since the electromagnetic shielding layer 205 is located inside the package case 203, the emission hole 1001 provided on the package case 203 is located above the electromagnetic shielding layer 205, and the emitted light guided out through the emission hole 1001 does not enter the receiving hole 1002 after being reflected or scattered by the electromagnetic shielding layer 205. Compared with the metal shell of the outer sleeve, the electromagnetic shielding layer positioned at the inner side of the packaging shell can effectively reduce the risk of light crosstalk.

In some embodiments, the electromagnetic shielding module further includes a first filtering unit (e.g., a filter) disposed between the receiving hole 1002 and the second chip 902, where the first filtering unit covers the lower surface of the receiving hole 1002 and is used for filtering out light other than the reflected light, reducing interference generated by ambient light, and improving the working performance of the electromagnetic shielding module.

In some embodiments, the electromagnetic shielding module further includes a second filtering unit (e.g., a filter) disposed between the emission hole 1001 and the first chip 901, where the second filtering unit covers the lower surface of the emission hole 1001 and is used for filtering out other light except the emitted light, and further improving the working performance of the electromagnetic shielding module.

It should be noted that, in the embodiment in which the electromagnetic shielding layer is disposed outside the package case, or in the embodiment in which the grounding region is coated with the conductive adhesive, the grounding wire may not be disposed for connecting the grounding region and the electromagnetic shielding layer. The outer electromagnetic shielding layer can be directly contacted and connected with the grounding area of the substrate, or the electromagnetic shielding layer is connected with the grounding area of the substrate through conductive adhesive.

Based on the same inventive concept, an embodiment of the present application further provides an electronic device, as shown in fig. 11, where the electronic device 300 includes the electromagnetic shielding module 200 in any of the above embodiments.

Since the electronic device 300 includes the electromagnetic shielding module 200, the electronic device 300 has the same or similar advantages as the electromagnetic shielding module, and thus the beneficial effects of the electronic device will not be described here again.

In some embodiments, as shown in fig. 12, the electronic device 300 further includes a foam 1201 and a glass panel 1202 disposed on one side of the electromagnetic shielding module 200. The foam 1201 has good shock absorption and decompression performance, and can protect the electromagnetic shielding module together with the transparent panel, and also can keep a proper air gap between the electromagnetic shielding module 200 and the glass panel 1202, thereby ensuring the optical performance of the electronic device.

The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. The electromagnetic shielding module is characterized by comprising a substrate, a chip assembly and a packaging shell, wherein the chip assembly and the packaging shell are arranged on one side of the substrate;

The substrate comprises at least one grounding region;

The packaging shell is connected with the substrate and covers the chip assembly;

an electromagnetic shielding layer is arranged on one side of the packaging shell, which is close to the chip assembly, and/or one side of the packaging shell, which is far away from the chip assembly;

Wherein the grounding region is electrically connected with the electromagnetic shielding layer.

2. The electromagnetic shielding module of claim 1, wherein the package is adhered to the substrate by an insulating adhesive;

The electromagnetic shielding module further comprises at least one grounding wire, and the grounding wire is electrically connected with the grounding area and the electromagnetic shielding layer positioned on one side, close to the chip assembly, of the packaging shell.

3. The electromagnetic shielding module according to claim 2, wherein both ends of the ground wire are electrically connected to the same ground region, or both ends of the ground wire are electrically connected to different ground regions, respectively;

The portion between the two ends of the grounding wire contacts the electromagnetic shielding layer so that the grounding wire is electrically connected with the electromagnetic shielding layer and the grounding area.

4. The electromagnetic shielding module of claim 2, wherein the electromagnetic shielding layer on a side of the package housing adjacent to the chip assembly includes one or more contacts to the ground line;

The contact portion is located on a top wall or a side wall of the electromagnetic shielding layer.

5. The electromagnetic shielding module of claim 4, wherein the ground wire and the contact are connected by conductive adhesive.

6. The electromagnetic shielding module of claim 2, wherein the chip assembly comprises a first chip and a second chip distributed along a first direction, the first chip comprises a light emitting area for outputting emitted light, the second chip comprises a light receiving area for receiving reflected light of the emitted light, and the projection of the grounding wire on the substrate is outside the light emitting area and the projection area of the light receiving area on the substrate.

7. The electromagnetic shielding module of claim 6, wherein two of the grounding regions are located on opposite sides of the chip assembly in a second direction, respectively, wherein the second direction intersects the first direction;

The packaging shell further comprises a transmitting hole, a receiving hole and a protruding structure;

The receiving hole is positioned at the light receiving position of the second chip;

the convex structure is positioned between the emitting hole and the receiving hole and extends along the second direction, and is used for optically isolating the emitted light and the reflected light;

At least part of the grounding wire is fixed between the protruding structure and the second chip.

8. The electromagnetic shielding module of claim 1, wherein the encapsulation is bonded to the substrate by an insulating adhesive; the grounding area is at least partially positioned on the surface of the substrate outside the packaging shell;

The electromagnetic shielding layer on a side of the package away from the chip assembly is electrically connected to the ground region.

9. The electromagnetic shielding module of claim 1, wherein the package is bonded to the substrate by an insulating adhesive and a conductive adhesive; the grounding area is at least partially positioned on the surface of the substrate inside the packaging shell;

The electromagnetic shielding layer positioned on one side of the packaging shell close to the chip assembly is electrically connected with the grounding area through the conductive adhesive.

10. An electronic device comprising an electromagnetic shielding module according to any one of claims 1 to 9.