CN223195025U - Charging device - Google Patents

Abstract

The charging device comprises a shell, a charging module, a heat dissipation module and a liquid cooling piece, wherein the shell is provided with an installation part, the charging module is arranged on the installation part, the heat dissipation module comprises a heat dissipation assembly and the liquid cooling piece, the liquid cooling piece is in heat conduction connection with the charging module, a liquid flow channel is arranged in the liquid cooling piece, and the heat dissipation assembly is communicated with the liquid flow channel. According to the charging device, the liquid cooling piece is communicated with the heat radiating component, so that heat radiating liquid can be subjected to heat exchange through the heat radiating component, heat exchange loss caused by attaching the heat radiating component to the liquid cooling piece is reduced, and heat radiating efficiency is improved.

Description

Charging device

Technical Field

The utility model relates to the technical field of electronic equipment accessories, in particular to a charging device.

Background

With the development of electronic devices (such as mobile phones), the electronic devices are used as devices necessary for people to live in daily life and travel, and basically cover various daily application scenes of people. The charging device can charge the electronic device to improve the endurance of the electronic device. The charging device is provided with a charging module which can charge the electronic device. However, in the charging process, the charging module may generate heat, which may cause serious heating of the charging device, or may even cause heating of the electronic device, so that charging efficiency between the charging device and the electronic device is seriously affected, and service lives of the charging device and the electronic device may be shortened.

The existing charging equipment is generally provided with a liquid cooling device for radiating heat of the charging module, and the liquid cooling device comprises a liquid cooling piece and a radiator attached to the liquid cooling piece. The liquid cooling piece is connected with the charging module in a heat conduction way, the liquid in the liquid cooling piece is used for absorbing heat of the charging module, then the heat is transferred to the radiator, and finally the radiator is used for radiating heat. The heat of liquid needs to pass through the liquid cooling piece shell and the connecting medium between liquid cooling piece and the radiator, just can transmit to the radiator, leads to the heat conduction inefficiency of liquid and radiator, and then influences the radiating efficiency of battery charging outfit.

Disclosure of utility model

Aiming at least part of problems and defects in the prior art, the embodiment of the utility model discloses a charging device, which aims to solve the problem of lower heat dissipation efficiency caused by attaching a radiator and a diaphragm to dissipate heat in the prior art.

The charging device comprises a shell, a charging module, a heat dissipation module and a liquid cooling piece, wherein the shell is provided with an installation part, the charging module is arranged on the installation part, the heat dissipation module comprises a heat dissipation component and the liquid cooling piece, the liquid cooling piece is in heat conduction connection with the charging module, a liquid flow channel is arranged in the liquid cooling piece, and the heat dissipation component is communicated with the liquid flow channel.

According to the charging device provided by the embodiment, the liquid cooling piece and the heat radiating component are communicated, so that heat radiating liquid flowing in the liquid flow channel can flow through the heat radiating component to conduct heat exchange, heat exchange loss caused by attaching the heat radiating component to the liquid cooling piece is reduced, and heat radiating efficiency is improved.

In one embodiment of the utility model, the heat dissipation module comprises a runner assembly, the runner assembly is respectively connected with the heat dissipation assembly and the liquid cooling piece, the runner assembly is communicated with the liquid runner, and the liquid cooling piece, the runner assembly and the heat dissipation assembly form a closed liquid channel together.

In one embodiment of the utility model, the heat dissipation assembly comprises a heat sink and a connecting cover, wherein the heat sink and the connecting cover are connected to form a heat exchange space, and the flow passage assembly is communicated with the heat exchange space.

In one embodiment of the utility model, the radiator comprises a radiator substrate and radiating fins arranged on the radiator substrate, the connecting cover is covered on one side of the radiator substrate, which is away from the radiating fins, and the runner component is connected with the connecting cover.

In an embodiment of the utility model, the heat dissipation assembly further includes a heat conduction member, and the heat conduction member is disposed on the heat dissipation substrate and located in the heat exchange space.

In one embodiment of the utility model, a plurality of heat conducting columns are arranged on one side of the heat conducting piece away from the radiator, and the plurality of heat conducting columns extend towards the direction away from the radiator and are arranged at intervals.

In one embodiment of the present utility model, a blocking post is further disposed on a side of the heat conducting member away from the heat sink, and the blocking post is disposed between the plurality of heat conducting posts.

In one embodiment of the utility model, the runner assembly comprises two runner pipe fittings, one runner pipe fitting is communicated with the output port of the liquid cooling piece and the input port of the heat exchange space, and the other runner pipe fitting is communicated with the input port of the liquid cooling piece and the output port of the heat exchange space.

In one embodiment of the utility model, the heat dissipation assembly further comprises a heat conduction piece, wherein the heat conduction piece is arranged on one side of the heat dissipation substrate, which is far away from the heat dissipation fins, at least two blocking columns are arranged on one side of the heat conduction piece, which is far away from the heat dissipation fins, and the blocking columns are arranged between the input ports and the output ports of the two heat exchange spaces and are arranged at staggered intervals on the flow passage paths between the input ports and the output ports of the heat exchange spaces.

In one embodiment of the utility model, the heat dissipation module further comprises a power member, wherein the power member is communicated with the flow channel assembly.

In one embodiment of the utility model, the charging module comprises a coil assembly and a circuit board assembly electrically connected with the coil assembly, and the liquid cooling piece is connected with the coil assembly.

In one embodiment of the utility model, the housing comprises an upper housing and a lower housing, the mounting part comprises a mounting cavity and a containing groove, the lower housing is connected with the upper housing to form the mounting cavity, the containing groove is arranged on one side of the upper housing far away from the lower housing, the coil assembly is arranged in the containing groove, the circuit board assembly is arranged in the mounting cavity, and the liquid cooling piece cover is arranged on one side of the coil assembly far away from the upper housing.

In one embodiment of the utility model, the heat radiation module further comprises a heat radiation fan and a radiator, wherein the heat radiation fan is arranged in the installation cavity, an air inlet communicated with the radiator and an air outlet communicated with the heat radiation fan are arranged on the shell, the heat radiation fan and the radiator are arranged along a first direction, the circuit board assembly is arranged along a second direction and is spaced from the radiator and the heat radiation fan, the first direction is perpendicular to the second direction, and/or the heat radiator comprises heat radiation fins, a channel between the air inlet and the heat radiation fins and a gap between the heat radiator and the circuit board assembly jointly form an air inlet channel, the air inlet channel is communicated with an inlet of the heat radiation fan, and an outlet of the heat radiation fan and the air outlet form an air outlet channel.

In one embodiment of the utility model, part of the liquid cooling piece covers the coil assembly, part of the liquid cooling piece covers the upper shell, or the liquid cooling piece completely covers the coil assembly and the upper shell.

Therefore, the charging device provided by the embodiment of the utility model has the following one or more beneficial effects that the liquid cooling piece is communicated with the heat dissipation component, so that heat dissipation liquid flowing in the liquid flow channel can flow through the heat dissipation component to perform heat exchange, thereby reducing heat exchange loss caused by attaching the heat dissipation component to the liquid cooling piece, and further improving heat dissipation efficiency.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is an exploded view of a charging device according to an embodiment of the present utility model.

Fig. 2 is an exploded view of the charging device of fig. 1 at another angle.

Fig. 3 is an exploded view of the heat dissipation module of fig. 1.

Fig. 4 is a schematic diagram of the positions of the heat conducting columns and the blocking columns on the heat conducting member.

Reference numerals illustrate:

10-a charging device;

100-shell, 101-heat dissipation air outlet, 102-shell air inlet, 103-installation part, 110-upper shell, 111-containing groove, 112-through hole, 120-lower shell, 130-installation cavity, 131-first installation cavity, 132-second installation cavity, 140-baffle plate, 200-charging module, 210-coil assembly, 220-circuit board assembly, 300-heat dissipation module, 310-liquid cooling piece, 320-flow channel assembly, 321-flow channel pipe fitting, 322-connecting cover, 330-heat dissipation assembly, 331-heat conduction piece, 3311-heat conduction column, 3312-baffle column, 332-heat radiator, 340-heat dissipation fan, 350-power piece, 400-circuit board and 500-battery.

Detailed Description

In order to make the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to specific embodiments of the present utility model and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, in the embodiments of the present utility model, directional terms, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., refer only to the directions of the attached drawings. Accordingly, directional terminology is used to describe and understand the utility model and is not limiting of the utility model. For the sake of understanding and convenience of description, the size and thickness of each component shown in the drawings are arbitrarily shown, but the present utility model is not limited thereto.

It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. In addition, in the description, unless explicitly described to the contrary, the word "comprising" will be understood to mean comprising the recited component, but not excluding any other components. Further, in the specification, "above" means above or below the target assembly, and does not mean necessarily on top of above based on gravity.

Some embodiments of the present utility model are described in detail below with reference to the accompanying drawings. The embodiments described below and features of the embodiments may be combined with each other without conflict.

As shown in fig. 1 and 2, an embodiment of the present utility model provides a charging device 10. The charging device 10 provided in the embodiment of the utility model is used for charging electronic equipment, for example, a mobile phone, a tablet computer, and the like. The charging device 10 may charge the electronic apparatus by wired or wireless means, for example, the charging device 10 may charge the electronic apparatus by a data line, for example, or the charging device 10 may charge the electronic apparatus by wireless means, for example, magnetic attraction, for example. The charging device 10 may be, for example, a charger, or the charging device 10 may be a charging plug capable of charging an electronic device, and the present utility model is not limited to a specific product of the charging device 10. The specific structure of the charging device 10 will be described below with reference to the charging device 10 as, for example, a charger.

Referring again to fig. 1 and 2, the charging device 10 includes, for example, a housing 100, a charging module 200, and a heat dissipation module 300. Specifically, the housing 100 is provided with a mounting portion 103, for example, the charging module 200 is provided on the mounting portion 103 and is used for charging an external device, and the heat dissipation module 300 is provided on the mounting portion 103 and is used for dissipating heat from the charging module 200, for example. The heat dissipation module 300 includes, for example, a liquid cooling member 310 and a heat dissipation assembly 330, wherein the liquid cooling member 310 is in heat conduction connection with the charging module 200. The liquid cooling member 310 is connected with the charging module 200, a liquid flow channel is arranged in the liquid cooling member 310, and the heat dissipation assembly 330 is communicated with the liquid flow channel, so that heat dissipation liquid flowing in the liquid flow channel can flow through the heat dissipation assembly 330 to perform heat exchange, thereby reducing heat exchange loss caused by attaching the heat dissipation assembly to the liquid cooling member, and further improving heat dissipation efficiency of the charging module 200. It should be noted that, the heat dissipating component 330 is in communication with the liquid flow channel, which means that the heat dissipating liquid flowing in the liquid flow channel may flow over the surface or inside of the heat dissipating component 330.

Further, the heat dissipation module 300 includes a flow channel assembly 320, wherein the flow channel assembly 320 is connected with the liquid cooling member 310 and communicates with the liquid flow channel therein, and the heat dissipation assembly 330 is connected with the flow channel assembly 320, and the liquid cooling member 310, the flow channel assembly 320 and the heat dissipation assembly 330 together form a closed liquid channel. The liquid cooling member 310 is connected with the charging module 200 to guide heat of the charging module 200 into the heat dissipation liquid, the heat dissipation liquid with cold flows through the heat dissipation assembly 330 to cool the heat dissipation liquid, the heat is dissipated from the heat dissipation assembly 330, and the cooled heat dissipation liquid is guided back to the liquid cooling member 310 from the flow passage assembly 320 to circulate, thereby cooling the charging module 200. In other embodiments, the heat dissipation component 330 may be directly covered over the liquid cooling component 310, and connected to the liquid flow channel of the liquid cooling component 310, so as to achieve higher efficiency of heat conduction, where the communication mode between the liquid cooling component 310 and the heat dissipation component 330 is not limited only.

For example, the liquid channel has a heat dissipation liquid capable of circulating, and the heat dissipation liquid flows through the liquid channel in the liquid cooling member 310 to dissipate heat of the charging module 200, and the heat dissipation liquid also flows through the heat dissipation component 330. The liquid cooling member 310 is, for example, provided with a cold plate (usually a closed cavity formed by a heat conducting metal such as copper and aluminum), and the liquid cooling member 310 is in heat conduction connection with the charging module 200, so that heat generated by the charging module 200 is indirectly transferred to the heat dissipation liquid enclosed in the liquid flow channel, and heat dissipation of the charging module 200 is completed.

In the charging device 10 provided by the application, the flow channel assembly 320 is communicated with the liquid flow channel in the liquid cooling member 310, and the flow channel assembly 320 is also communicated with the heat dissipation assembly 330, so that the heat dissipation liquid circularly flows in a closed loop formed by the liquid cooling member 310, the flow channel assembly 320 and the heat dissipation assembly 330. The heat dissipation liquid is, for example, water or a cooling liquid, but of course, the heat dissipation liquid may be the rest of the liquid having a high specific heat capacity, which is not particularly limited by the present application. The heat in the charging module can be absorbed by utilizing the high specific heat capacity of the heat dissipation liquid, so that the heat dissipation of the charging module is realized.

According to the charging device 10 provided by the embodiment, the runner assembly is arranged between the liquid cooling piece and the heat radiating assembly, so that heat radiating liquid can enter the heat radiating assembly to exchange heat, heat exchange loss caused by attaching the heat radiating assembly to the liquid cooling piece is reduced, and heat radiating efficiency is improved.

Further, referring to fig. 1 and 2, the housing 100 is provided with a mounting portion 103, and the mounting portion 103 includes a mounting cavity 130 and a receiving groove 111. For example, the housing 100 includes an upper housing 110 and a lower housing 120, and the lower housing 120 is connected with the upper housing 110 to form a mounting cavity 130. Wherein, for example, a receiving groove 111 is provided on a side of the upper case 110 away from the lower case 120. In one embodiment, the charging device 10 has a wireless charging function, the charging module 200 includes a coil assembly 210 and a circuit board assembly 220, the circuit board assembly 220 is disposed in the mounting cavity 130, and the coil assembly 210 is disposed in the accommodating groove 111. The liquid cooling member 310 is, for example, covered on a side of the coil assembly 210 away from the upper housing 110, and is connected to the coil assembly 210 in a heat conduction manner. The liquid cooling member 310 is partially disposed on the coil assembly 210, and partially disposed on the upper housing 110, so that in order to better transfer heat from the coil assembly 210 to the liquid cooling member 310, the coil assembly 210 needs to be completely covered by the liquid cooling member 310, in one embodiment, the liquid cooling member 310 not only completely covers the coil assembly, but also completely covers the upper housing, the liquid cooling member 310 not only conducts heat from the coil assembly, but also transfers heat from an electronic device in contact with the liquid cooling member 310, and the area of the cold member 310 in contact with the electronic device has a better heat transfer effect on the electronic device. The upper housing 110 is further provided with a through hole 112, for example, and the flow path assembly 320 communicates with the liquid cooling member 310 through the through hole 112, for example. For example, referring to fig. 3, a baffle 140 is disposed on the housing 100, for example, and the baffle 140 divides the mounting cavity 130 into a first mounting cavity 131 and a second mounting cavity 132, for example. Wherein the heat dissipating component 330 is located in the second mounting cavity 132, for example. The charging device 10 is provided with, for example, a battery 500, the battery 500 being electrically connected to the cord assembly 200, the battery 500 being located, for example, within the first mounting cavity 131.

Further, referring to fig. 3, the heat dissipating assembly 330 includes, for example, a connection cover 322, a heat conducting member 331, and a heat sink 332. The heat sink 332 forms a relatively closed heat exchange space with the connection cover 322, and the heat dissipating liquid conducts heat in the heat exchange space to transfer heat to the heat sink 332. The flow path assembly 320 communicates with the heat exchange space to introduce or remove the heat dissipating liquid into or from the heat exchange space. Specifically, the heat sink 332 includes, for example, a heat sink substrate 3321, and heat dissipation fins facing away from the heat sink substrate 3321, the flow channel assembly 320 includes, for example, a flow channel pipe 321, the flow channel pipe 321 is connected to the connection cover 322, the flow channel pipe 321 is connected to the liquid flow channel in the liquid cooling member 310, and the connection cover 322 is connected to the flow channel pipe 321. Wherein, the connection cover 322 is covered on the heat sink substrate 3321 to form a heat exchange space.

As mentioned above, the heat conducting member 331 is disposed on the heat sink substrate 3321 and located in the heat exchanging space, and the heat dissipating liquid flows through the heat conducting member 331. For example, the heat conducting member 331 is a metal structure, preferably aluminum material, and the heat sink 332 includes heat dissipation fins connected to the heat sink substrate 3321, and the heat conducting member 331 is disposed on a side of the heat sink substrate 3321 away from the heat dissipation fins. Preferably, the heat sink substrate 3321 is fixedly connected to the heat conductive member 331, or integrally connected, for example, the heat conductive member 331 and the heat sink substrate 3321 may be welded to each other to enhance the connection stability.

As described above, referring to fig. 3 and 4, the heat conductive member 331 is provided with a plurality of heat conductive posts 3311 at a side thereof away from the heat sink 332, and the plurality of heat conductive posts 3311 extend toward a direction away from the heat sink 332 and are disposed on the heat conductive member 331 at intervals, and the heat dissipation liquid flows through the plurality of heat conductive posts 3311. The heat conduction area is increased by providing a plurality of heat conductive pins 3311, so that the heat dissipation liquid can perform sufficient heat exchange with the heat sink 332 on the heat conductive member 331, thereby improving the heat dissipation efficiency. The heat conductive posts 3311 are made of metal, for example, the heat conductive posts 3311 may be copper posts, but the heat conductive posts 3311 may be aluminum posts, which is not limited in this disclosure. After the heat dissipation liquid radiates heat to the coil assembly 200 through the liquid cooling member 310, the heat dissipation liquid flows to the heat conduction member 331 through the flow channel assembly 320 and exchanges heat with the heat sink 332, so that the heat sink 332 can cool down the heat dissipation liquid.

In a specific embodiment, referring again to fig. 4, a side of the heat conducting member 331 away from the heat sink 332 is further provided with a blocking pillar 3312, for example, and the blocking pillar 3312 is disposed between the plurality of heat conducting pillars 3311 to guide the heat dissipation liquid. Wherein the number of the barrier ribs 3312 is at least two, and two adjacent barrier ribs 3312 are staggered, for example. For example, as shown in fig. 4, the blocking pillars 3312 are disposed to form a water path inside the heat conducting member 331, so that the heat dissipating liquid can fully contact with the plurality of heat dissipating pillars 3311, thereby avoiding the heat dissipating liquid from contacting with the heat dissipating pillars 3311 due to the linear path, and increasing the contact area between the heat dissipating liquid and the heat dissipating pillars 3311, i.e. increasing the heat dissipating area, and thus improving the heat dissipating efficiency.

In one embodiment, the number of the flow channel pipes 321 is two, and one end of the two flow channel pipes 321 is connected to the liquid cooling member 310, and the other end is connected to the connection cover 322. The radiator base plate 332 is connected with the connecting cover 322 to form a box-shaped heat exchange space, the two runner pipe fittings 321 are respectively connected with the output port and the input port of the connecting cover 322, the output port of the liquid cooling piece 310 outputs heat-carrying liquid which enters the heat exchange space through one runner pipe fitting 321 to be contacted with the heat conducting piece 331 in the heat exchange space, the heat of the heat conducting piece 331 is conducted to the radiator 332 to be contacted with the external air for radiating, and the temperature of the radiating heat-carrying liquid which is radiated is reduced and is output from the output port of the heat exchange space and enters the input port of the liquid cooling piece 310 again through the other runner pipe fitting 321. The heat conducting piece 331 is disposed on the radiator substrate 3321 and is close to the side of the connection cover 322, at least two blocking columns 3312 are disposed on the side of the heat conducting piece 331 far away from the radiator 332, at least two blocking columns 3312 are disposed between the output port and the input port of the heat exchange space, and the flow channels between the input port and the output port of the heat exchange space are alternately arranged, so that the heat dissipation liquid is fully contacted with the heat conducting columns 3311 on the path of the liquid cooling piece 310 from the output port to the input port of the liquid cooling piece 310, the blocking columns 3312 are disposed on the path of the heat dissipation liquid from the output port of the liquid cooling piece 310 to the input port of the liquid cooling piece 310 at staggered intervals, so that the heat conducting columns 3311 through which the heat dissipation liquid flows are more, the contact area is larger, the path is increased, the heat conduction time of the heat dissipation liquid on the heat conducting piece 331 is increased, the heat dissipation effect is better, and the heat dissipation efficiency is higher.

As described above, referring to fig. 3 again, the heat dissipation module 300 further includes a power member 350, the power member 350 is in communication with the flow path assembly 320, and the heat dissipation liquid flows through the power member 350, and the power member 350 is used to provide power for the heat dissipation liquid so that the heat dissipation liquid can circulate in the flow path assembly 320 and flow through the heat dissipation assembly 310, the liquid cooling member 330 and the power member 350. The power member 350 is, for example, a water pump or other power device capable of providing heat dissipation liquid circulation, which is not particularly limited by the present application. Specifically, the power element 350, the heat dissipation assembly 330, the liquid cooling element 310 and the runner assembly 320 together form a closed heat dissipation circuit. It should be noted that, the flow channel assembly 320 is provided with a multi-way joint, so that it may have a plurality of ports for connecting the heat dissipating assembly 330, the liquid cooling member 310, and the power member 350, respectively, for example.

In addition, referring to fig. 1 and 2, the heat dissipation module 300 further includes, for example, a heat dissipation fan 340, an air outlet 101 is disposed on the housing 100, for example, the air outlet 101 is in communication with, for example, an air outlet of the heat dissipation fan 340, and the heat dissipation fan 340 is configured to take away heat of the heat dissipation assembly 330 and exhaust the heat from the heat dissipation air outlet 101. The heat dissipation fan 340 is used for taking away heat on the heat dissipation device 332, so as to cool the heat dissipation device 332, and the heat dissipation device 332 can continuously exchange heat with the heat dissipation liquid in the heat conduction member 331, so as to cool the heat dissipation liquid. Specifically, the heat dissipation fan 340 is, for example, a centrifugal fan. Referring to fig. 2, the housing 100 is provided with an air inlet 102, for example, in communication with a radiator 332, and an external air flow enters the housing 100 as an internal air flow, for example, through the housing air inlet 102. The internal air flow enters the cooling fan 340 from the air inlet of the cooling fan 340 after passing through the radiator 332, and is discharged from the cooling air outlet 101 by the rotation of the cooling fan 340.

For example, the heat dissipation fan 340 and the heat sink 332 are arranged along a first direction, for example, the circuit board assembly 220 is arranged along a second direction, for example, and is spaced apart from the heat sink 332 and the heat dissipation fan 340, wherein the first direction is perpendicular to the second direction, for example. The first direction is for example referred to in the X direction in fig. 2 and the second direction is for example referred to in the Y direction in fig. 2. And/or, the radiator 332 includes, for example, heat dissipation fins, the channel between the air inlet 102 and the heat dissipation fins, and the gap between the radiator 332 and the circuit board assembly 220 together form an air inlet channel, and the air inlet channel is further connected to, for example, an inlet of the heat dissipation fan 340, and an outlet of the heat dissipation fan 340 forms an air outlet channel with the air outlet 101.

The above-mentioned heat dissipation fan 340 is, for example, a centrifugal fan, and the centrifugal fan is selected as the heat dissipation fan, compared with the axial fan, on the one hand, the fan can be prevented from being placed vertically to cause the thickness of the charging device 10 to be too thick, and on the other hand, the axial fan can only blow air towards the radiator or the circuit board, and an air duct needs to be specially arranged for the axial fan, otherwise, the air flow disorder can occur to cause the poor heat dissipation efficiency of the fan, and the centrifugal fan sucks the internal air flow into the fan, and the internal air flow can be sucked by the centrifugal fan after passing through the radiator and the circuit board, thereby taking away the heat on the radiator and the circuit board.

In summary, in the charging device provided by the embodiment of the utility model, the runner assembly is arranged between the liquid cooling piece and the heat dissipation assembly, so that heat dissipation liquid can enter the heat dissipation assembly to exchange heat, thereby reducing heat exchange loss caused by attaching the heat dissipation assembly to the liquid cooling piece, and further improving heat dissipation efficiency.

It should be understood that the foregoing embodiments are merely exemplary illustrations of the present utility model, and the technical solutions of the embodiments may be arbitrarily combined and matched for use without conflict in technical features and contradiction in structure.

It should be noted that the above-mentioned embodiments are merely for illustrating the technical solution of the present utility model, and not for limiting the same, and although the present utility model has been described in detail with reference to the above-mentioned embodiments, it should be understood by those skilled in the art that the technical solution described in the above-mentioned embodiments may be modified or some technical features may be equivalently replaced, and these modifications or substitutions do not make the essence of the corresponding technical solution deviate from the spirit and scope of the technical solution of the embodiments of the present utility model.

Claims (14)

1. A charging device, characterized by comprising:

A housing provided with an installation portion;

The charging module is arranged on the mounting part;

The heat dissipation module is arranged on the mounting part and comprises a heat dissipation assembly and a liquid cooling piece, the liquid cooling piece is in heat conduction connection with the charging module, a liquid flow passage is arranged in the liquid cooling piece, and the heat dissipation assembly is communicated with the liquid flow passage.

2. The charging device of claim 1, wherein the heat dissipation module comprises a runner assembly, the runner assembly is respectively connected with the heat dissipation assembly and the liquid cooling member, the runner assembly is communicated with the liquid runner, and the liquid cooling member, the runner assembly and the heat dissipation assembly together form a closed liquid channel.

3. The charging device of claim 2, wherein the heat dissipating assembly comprises a heat sink and a connecting cover, the heat sink and the connecting cover being connected to form a heat exchanging space, the flow path assembly being in communication with the heat exchanging space.

4. A charging device as claimed in claim 3, wherein the heat sink comprises a heat sink base plate and heat sink fins provided on the heat sink base plate, the connection cover is provided on a side of the heat sink base plate facing away from the heat sink fins, and the flow path assembly is connected to the connection cover.

5. The charging device of claim 4, wherein the heat dissipation assembly further comprises a heat conducting member disposed on the heat sink substrate and positioned within the heat exchange space.

6. The charging device according to claim 5, wherein a side of the heat conductive member away from the heat sink is provided with a plurality of heat conductive posts extending in a direction away from the heat sink and arranged at intervals.

7. The charging device as set forth in claim 6, wherein a side of the heat conductive member remote from the heat sink is further provided with a blocking column, the blocking column being disposed between the plurality of heat conductive columns.

8. The charging device of claim 3, wherein said flow path assembly comprises two flow path tubes, one of said flow path tubes communicating with said liquid cooling member outlet and said heat exchange space inlet, and the other of said flow path tubes communicating with said liquid cooling member inlet and said heat exchange space outlet.

9. The charging device of claim 8, wherein the heat dissipation assembly further comprises a heat conduction member disposed on a side of the heat dissipation substrate facing away from the heat dissipation fins, wherein at least two blocking posts are disposed on a side of the heat conduction member facing away from the heat dissipation fins, and at least two blocking posts are disposed between the input port and the output port of the two heat exchange spaces and are disposed at intervals in a flow path between the input port and the output port of the heat exchange spaces.

10. The charging device of claim 2, wherein the heat dissipation module further comprises a power member in communication with the flow path assembly.

11. The charging device according to any one of claims 1 to 10, wherein the charging module includes a coil assembly and a circuit board assembly electrically connected to the coil assembly, and the liquid cooling member is connected to the coil assembly.

12. The charging device of claim 11, wherein the housing comprises an upper housing and a lower housing, the mounting portion comprises a mounting cavity and a receiving groove, the lower housing is connected with the upper housing to form the mounting cavity, the receiving groove is formed in one side of the upper housing away from the lower housing, the coil assembly is arranged in the receiving groove, the circuit board assembly is arranged in the mounting cavity, and the liquid cooling member is covered on one side of the coil assembly away from the upper housing.

13. The charging device as set forth in claim 12, wherein the heat radiation module further comprises a heat radiation fan and a radiator, the heat radiation fan is disposed in the installation cavity, and an air inlet communicating with the radiator and an air outlet communicating with the heat radiation fan are disposed on the housing;

The heat dissipation fan and the radiator are arranged along a first direction, the circuit board assembly is arranged along a second direction and is arranged at intervals with the radiator and the heat dissipation fan, and the first direction is perpendicular to the second direction, and/or

The radiator comprises radiating fins, an air inlet channel is formed by the channel between the air inlet and the radiating fins and the gap between the radiator and the circuit board assembly, the air inlet channel is communicated with the inlet of the radiating fan, and an air outlet channel is formed by the outlet of the radiating fan and the air outlet.

14. The charging device of claim 12, wherein a portion of the liquid cooling member is disposed over the coil assembly and a portion of the liquid cooling member is disposed over the upper housing, or wherein the liquid cooling member completely covers the coil assembly and the upper housing.