CN223244938U - Display module and display device - Google Patents

Abstract

The display module can comprise a display panel, a second flip chip film, at least two first flip chip films and at least two rigid circuit boards, wherein the first flip chip film is connected between each rigid circuit board and the display panel, and the second flip chip film is connected between at least part of adjacent two rigid circuit boards. The display module can reduce signal attenuation of at least part of signals on the connector and the flexible circuit board, improve eye pattern quality of a large-size high-resolution display panel, reduce cost by replacing the connector and the flexible circuit board with the second flip chip film, facilitate ultrathin design of the display device, and enable the second flip chip film and the first flip chip film to be subjected to binding process simultaneously, thereby facilitating productivity improvement.

Description

Display module and display device

Technical Field

The disclosure relates to the technical field of display, in particular to a display module and a display device.

Background

In the display industry, no matter TFT-LCD (thin film transistor liquid crystal display) or OLED (organic light emitting diode display), an external circuit is required to realize display driving, and the external circuit is not separated from a printed circuit board (PCB, printed Circuit Board).

The existing flexible circuit board FPC mounting mode is that a flip type connector is welded on a PCB, and then a production line worker manually plugs the flexible circuit board FPC on the connector. In the actual production process, errors such as oblique insertion and reverse insertion are easy to occur in manual operation of production line workers, lighting abnormality and repeated operation are caused, the manual operation consumes more man hours, the yield of products is affected, the productivity is reduced, and signals are seriously attenuated after passing through a flexible circuit board FPC and a connector, so that the quality of an eye pattern is poor.

It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the present disclosure and thus may include information that does not constitute prior art known to those of ordinary skill in the art.

Disclosure of utility model

The present disclosure aims to overcome the shortcomings of the prior art and provide a display module and a display device.

According to an aspect of the present disclosure, there is provided a display module including:

A display panel;

At least two first flip chip films;

At least two rigid circuit boards, wherein the first flip chip film is connected between each rigid circuit board and the display panel;

And the second flip chip film is connected between at least part of adjacent two rigid circuit boards.

In one exemplary embodiment of the present disclosure, the second flip chip film includes:

a first portion connected to one of the adjacent two rigid circuit boards;

A second portion connected to the other of the adjacent two rigid circuit boards;

And the connecting part is connected between the first part and the second part.

In an exemplary embodiment of the disclosure, a first connection binding pin is disposed at an end portion of the connection portion, which is close to the display panel, and a panel binding pin is disposed at an end portion of the display panel, which is close to the second flip chip film, and the first connection binding pin is in binding connection with the panel binding pin.

In an exemplary embodiment of the present disclosure, the first connection bonding pin and the panel bonding pin are both dummy bonding pins.

In an exemplary embodiment of the present disclosure, a corner portion formed by the connection of the first portion and the connection portion is provided with a chamfer, and a corner portion formed by the connection of the second portion and the connection portion is provided with a chamfer.

In one exemplary embodiment of the present disclosure, the differential signal traces are disposed on the second flip chip film.

In an exemplary embodiment of the present disclosure, the display panel is provided with connection traces thereon, and the second flip chip film includes:

The first part is connected between one of the two adjacent rigid circuit boards and the display panel and is bound to one end of the connecting wire;

And the second part is connected between the other of the two adjacent rigid circuit boards and the display panel and is bound to the other end of the connecting wire.

In one exemplary embodiment of the present disclosure, the first portion and the adjacent first flip-chip film are disposed as an integral structure to form a composite flip-chip film, and/or the second portion and the adjacent first flip-chip film are disposed as an integral structure to form a composite flip-chip film.

In an exemplary embodiment of the disclosure, an end of the integrated flip chip film connected to the display panel is a first end, an end of the integrated flip chip film connected to the rigid circuit board is a second end, a width of the first end along a first direction is smaller than a width of the second end along the first direction, the first direction intersects with a second direction, and the second direction is a connection direction of the display panel, the first flip chip film, and the rigid circuit board.

In an exemplary embodiment of the disclosure, a plurality of first bonding pins are arranged at the first end portion, a plurality of second bonding pins are arranged at the second end portion, a plurality of third bonding pins are arranged on the display panel and are in bonding connection with the first bonding pins, the pitch and the width of the third bonding pins are correspondingly the same as those of the first bonding pins, a plurality of fourth bonding pins are arranged on the rigid circuit board and are in bonding connection with the second bonding pins, the pitch and the width of the fourth bonding pins are correspondingly the same as those of the second bonding pins, the pitch of the first bonding pins is smaller than that of the second bonding pins, and the width of the first bonding pins is smaller than that of the second bonding pins.

In one exemplary embodiment of the present disclosure, the connection trace includes a first differential signal trace.

In an exemplary embodiment of the present disclosure, the first flip chip films connected between the same rigid circuit board and the display panel are provided in at least two, the first flip chip film closest to the adjacent rigid circuit board is a composite flip chip film, one of the composite flip chip films is provided in an integral structure with the first portion of the second flip chip film, and the other of the composite flip chip films is provided in an integral structure with the second portion of the second flip chip film.

In an exemplary embodiment of the present disclosure, the display module further includes:

The central control board is electrically connected with the two adjacent rigid circuit boards, the second flip-chip film is not connected between the two adjacent rigid circuit boards connected with the central control board, or the central control board is electrically connected with one rigid circuit board.

In an exemplary embodiment of the present disclosure, a first rigid circuit board adjacent to the central control board, and a second rigid circuit board remote from the central control board, wherein the first portion is connected between the first rigid circuit board and the display panel, and the second portion is connected between the second rigid circuit board and the display panel;

A second differential signal wire is arranged on the first part, a third differential signal wire is arranged on the second part, and the second differential signal wire and the third differential signal wire are connected to two opposite ends of the first differential signal wire;

A fourth differential signal wire is arranged on the first rigid circuit board, and one end of the fourth differential signal wire is connected with the central control board;

a fifth differential signal wire is arranged on the second rigid circuit board, one end of the fifth differential signal wire is connected with the third differential signal wire, and the other end of the fifth differential signal wire is connected with the first flip-chip film connected with the second rigid circuit board.

In an exemplary embodiment of the present disclosure, the display module further includes:

At least two connectors are arranged on at least two rigid circuit boards in a one-to-one correspondence manner;

and the flexible circuit board is connected between two adjacent connectors.

In an exemplary embodiment of the present disclosure, the flexible circuit board does not exceed the rigid circuit board in a second direction, the second direction being a connection direction of the display panel, the first flip chip film, and the rigid circuit board.

In one exemplary embodiment of the present disclosure, a solder resist film is disposed on the first and second flip chip films.

According to another aspect of the present disclosure, there is provided a display apparatus including:

the display module is any one of the display modules.

According to the display module, data transmission between two adjacent rigid circuit boards is achieved through the second flip chip film, the use of the flexible circuit boards and connectors is reduced, on one hand, signal attenuation of at least part of signals on the connectors and the flexible circuit boards can be reduced, eye pattern quality of a large-size high-resolution display panel can be improved, and signal connection reliability is improved, on the other hand, cost can be reduced by replacing the connectors and the flexible circuit boards with the second flip chip film, the thickness and the size of the second flip chip film are small, ultrathin design of a display device is facilitated, and design trend of a client product is met, on the other hand, the second flip chip film and the first flip chip film can be simultaneously bonded with the rigid circuit boards, operation steps of welding the connectors and manually splicing the flexible circuit boards are omitted, productivity improvement is facilitated, compared with manual splicing, binding process precision is higher, and product yield improvement is facilitated.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure. It will be apparent to those of ordinary skill in the art that the drawings in the following description are merely examples of the disclosure and that other drawings may be derived from them without undue effort.

Fig. 1 is a schematic view of a region division structure of a display panel in a display module of the present disclosure.

Fig. 2 is a schematic structural diagram of a first exemplary embodiment of a display module according to the present disclosure.

Fig. 3 is a schematic partial structure of a second exemplary embodiment of a display module according to the present disclosure.

Fig. 4 is a schematic partial structure of a third exemplary embodiment of a display module according to the present disclosure.

Fig. 5 is a schematic partial structure of a fourth exemplary embodiment of a display module according to the present disclosure.

Fig. 6 is a schematic partial structure of a fifth exemplary embodiment of a display module according to the present disclosure.

Fig. 7 is a schematic partial structure of a sixth exemplary embodiment of a display module according to the present disclosure.

Fig. 8 is a schematic partial structure of a seventh exemplary embodiment of a display module according to the present disclosure.

Fig. 9 is a schematic partial structure of an eighth exemplary embodiment of a display module according to the present disclosure.

Fig. 10 is a schematic structural view of a ninth exemplary embodiment of a display module according to the present disclosure.

Reference numerals illustrate:

Panel, display Panel, panel-Lead, panel binding pins;

PCBA1, the first rigid circuit board, PCBA2, the second rigid circuit board;

COF1, a first flip chip film;

COFZ, a comprehensive flip chip film, COFZ, a first end part, COFZ, a middle part, COFZ, and a second end part;

COF2, a second flip chip film, a COF21, a first part, a COF22, a second part, a COF23, a connecting part, a COF23-Lead and a first connecting binding pin;

CNT1, a first connector, CNT2, a second connector;

FPC, flexible circuit board;

ZX, connecting wiring;

DS1, a first differential signal wire, DS2, a second differential signal wire, DS3, a third differential signal wire, DS4, a fourth differential signal wire;

TCON, central control board;

x, a first direction, Y, a second direction.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus detailed descriptions thereof will be omitted. Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification for convenience only, such as in terms of the orientation of the examples described in the figures. It will be appreciated that if the device of the icon is flipped upside down, the recited "up" component will become the "down" component. When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

The terms "a," "an," "the," "said" and "at least one" are used to indicate the presence of one or more elements/components/etc., the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. in addition to the listed elements/components/etc., and the terms "first," "second," and "third," etc. are used merely as labels, and not as limitations on the number of objects thereof.

In the present application, unless explicitly stated and limited otherwise, the term "coupled" is to be construed broadly, and for example, the term "coupled" may be a fixed connection, a removable connection, or an integral unit, and may be directly or indirectly coupled via an intervening medium. "and/or" is merely an association relation describing the association object, and means that three kinds of relations may exist, for example, a and/or B, and that three kinds of cases where a exists alone, a and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

The exemplary embodiments of the present disclosure provide a display module, as shown in fig. 1 to 10, which may include a display Panel, a second flip chip film COF2, at least two rigid circuit boards PCBA and at least two first flip chip films COF1, where the first flip chip films COF1 are connected between each rigid circuit board PCBA and the display Panel, and the second flip chip film COF2 is connected between at least part of adjacent two rigid circuit boards PCBA.

According to the display module, data transmission between two adjacent rigid circuit boards PCBA is achieved through the second COF2, the use of the flexible circuit board FPC and the connector CNT is reduced, on one hand, signal attenuation of at least part of signals on the connector CNT and the flexible circuit board FPC can be reduced, eye pattern quality of a large-size high-resolution display Panel can be improved, signal connection reliability is improved, on the other hand, cost can be reduced by replacing the connector CNT and the flexible circuit board FPC with the second COF2, thickness and size of the second COF2 are small, ultrathin design of a display device is facilitated, design trend of a client product is met, on the other hand, the second COF2 and the first COF1 can be bound with the rigid circuit board PCBA at the same time, operation steps of welding the connector CNT and manually splicing the flexible circuit board FPC are omitted, improvement of productivity is facilitated, compared with manual splicing is facilitated, binding process accuracy is higher, and product yield is facilitated to be improved.

In some example embodiments of the present disclosure, the display Panel may be a Liquid crystal display (Liquid CRYSTAL DISPLAY, LCD), an OLED (Organic Electroluminescence Display, an organic light emitting semiconductor) display Panel, a QLED (Quantum Dot LIGHT EMITTING Diodes), a micro-LED (micro-LIGHT EMITTING Diode) display Panel, a mini-LED (mini-LIGHT EMITTING Diode), a sub-millimeter light emitting Diode) display Panel, or the like.

Referring to fig. 1, the display Panel has a display area and AA (Active Area) and a non-display area NAA, and in particular, the non-display area NAA may be provided around the outer circumference of the display area AA. The display Panel may be set to be rectangular, and the display area AA may be set to be rectangular, so that the non-display area NAA is set to be a rectangular frame.

For the liquid crystal display panel, the non-display area NAA may include a Data binding side DP (Data Pad), a Data binding side DPO (Data Pad Opposite), a gate signal output left side GPL (Gate Pad Left), and a gate signal output right side GPR (Gate Pad Left). Gate drive circuits (GOA: GATE DRIVER On Array) are provided in the gate signal output left GPL and the gate signal output right GPR, which are disposed opposite to each other in the first direction X, the gate signal output left GPL generally corresponds to the coverage area of the left frame, and the gate signal output right GPR generally corresponds to the coverage area of the right frame. The data binding side DP generally corresponds to the coverage area of the lower border. The data binding side DP is disposed opposite to the data binding side DPO in the second direction Y, and the data binding side DPO generally corresponds to a coverage area of the upper frame.

The data binding side DP may include a fan-out area Fanout and a binding area BOD, where the display area AA and the binding area BOD are connected to opposite sides of the fan-out area Fanout in the second direction Y, that is, the fan-out area Fanout is connected between the display area AA and the binding area BOD, specifically, the fan-out area Fanout is connected to the display area AA, the binding area BOD is connected to a side of the fan-out area Fanout facing away from the display area AA, various wires are disposed in the fan-out area Fanout, and a plurality of binding pins are disposed in the binding area BOD, where a part of the binding pins are used for binding the driving integrated circuit IC and another part of the binding pins are used for binding the first flip chip film COF1.

For other display panels, the non-display area NAA may include a Data binding side DP (Data Pad), a Data binding side DPO (Data Pad Opposite), and first and second areas oppositely disposed in the first direction X.

It should be noted that, in the present disclosure, the first direction X and the second direction Y are parallel to the display surface of the display Panel, and the second direction Y is a connection direction of the display Panel, the first flip chip film COF1, and the rigid circuit board PCBA, and the first direction X intersects with the second direction Y, for example, the first direction X is perpendicular to the second direction Y.

The display Panel may include a substrate having a driving circuit layer group provided at one side thereof, and the material of the substrate may include an inorganic material, for example, glass, quartz, metal, or the like. The material of the base substrate may further include an organic material, and for example, the organic material may be a resin-based material such as polyimide, polycarbonate, polyacrylate, polyetherimide, polyethersulfone, polyethylene terephthalate, and polyethylene naphthalate. The substrate may be formed of multiple layers of material, for example, the substrate may include multiple layers of substrate material, the material of which may be any of the materials described above. Of course, the substrate may be a single layer, and may be any of the above materials. The driving circuit group may include a plurality of transistors arranged in an array.

The liquid crystal display panel may further include a first electrode layer, an insulating layer, a second electrode layer, and the like, which are stacked in this order. The Panel for the OLED display Panel may further include a first electrode layer, a pixel defining layer, a light emitting layer group, a second electrode layer, an encapsulation layer group, and the like, which are sequentially stacked.

Referring to fig. 2, the rigid circuit board PCBA may be provided in at least two, for example, the rigid circuit board PCBA may be provided in two, three or more, and the first flip chip film COF1 may be provided in at least two, for example, the first flip chip film COF1 may be provided in two, three or more. The first flip chip film COF1 is connected between each of the rigid circuit boards PCBA and the display Panel, specifically, one end of the first flip chip film COF1 is bound to the data binding side DP of the display Panel, and the opposite end of the first flip chip film COF1 is bound to the rigid circuit board PCBA, so that the first flip chip film COF1 is electrically connected between the rigid circuit board PCBA and the display Panel, and signals can be transmitted between the rigid circuit board PCBA and the display Panel through the first flip chip film COF 1.

The first COF1 can be bent, so that the rigid circuit board PCBA is located on the non-display side of the display Panel, the width of a non-display area NAA of the display Panel is reduced, and narrow frame arrangement is facilitated.

The rigid circuit board PCBA may provide functions of supporting, interconnecting and signal transmitting for various electronic components, and the blank board of the printed circuit board PCB (Printed Circuit Board) is mounted via SMT (Surface Mount Technology ) or via DIP (Dual Inline-PIN PACKAGE, dual Inline package technology) in the whole process of the package, which may be referred to as mounting for short PCBA (Printed Circuit Board Assembly).

Because the printed circuit board PCB manufacturing factory, the spare manufacturing factory and the module binding process of the display Panel can not cope with the ultra-long printed circuit board PCB, in the related art, for the large-size display Panel, at least two rigid circuit boards PCBA are required to be arranged, and the flexible circuit board FPC is used for connecting the adjacent two rigid circuit boards PCBA for data transmission. The Flexible Printed Circuit (FPC) comprises a base material, a copper foil and a covering layer, wherein the base material is made of flexible materials such as Polyimide (PI) or polyester film, and has the characteristics of being bendable, foldable, light in weight and the like. The copper foil is used as a conductive layer, and a circuit pattern is formed by etching or the like. The thickness of the copper foil can be selected according to different application requirements. The cover layer is typically an insulating material for protecting the circuit and providing insulating properties. The cover layer may be a polyimide film, mylar film, or other insulating material. When an electronic component is provided on a Flexible Printed Circuit (FPC), the electronic component needs to be soldered to the FPC. The adopted flexible circuit board FPC mounting mode is that a flip type connector CNT is welded on a printed circuit board PCB, and then a production line worker manually inserts the flexible circuit board FPC on the connector CNT. However, in the actual production process, errors such as oblique insertion and reverse insertion are easy to occur in manual operation of production line workers, lighting abnormality and repeated operation are caused, and the manual operation consumes more man-hours, so that the yield of products is affected, and the productivity is reduced.

In addition, as the Panel of the display Panel is towards oversized, the distance of signal transmission is longer and longer, the requirement on the transmission rate is higher and higher, the attenuation amplitude of the transmission signal on the connector CNT and the flexible circuit board FPC is larger and larger, the quality of the eye pattern of the product is poor, the product authentication schedule of the client is seriously influenced, and the quality of the product is influenced.

Furthermore, along with the development trend of thinning products in the whole factories, more and more factories require the flexible circuit board FPC to be reversely inserted, that is, the main body part of the flexible circuit board FPC is arranged close to the Panel of the display Panel relative to the plug-in part before the first flip chip film COF1 is not bent. The flexible printed circuit board FPC is required to be incapable of exceeding the edge design of the rigid printed circuit board PCBA, the flexible printed circuit board FPC is required to be narrower, the wiring space of the flexible printed circuit board FPC is limited, multi-layer design is usually required, the number of wires on the flexible printed circuit board FPC is increased along with the increasing resolution, namely along with the increasing of pixel density, the pressure of the wiring space of the flexible printed circuit board FPC is increased, even the flexible printed circuit board FPC is required to be capable of being designed in 4 layers or 6 layers, or the line width and the line distance of the wires are limited to meet the requirement that the customer cannot exceed the edge of the rigid printed circuit board PCBA after the flexible printed circuit board FPC is reversely inserted on a mechanism, the product cost is greatly improved, the impedance of the flexible printed circuit board FPC is greatly improved, and the product performance is influenced.

In the present exemplary embodiment, referring to fig. 2, the second flip chip film COF2 is connected between at least part of adjacent two rigid circuit boards PCBA, for example, the second flip chip film COF2 is not provided between the adjacent two rigid circuit boards PCBA connected to the central control board TCON, and the second flip chip film COF2 is provided between the other adjacent two rigid circuit boards PCBA. Of course, in other exemplary embodiments of the present disclosure, the second flip chip film COF2 may be connected between all adjacent two rigid circuit boards PCBA.

The COF2 is used for replacing the connector CNT and the flexible circuit board FPC, the thickness and the volume of the second COF2 are smaller, ultrathin design of a display device is facilitated, the design trend of a client product is met, on the other hand, the bonding process between the second COF2 and the first COF1 can be simultaneously carried out with the rigid circuit board FPC, on the one hand, signal attenuation of at least part of signals on the connector CNT and the flexible circuit board FPC can be reduced, eye pattern quality of a large-size high-resolution display Panel Panel can be improved, signal connection reliability is improved, on the other hand, the second COF2 is used for replacing the connector CNT and the flexible circuit board FPC, cost can be reduced, the thickness and the volume of the second COF2 are smaller, the ultrathin design of the display device is facilitated, the design trend of the client product is met, on the other hand, the bonding process between the second COF2 and the first COF1 and the rigid circuit board FPC can be simultaneously omitted, the operation steps of welding the connector and the flexible circuit board FPC are easy to be improved, the manufacturing error is facilitated, the manufacturing process is improved, and the manufacturing error is improved.

The bonding process is to thermally bond the ACF (Anisotropic Conductive Film, anisotropic conductive adhesive) under various conditions (temperature, pressure and time), specifically, the anisotropic conductive adhesive can be coated on the PCBA of the rigid circuit board, then the first COF1 and the second COF2 are aligned to the position of the PCBA of the rigid circuit board coated with the anisotropic conductive adhesive, and then the first COF1 and the second COF2 are pressed on the PCBA of the rigid circuit board by bonding equipment, and the pressure is kept for a certain time under the set temperature condition.

A Chip On Film (COF) is a die-attach technology for fixing a driving integrated circuit (driving IC) On a flexible circuit board, and a flexible attach circuit board is used as a package Chip carrier to bond a Chip and a flexible substrate circuit, or a flexible attach circuit board with a single Chip not packaged. Specifically, the flip chip film is generally composed of a substrate, a metal wiring, and a driving chip. The base material is generally made of flexible materials such as Polyimide (PI), has good flexibility, heat resistance and insulativity, and can adapt to various complex shapes and bending requirements. The metal wiring is usually made of a metal material having good conductivity such as copper, and a fine wiring pattern is formed on the substrate by a fine process technique. The driving chip is a core component of the flip chip film and is responsible for controlling the functions of image display, signal processing and the like of the display screen. The driving chip is directly arranged on the film through a flip chip technology (Flip Chip Technology), and compared with the traditional wire bonding technology, the driving chip has higher connection density and smaller packaging size, meets the development trend of thinning of electronic products, can provide more stable connection, reduces interference and loss in signal transmission, improves the reliability of the products, and can realize high-resolution signal transmission by fine metal circuits and advanced manufacturing technology and improve the image display quality of a display screen.

The first COF1 combines the chip and the flexible substrate circuit by using the flexible additional circuit board as the package chip carrier. The second COF2 is a flexible additional circuit board with single-finger unpackaged chips.

In some example embodiments of the present disclosure, referring to fig. 3 and 4, the second flip chip film COF2 may include a first portion COF21, a second portion COF22, and a connection portion COF23, the first portion COF21 being connected to one of the adjacent two rigid circuit board PCBAs, specifically, one end of the first portion COF21 being bound to one of the adjacent two rigid circuit board PCBAs, and the second portion COF22 being connected to the other of the adjacent two rigid circuit board PCBAs, specifically, one end of the second portion COF22 being bound to the other of the adjacent two rigid circuit board PCBAs. The connection portion COF23 is connected between the first portion COF21 and the second portion COF22, specifically, the connection portion COF23 is connected between an end of the first portion COF21 away from the rigid circuit board PCBA and an end of the second portion COF22 away from the rigid circuit board PCBA, so that the second flip chip film COF2 forms a structure of approximately "冂".

The corner portion formed by the connection of the first portion COF21 and the connection portion COF23 is provided with a chamfer, and the corner portion formed by the connection of the second portion COF22 and the connection portion COF23 is provided with a chamfer. Referring to fig. 3 and 4, a corner portion formed at a side of the first portion COF21 adjacent to the second portion COF22, which is connected to the connection portion COF23, is provided as a rounded corner, and a side edge line of the first portion COF21, which is connected to the connection portion COF23 and is distant from the second portion COF22, is provided as a straight line. The corner part formed on the side of the second part COF22, which is close to the first part COF21, is connected with the connection part COF23, and is provided with a round chamfer, and the edge line of the side, which is far from the first part COF21, of the second part COF22, which is connected with the connection part COF23, is provided with a straight line. By the arrangement, the connection length between the first part COF21 and the connection part COF23 is increased, sharp corners are avoided, so that the connection strength between the first part COF21 and the connection part COF23 is increased, tearing between the first part COF21 and the connection part COF23 in the process of carrying and testing is avoided, and similarly, the connection length between the second part COF22 and the connection part COF23 is increased, sharp corners are avoided, so that the connection strength between the second part COF22 and the connection part COF23 is increased, and tearing between the second part COF22 and the connection part COF23 in the process of carrying and testing is avoided.

Optionally, referring to fig. 3, a first connection binding pin COF23-Lead is disposed at an end of the connection portion COF23 near the display Panel, a Panel binding pin Panel-Lead is disposed at an end of the display Panel near the second flip film COF2, and the first connection binding pin COF23-Lead is connected with the Panel binding pin Panel-Lead in a binding manner, so that an end of the connection portion COF23 near the display Panel is connected with the display Panel in a binding manner, and both ends of the second flip film COF2 are fixedly disposed, so that after the display Panel is mounted on the display device, the second flip film COF2 can be bent together with the first flip film COF1, so that the display device is more stable in structure.

The first connection binding pin COF23-Lead and the Panel binding pin Panel-Lead may not be electrically connected, i.e., the first connection binding pin COF23-Lead and the Panel binding pin Panel-Lead are both dummy binding pins, do not participate in the electrical connection, and do not need to be electrified. By the arrangement, panel binding pins Panel-Lead are only required to be added on the substrate, and the design of other mask plates is not required to be changed, and binding pins required for binding the second COF2 are only required to be added on the basis of the prior art on the PCBA.

In the process, the second COF2 can be directly and mechanically bound with the first COF1 without adding additional process and interference with devices, so that the operation of manually plugging the flexible circuit board FPC is omitted, the productivity is improved, compared with manual plugging, the binding precision is higher, the product yield is improved, and compared with the connector CNT and the flexible circuit board FPC, the cost is greatly saved by adopting the second COF 2.

Of course, in other example embodiments of the present disclosure, as shown with reference to fig. 2 and 4, the end of the connection portion COF23 near the display Panel may not be connected to the display Panel by binding, in which case the lengths of the first portion COF21 and the second portion COF22 may be set smaller.

Alternatively, referring to fig. 4, differential signal traces may be disposed on the second flip chip film COF2, for example, only differential signal traces may be disposed on the second flip chip film COF2, where the display module may further include a flexible circuit board FPC and at least two connectors CNT, at least two connectors CNT are disposed on at least two rigid circuit boards PCBA in a one-to-one correspondence, that is, one connector CNT is disposed on one rigid circuit board PCBA, for example, two rigid circuit boards PCBA and two connectors CNT are disposed, the two connectors CNT are a first connector CNT1 and a second connector CNT2, the first connector CNT1 is disposed on one of the two adjacent rigid circuit boards PCBA, the second connector CNT2 is disposed on the other of the two adjacent rigid circuit boards PCBA, the flexible circuit board FPC is connected between the two adjacent connectors CNT, that is, the flexible circuit board is connected between the first connector FPC 1 and the second connector FPC 2, the two connectors CNT are disposed on the flexible circuit board FPC, and the other signal traces GOA (Gate on Array), the signal traces may be disposed on the other flexible circuit board, and the signal traces may be disposed on the other traces.

The differential signal with the largest attenuation degree is transmitted through the second COF2, so that the signal attenuation of the differential signal on the flexible circuit board FPC and the connector CNT can be avoided, the eye pattern quality is improved, the design of the mask plate does not need to be changed, and the rapid improvement of the product quality is facilitated.

In this case, the number of traces provided on the flexible circuit board FPC is reduced, so that the flexible circuit board FPC can be provided narrower, for example, so that the flexible circuit board FPC does not exceed the rigid circuit board PCBA in the second direction Y, so as to satisfy customer requirements.

Of course, in other example embodiments of the present disclosure, in addition to the differential signal traces, control signal traces may be disposed on the second flip chip film COF2, while other traces may be disposed on the flexible circuit board FPC, and the other traces may include GOA (Gate on Array) signal traces, gamma signal traces, power signal traces, and so on.

In some example embodiments of the present disclosure, referring to fig. 5-9, a connection trace ZX may be disposed on a display Panel, and the second flip chip film COF2 may include a first portion COF21 and a second portion COF22, where the first portion COF21 is connected between one of two adjacent rigid circuit boards PCBA and the display Panel and is bound to one end of the connection trace ZX, specifically, the first portion COF21 has a first end and a second end disposed opposite to each other, a first binding stitch is disposed at the first end and a second binding stitch is disposed at the second end, the first binding stitch is connected with the rigid circuit board PCBA in a binding manner, and the second binding stitch is bound to one end of the connection trace ZX, such that the signal trace on the first portion COF21 is in electrical communication with the connection trace ZX on the display Panel, and such that the signal trace on the first portion COF21 is also in electrical communication with the trace on the one rigid circuit board.

The second part COF22 is connected between the other rigid circuit board PCBA and the display Panel and is bound to the other end of the connecting wire ZX, specifically, the second part COF22 is provided with a third end and a fourth end which are oppositely arranged, a third binding pin is arranged at the third end, a fourth binding pin is arranged at the fourth end and is bound and connected with the rigid circuit board PCBA, the fourth binding pin is bound to the other end of the connecting wire ZX, so that the signal wire on the second part COF22 is electrically communicated with the connecting wire ZX on the display Panel, and the signal wire on the second part COF22 is also electrically communicated with the wire on the other rigid circuit board PCBA, thereby realizing the electrical communication of the adjacent two rigid circuit boards PCBA.

Referring to fig. 5, the first portion COF21 and the first flip chip film COF1 are separately provided, and the second portion COF22 and the first flip chip film COF1 are also separately provided.

The first COF21 and the second COF22 of the second COF2 are fixedly arranged at two ends, so that after the display Panel is installed on the display device, the first COF21 and the second COF22 of the second COF2 can be bent together with the first COF1, the display device is more stable in structure, the second COF2 is simpler in structure, and the second COF2 can be bound with the first COF1 in the process.

Generally, 60, 68 or 80 wires are required to be disposed on the second flip chip film COF2, and thus 60, 68 or 80 connection wires ZX are also disposed on the display Panel. The connection trace ZX can be formed on the display Panel by changing the structure of the mask plate, and the connection traces ZX with the number can be arranged on the display Panel.

Alternatively, referring to fig. 6-8, the first portion COF21 and the adjacent first flip chip film COF1 may be configured as an integrated structure to form the integrated flip chip film COFZ, that is, one first flip chip film COF1 is configured to be larger, a part of the first flip chip film COF1 is still used as the first flip chip film COF1, a driving integrated circuit IC is disposed at the part used as the first flip chip film COF1, and another part of the first flip chip film COF1 is used as the first portion COF21 of the second flip chip film COF2, where no driving integrated circuit IC is required, and only wiring connection is required.

The second portion COF22 and the adjacent first flip chip film COF1 may be configured as an integrated structure to form a comprehensive flip chip film COFZ, that is, another first flip chip film COF1 is configured to be larger, a portion of the first flip chip film COF1 is still used as the first flip chip film COF1, a portion used as the first flip chip film COF1 is provided with a driving integrated circuit IC, another portion of the first flip chip film COF1 is used as the second portion COF22 of the second flip chip film COF2, and the portion does not need to be provided with the driving integrated circuit IC and only needs to be connected by routing.

By the arrangement, the preshrinking uniformity in the binding process can be ensured, the structure of the integrated flip chip film COFZ in the present disclosure is basically the same as that of the first flip chip film COF1 in the related art, but the integrated flip chip film COFZ in the present disclosure is larger in arrangement and more in binding pins, and the alignment of the second flip chip film COF2 is reduced, so that the binding process is simpler.

Generally, 68 or 80 wires are actually required for the second COF2, and since the sizes of the COF raw materials are fixed, for low-resolution display Panel panels and display Panel panels with a large number of integrated COF COFZ, for example, for 720-channel display Panel panels, there are 12 integrated COF COFZ, the raw material specifications of the existing integrated COF COFZ can meet the channel requirements of the integrated design of the first part COF21 and the first COF1 and the channel requirements of the integrated design of the second part COF22 and the first COF1, so that the existing first COF1 is not replaced, the cost is reduced, and the connecting wires ZX are also required to be arranged on the display Panel panels to realize the connection of the first part COF21 and the second part COF 22.

Of course, in other exemplary embodiments of the present disclosure, the first portion COF21 and the adjacent first flip chip film COF1 may be configured as a single structure, and the second portion COF22 and the adjacent first flip chip film COF1 may be configured as a separate structure, or the second portion COF22 and the adjacent first flip chip film COF1 may be configured as a single structure, and the first portion COF21 and the adjacent first flip chip film COF1 may be configured as a separate structure.

Alternatively, referring to fig. 7 and 8, the end of the integrated flip chip film COFZ connected to the Panel is a first end COFZ, the end of the integrated flip chip film COFZ connected to the rigid circuit board PCBA is a second end COFZ3, and the width of the first end COFZ1 along the first direction X is smaller than the width of the second end COFZ3 along the first direction X. By the arrangement, the size of the raw materials of the integrated flip chip film COFZ is reduced, and only the required number of channels is reserved at the Panel end of the display Panel.

The first end COFZ is provided with a plurality of first bonding pins, the pitches and the widths of the plurality of first bonding pins are correspondingly the same, namely, the pitches of the first bonding pins serving as the first COF1 and the pitches of the first bonding pins serving as the second COF2 are the same, and the widths of the first bonding pins serving as the first COF1 and the widths of the first bonding pins serving as the second COF2 are the same, so that the preshrinking uniformity during bonding is ensured.

The second end COFZ is provided with a plurality of second bonding pins, the pitches and widths of the second bonding pins are the same, namely, the pitches of the second bonding pins serving as the first COF1 and the pitches of the second bonding pins serving as the second COF2 are the same, and the widths of the second bonding pins serving as the first COF1 and the second bonding pins serving as the second COF2 are the same, so that the uniformity of preshrinking during bonding is ensured.

A plurality of third binding pins are arranged on the display Panel, and the third binding pins are in binding connection with the first binding pins. The pitches and widths of the plurality of third bonding pins are the same, namely the pitches of the third bonding pins bonded with the first COF1 and the pitches of the third bonding pins bonded with the second COF2 are the same, and the widths of the third bonding pins bonded with the first COF1 and the widths of the third bonding pins bonded with the second COF2 are the same, so that the preshrinking uniformity in bonding is ensured.

In order to ensure uniformity of preshrinking of the bonding pins on the Panel and the bonding pins of the first end COFZ of the integrated flip-chip film COFZ during bonding, the Pitch (Pitch) of the bonding pins on the Panel is the same as the Pitch (Pitch) of the bonding pins of the first end COFZ1 of the integrated flip-chip film COFZ, and the width of the bonding pins on the Panel is the same as the width of the bonding pins of the first end COFZ1 of the integrated flip-chip film COFZ, i.e., the Pitch of the third bonding pins is the same as the Pitch of the first bonding pins, i.e., the width of the third bonding pins is the same as the width of the first bonding pins.

A plurality of fourth binding pins are arranged on the PCBA of the rigid circuit board and are in binding connection with the second binding pins. The pitch and the width of the plurality of fourth binding pins are the same, namely the pitch of the fourth binding pins bound with the first COF1 and the pitch of the fourth binding pins bound with the second COF2 are the same, and the width of the fourth binding pins bound with the first COF1 and the width of the fourth binding pins bound with the second COF2 are the same, so that the preshrinking uniformity during binding is ensured.

Similarly, to ensure uniformity of the bonding pins of the second end COFZ3 of the integrated flip chip film COFZ and the bonding pins on the rigid circuit board PCBA pre-shrinking during bonding, the Pitch (Pitch) of the bonding pins on the rigid circuit board PCBA is the same as the Pitch (Pitch) of the bonding pins of the first end COFZ1 of the integrated flip chip film COFZ, and the width of the bonding pins on the rigid circuit board PCBA is the same as the width of the bonding pins of the first end COFZ1 of the integrated flip chip film COFZ, i.e., the Pitch of the fourth bonding pins is the same as the Pitch of the second bonding pins, i.e., the width of the fourth bonding pins is the same as the width of the second bonding pins.

The Pitch (Pitch) and the width of the bonding pins on the rigid circuit board PCBA are not sufficiently small, that is, the Pitch of the fourth bonding pin is larger than the Pitch of the third bonding pin, and the width of the fourth bonding pin is larger than the width of the third bonding pin, so that the width of the first end COFZ1 along the first direction X is smaller than the width of the second end COFZ along the first direction X, so that the Pitch (Pitch) and the width of the bonding pins of the first end COFZ1 on the integrated flip film COFZ are matched with the bonding pins on the display Panel, and the Pitch (Pitch) and the width of the bonding pins of the second end COFZ on the integrated flip film COFZ are matched with the bonding pins on the rigid circuit board PCBA.

Referring to fig. 7, the integrated flip-chip film COFZ may be provided in a symmetrical structure, with a symmetry axis being a central axis of the integrated flip-chip film COFZ extending in the second direction Y, so that the integrated flip-chip film COFZ may be provided in a substantially isosceles trapezoid structure, and in particular, the integrated flip-chip film COFZ may include a first end portion COFZ, a middle portion COFZ2, and a second end portion COFZ, which are sequentially connected, the first end portion COFZ and the second end portion COFZ may be provided in a rectangular shape, and the middle portion COFZ may be provided in an isosceles trapezoid shape.

Referring to fig. 8, the integrated flip-chip film COFZ may be disposed in an asymmetric structure, for example, the integrated flip-chip film COFZ may be disposed in a substantially right trapezoid structure, and in particular, the integrated flip-chip film COFZ may include a first end COFZ, a middle portion COFZ2, and a second end COFZ3 connected in sequence, the first end COFZ and the second end COFZ may be disposed in a rectangular shape, and the middle portion COFZ may be disposed in a right trapezoid shape.

Of course, in other example embodiments of the present disclosure, the integrated flip-chip film COFZ may be configured in a generally non-isosceles trapezoid configuration, and in particular, the integrated flip-chip film COFZ may include a first end portion COFZ, a middle portion COFZ2, and a second end portion COFZ3 connected in sequence, and the first end portion COFZ1 and the second end portion COFZ3 may be configured in a rectangular shape, and the middle portion COFZ may be configured in a non-isosceles trapezoid configuration.

Referring to fig. 2 and 9, in some example embodiments of the present disclosure, the connection trace ZX disposed on the display Panel may include a first differential signal trace DS1.

At least two first flip chip films COF1 connected between the same rigid circuit board PCBA and the display Panel may be provided, for example, three first flip chip films COF1 connected between the same rigid circuit board PCBA and the display Panel may be provided. Of course, in other example embodiments of the present disclosure, the first flip chip film COF1 connected between the same rigid circuit board PCBA and the display Panel may be provided in four or more.

The first flip chip film COF1 closest to the adjacent rigid circuit board PCBA is a composite flip chip film COFZ, and one composite flip chip film COFZ and the first portion COF21 of the second flip chip film COF2 are arranged as an integral structure, i.e. one composite flip chip film COFZ includes one first flip chip film COF1 and the first portion COF21 arranged as an integral structure. The other integrated flip chip film COFZ and the second portion COF22 of the second flip chip film COF2 are arranged as an integral structure, that is, the other integrated flip chip film COFZ includes the other first and second portion COFs 1 and 22 arranged as an integral structure.

The first COF1 far away from the adjacent rigid circuit board PCBA is still the original first COF1, and is not combined with the first part COF21 or the second part COF22 of the second COF2 to form an integrated structure.

Referring to fig. 2, the display module may further include a central control board TCON electrically connected to the adjacent two rigid circuit boards PCBA, through which various display signals can be directly transmitted to the adjacent two rigid circuit boards PCBA, and thus, the second flip chip film COF2 is not connected between the adjacent two rigid circuit boards PCBA connected to the central control board TCON. For example, the rigid circuit board PCBA may be provided in four, the two rigid circuit boards PCBA in the middle may be connected to the central control board TCON through FFC (Flexible Flat Cable ), the two rigid circuit boards PCBA in the left side may be connected through the second flip chip film COF2, and the two rigid circuit boards PCBA in the right side may be connected through the second flip chip film COF2.

Of course, in other example embodiments of the present disclosure, the central control board TCON is electrically connected to one rigid circuit board PCBA, for example, referring to fig. 10, the rigid circuit board PCBA may be provided in three, one rigid circuit board PCBA in the middle may be connected to the central control board TCON through an FFC (Flexible Flat Cable ), two rigid circuit board PCBAs on the left may be connected through a second flip chip film COF2, and two rigid circuit board PCBAs on the right may be connected through a second flip chip film COF 2.

In the case where the rigid circuit boards PCBA may be provided in two, one rigid circuit board PCBA may be connected to the central control board TCON through an FFC (Flexible Flat Cable ), and the two rigid circuit boards PCBA may be connected through a second flip chip film COF 2.

In addition, the number of the rigid circuit boards PCBA may be other numbers, and the specific connection manner thereof is not described here.

In this case, as shown in fig. 2 and 9, the adjacent two rigid circuit boards PCBA are the first rigid circuit board PCBA1 close to the center control board TCON, the second rigid circuit board PCBA2 far from the center control board TCON, the first portion COF21 is connected between the first rigid circuit board PCBA1 and the display Panel, and the second portion COF22 is connected between the second rigid circuit board PCBA2 and the display Panel.

The second differential signal wires DS2 are disposed on the first portion COF21, the third differential signal wires DS3 are disposed on the second portion COF22, the second differential signal wires DS2 and the third differential signal wires DS3 are connected to opposite ends of the first differential signal wires DS1, specifically, the second differential signal wires DS2 and the third differential signal wires DS3 are connected to opposite ends of the first differential signal wires DS1 by binding, and therefore, the number of the first differential signal wires DS1, the number of the second differential signal wires DS2, and the number of the third differential signal wires DS3 are the same.

A fourth differential signal wire DS4 is disposed on the first rigid circuit board PCBA1, and one end of the fourth differential signal wire DS4 is connected to the central control board TCON.

The second rigid circuit board PCBA2 is provided with a fifth differential signal wire DS5, one end of the fifth differential signal wire DS5 is connected to the third differential signal wire DS3, the number of the fifth differential signal wires DS5 may be the same as the number of the third differential signal wires DS3, and the other end of the fifth differential signal wire DS5 is connected to the first flip chip film COF1 connected to the second rigid circuit board PCBA 2. The differential signals are sequentially transmitted to each first flip chip film COF1 through the fourth differential signal wire DS4, the second differential signal wire DS2, the first differential signal wire DS1, the third differential signal wire DS3 and the fifth differential signal wire DS5, and then transmitted to the display Panel through each first flip chip film COF1.

It should be noted that the differential signal traces are arranged in pairs, and one line in fig. 9 represents a pair of differential signal traces for simplicity. Under the condition that the wires of other signals are connected through the first part and the second part, the structure of the wires is basically the same as that of the wires of the differential signals, so that the wires are not repeated here.

Optionally, the display module may further include a flexible circuit board FPC and at least two connectors CNT, where the at least two connectors CNT are disposed on the at least two rigid circuit boards PCBA in a one-to-one correspondence manner, that is, one connector CNT is disposed on one rigid circuit board PCBA, and two rigid circuit boards PCBA and two connectors CNT are disposed, for example, the two connectors CNT are a first connector CNT1 and a second connector CNT2, the first connector CNT1 is disposed on one of the adjacent two rigid circuit boards PCBA, for example, the first connector CNT1 is disposed on the first rigid circuit board PCBA1, the second connector CNT is disposed on the other of the adjacent two rigid circuit boards PCBA, for example, the second connector CNT2 is disposed on the second rigid circuit board PCBA2, the flexible circuit board FPC is connected between the adjacent two connectors FPC, that is, the flexible circuit board FPC is connected between the first connector CNT1 and the second connector CNT2, and other traces including signal traces GOA (Gate on Array), gamma signal traces, and other traces, and the like are disposed on the flexible circuit board FPC.

The differential signal with the largest attenuation degree is transmitted through the second COF2, so that the signal attenuation of the differential signal on the flexible circuit board FPC and the connector CNT can be avoided, the eye pattern quality is improved, the design of the mask plate does not need to be changed, and the rapid improvement of the product quality is facilitated.

In this case, the number of traces provided on the flexible circuit board FPC is reduced, so that the flexible circuit board FPC can be provided narrower, for example, so that the flexible circuit board FPC does not exceed the rigid circuit board PCBA in the second direction Y, so as to satisfy customer requirements.

Of course, in other example embodiments of the present disclosure, in addition to the differential signal traces, control signal traces may be disposed on the second flip chip film COF2, while other traces may be disposed on the flexible circuit board FPC, and the other traces may include GOA (Gate on Array) signal traces, gamma signal traces, power signal traces, and so on.

Optionally, a solder resist film (Solder Resist, SR) is disposed on the first and second flip chip films COF1, COF 2. Common welding-resistant film materials include a dry film and a liquid film. The dry film solder resist film is a film layer formed by covering a prefabricated dry film layer on the surface of the second COF2 and fusing with the surface of the second COF2 under high temperature and pressure, and the liquid film solder resist film is a liquid solder resist film material coated on the surface of the second COF2 and cured on the surface of the second COF2 by heat curing or ultraviolet irradiation. The strength of the second COF2 can also be increased through the solder resist film, and the second COF2 is prevented from tearing in the process of carrying and testing.

Based on the same inventive concept, the exemplary embodiments of the present disclosure provide a display device, which may include the display module set described in any one of the above. The specific structure of the display module has been described in detail above, and therefore, will not be described here again.

The specific type of the display device is not particularly limited, and the type of the display device commonly used in the art may be, for example, a mobile device such as a mobile phone, a wearable device such as a watch, a VR device, etc., and those skilled in the art may select the display device accordingly according to the specific application of the display device, which is not described herein again.

It should be noted that, the display device includes other necessary components and components besides the array substrate, for example, a display, specifically, a housing, a circuit board, a power cord, etc., and those skilled in the art can correspondingly supplement the components and components according to specific usage requirements of the display device, which is not described herein.

Compared with the prior art, the display device provided by the exemplary embodiment of the present utility model has the same advantages as those of the array substrate provided by the foregoing exemplary embodiment, and will not be described herein.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

Claims (18)

1. A display module, comprising:

A display panel;

At least two first flip chip films;

At least two rigid circuit boards, wherein the first flip chip film is connected between each rigid circuit board and the display panel;

And the second flip chip film is connected between at least part of adjacent two rigid circuit boards.

2. The display module of claim 1, wherein the second flip-chip film comprises:

a first portion connected to one of the adjacent two rigid circuit boards;

A second portion connected to the other of the adjacent two rigid circuit boards;

And the connecting part is connected between the first part and the second part.

3. The display module assembly of claim 2, wherein a first connection binding pin is disposed at an end of the connection portion near the display panel, a panel binding pin is disposed at an end of the display panel near the second flip chip film, and the first connection binding pin is in binding connection with the panel binding pin.

4. A display module according to claim 3, wherein the first connection bonding pin and the panel bonding pin are dummy bonding pins.

5. The display module of claim 2, wherein a corner portion formed by the connection of the first portion and the connection portion is provided with a chamfer, and a corner portion formed by the connection of the second portion and the connection portion is provided with a chamfer.

6. The display module of claim 2, wherein the second flip-chip film is provided with differential signal traces.

7. The display module of claim 1, wherein the display panel is provided with connection traces, and the second flip-chip film comprises:

The first part is connected between one of the two adjacent rigid circuit boards and the display panel and is bound to one end of the connecting wire;

And the second part is connected between the other of the two adjacent rigid circuit boards and the display panel and is bound to the other end of the connecting wire.

8. The display module of claim 7, wherein the first portion and the adjacent first flip-chip film are configured as an integral structure to form a comprehensive flip-chip film, and/or wherein the second portion and the adjacent first flip-chip film are configured as an integral structure to form a comprehensive flip-chip film.

9. The display module of claim 8, wherein the end of the integrated flip-chip film connected to the display panel is a first end, the end of the integrated flip-chip film connected to the rigid circuit board is a second end, the width of the first end along a first direction is smaller than the width of the second end along the first direction, the first direction intersects with a second direction, and the second direction is the connection direction of the display panel, the first flip-chip film, and the rigid circuit board.

10. The display module of claim 9, wherein a plurality of first binding pins are arranged at the first end portion, a plurality of second binding pins are arranged at the second end portion, a plurality of third binding pins are arranged on the display panel and are in binding connection with the first binding pins, the pitch and the width of the third binding pins are correspondingly the same as those of the first binding pins, a plurality of fourth binding pins are arranged on the rigid circuit board and are in binding connection with the second binding pins, the pitch and the width of the fourth binding pins are correspondingly the same as those of the second binding pins, the pitch of the first binding pins is smaller than that of the second binding pins, and the width of the first binding pins is smaller than that of the second binding pins.

11. The display module of claim 8, wherein the connection trace comprises a first differential signal trace.

12. The display module of claim 11, wherein at least two first flip-chip films are connected between the same rigid circuit board and the display panel, the first flip-chip film closest to the adjacent rigid circuit board is a composite flip-chip film, one of the composite flip-chip films is integrally formed with the first portion of the second flip-chip film, and the other of the composite flip-chip films is integrally formed with the second portion of the second flip-chip film.

13. The display module of claim 12, wherein the display module further comprises:

The central control board is electrically connected with the two adjacent rigid circuit boards, the second flip-chip film is not connected between the two adjacent rigid circuit boards connected with the central control board, or the central control board is electrically connected with one rigid circuit board.

14. The display module of claim 13, wherein a first rigid circuit board is adjacent to the central control board and a second rigid circuit board is adjacent to the central control board, the first portion is connected between the first rigid circuit board and the display panel, and the second portion is connected between the second rigid circuit board and the display panel;

A second differential signal wire is arranged on the first part, a third differential signal wire is arranged on the second part, and the second differential signal wire and the third differential signal wire are connected to two opposite ends of the first differential signal wire;

A fourth differential signal wire is arranged on the first rigid circuit board, and one end of the fourth differential signal wire is connected with the central control board;

a fifth differential signal wire is arranged on the second rigid circuit board, one end of the fifth differential signal wire is connected with the third differential signal wire, and the other end of the fifth differential signal wire is connected with the first flip-chip film connected with the second rigid circuit board.

15. The display module of claim 6 or 11, wherein the display module further comprises:

At least two connectors are arranged on at least two rigid circuit boards in a one-to-one correspondence manner;

and the flexible circuit board is connected between two adjacent connectors.

16. The display module of claim 15, wherein the flexible circuit board does not extend beyond the rigid circuit board in a second direction, the second direction being a connection direction of the display panel, the first flip chip film, and the rigid circuit board.

17. The display module assembly of any one of claims 1-14, wherein,

And a welding-resistant film is arranged on the first flip-chip film and the second flip-chip film.

18. A display device, comprising:

A display module according to any one of claims 1 to 17.