CN223259613U - Radiation detector module, radiation detector and imaging device - Google Patents

Abstract

The embodiment of the application provides a radiation detector module, a radiation detector and imaging equipment. The radiation detector module includes a radiation detector element that receives radiation emitted by a radiation source and converts the radiation into an electrical signal, a circuit substrate having the radiation detector element mounted on a first side of the circuit substrate, and a processing circuit chip disposed on a second side of the substrate and in communication with the radiation detector element. In the radiation detector module, the radiation detector element and the processing circuit chip are respectively arranged on different sides of the circuit substrate, so that the packaging density of the radiation detector module is improved, the channel number of the radiation detector module is further improved, the number of the radiation detector modules in the radiation detector is reduced, and the interconnection complexity between the radiation detector modules and the total cost of the radiation detector are reduced.

Description

Radiation detector module, radiation detector and imaging device

Technical Field

The embodiment of the application relates to the technical field of imaging equipment, in particular to a radiation detector module, a radiation detector and imaging equipment.

Background

Imaging devices are used to scan an examination object (e.g., patient, workpiece) in a non-invasive or non-invasive manner to acquire an internal structural image of an anatomical tissue or region of interest of the examination object to aid in diagnosis.

Imaging devices typically include a circular scan aperture for scanning an examination object in and out, and include a detector subsystem mounted along the entire circumference or partial arc of the circular aperture, the detector subsystem including a plurality of detector modules mounted on a gantry. By way of example, a computed tomography (i.e., CT, computed Tomography) apparatus is commonly used as a medical imaging apparatus for scanning a patient to acquire tomographic images of a region of interest of the patient to assist a doctor in diagnosis.

The CT apparatus includes a plurality of detector modules that receive X-rays from the X-ray tube and pass through the patient, the form and number of each detector module being dependent on clinical requirements and the design of the CT system, and communication connections being established between each detector module. Each detector module of a CT apparatus generally includes a scintillator for receiving X-rays passing through a patient and generating light, and a photoelectric conversion device (e.g., a photodiode) for converting the light generated by the scintillator into an electrical signal, which are disposed in order along a radiation transmission direction. Each detector module also includes a collimator for collimating X-rays that have passed through the patient to a particular direction to avoid or reduce interference between pixels of the scintillator. Each detector module further includes a signal processing circuit for processing the electrical signals generated by the photoelectric conversion device, and a frame for supporting the collimator, the scintillator, the photoelectric conversion device, the circuit board, and the heat sink device.

The CT apparatus also includes a computer subsystem that reconstructs based on the processed electrical signals to generate medical tomographic images for aiding diagnosis.

It should be noted that the foregoing description of the background art is only for the purpose of providing a clear and complete description of the technical solution of the present application and is presented for the convenience of understanding by those skilled in the art.

Disclosure of utility model

The inventors have found that the inclusion of a large number of small detector modules in a conventional radiation detector (e.g., a CT detector) results in a low integration of the detector modules, resulting in a large number of interconnections between the detector modules, requiring a long time investment in alignment and integration of the detector modules, and a high overall cost of the detector.

In view of at least one of the above technical problems, or other similar problems, embodiments of the present application provide a radiation detector module, a radiation detector, and an imaging apparatus. In the radiation detector module, the radiation detector element and the processing circuit chip are respectively arranged on different sides of the circuit substrate, so that the packaging density of the radiation detector module is improved, the channel number of the radiation detector module is further improved, the number of the radiation detector modules in the radiation detector is reduced, and the interconnection complexity between the radiation detector modules and the total cost of the radiation detector are reduced.

According to an aspect of an embodiment of the present application, there is provided a radiation detector module including:

A radiation detector element that receives radiation emitted by the radiation source and converts the radiation into an electrical signal;

A circuit substrate having the radiation detector element mounted on a first side thereof, and

A processing circuit chip is disposed on the second side of the substrate and in communication with the radiation detector element.

In the radiation detector module, the radiation detector element and the processing circuit chip are respectively arranged on different sides of the circuit substrate, so that the packaging density of the radiation detector module is improved, the channel number of the radiation detector module is further improved, and the number of the radiation detector modules in the radiation detector is reduced.

In some embodiments, one or more of the processing circuit chips are disposed within an area of the circuit substrate covered by each of the radiation detector elements.

In some embodiments, each of the radiation detector elements includes 16 radiation transmission channels disposed in a first direction.

In some embodiments, the radiation detector module includes an even number of the radiation detector elements disposed in a first direction.

In some embodiments, the radiation detector element is electrically connected to the processing circuit chip by a conductive path through the circuit substrate.

In some embodiments, the radiation detector element includes a scintillator that receives radiation and generates light, and a photoelectric conversion element that converts the light generated by the scintillator into an electrical signal, the photoelectric conversion element including a backlight photodiode (backlit photodiode).

In some embodiments, the radiation detector module has a planar configuration (FLAT PANEL form factor).

In some embodiments, the radiation detector module further comprises:

a radiation shielding member disposed at least one of:

An interior of the circuit substrate;

The processing circuit chip is arranged inside;

The processing circuit chip is arranged between the processing circuit chip and the circuit substrate.

In some embodiments, the radiation shielding component is disposed between the processing circuit chip and the circuit substrate:

The lead terminal of the processing circuit chip is electrically connected with the circuit substrate through a lead wire, or

The shielding member has a plurality of through holes through which the processing circuit chip is electrically connected to the circuit substrate.

In some embodiments, the processing circuit chip has radiation-resistant circuitry therein.

In some embodiments, the radiation detector module further comprises:

and the data collection circuit board is electrically connected with the circuit substrate through a wire and receives the data processed by the processing circuit chip.

In some embodiments, the wires are connected to an edge of the circuit substrate.

In some embodiments, the radiation detector module further comprises:

And a heat dissipation member disposed at least partially between the processing circuit chip and the data collection circuit board and thermally coupled to both the processing circuit chip and the data collection circuit board.

In some embodiments, the radiation detector module further comprises:

A collimator assembly disposed on a surface of the radiation detector element, the collimator assembly collimating radiation emitted by the radiation source toward the radiation detector element.

In some embodiments, the material of the circuit substrate comprises at least one of the following materials:

Flame retardant class 4 (FR 4) materials, taste element laminated film (ABF), bismaleimide Triazine (BT).

According to a further aspect of embodiments of the present application, there is also provided a radiation detector comprising:

A rail and a radiation detector module according to any one of the above embodiments supported on the rail.

In some embodiments, in the radiation detector, more than two of the radiation detector modules are arranged along a first direction in which the guide rail extends, wherein the number of the radiation detector modules is 3 to 15.

According to another aspect of embodiments of the present application, there is provided an imaging apparatus having the radiation detector of the above embodiments and an image reconstruction device that performs image reconstruction to generate tomographic imaging of an inspection object from electric signals generated by radiation detector elements in a radiation detector module of the radiation detector.

Specific implementations of embodiments of the application are disclosed in detail below with reference to the following description and drawings, indicating the manner in which the principles of embodiments of the application may be employed. It should be understood that the embodiments of the application are not limited in scope thereby. The embodiments of the application include many variations, modifications and equivalents within the spirit and scope of the appended claims.

Drawings

The accompanying drawings, which are included to provide a further understanding of embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is evident that the drawings in the following description are only examples of the application and that other embodiments can be obtained from these drawings by a person skilled in the art without inventive effort. In the drawings:

FIG. 1 is a schematic diagram of a CT apparatus according to an embodiment of the present application;

FIG. 2 is a schematic diagram of a CT imaging system in accordance with an embodiment of the present application;

FIG. 3 is a schematic view of a cross section of the radiation detector module viewed along the Z-direction;

FIG. 4 is a schematic illustration of the distribution of radiation detector elements in a radiation detector module;

FIG. 5 is a schematic diagram of the distribution of processing circuit chips in a radiation detector module;

FIG. 6 is another schematic view of a cross-section of the radiation detector module viewed in the Z-direction;

FIG. 7 is a further schematic view of a cross-section of the radiation detector module, viewed in the Z-direction;

FIG. 8 is a further schematic view of a cross-section of the radiation detector module viewed in the Z-direction;

FIG. 9 is a schematic perspective view of a radiation detector module according to an embodiment of the application;

FIG. 10 is a schematic perspective view of a radiation detector module according to an embodiment of the application;

FIG. 11 is another schematic perspective view of a radiation detector module according to an embodiment of the application;

FIG. 12 is a schematic perspective view of a radiation detector according to an embodiment of the application;

fig. 13 is a schematic diagram of a composition of an image forming apparatus.

Detailed Description

The foregoing and other features of embodiments of the application will be apparent from the following description, taken in conjunction with the accompanying drawings. In the specification and drawings, there have been specifically disclosed specific embodiments of the application that are indicative of some of the ways in which the principles of the embodiments of the application may be employed, it being understood that the application is not limited to the specific embodiments described, but, on the contrary, the embodiments of the application include all modifications, variations and equivalents falling within the scope of the appended claims.

In the embodiments of the present application, the terms "first," "second," and the like are used to distinguish between different elements from each other by name, but do not indicate spatial arrangement or time sequence of the elements, and the elements should not be limited by the terms. The term "and/or" includes any and all combinations of one or more of the associated listed terms. The terms "comprises," "comprising," "including," "having," and the like, are intended to reference the presence of stated features, elements, components, or groups of components, but do not preclude the presence or addition of one or more other features, elements, components, or groups of components.

In embodiments of the present application, the singular forms "a," an, "and" the "include plural referents and should be construed broadly to mean" one "or" one type "and not limited to" one "or" another; furthermore, the term "comprising" is to be interpreted as including both the singular and the plural, unless the context clearly dictates otherwise. Furthermore, the term "according to" should be understood as "based at least in part on" the term "based on" should be understood as "based at least in part on" the term "unless the context clearly indicates otherwise.

Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments in combination with or instead of the features of the other embodiments. The term "comprises/comprising" when used herein refers to the presence of a feature, integer, step or component, but does not exclude the presence or addition of one or more other features, integers, steps or components.

In each embodiment of the present application, "above" and "below" include the present numbers. For example, two or more include two and more than two, and two or less include two and less than two.

The medical imaging devices described in the present application may be adapted for use in a variety of medical imaging modalities including, but not limited to, CT (computed tomography) imaging devices, PET (positron emission tomography) -CT, or any other suitable medical imaging device.

The system for obtaining medical image data may comprise the medical imaging device, a separate computer device connected to the medical imaging device, and a computer device connected to the cloud end of the internet, wherein the computer device is connected to the medical imaging device or a memory for storing medical images through the internet. The imaging method can be implemented independently or jointly by the medical imaging device, the computer device connected to the medical imaging device, and the computer device connected to the internet cloud. For example, the system for obtaining medical image data may be a CT imaging system or the like.

By way of example, embodiments of the present application are described below in connection with an X-ray Computed Tomography (CT) imaging apparatus. Those skilled in the art will appreciate that embodiments of the present application may also be applicable to other medical imaging devices.

Fig. 1 is a schematic diagram of a CT apparatus according to an embodiment of the present application, schematically illustrating a case of a CT apparatus 100. As shown in fig. 1, a CT apparatus 100 includes a scanner gantry 101 and a patient table 102, the scanner gantry 101 has an X-ray source 103, and the X-ray source 103 projects a beam of X-rays toward a detector assembly or collimator 104 on an opposite side of the scanner gantry 101. The subject 105 may lie on the patient table 102 and move into the gantry opening 106 with the patient table 102. Medical image data of the subject 105 may be obtained by scanning with the X-ray source 103.

Fig. 2 is a schematic diagram of a CT imaging system according to an embodiment of the present application, schematically illustrating a block diagram of a CT imaging system 200. As shown in fig. 2, the detector assembly 104 includes a plurality of detector units 104a and a data acquisition system (DAS, data Acquisition System) 104b. The plurality of detector units 104a sense the projected X-rays that pass through the detection object 105.

The DAS104b converts the collected information into projection data for subsequent processing based on the sensing by the detector unit 104 a. During a scan in which X-ray projection data is acquired, the scanner gantry 101 and the components mounted thereon rotate about a center of rotation 101 c.

Rotation of the scanner gantry 101 and the operation of the X-ray source 103 are controlled by a control mechanism 203 of the CT imaging system 200. The control mechanism 203 includes an X-ray controller 203a that provides power and timing signals to the X-ray source 103, and a scan gantry motor controller 203b that controls the rotational speed and position of the scan gantry 101. An image reconstruction device 204 receives projection data from DAS104b and performs image reconstruction. The reconstructed image is transmitted as an input to a computer 205, and the computer 205 stores the image in a mass storage device 206.

The computer 205 also receives commands and scanning parameters from an operator via a console 207. The console 207 has some form of operator interface such as a keyboard, mouse, voice activated controller, or any other suitable input device. An associated display 208 allows an operator to view the reconstructed image and other data from the computer 205. The operator supplied commands and parameters are used by computer 205 to provide control signals and information to DAS104b, X-ray controller 203a, and gantry motor controller 203 b. In addition, the computer 205 operates the patient table motor controller 209 to control the patient table 102 to position the test object 105 and the scanner gantry 101. In particular, the patient table 102 moves the test object 105 in whole or in part through the scan gantry opening 106 of fig. 1.

The apparatus and system for acquiring medical image data (or may also be referred to as medical image or medical image data) of the embodiment of the present application are schematically described above, but the present application is not limited thereto. The medical imaging device may be a CT device, a PET-CT or any other suitable imaging device. The storage device may be located within the medical imaging device, within a server external to the medical imaging device, within a separate medical image storage system (e.g., PACS, picture ARCHIVING AND Communication System), and/or within a remote cloud storage system.

Furthermore, the medical imaging workstation may be located locally to the medical imaging device, i.e. the medical imaging workstation is located adjacent to the medical imaging device, both of which may be co-located in the scanning room, the imaging department or in the same hospital. While the medical image cloud platform analysis system may be located remotely from the medical imaging device, for example, disposed at a cloud end in communication with the medical imaging device.

By way of example, after an imaging scan is completed by a medical institution using a medical imaging device, the scanned data is stored in a memory device, and the scanned data may be read directly by a medical imaging workstation and image processed by its processor. As another example, the medical image cloud platform analysis system may read medical images within a storage device via remote communication to provide "Software as a service" (SaaS, software AS A SERVICE). The SaaS may exist between hospitals, between hospitals and image centers, or between hospitals and third-party online diagnosis and treatment service providers.

Having schematically illustrated medical image scanning, embodiments of the present application are described in detail below with reference to the accompanying drawings. In the embodiments described below, the description will be given taking an example in which the imaging apparatus is a CT apparatus, and the description applies equally to other medical imaging apparatuses.

In embodiments of the present application, the X-direction is, for example, the direction in which each point of the above-mentioned arc points to the X-ray source 103 shown in fig. 1, i.e., the transverse or left-right direction of the gantry 101 or the patient table 102 shown in fig. 1, the Y-direction is, for example, the tangential direction of the arc centered on the X-ray source 103 shown in fig. 1, which may, for example, represent the trajectory of an extension of the rail 1201 described later, the Y-direction is, for example, the up-down direction of the gantry 101 or the patient table 102 shown in fig. 1, and the Z-direction is, for example, the direction in which the patient table 102 moves in or out relative to the gantry opening 106 shown in fig. 1, i.e., the front-back direction of the gantry 101 and the gantry opening 106 shown in fig. 1, which may also be referred to as the first direction.

Fig. 3 is a schematic view of a cross section of the radiation detector module viewed along the Z-direction. As shown in fig. 3, the radiation detector module 300 comprises a radiation detector element 301, a processing circuit chip 302 and a circuit substrate 303. The radiation detector module 300 may have a flat plate-like configuration (FLAT PANEL form factor). The planar configuration of the radiation detector module means that the radiation receiving plane of the radiation detector module, which receives radiation or faces the radiation source, has a dimension which is substantially greater or several times the dimension of the radiation detector module parallel to the radiation propagation path, for example the length or width of a radiation detector module whose radiation receiving plane is rectangular is substantially greater than its thickness.

The radiation detector element 301 receives radiation emitted by a radiation source and converts the radiation into electrical signals.

In some examples, the radiation detector element 301 includes a scintillator 3011 and a photoelectric conversion element 3012, and the scintillator 3011 and the photoelectric conversion element 3012 may be arranged correspondingly in the X-direction or the radiation direction of the X-rays, e.g., the scintillator 3011 is closer to the radiation source than the photoelectric conversion element 3012. The scintillator 3011 receives radiation emitted by an X-ray source and generates light, such as visible light. The photoelectric conversion element 3012 receives light generated by the scintillator 3011, and converts the received light into an electrical signal. The photoelectric conversion element 3012 may be a photodiode (photo diode), for example, a backlight photodiode (backlit photodiode).

In other examples, the radiation detector element 301 may not have the scintillator 3011, and thus the radiation detector element 301 may directly receive radiation emitted by a radiation source and generate an electrical signal. The radiation detector element 301 may be a Photon Counting (Photon Counting) detector, a direct conversion (Direct Conversion) detector, or the like, among others.

In the present application, an electric signal generated by the radiation detector element 301 (for example, an electric signal generated by the photoelectric conversion element 3012) is transmitted to the processing circuit chip 302 through the circuit substrate 303, and the processing circuit chip 302 processes the received electric signal. For example, the electrical signal received by the processing circuit chip 302 is an analog signal, and the processing circuit chip 302 converts the analog signal into a digital signal, that is, performs analog-to-digital conversion.

As shown in fig. 3, a first side of the circuit substrate 303 (e.g., the side facing the radiation source in the X-direction) is mounted with the radiation detector element 301, and a second side of the circuit substrate 303 (e.g., the side facing away from the radiation source in the X-direction) is mounted with the processing circuit chip 302.

The application arranges the radiation detector element 301 and the processing circuit chip 302 on different sides of the circuit substrate 303, thereby improving the packaging density of the radiation detector module 300, further improving the channel number of the radiation detector module, and reducing the number of the radiation detector modules in the radiation detector and the cost of the radiation detector.

As shown in fig. 3, the radiation detector element 301 is electrically connected to the processing circuit chip 302 by a conductive via 3031 extending through the circuit substrate 303. For example, a via hole may be formed in the circuit substrate 303 by a technique such as a glass via hole (TGV) or a ceramic via hole (TCV), and a conductive material may be filled in the via hole, thereby forming the conductive via 3031. The conductive path 3031 penetrating the circuit substrate 303 can realize high-density interconnection between the photoelectric conversion element 3012 and the processing circuit chip 302, and the conductive path 3031 can shorten the length of an electrical connection path between the photoelectric conversion element 3012 and the processing circuit chip 302, so that interference of rays on electrical signals transmitted in the electrical connection path is reduced, thereby improving detection accuracy of the radiation detector module.

In at least one embodiment, the material of the circuit substrate 303 includes at least one of a flame retardant class 4 (FR 4) material, a flavored laminated film (ABF), bismaleimide Triazine (BT). Among them, flame retardant type 4 (FR 4) has lower cost, and the laminated film of monosodium glutamate (ABF) and Bismaleimide Triazine (BT) have better thermal expansion coefficients, enabling to obtain smaller warpage and higher interconnection density. In the present application, the circuit board 303 is made of FR4, ABF, BT, or the like, and good flatness and interconnection reliability can be achieved. The present application is not limited to this, and other materials may be used for the circuit board 303.

Fig. 4 is a schematic view of the distribution of radiation detector elements in a radiation detector module. As shown in fig. 4, a plurality of radiation detector elements 301 are mounted on a first side of a circuit substrate 303, and the plurality of radiation detector elements 301 may be arranged in an array. The radiation detector module 300 includes a plurality of radiation detector elements 301 arranged in each column in a first direction (i.e., the Z-direction), each radiation detector element 301 including 16 or other even rows of radiation detector cells (cells) or pixels. For example, in a first direction, the radiation detector module 300 may be provided with 1, 2, 3, 4, 5, 8 or 16 radiation detector elements 301 per column, and accordingly the radiation detector module 300 comprises 16, 32, 48, 64, 80, 128, 256 rows of radiation detector units, respectively.

Fig. 5 is a schematic diagram of the distribution of processing circuit chips in a radiation detector module. As shown in fig. 5, on the second side of the circuit substrate 303, one or more processing circuit chips 302 are provided in the area covered by each radiation detector element 301. For example, on the other side of the area of the circuit substrate 303 covered by each radiation detector element 301, 2 processing circuit chips 302 may be provided. The radiation detector element 301 may be electrically connected to a corresponding processing circuit chip 302 by conductive vias 3031 (shown in fig. 3) extending through the circuit substrate 303.

The processing circuit chip 302 is arranged in the area covered by the corresponding radiation detector element 301, so that the length of an electric connection path between the radiation detector element 301 and the processing circuit chip 302 can be shortened, interference of rays emitted by a radiation source on electric signals transmitted in the electric connection path is reduced, and the detection accuracy of the radiation detector module 300 is improved.

As shown in fig. 4 and 5, the circuit substrate 303 of the radiation detector module 300 has a planar shape with a larger area, and the circuit substrate 303 is provided with three columns of radiation detector elements 301 and corresponding three columns of processing circuit chips 302 in the Y direction, so that the radiation detector module 300 is provided with more radiation detector elements 301 and processing circuit chips 302 on one planar circuit substrate 303 with a larger area, thereby increasing the integration level of the radiation detector module 300 and correspondingly reducing the cost of the radiation detector module 300. In other embodiments, the circuit substrate 303 is provided with one, two or more columns of the radiation detector elements 301 and the corresponding column number processing circuit chips 302 in the Y direction, so that the radiation detector module 300 has higher flexibility in terms of manufacturing and cost.

As shown in fig. 3, in some embodiments, the radiation detector module 300 can also include a data collection circuit board 304. The data collection circuit board 304 is electrically connected to the circuit substrate 303 by a wire 305, and the wire 305 is connected to an edge of the circuit substrate 303. The signals (e.g., digital signals) processed by the processing circuit chip 302 are transmitted by the wires 305 to the data collection circuit board 304.

As shown in fig. 3, in some embodiments, the radiation detector module 300 can further include a heat sink member 308 disposed at least partially between the processing circuit chip 302 and the data collection circuit board 304 and thermally coupled (e.g., in contact) with both the processing circuit chip 302 and the data collection circuit board 304. Thus, the heat dissipation member 308 dissipates heat from the processing circuit chip 302 and the data collection circuit board 304, thereby improving reliability.

The heat dissipation member 308 may be made of a material having high thermal conductivity, for example, a metal material (e.g., aluminum or stainless steel, etc.).

As shown in fig. 3, in some embodiments, the radiation detector module 300 can further include a collimator assembly 307. The collimator assembly 307 may be arranged at a surface of the radiation detector element 301. The collimator assembly 307 may collimate radiation emitted by the radiation source towards the radiation detector element 301.

In some embodiments of the present application, radiation-resistant circuitry may be provided in the processing circuitry chip 302 and/or shielding components may be provided in the radiation detector module 300 to avoid radiation emitted by the radiation source from affecting the reliability and lifetime of the processing circuitry chip 302.

For example, the radiation-resistant circuit may be an analog-to-digital converter or the like having a radiation-resistant function.

For another example, the shielding member may be provided in at least one of the inside of the circuit substrate 303, the inside of the processing circuit chip 302, and between the processing circuit chip 302 and the circuit substrate 303. Thus, the shielding member can block rays (e.g., X-rays) directed to the processing circuit chip 302, thereby improving reliability and service life of the processing circuit chip 302.

Fig. 6 is another schematic view of a cross section of the radiation detector module, viewed in the Z-direction. As shown in fig. 6, the shielding member 601 of the radiation detector module 300 may be disposed inside the circuit substrate 303.

Fig. 7 is a further schematic view of a cross section of the radiation detector module, seen in the Z-direction. As shown in fig. 7, the shielding member 701 is provided inside the processing circuit chip 302.

Fig. 8 is a further schematic view of a cross section of the radiation detector module, seen in the Z-direction. As shown in fig. 8, a shielding member 801 is provided between the processing circuit chip 302 and the circuit substrate 303. For example, the lead terminals of the processing circuit chip 302 are electrically connected to the circuit board 303 via leads (not shown) to realize data transmission between the processing circuit chip 302 and the circuit board 303, or the shielding member 801 has a plurality of through holes (not shown) through which the processing circuit chip 302 is electrically connected to the circuit board 303 to realize data transmission between the processing circuit chip 302 and the circuit board 303.

Fig. 9 is a schematic perspective assembly view of a radiation detector module according to an embodiment of the application. As shown in fig. 9, the radiation detector module 300 includes a collimator assembly 307, a circuit substrate 303, a heat sink member 308, and a data collection circuit board 304.

A collimator assembly 307 is arranged at a surface of the radiation detector element 301 (not shown in fig. 9), the collimator assembly 307 being arranged to collimate radiation emitted by the radiation source towards the radiation detector element 301. In some examples, the radiation detector element 301 includes a scintillator 3011 that receives radiation, and a photoelectric conversion element 3012 that converts light generated by the scintillator 3011 after being irradiated with the radiation into an electrical signal, wherein radiation (e.g., X-rays) emitted by a radiation source is collimated by the collimator assembly 307 and irradiated to the scintillator, and light generated by the scintillator after being irradiated with the radiation is converted into the electrical signal by the photoelectric conversion element, and the electrical signal generated by the photoelectric conversion element is used to perform tomographic imaging of the object. Furthermore, as previously described, in some embodiments the radiation detector element 301 may not include a scintillator 3011, whereby radiation (e.g., X-rays) emitted by the radiation source is collimated by the collimator assembly 307 and then directed to the photon counting or direct conversion radiation detector element 301, where the radiation detector element 301 generates an electrical signal.

The heat sink 308 is disposed at least partially between the processing circuit chip 302 and the data collection circuit board 304 and is thermally coupled to both the processing circuit chip 302 and the data collection circuit board 304. The heat dissipation member 308 may be a frame structure of a metal material or a large-area flat plate-like structure having a contact portion 3081 located in the middle and fin portions 3082 located on both sides of the contact portion 3081.

Fig. 9 furthermore shows a housing part 901 (not shown in fig. 3) of the radiation detector module 300. A housing part 901 is mounted to the heat sink 308 and encloses the data collection circuit board 304, the housing part 901 being made of a metallic material to shield electromagnetic radiation and thereby improve performance of the data collection circuit board 304, such as signal to noise ratio. A heat sink 3041 is also mounted on the data collection circuit board 304 shown in fig. 9 for thermal management, and the housing part 901 is provided with an opening 3042 corresponding to the outline of the heat sink 3041, the heat sink 3041 extending outwardly from the opening 3042. In some embodiments, the housing component 901 is also thermally coupled to the data collection circuit board 304 to increase the heat dissipation area of the data collection circuit board 304. The housing part 901 may be further thermally coupled with a heat sink 3041, whereby the housing part 901 is thermally coupled with the heat sink 308, the data collection circuit board 304 and its heat sink 3041 together, thereby improving the thermal management of the radiation detector module 300.

Fig. 10 is a schematic perspective view of a radiation detector module according to an embodiment of the application, showing a schematic perspective view of the radiation detector module 300 from the radiation entrance face of the collimator assembly 307. Fig. 11 is another perspective view of a radiation detector module according to an embodiment of the application, showing the view with the collimator assembly 307 of fig. 10 removed.

As shown in fig. 10 and 11, the collimator assembly 307 is mounted on the circuit substrate 303 along the X direction, the radiation detector element 301 is mounted on the side of the circuit substrate 303 facing the X direction, the circuit substrate 303 is disposed on the side of the heat dissipating member 308 facing the X direction, and the data collecting circuit board 304 is disposed on the side of the heat dissipating member 308 facing the X direction.

The embodiment of the application also provides a radiation detector.

Fig. 12 is a schematic perspective view of a radiation detector according to an embodiment of the application. As shown in fig. 12, the radiation detector 400 comprises the radiation detector module 300 of fig. 3 and a guide rail 1201. Wherein the radiation detector modules 300 are arranged along the Y-direction along which the rail 1201 extends, the number of radiation detector modules 300 is 3 to 15, e.g. the radiation detector 400 comprises 9 radiation detector modules 300, the scanning field of view (FOV) of the radiation detector 400 is 50 centimeters (cm), the radiation detector 400 comprises 11 radiation detector modules 300, and the scanning field of view (FOV) of the radiation detector 400 is 60 centimeters (cm).

In the radiation detector 400 of the present application, the radiation detector modules 300 may have a larger area, thereby enabling a reduction in the number of radiation detector modules 300, a reduction in the complexity of interconnections between the radiation detector modules, and a reduction in the cost of the radiation detector 400, while ensuring that the radiation detector 600 achieves a predetermined scan field of view.

The embodiment of the application also provides an imaging device, such as a medical imaging device.

Fig. 13 is a schematic diagram of a composition of an image forming apparatus. As shown in fig. 13, the imaging apparatus 500 includes the radiation detector 400 shown in fig. 12 and an image reconstruction device 1301. Wherein the image reconstruction means 1301 performs tomographic imaging of the object based on the electrical signals generated by the photo-conversion elements in the radiation detector module 300 (as shown in fig. 12) of the radiation detector 400.

In some examples, image reconstruction device 1301 may perform image reconstruction using data collected by data collection circuit board 304 of fig. 3, for example. For a detailed description of the image reconstruction apparatus 1301, reference may be made to the related art.

The imaging device 500 of the present application is, for example, a CT (computed tomography) imaging device, a PET-CT or any other suitable imaging device.

The above embodiments have been described only by way of example of the embodiments of the present application, but the present application is not limited thereto, and appropriate modifications may be made on the basis of the above embodiments. For example, each of the above embodiments may be used alone, or one or more of the above embodiments may be combined.

While the application has been described in connection with specific embodiments, it will be apparent to those skilled in the art that the description is intended to be illustrative and not limiting in scope. Various modifications and alterations of this application will occur to those skilled in the art in light of the principles of this application, and such modifications and alterations are intended to be within the scope of this application.

Claims (18)

1. A radiation detector module, the radiation detector module comprising:

A radiation detector element that receives radiation emitted by the radiation source and converts the radiation into an electrical signal;

A circuit substrate having the radiation detector element mounted on a first side thereof, and

A processing circuit chip is disposed on the second side of the substrate and in communication with the radiation detector element.

2. The radiation detector module defined in claim 1, wherein the radiation detector module comprises,

One or more of the processing circuit chips are disposed within an area of the circuit substrate covered by each of the radiation detector elements.

3. The radiation detector module defined in claim 2, wherein each of the radiation detector elements comprises 16 radiation transmission channels disposed in a first direction.

4. A radiation detector module according to claim 3, characterized in that the radiation detector module comprises an even number of the radiation detector elements arranged in the first direction.

5. The radiation detector module defined in claim 2, wherein the radiation detector module comprises,

The radiation detector element is electrically connected to the processing circuit chip by a conductive path through the circuit substrate.

6. The radiation detector module defined in claim 1, wherein the radiation detector element comprises a scintillator that converts received radiation and generates light, and a photoelectric conversion element that converts light generated by the scintillator into an electrical signal, the photoelectric conversion element comprising a backlight photodiode.

7. The radiation detector module defined in claim 1, wherein the radiation detector module has a planar configuration.

8. The radiation detector module defined in claim 1, wherein the radiation detector module comprises,

The radiation detector module further comprises:

a radiation shielding member disposed at least one of:

An interior of the circuit substrate;

The processing circuit chip is arranged inside;

The processing circuit chip is arranged between the processing circuit chip and the circuit substrate.

9. The radiation detector module defined in claim 8, wherein the radiation detector module comprises,

The radiation shielding component is arranged between the processing circuit chip and the circuit substrate:

The lead terminal of the processing circuit chip is electrically connected with the circuit substrate through a lead wire, or

The shielding member has a plurality of through holes through which the processing circuit chip is electrically connected to the circuit substrate.

10. The radiation detector module defined in claim 1, wherein the processing circuit chip has radiation-resistant circuitry therein.

11. The radiation detector module defined in claim 1, wherein the radiation detector module comprises,

The radiation detector module further comprises:

and the data collection circuit board is electrically connected with the circuit substrate through a wire and receives the data processed by the processing circuit chip.

12. The radiation detector module defined in claim 11, wherein the radiation detector module comprises,

The wire is connected to an edge of the circuit substrate.

13. The radiation detector module defined in claim 11, wherein the radiation detector module further comprises:

And a heat dissipation member disposed at least partially between the processing circuit chip and the data collection circuit board and thermally coupled to both the processing circuit chip and the data collection circuit board.

14. The radiation detector module of claim 1, wherein the radiation detector module further comprises:

a collimator assembly disposed on a surface of the radiation detector element, the collimator assembly collimating radiation emitted by the radiation source toward the radiation detector element.

15. The radiation detector module defined in claim 1, wherein the radiation detector module comprises,

The material of the circuit substrate comprises at least one of the following materials:

Flame retardant class 4 (FR 4) materials, taste element laminated film (ABF), bismaleimide Triazine (BT).

16. A radiation detector, characterized in that the radiation detector comprises a guide rail and two or more radiation detector modules as claimed in any one of claims 1 to 15 supported on the guide rail.

17. The radiation detector according to claim 16, wherein,

In the radiation detector, two or more of the radiation detector modules are arranged along the direction in which the guide rail extends, wherein the number of the radiation detector modules is 3 to 15.

18. An imaging apparatus having a radiation detector as claimed in any one of claims 16 to 17 and image reconstruction means for performing image reconstruction from electrical signals generated by radiation detector elements in a radiation detector module of the radiation detector to generate tomographic imaging of an examination object.