CN223401390U - A memory chip testing device based on memory module - Google Patents
A memory chip testing device based on memory moduleInfo
- Publication number
- CN223401390U CN223401390U CN202422146505.0U CN202422146505U CN223401390U CN 223401390 U CN223401390 U CN 223401390U CN 202422146505 U CN202422146505 U CN 202422146505U CN 223401390 U CN223401390 U CN 223401390U
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- circuit board
- memory module
- memory
- test pin
- tray
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Abstract
The utility model discloses a memory chip testing device based on a memory module, which relates to the technical field of chip testing equipment, and comprises a memory module circuit board, a second circuit board 2, a third circuit board 3, a top testing needle 4 and a bottom testing needle 5, wherein one side of the second circuit board 2 is welded with the top of the memory module circuit board, the other side of the second circuit board is contacted with the bottom of the top testing needle 4, one side of the second circuit board 2 is welded with the bottom of the memory module, the other side of the second circuit board is contacted with the top of the bottom testing needle 5, the top of the top testing needle 4 is used for connecting a top memory chip, and the bottom of the bottom testing needle 5 is used for connecting a bottom memory chip. The utility model has the beneficial effect of ensuring the suitability among the memory chips of the memory module.
Description
Technical Field
The utility model relates to the technical field of chip testing equipment, in particular to a memory chip testing device based on a memory module.
Background
The memory module is an indispensable component of the computer, and the CPU can address the memory through the data bus. Initially, the memory used in a computer is a chip that is soldered to the motherboard of the computer, and once a certain memory chip is damaged, it must be soldered for replacement. The modularized strip memory is invented later, a plurality of memory chips (commonly called DRAM particles) are integrated on each strip, and memory slots are designed on a main board correspondingly, so that the memory module can be detachably loaded, and the maintenance and expansion of the memory become very convenient.
Memory module specifications, undergoing the SDRAM age and the DDR age, currently mainstream are DDR4 and DDR5. Currently 6400MHz has become the mainstream DDR5 frequency, the highest frequency breaks through 10000MHz, the frequency is higher and higher, and the high frequency requirement for testing the memory chip (DRAM particle) is higher and higher.
One memory module consists of 8 or 16 memory chips (DRAM particles), with 8 on one side and 8 on the other side. The memory modules of 16 memory chips (DRAM particles) must meet the high-frequency requirement, wherein one of the memory modules is insufficient in frequency, so that not only can the high-frequency large-capacity memory module be formed, but also 15 memory modules can be operated at high frequency, and the optimal value can not be represented. Therefore, the memory chips (DRAM particles) are tested for frequency, electrical performance, etc. and classified before forming the memory module, which is a key means for maximizing the value.
In the process of manufacturing the memory module, 8 memory chips (DRAM particles) are typically used for combination, and then the memory module including 16 memory chips is manufactured after screening and classification. In this process, a problem of matching degree between chips may occur, that is, the different chips may not have the same performance or parameters, which may affect the performance of the whole memory module.
Therefore, the utility model provides a memory chip testing device based on a memory module, which ensures the suitability among DRAM particles of the memory module by performing double-sided high-frequency test on the memory chip.
Disclosure of utility model
In order to overcome the defects of the prior art, the utility model provides a memory chip testing device based on a memory module, which ensures the suitability among DRAM particles of the memory module.
The technical scheme includes that the memory chip testing device based on the memory module is improved in that the memory chip testing device based on the memory module comprises a memory module circuit board, a second circuit board, a third circuit board, a top testing needle and a bottom testing needle, one side of the second circuit board is welded with the top of the memory module circuit board, the other side of the second circuit board is contacted with the bottom of the top testing needle, one side of the second circuit board is welded with the bottom of the memory module, the other side of the second circuit board is contacted with the top of the bottom testing needle, the top of the top testing needle is used for being connected with a top memory chip, and the bottom of the bottom testing needle is used for being connected with a bottom memory chip.
In the structure, the memory chip testing device based on the memory module further comprises a shell and a memory module circuit board fixing piece, wherein fixing piles are arranged in the shell and distributed at the top and bottom positions of two sides of the shell, and the memory module circuit board fixing piece is fixedly arranged between the fixing piles.
In the above structure, the memory chip testing device based on the memory module further comprises a first top testing needle fixing plate, a second top testing needle fixing plate, a first bottom testing needle fixing plate, a second bottom testing needle fixing plate, a limit screw, a first spring and a fixing bolt, wherein the first top testing needle fixing plate and the second top testing needle fixing plate and the first bottom testing needle fixing plate are fixedly connected through the first spring, the first top testing needle fixing plate is sleeved at the top of the top testing needle, the second top testing needle fixing plate is sleeved at the bottom of the top testing needle, the first bottom testing needle fixing plate is sleeved at the top of the bottom testing needle, the second bottom testing needle fixing plate is sleeved at the bottom of the bottom testing needle, the limit screw is clamped in the first spring, and the fixing bolt simultaneously penetrates through the second top testing needle fixing plate, the second circuit board, the memory module circuit board fixing piece, the third circuit board and the first bottom testing needle fixing plate.
In the structure, the memory chip testing device based on the memory module further comprises a top tray clamping piece, a bottom tray clamping piece, a top tray, a bottom tray and a second spring, wherein the top tray clamping piece is connected with the top of the memory module circuit board fixing piece and the bottom tray clamping piece is connected with the bottom of the memory module circuit board fixing piece through the second spring, the top tray clamping piece and the second spring connected with the top tray are arranged on fixing piles at the top position of the shell in a penetrating mode, the bottom tray clamping piece and the second spring connected with the bottom tray are arranged on fixing piles at the bottom position of the shell in a penetrating mode, the top tray is connected with the top tray clamping piece in a sliding mode and is used for installing a top memory chip, the bottom tray is connected with the bottom tray clamping piece in a sliding mode, and the bottom tray is used for installing a bottom memory chip.
In the structure, the memory chip testing device based on the memory module further comprises a pressing handle, a top pressing plate, a bottom pressing plate and a third spring, wherein the top pressing plate is connected with the top tray clamping piece and the bottom pressing plate is connected with the bottom tray clamping piece through the third spring, the top pressing plate and the third spring connected with the top pressing plate are arranged on a fixed pile at the top position of the shell in a penetrating mode, the bottom pressing plate and the third spring connected with the bottom pressing plate are arranged on the fixed pile at the bottom position of the shell in a penetrating mode, and the pressing handle is rotatably arranged on one side outside the shell and is in transmission connection with the top pressing plate and the bottom pressing plate.
In the above structure, the bottom of the housing is provided with a slot, and the slot and an edge position of one side of the memory module circuit board are located on the same straight line.
In the above structure, the reserved serial interfaces are arranged on the second circuit board and the third circuit board, and are positioned on one side of the second circuit board far away from the top of the memory module circuit board and one side of the third circuit board far away from the bottom of the memory module circuit board.
The dual-sided high-frequency test device has the beneficial effects that the second circuit board is welded at the top of the memory module circuit board, the third circuit board is welded at the bottom of the memory module circuit board, the third circuit board is connected between the second circuit board and the top memory chip through the top test pin, and the third circuit board and the bottom memory chip are connected through the bottom test pin, so that the dual-sided high-frequency test of the memory chips is realized at the same time, and the suitability among the memory chips of the memory module is ensured.
Drawings
FIG. 1 is a diagram showing the overall structure of a memory chip based on a memory module according to the present utility model;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
fig. 3 is a test connection diagram of a memory chip based on a memory module according to the present utility model.
Detailed Description
The utility model will be further described with reference to the drawings and examples.
The conception, specific structure, and technical effects produced by the present utility model will be clearly and completely described below with reference to the embodiments and the drawings to fully understand the objects, features, and effects of the present utility model. It is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments, and that other embodiments obtained by those skilled in the art without inventive effort are within the scope of the present utility model based on the embodiments of the present utility model. In addition, all the coupling/connection relationships referred to in the patent are not direct connection of the single-finger members, but rather, it means that a better coupling structure can be formed by adding or subtracting coupling aids depending on the specific implementation. The technical features in the utility model can be interactively combined on the premise of no contradiction and conflict.
Referring to fig. 1-3, the utility model discloses a memory chip testing device based on a memory module, which comprises a memory module circuit board 1, a second circuit board 2, a third circuit board 3, a top testing needle 4 and a bottom testing needle 5, wherein one side of the second circuit board 2 is welded with the top of the memory module circuit board 1, the other side of the second circuit board 2 is contacted with the bottom of the top testing needle 4, one side of the second circuit board 2 is welded with the bottom of the memory module, the other side of the second circuit board is contacted with the top of the bottom testing needle 5, the top of the top testing needle 4 is used for being connected with a top memory chip 19, and the bottom of the bottom testing needle 5 is used for being connected with a bottom memory chip 20.
It should be noted that in this embodiment, the memory module circuit board 1 includes circuit connections between the top memory chip 19 and the bottom memory chip 20 of the memory module as main components for testing performance of the memory chip, the top test pin 4 and the second circuit board 2 form a connection channel between the top memory chip 19 and the top of the memory module circuit board 1, the bottom test pin 5 and the third circuit board 3 form a connection channel between the bottom memory chip 20 and the bottom of the memory module circuit board 1, specifically, a power supply detection channel between the VPP pin of the memory module circuit board 1 and the VPP pin of the memory chip, between the VDD pin of the memory module circuit board 1 and the VDD pin of the memory chip, and between the VDDQ pin of the memory module circuit board 1 and the VDDQ pin of the memory chip are provided, specifically, the top surface and the bottom of the memory module circuit board 1 are soldered to the second circuit board 2 and the third circuit board 3 through solder balls, respectively, so that the memory chip (DRAM particles) is electrically drawn out, wherein the non-power supply IO circuit is directly connected, and the power supply circuit is disconnected and the power supply circuit is serially drawn out. The flash memory chips on the top surface and the bottom surface are communicated with the memory module circuit board 1 through the test pins, the second circuit board 2 and the third circuit board 3, and high-frequency ultra-short distance connection is realized, so that double-sided high-frequency test is carried out on the memory chips simultaneously, and the suitability among the memory chips of the memory module is ensured.
Referring to fig. 1, the memory chip testing device based on the memory module further includes a housing 6 and a memory module circuit board fixing member 7, wherein fixing piles 25 are disposed inside the housing 6, the fixing piles 25 are distributed at the top and bottom positions of two sides inside the housing 6, and the memory module circuit board fixing member 7 is fixedly mounted between the fixing piles 25.
It should be noted that, in this embodiment, the housing 6 is an external protection structure of the testing device, and provides physical protection and stability for the internal components, the fixing piles 25 are disposed at the top and bottom of two sides of the interior of the housing 6, and are used for fixing and supporting the memory module circuit board fixing members 7, which ensure that the fixing members are stable in position and prevent movement or vibration during the testing process, and the memory module circuit board fixing members 7 are mounted between the fixing piles 25, so as to ensure that the memory module circuit board 1 can be firmly fixed inside the testing device, so as to prevent the memory module from being shifted during the testing process, thereby maintaining the accuracy and consistency of the testing process.
Referring to fig. 1, the memory chip testing device based on the memory module further includes a first top test pin fixing plate 8, a second top test pin fixing plate 9, a first bottom test pin fixing plate 10, a second bottom test pin fixing plate 11, a limit screw 13, a first spring 12 and a fixing bolt 24, wherein the first top test pin fixing plate 8 and the second top test pin fixing plate 9 and the first bottom test pin fixing plate 10 and the second bottom test pin fixing plate 11 are fixedly connected through the first spring 12, the first top test pin fixing plate 8 is sleeved at the top of the top test pin 4, the second top test pin fixing plate 9 is sleeved at the bottom of the top test pin 4, the first bottom test pin fixing plate 10 is sleeved at the top of the bottom test pin 5, the second bottom test pin fixing plate 11 is sleeved at the bottom of the bottom test pin 5, the limit screw 13 is clamped in the first spring 12, and the fixing bolt 24 passes through the second top test pin fixing plate 9, the second bottom test pin fixing plate 2, the second circuit board 7, the third circuit module fixing plate 3 and the third circuit module fixing plate 10.
In this embodiment, the first top test needle fixing plate 8 and the second top test needle fixing plate 9 are respectively sleeved on the top and the bottom of the top test needle 4, so as to protect the two ends of the top test needle 4 during the test completion or the test stopping process; the first top test needle fixing plate 8 and the second top test needle fixing plate 9 are connected through a first spring 12, a certain elastic displacement is allowed, the end parts of the top test needle 4 can be exposed out of the first top test needle fixing plate 8 and the second top test needle 4 to be connected with the top memory chip 19 and the second circuit board 2 in the test process, the first bottom test needle fixing plate 10 and the second bottom test needle fixing plate 11 are sleeved on the top and the bottom of the bottom test needle 5 respectively and used for protecting the two ends of the bottom test needle 5 in the test process or stopping the test process, the first bottom test needle fixing plate 10 and the second bottom test needle fixing plate 11 are connected through the first spring 12, a certain elastic displacement is allowed, the end parts of the bottom test needle 5 can be exposed out of the first bottom test needle fixing plate 10 and the second bottom test needle 5 to be connected with the top memory chip 19 and the second circuit board 2 in the test process, the limit screw 13 is used for limiting the compression range of the spring, so that the test needle is controlled to move in the range, the second test needle fixing plate 3 and the second test needle fixing plate 2 are prevented from damaging the first circuit board 3, the second test needle fixing plate 3 and the circuit board 2, the third test needle fixing plate 3 and the circuit board 2 in the test process, the stability of the memory module circuit board 1 in the test device is ensured.
Referring to fig. 1 and 2, the memory chip testing device based on the memory module further includes a top tray clamping member 14, a bottom tray clamping member 15, a top tray 17, a bottom tray 18 and a second spring 16, wherein the top tray clamping member 14 is connected with the top of the memory module circuit board fixing member 7 and the bottom tray clamping member 15 is connected with the bottom of the memory module circuit board fixing member 7 through the second spring 16, the top tray clamping member 14 and the second spring 16 connected with the top tray 17 are respectively arranged on a fixing pile 25 at the top position of the casing 6, the bottom tray clamping member 15 and the second spring 16 connected with the bottom tray 18 are respectively arranged on a fixing pile 25 at the bottom position of the casing 6, the top tray 17 is slidably connected with the top tray clamping member 14, the top tray 17 is used for mounting a top memory chip 19, the bottom tray 18 is slidably connected with the bottom tray clamping member 15, and the bottom tray 18 is used for mounting a bottom memory chip.
It should be noted that in this embodiment, the designs of the top tray clamping member 14 and the bottom tray clamping member 15 are respectively used for supporting the top tray 17 and the bottom tray 18, the top tray 17 is used for installing the top memory chip 19, the bottom tray 18 is used for installing the bottom memory chip 20, the solder ball of the top memory chip 19 is close to the top of the top test needle 4, the solder ball of the bottom memory chip 20 is close to the bottom of the bottom test needle 5, and the second spring 16 provides elastic connection between the top tray clamping member 14 and the top of the memory module circuit board fixing member 7 and between the bottom tray clamping member 15 and the bottom of the memory module circuit board fixing member 7, so that the top tray 17 and the bottom tray 18 can move in a direction close to the memory module circuit board 1 to ensure normal electrical connection between the top memory chip 19 and the top of the top test needle 4 and between the bottom memory chip 20 and the bottom of the bottom test needle 5, thereby ensuring stability of the test.
Referring to fig. 1 and 2, the memory chip testing device based on the memory module further includes a pressing handle 26, a top pressing plate 21, a bottom pressing plate 22 and a third spring 23, wherein the top pressing plate 21 is connected with the top tray clamping member 14 and the bottom pressing plate 22 is connected with the bottom tray clamping member 15 through the third spring 23, the top pressing plate 21 and the third spring 23 connected with the top pressing plate 21 are all arranged on a fixing pile 25 at the top position of the housing 6 in a penetrating manner, the bottom pressing plate 22 and the third spring 23 connected with the bottom pressing plate 22 are all arranged on the fixing pile 25 at the bottom position of the housing 6 in a penetrating manner, and the pressing handle 26 is rotatably arranged on one side outside the housing 6 and is in transmission connection with the top pressing plate 21 and the bottom pressing plate 22.
It should be noted that, in this embodiment, the pressing handle 26 is in transmission connection with the top pressing plate 21 and the bottom pressing plate 22, so that the pressing handle 26 can make the top pressing plate 21 and the bottom pressing plate 22 apply pressure through a transmission mechanism by rotating operation, and the third spring 23 is connected between the top pressing plate 21 and the top tray clamping member 14 and between the bottom pressing plate 22 and the bottom tray clamping member 15 to provide an elastic force, so that the top pressing plate 21 can apply appropriate pressure to the top tray clamping member 14 and the bottom pressing plate 22 to the bottom tray clamping member 15 when needed, and ensure that the memory chip contacts with the testing device well, thereby further ensuring the stability of the test.
Referring to fig. 1 and 2, a slot is disposed at the bottom of the housing 6, and the slot and a side edge of the memory module circuit board 1 are located on the same straight line.
It should be noted that, in this embodiment, the memory module circuit board 1 is further connected to the computer motherboard 28 to ensure that the memory module can perform data transmission and function test correctly, and the design that the slot and one side edge of the memory module circuit board 1 are on the same line is to facilitate the insertion of the extension board 27 connected between the computer motherboard 28 and the memory module circuit board 1, so as to perform data transmission and function test on the memory module circuit board 1.
Referring to fig. 3, reserved serial interfaces 29 are disposed on the second circuit board 2 and the third circuit board 3, and the reserved serial interfaces 29 are located on one side of the second circuit board 2 far from the top of the memory module circuit board 1 and one side of the third circuit board 3 far from the bottom of the memory module circuit board 1.
It should be noted that, in this embodiment, the reserved serial interfaces 29 are provided on the second circuit board 2 and the third circuit board 3, so as to perform serial connection between the circuit boards, so as to extend functions, increase flexibility of connection, or achieve specific electrical connection requirements.
While the preferred embodiment of the present utility model has been described in detail, the present utility model is not limited to the embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model, and the equivalent modifications or substitutions are included in the scope of the present utility model as defined in the appended claims.
Claims (7)
1. The memory chip testing device based on the memory module is characterized by comprising a memory module circuit board, a second circuit board, a third circuit board, a top testing needle and a bottom testing needle, wherein one side of the second circuit board is welded with the top of the memory module circuit board, the other side of the second circuit board is contacted with the bottom of the top testing needle, one side of the second circuit board is welded with the bottom of the memory module, the other side of the second circuit board is contacted with the top of the bottom testing needle, the top of the top testing needle is used for being connected with a top memory chip, and the bottom of the bottom testing needle is used for being connected with a bottom memory chip.
2. The memory chip testing device based on the memory module according to claim 1, further comprising a housing and a memory module circuit board fixing member, wherein fixing piles are arranged in the housing and distributed at the top and bottom positions on two sides of the housing, and the memory module circuit board fixing member is fixedly arranged between the fixing piles.
3. The memory chip testing device based on the memory module according to claim 2, further comprising a first top test pin fixing plate, a second top test pin fixing plate, a first bottom test pin fixing plate, a second bottom test pin fixing plate, a limit screw, a first spring and a fixing bolt, wherein the first top test pin fixing plate and the second top test pin fixing plate and the first bottom test pin fixing plate and the second bottom test pin fixing plate are fixedly connected through the first spring, the first top test pin fixing plate is sleeved on the top of the top test pin, the second top test pin fixing plate is sleeved on the bottom of the top test pin, the first bottom test pin fixing plate is sleeved on the bottom of the bottom test pin, the limit screw is clamped in the first spring, and the fixing bolt simultaneously passes through the second top test pin fixing plate, the second circuit board, the memory module fixing piece, the third circuit board and the first circuit module fixing plate.
4. The memory chip testing device based on the memory module according to claim 3, further comprising a top tray clamping piece, a bottom tray clamping piece, a top tray, a bottom tray and a second spring, wherein the top tray clamping piece is connected with the top of the memory module circuit board fixing piece and the bottom of the memory module circuit board fixing piece through the second spring, the top tray clamping piece and the second spring connected with the top tray are arranged on fixing piles at the top position of the shell in a penetrating mode, the bottom tray clamping piece and the second spring connected with the bottom tray are arranged on fixing piles at the bottom position of the shell in a penetrating mode, the top tray is connected with the top tray clamping piece in a sliding mode, the top tray is used for installing a top memory chip, the bottom tray is connected with the bottom tray clamping piece in a sliding mode, and the bottom tray is used for installing a bottom memory chip.
5. The memory chip testing device based on the memory module of claim 4, further comprising a pressing handle, a top pressing plate, a bottom pressing plate and a third spring, wherein the top pressing plate is connected with the top tray clamping piece and the bottom pressing plate is connected with the bottom tray clamping piece through the third spring, the top pressing plate and the third spring connected with the top pressing plate are arranged on fixing piles at the top position of the shell in a penetrating mode, the bottom pressing plate and the third spring connected with the bottom pressing plate are arranged on fixing piles at the bottom position of the shell in a penetrating mode, and the pressing handle is rotatably arranged on one side outside the shell and is in transmission connection with the top pressing plate and the bottom pressing plate.
6. The memory chip testing device based on the memory module according to claim 2, wherein the bottom of the housing is provided with a slot, and the slot and a side edge position of the memory module circuit board are on the same straight line.
7. The memory chip testing device according to claim 1, wherein reserved serial interfaces are arranged on the second circuit board and the third circuit board, and the reserved serial interfaces are located on one side of the second circuit board far away from the top of the memory module circuit board and one side of the third circuit board far away from the bottom of the memory module circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422146505.0U CN223401390U (en) | 2024-09-02 | 2024-09-02 | A memory chip testing device based on memory module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422146505.0U CN223401390U (en) | 2024-09-02 | 2024-09-02 | A memory chip testing device based on memory module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223401390U true CN223401390U (en) | 2025-09-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202422146505.0U Active CN223401390U (en) | 2024-09-02 | 2024-09-02 | A memory chip testing device based on memory module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223401390U (en) |
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- 2024-09-02 CN CN202422146505.0U patent/CN223401390U/en active Active
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