CN2603522Y

CN2603522Y - Miniaturized Image Sensor Module

Info

Publication number: CN2603522Y
Application number: CNU032362390U
Authority: CN
Inventors: 萧永宏
Original assignee: Kingpak Technology Inc
Current assignee: Kingpak Technology Inc
Priority date: 2003-01-17
Filing date: 2003-01-17
Publication date: 2004-02-11
Anticipated expiration: 2013-01-17

Abstract

A miniaturized image sensor module. In order to provide an image sensor module with a light, thin, short and small structure, low cost and good assembly performance, the utility model is provided, which comprises a substrate, an image sensing chip with a photosensitive area, a light transmission layer, an injection molding structure and a lens cone; the substrate is provided with an upper surface and a lower surface for the light transmission layer to be arranged, and a through groove which penetrates from the upper surface to the lower surface and is used for exposing the photosensitive area of the image sensing chip, and the lower surface forms a plurality of circuits at the periphery of the through groove; the periphery of the photosensitive area of the image sensing chip is provided with a plurality of welding pads electrically connected with the lower surface of the substrate, and the photosensitive area is exposed out of the through groove of the substrate; the light-transmitting layer is arranged on the upper surface of the substrate and covers the hollow groove; the injection molding structure wraps the substrate and the image sensing chip and forms a flange layer with internal threads on the upper end of the light-transmitting layer; the central part of the lens barrel forms an accommodating chamber which is provided with a through hole and an aspheric lens from top to bottom.

Description

Miniaturization image sensor module

Technical field

The utility model belongs to the image sensor module, particularly a kind of miniaturization image sensor module.

Background technology

As shown in Figure 1, known image sensor module comprises microscope base 10, lens barrel 20 and image sensor 30.

Microscope base 10 is provided with upper surface 12, lower surface 14 and connects to the lower surface 14 and form the accommodation chamber 16 of internal thread 18 by upper surface 12.

Lens barrel 20 is provided with external screw thread 22 corresponding with microscope base 10 accommodation chambers 16 internal threads 18 and that be spirally connected, from top to bottom is provided with transparent area 24, aspherical lens 26 and infrared ray filter glass 28 in it.Lens barrel 20 is placed in the accommodation chamber 16 by the upper surface 12 of microscope base 10, and with internal thread 18 screw locks of microscope base 10.

Image sensor 30 is provided with first 32 and second 34, the first 32 and is provided with photic zone 36.

Image sensor 30 is to stick together the lower surface 14 of being fixed in microscope base 10 by photic zone 36, and by adjusting the degree of depth that lens barrel 20 and microscope base 10 screw togather, with the focal length of 36 of the aspherical lens 26 of control lens barrel 20 and image sensor 30 photic zones.

Only, the known image sensor module of this kind must provide the microscope base 10 that combines with lens barrel 20 separately, not only cause volume to dwindle, and cost is comparatively high; Moreover the photic zone 36 of image sensor 30 must be positioned in the accommodation chamber 16 of microscope base 10 with accurately sticking together, otherwise will cause the light signal of reception that the existing picture of skew is arranged; In addition, the thickness of its employed image sensor 30 can't dwindle, and makes whole module can't reach compact demand.

Summary of the invention

The purpose of this utility model provides that a kind of structure is compact, cost is low, the good miniaturization image sensor module of assembling performance.

The utility model comprises substrate, is provided with the image sensing wafer of photosensitive area, photic zone, ejection formation structure and lens barrel; Substrate is provided with for the upper surface of photic zone setting, lower surface and connects the saturating dead slot that exposes for the image sensing wafer photosensitive area to lower surface by upper surface, and lower surface forms a plurality of circuits in saturating dead slot periphery; Image sensing wafer photosensitive area periphery is provided with a plurality of weld pads that are electrically connected base lower surface, and its photosensitive area is exposed by the saturating dead slot of substrate; Photic zone places on the upper surface of base plate, and saturating dead slot is covered; The ejection formation structure envelopes substrate and image sensing wafer, and forms the flange layer that is provided with internal thread in the photic zone upper end; The lens barrel middle body forms the accommodation chamber that from top to bottom is formed with open-work and aspherical lens.

Wherein:

Form on a plurality of weld pads of image sensing wafer to cover crystal type and be electrically connected on projection on the base plate line.

Photic zone is a transparent glass.

Be provided with the infrared ray filter glass in the lens barrel accommodation chamber.

Because the utility model comprises substrate, is provided with image sensing wafer, photic zone, ejection formation structure and the lens barrel of photosensitive area; Substrate is provided with for the upper surface of photic zone setting, lower surface and connects the saturating dead slot that exposes for the image sensing wafer photosensitive area to lower surface by upper surface, and lower surface forms a plurality of circuits in saturating dead slot periphery; Image sensing wafer photosensitive area periphery is provided with a plurality of weld pads that are electrically connected base lower surface, and its photosensitive area is exposed by the saturating dead slot of substrate; Photic zone places on the upper surface of base plate, and saturating dead slot is covered; The ejection formation structure envelopes substrate and image sensing wafer, and forms the flange layer that is provided with internal thread in the photic zone upper end; The lens barrel middle body forms the accommodation chamber that from top to bottom is formed with open-work and aspherical lens.During making, at first provide substrate, and image sensing wafer is electrically connected on the lower surface of substrate, again photic zone is covered on the upper surface of substrate, to form the image sensor of new construction; Carry out the ejaculation type with industrial plastic cement again, and form the ejection formation structure that envelopes substrate and image sensing wafer and form the flange layer that is provided with internal thread, can with the lens barrel screw lock in flange layer, just finish assembling of the present utility model; Image sensing wafer can see through saturating dead slot and receive the light signal, can make the utility model miniaturization; Form flange layer and encapsulate image sensing wafer with injection molding method, comparatively convenient on making, more convenient in the assembling, can effectively reduce production costs.Not only structure is compact, and cost is low, the assembling performance is good, thereby reaches the purpose of this utility model.

Description of drawings

Fig. 1, be known image sensor modular structure schematic sectional view.

Fig. 2, be the utility model structural representation cutaway view.

Fig. 3, be the utility model manufacture method step 1 schematic diagram.

Fig. 4, be the utility model manufacture method step 2 schematic diagram.

Embodiment

As shown in Figure 2, the utility model comprises substrate 40, image sensing wafer 42, photic zone 44, ejection formation structure 46 and lens barrel 48.

Substrate 40 is provided with upper surface 50, lower surface 52 and connects saturating dead slot 54 to lower surface 52 by upper surface 50, and lower surface 52 forms a plurality of circuits 56 in saturating dead slot 54 peripheries.

Image sensing wafer 42 is provided with photosensitive area 58 and is provided with a plurality of weld pads 60 in photosensitive area 58 peripheries, be formed with projection 62 on a plurality of weld pads 60, image sensing wafer 42 is with on a plurality of circuits 56 of lower surface 52 that cover crystal type and be electrically connected on substrate 40, and photosensitive area 58 is then exposed by the saturating dead slot 54 of substrate 40.

Photic zone 44 is a transparent glass, and it is to be arranged on the upper surface 50 of substrate 40, and saturating dead slot 54 is covered, so that image sensing wafer 42 can see through saturating dead slot 54 and photic zone 44 receives the light signal.

Ejection formation structure 46 is that the mode by ejection formation envelopes substrate 40 and image sensing wafer 42 with industrial plastic cement, and forms the flange layer 64 that is provided with internal thread 66 in photic zone 44 upper ends.

Lens barrel 48 is provided with the external screw thread 68 of and screw lock corresponding with flange layer 64 internal threads 66, and its middle body forms accommodation chamber 70, and accommodation chamber 70 from top to bottom is formed with open-work 72, aspherical lens 74 and infrared ray filter glass 76 respectively.

As shown in Figure 3, when the utility model is made, at first provide have upper surface 50, lower surface 52 and connecting to the substrate 40 of the saturating dead slot 54 of lower surface 52 by upper surface 50; Lower surface 52 forms a plurality of circuits 56 in saturating dead slot 54 peripheries; Image sensing wafer 42 to cover the lower surface 52 that crystal type is electrically connected on substrate 40, is covered on photic zone 44 on the upper surface 50 of substrate 40 again, to form the image sensor of new construction.

As shown in Figure 4, image sensor is as shown in Figure 3 carried out the ejaculation type with industrial plastic cement, and form ejection formation structure 46, and substrate 40 and image sensing wafer 42 are enveloped; Ejection formation structure 46 forms flange layer 64 in photic zone 44 upper ends, and when ejection formation, makes flange layer 64 form internal thread 66; At this moment, can with lens barrel 48 screw locks in flange layer 64, just finish assembling of the present utility model.

As mentioned above, the utlity model has following advantage:

1, on substrate 40, forms saturating dead slot 54, receive the light signal,, can make the utility model miniaturization so that image sensor has thin advantage so that image sensing wafer 42 can see through saturating dead slot 54.

2, image sensor of the present utility model forms flange layer 64 with injection molding method and image sensing wafer 42 is encapsulated, and is comparatively convenient on making.

3, when ejection formation, formation internal thread 66 makes its function with known microscope base, and can screw togather with lens barrel on flange layer 64, and is more convenient in the assembling of module, can effectively reduce the production cost of module.

Claims

1. A miniaturized image sensor module, which includes an image sensing chip with a photosensitive area, a light-transmitting layer, and a lens barrel with external threads; the central part of the lens barrel is formed with a through hole from top to bottom and an accommodating chamber for an aspheric lens; it is characterized in that the periphery of the photosensitive area of the image sensing chip is provided with a plurality of welding pads electrically connected to the lower surface of the substrate; the substrate and the image sensing chip are covered with an injection molding structure; the substrate There are upper and lower surfaces and a hollow groove penetrating from the upper surface to the lower surface for exposing the photosensitive area of the image sensing chip. The lower surface forms a plurality of lines around the periphery of the hollow groove; the light-transmitting layer is placed on the upper surface of the substrate. And cover the hollow groove; the injection molding structure forms a flange layer with internal threads on the upper end of the light-transmitting layer.

2 . The miniaturized image sensor module according to claim 1 , wherein bumps electrically connected to substrate circuits in a flip-chip manner are formed on a plurality of solder pads of the image sensor chip.

3. The miniaturized image sensor module according to claim 1, wherein the transparent layer is transparent glass.

4. The miniaturized image sensor module according to claim 1, wherein an infrared filter lens is arranged in the housing of the lens barrel.