CN2612070Y - Liquid cooling radiator - Google Patents

Abstract

A liquid-cooled cooling device for cooling electronic components mainly includes a circuit composed of a cooling plate, a radiator and a pump, and cooling liquid circulating in the circuit driven by the pump. The cooling plate is used to absorb the heat generated by an electronic component, and is provided with a cooling liquid passage, and the two ends of the cooling liquid passage are respectively a liquid inlet and a liquid outlet. The radiator is arranged on the top surface of the cooling plate, and includes a plurality of cooling fins and a heat dissipation pipe pierced in the cooling fins, and the liquid inlet end of the heat dissipation pipe is connected with the liquid outlet of the cooling plate. The pump has a liquid suction port and a liquid discharge port, the liquid suction port is connected with the liquid outlet end of the cooling pipe, and the liquid discharge port is connected with the liquid inlet port of the cooling plate.

Description

Liquid-cooled heat sink

【Technical field】

The utility model relates to a liquid-cooled radiator, in particular to a liquid-cooled radiator for cooling electronic components.

【Background technique】

With the continuous development of electronic technology, the operating frequency and speed of electronic components are also increasing. However, high frequency and high speed will cause more and more heat generated by electronic components, and the temperature will become higher and higher, which seriously threatens the performance and stability of electronic components during operation. In order to ensure the normal operation of electronic components, it is necessary to carry out Effective cooling. However, the existing single forced air-cooled heat sink is difficult to meet the heat dissipation needs of high-frequency and high-speed electronic components. Therefore, the industry combines forced air-cooled heat sinks and forced liquid-cooled heat sinks to improve heat dissipation efficiency.

Patent No. 99254044.5 of the People's Republic of China discloses a cooling device for a computer mainframe, which mainly consists of a cooling plate, a cooling water tank with a number of metal sheets inside, a radiator, a pump, a conduit connected therebetween, and a cooling system inside. liquid composition. The cooling plate is a hollow structure, and a plurality of staggered partitions with gaps at one end are arranged inside to form a circulation path together. The cooling plate absorbs heat from the surface of the electronic components and transfers the heat to the cooling liquid. Driven by the pump, the heat-absorbing cooling liquid is conducted to the water tank through the conduit for the first heat dissipation. Then, the coolant in the water tank is introduced into the radiator, and the second cooling is carried out with the assistance of the fan. The heat dissipation device for the main computer preferably combines forced air cooling and forced liquid cooling, so that the heat dissipation efficiency is greatly improved.

However, the above-mentioned cooling plate and radiator are of separate design. After the cooling liquid in the cooling plate absorbs heat, it needs to be transferred to a water tank through a conduit first, and then to the radiator, which makes the structure of the whole main engine cooling device quite complicated and heavy. , easy to interfere with other surrounding electronic components, and it is difficult to produce in batches, all of which are contrary to the development direction of today's portable electronic products. In addition, the circulation channel of the cooling plate is only formed by several partitions, and the contact area between the cooling liquid and the circulation channel is small, resulting in poor heat exchange efficiency.

【Content of invention】

The purpose of the utility model is to provide a liquid-cooled heat dissipation device with compact structure and good heat exchange effect.

The purpose of this utility model is achieved through the following technical solutions: the utility model liquid-cooled heat dissipation device mainly includes a circuit composed of a cooling plate, a radiator and a pump, and a cooling circuit circulating in the circuit driven by the pump. liquid. The cooling plate is used to absorb the heat generated by an electronic component, and a cooling liquid passage is arranged in it, and two ends of the cooling liquid passage are respectively a liquid inlet and a liquid outlet. The radiator is arranged on the top surface of the cooling plate, and includes a plurality of fins and a heat dissipation pipe passing through the fins, and one end of the heat dissipation pipe is connected with the liquid outlet of the cooling plate. The pump has a liquid suction port and a liquid discharge port, the liquid suction port is connected with the other end of the cooling pipe, and the liquid discharge port is connected with the liquid inlet port of the cooling plate.

On the basis of the above technical solution, the utility model is further provided with several heat exchange columns in the cooling liquid channel of the cooling plate.

Due to the adoption of the above technical solution, the liquid-cooled heat sink of the utility model is an integrated design in which the radiator is arranged on the top surface of the cooling plate, making the structure more compact and easy to mass-produce. At the same time, the cooling plate can also directly transfer heat to the radiator to improve heat dissipation efficiency. In addition, because a number of heat exchange columns are arranged in the cooling liquid channel of the cooling plate, the heat exchange area between the cooling liquid and the cooling plate is increased, and the turbulent flow in the flow process of the cooling liquid is enhanced, which can improve the distance between the cooling plate and the cooling liquid. heat transfer efficiency between them.

The utility model will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

【Description of drawings】

Fig. 1 is a three-dimensional exploded view of a liquid-cooled heat sink of the present invention.

Fig. 2 is a three-dimensional assembled view of the liquid-cooled heat dissipation device of the present invention.

Fig. 3 is an assembly diagram of the liquid-cooled heat sink of the present invention and related components.

【Detailed ways】

Please refer to FIG. 1 and FIG. 2 , the liquid-cooled heat dissipation device 1 of the present invention mainly includes a cooling plate 10 , a radiator 20 and a pump 30 .

The cooling plate 10 is a hollow structure, in which a plurality of staggered partitions 12 with a gap at one end and a top plate 18 jointly form a cooling liquid channel. A number of heat exchange columns 14 are arranged in the cooling liquid channel to enhance the heat exchange between the cooling liquid and the cooling plate 10 . A liquid outlet 16 and a liquid inlet 17 are respectively provided at two ends of the cooling liquid channel on the side wall of the cooling plate 10 .

The radiator 20 is composed of a plurality of cooling fins 21 and a heat dissipation pipe 23 bent and inserted therethrough. These cooling fins 21 are covered with a shell 25 to form an air duct. Of course, the radiating pipe 23 can also be formed by connecting several short pipes in series. For example, several short pipes can be interspersed in some cooling fins 21, and the two ends of these short pipes are connected in series by a U-shaped pipe. . A fan 40 is fastened on the side of the radiator 20 through a fan fixing bracket 42 , and its air outlet is in front of the air duct formed by the casing 25 . The radiator 20 is directly arranged on the top surface of the cooling plate 10 to make the structure more compact, and at the same time, the heat on the upper surface of the cooling plate 10 can be directly transferred to the radiator 20 . The liquid inlet 232 of the cooling pipe 23 directly communicates with the liquid outlet 16 of the cooling plate 10 , and the joint is covered with waterproof material to prevent the cooling liquid from leaking. Of course, the cooling pipe 23 can also be connected to the liquid outlet 16 indirectly through a conduit or the like.

The pump 30 is fixed on a bracket 36 through a buckle 38, and has a liquid suction port 32 and a liquid discharge port 34, and the liquid suction port 32 is directly connected with the liquid outlet 234 of the cooling pipe 23 of the radiator 20 The connection is also covered with waterproof material. Apparently, the liquid suction port 32 of the pump 30 can also be connected to the heat dissipation pipe 23 through a conduit or other indirect means. A conduit 50 connects the liquid outlet 34 with the liquid inlet 17 of the cooling plate 10 , so that the cooling plate 10 , the radiator 20 , the pump 30 and the conduit 50 form a closed circuit.

During operation, the bottom surface of the cooling plate 10 is bonded to the electronic component (not shown) to absorb the heat generated by the electronic component and transfer it to the cooling liquid in the cooling plate 10 to form a high-temperature cooling liquid. The high-temperature cooling liquid flows in the pump 30 Under the drive of the pump 30, it is transmitted to the heat dissipation pipe 23 of the radiator 20 through the liquid outlet 16 to dissipate heat and cool down to form a low-temperature coolant. The low-temperature coolant flows back into the cooling plate 10 under the drive of the pump 30 to start a new cycle One cycle, such a reciprocating cycle can effectively dissipate the heat generated by the electronic components. The heat dissipation pipe 23 can also transfer heat to the heat dissipation fins 21 of the heat sink 20 , and use the auxiliary heat dissipation of the fan 40 to improve heat dissipation efficiency. In addition, the cooling plate 10 can also directly conduct heat to the radiator 20 disposed on the top surface thereof, so that the heat dissipation effect is better.

Please refer to FIG. 3 , the liquid-cooled heat dissipation device 1 of the present invention is arranged in an electronic device casing 60 , the structure is very compact, and the surrounding electronic components 62 will not be hindered. The air outlet of the heat sink 20 faces a power supply 66, and hot air can be easily discharged to the outside of the electronic device housing 60 through the air passage in the power supply 66, and the power supply 66 can be carried out simultaneously. Cooling, in order to achieve better system cooling effect. The pump 30 is arranged on one side adjacent to the radiator 20 and is fixed on a platform 64 . Obviously, the pump 30 can be placed at any position as required.

Claims (7)

1. liquid-cooling heat radiator, comprise a coldplate, the loop that one radiator and a pump are formed and be located in this loop and can be in the cooling fluid that in this loop, circulates under the driving of this pump, establish a cooling passage in this coldplate, these cooling passage two ends are respectively a liquid inlet and a liquid outlet, this radiator comprises that some fin and are arranged in the radiating tube in these fin, this pump has a liquid pumping hole and a leakage fluid dram, it is characterized in that: this radiator is arranged on the top of this coldplate, one end of this radiating tube links to each other with the liquid outlet of this coldplate, the liquid pumping hole of this pump links to each other with the other end of this radiating tube, and the leakage fluid dram of this pump links to each other with the liquid inlet of this coldplate.

2. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: this cooling passage is formed by the dividing plate that some interlaced arrangement and an end have a breach.

3. liquid-cooling heat radiator as claimed in claim 2 is characterized in that: be provided with some heat exchange posts in this cooling passage.

4. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: the fin of this radiator is coated with a shell, forms an air channel.

5. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: be equiped with a fan on this radiator.

6. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: the junction between this coldplate, this radiator and this pumping all is coated with waterproof material.

7. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: the air outlet of this radiator is over against a power supply unit.

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