CN2909475Y - I-shaped structure symmetric biplate ceramic overcurrent protection element - Google Patents
I-shaped structure symmetric biplate ceramic overcurrent protection element Download PDFInfo
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- CN2909475Y CN2909475Y CN 200620041447 CN200620041447U CN2909475Y CN 2909475 Y CN2909475 Y CN 2909475Y CN 200620041447 CN200620041447 CN 200620041447 CN 200620041447 U CN200620041447 U CN 200620041447U CN 2909475 Y CN2909475 Y CN 2909475Y
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- ceramic
- shaped structure
- ceramic thermal
- thermal resistance
- biplate
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Abstract
The I-shaped symmetric ceramic two-piece over-current protection element including two ceramic thermosensitive resistances and an I-shaped structure member, is characterized in that the two electrodes of the ceramic thermosensitive resistances have metal pins; the two ceramic thermosensitive resistances are symmetrically disposed at the both sides of the I-shaped structure member which is of ceramic material or other heat-resistant insulation material; the resistance values of the two ceramic thermosensitive resistances match with each other. The utility has a small area occupation on the circuit board, the two ceramic thermosensitive resistances do not have the problem of unequal resistance value variation caused by the uneven heat-dispersing environments, the pin structure has no cross wire. Therefore the utility is convenient to be used and is suitable for massive surface mount automatic production.
Description
Technical field
The utility model relates to a kind of ceramic overflow protecting element, relates in particular to the structure of the ceramic overflow protecting element that is used for the communication apparatus protection.
Background technology
Often use ceramic thermal resistance as over-current protecting element in the communication apparatus, and traditional ceramic thermal resistance is generally the through hole mount type, and pairing is used usually.Its manufacturing process is as follows: ceramic thermal resistance is made the disk shape, cover silver electrode at its two ends then, the lead packages of burn-oning.Ceramic thermal resistance must weld in the through hole with lead-in wire insertion circuit board when mounted, and this mounting means incompatibility wiring board manufacturing enterprise automatic surface in enormous quantities mounts production.
Based on above shortcoming, have again a kind of electrode slice to be welded on the ceramic thermal resistance of resistance chip upper and lower surface, can realize that the automation surface mounts production, but resistor disc is single installation, have defective on resistors match, and it is bigger to take erection space.On the basis of monolithic mounted on surface thermistor, there be a kind of two thermistor chips are gathered into folds along the vertical direction to constitute one group of protection component again, this structure can be saved half erection space, and the resistors match of starting stage is relatively good.But because the heat dissipation environment difference of two thermistors up and down, cause that two thermistors action back resistance variations are not of uniform size up and down, thereby the influence pairing of two sheet resistors up and down.And because the folded direction of two sheet resistors is an above-below direction, and making the electrode deriving structure is criss-cross construction, the kind electrode deriving structure has single line to have to pass from the thermistor below when making the wiring board wiring, increased the difficulty of wiring.
Summary of the invention
The purpose of this utility model provides a kind of busy line board space little, and the pairing good stability of two sheet resistors, electrode deriving structure do not have right-angled intersection, wiring is easy to use, is applicable to the communication overflow protecting element that surface mount in enormous quantities is produced.
For achieving the above object; the technical scheme that adopts is: a kind of I-shaped structure symmetry biplate pottery overflow protecting element; comprise two ceramic thermal resistances and an I-shaped structure spare; two lateral electrodes that it is characterized in that ceramic thermal resistance are welded with metal pins respectively, and described two ceramic thermal resistances place the both sides of I-shaped structure spare symmetrically with vertical direction.The material of I-shaped structure spare is pottery or macromolecule high-temperature insulation material, the resistance value coupling of two ceramic thermal resistances.
The beneficial effects of the utility model are that the line is busy, and the road board space is smaller, the pairing good stability of two sheet resistors,, be not applicable to surface mount production in enormous quantities because the different resistance variations problems not of uniform size, electrode deriving structure of causing of heat dissipation environment do not have right-angled intersection, connect up easy to usely.
Description of drawings
Fig. 1 the utility model structural representation one;
The A of Fig. 2 Fig. 1 is to view;
The B of Fig. 3 Fig. 1 is to view;
Fig. 4 the utility model structural representation two.
Among the figure: 1-I-shaped structure spare; The 2-ceramic thermal resistance; 3,3 ' 4,4 '-metal pins; The 5-ceramic thermal resistance; Button in the 6-.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail.
From Fig. 1 as seen; a kind of I-shaped structure symmetry biplate pottery overflow protecting element; comprise 2,5 and I-shaped structure spares 1 of two ceramic thermal resistances, it is characterized in that described ceramic thermal resistance 2 and ceramic thermal resistance 5, place the both sides of I-shaped structure spare 1 with vertical direction symmetrically.Layered ceramic thermistor 2 or 5 is square, the modes such as weldering, soldering of blowing by Reflow Soldering, hot blast are welded metal pins respectively on ceramic thermal resistance 2 and 5 liang of lateral electrodes, the metal pins 3 and 3 ' that 2 liang of lateral electrodes of described ceramic thermal resistance are welded respectively is staggered, and the metal pins 4 and 4 ' that 5 liang of lateral electrodes of described ceramic thermal resistance are welded respectively is staggered.I-shaped structure spare 1 material is pottery or macromolecule high-temperature insulation material, and described ceramic thermal resistance 2 and 5 resistance value are complementary.
Fig. 4 is another embodiment of the present utility model, for ease of the positioning and fixing of ceramic thermal resistance 2 and 5, and button 6 in the both sides, upper end of I-shaped structure spare 1 are provided with.
Claims (3)
1, a kind of I-shaped structure symmetry biplate pottery overflow protecting element; comprise two ceramic thermal resistances (2), (5) and an I-shaped structure spare (1); it is characterized in that described ceramic thermal resistance (2) two lateral electrodes are welded with metal pins (3) and (3 ') respectively; described ceramic thermal resistance (5) two lateral electrodes are welded with metal pins (4) and (4 ') respectively; described ceramic thermal resistance (2) and ceramic thermal resistance (5) place the both sides of I-shaped structure spare (1) symmetrically with vertical direction.
2, according to the described a kind of I-shaped structure symmetry biplate pottery overflow protecting element of claim 1, it is characterized in that described I-shaped structure spare (1) material is pottery or macromolecule high-temperature insulation material.
3, according to the described a kind of I-shaped structure symmetry biplate pottery overflow protecting element of claim 1, it is characterized in that the resistance value of described ceramic thermal resistance (2) and (5) is complementary.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620041447 CN2909475Y (en) | 2006-04-28 | 2006-04-28 | I-shaped structure symmetric biplate ceramic overcurrent protection element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620041447 CN2909475Y (en) | 2006-04-28 | 2006-04-28 | I-shaped structure symmetric biplate ceramic overcurrent protection element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2909475Y true CN2909475Y (en) | 2007-06-06 |
Family
ID=38128693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620041447 Expired - Fee Related CN2909475Y (en) | 2006-04-28 | 2006-04-28 | I-shaped structure symmetric biplate ceramic overcurrent protection element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2909475Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101796594B (en) * | 2007-09-06 | 2013-02-06 | 埃普科斯股份有限公司 | electrical protection device |
| CN101988829B (en) * | 2009-07-29 | 2013-03-13 | 财团法人国家实验研究院 | Monitoring system and monitoring device of riverbed structure |
| CN112378963A (en) * | 2020-11-04 | 2021-02-19 | 北京航天微电科技有限公司 | Humidity sensor with heating and temperature measuring functions and manufacturing method thereof |
-
2006
- 2006-04-28 CN CN 200620041447 patent/CN2909475Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101796594B (en) * | 2007-09-06 | 2013-02-06 | 埃普科斯股份有限公司 | electrical protection device |
| CN101988829B (en) * | 2009-07-29 | 2013-03-13 | 财团法人国家实验研究院 | Monitoring system and monitoring device of riverbed structure |
| CN112378963A (en) * | 2020-11-04 | 2021-02-19 | 北京航天微电科技有限公司 | Humidity sensor with heating and temperature measuring functions and manufacturing method thereof |
| CN112378963B (en) * | 2020-11-04 | 2024-05-07 | 北京航天微电科技有限公司 | Humidity sensor with heating and temperature measuring functions and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SUZHOU JINGXUN SCIENCE + TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHANGHAI SIMAI ELECTRONIC CO., LTD. Effective date: 20110111 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201201 NO. 100, QINFEN INDUSTRY RESIDENTIAL QUARTER, HEQING TOWN, PUDONG NEW DISTRICT, SHANGHAI TO: 215163 NO. 2, PEIYUAN ROAD, DONGZHU TOWN, HIGH-TECH. ZONE, SUZHOU CITY |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20110111 Address after: 215163 Suzhou high tech Zone Dongzhu eswell Road No. 2 Patentee after: Suzhou Jingxun Technology Co., Ltd. Address before: Pudong New Area Heqing town of Shanghai city in 201201 Industry Industrial Area No. 100 Patentee before: Shanghai Simai Electronic Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070606 Termination date: 20130428 |